WO2009090871A1 - 被検査体の検査装置 - Google Patents
被検査体の検査装置 Download PDFInfo
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- WO2009090871A1 WO2009090871A1 PCT/JP2009/000114 JP2009000114W WO2009090871A1 WO 2009090871 A1 WO2009090871 A1 WO 2009090871A1 JP 2009000114 W JP2009000114 W JP 2009000114W WO 2009090871 A1 WO2009090871 A1 WO 2009090871A1
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- substrate
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- line sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
Definitions
- the present invention relates to an inspection apparatus for an inspection object, and more particularly to an inspection apparatus for an inspection object that inspects the inspection object using an image of the inspection object obtained by imaging.
- ⁇ Electronic parts may have feet, and foreign matter may get caught between the feet and the board.
- Such foreign matter may be very thin, for example, 0.1 mm, and in order to determine whether such foreign matter is pinched, it is required to accurately grasp the height of components on the board.
- the image captured by the two camera arrays is greatly influenced by the parallax.
- the influence of parallax is large, it is difficult to analyze an image for grasping the height of a component on the substrate, and the measurement accuracy of the height of the component on the substrate may be lowered.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide an inspection apparatus for an object to be inspected that can grasp the three-dimensional shape of the surface to be inspected in the inspection object at high speed and with high accuracy. It is in.
- an inspection apparatus for an object to be inspected includes an optical system that collects reflected light from a non-inspection object in parallel to the lens optical axis.
- the first line sensor scans through a first line sensor that scans an image to generate first image data and an optical system that collects reflected light from the non-inspection object in parallel to the lens optical axis.
- a second line sensor that generates a second image data by scanning an image of the object viewed from an angle different from the image, and an inspection surface of the object to be inspected using the first image data and the second image data.
- a height calculation unit for calculating the height is provided. According to this aspect, since a stereo image with little influence of parallax can be used, the three-dimensional shape of the surface to be inspected in the inspection object can be grasped at high speed and with high accuracy.
- the first line sensor or the second line sensor may scan an image of the object to be inspected via a telecentric lens. According to this aspect, by obtaining an image through a telecentric lens having a very small angle of view, an image having a very small influence of parallax can be obtained.
- the first line sensor or the second line sensor may scan the image of the object to be inspected via the equal magnification optical system. According to this aspect, it is possible to obtain an image in which the influence of parallax is very small as compared with the case of scanning the reflected light of the inspection object that has passed through a normal reduction optical system.
- the first line sensor may scan an image obtained by vertically viewing the surface to be inspected. According to this aspect, it is possible to obtain an image obtained by vertically viewing the surface to be inspected. For this reason, the range which becomes a blind spot can be reduced compared with the case where all the line sensors scan the image
- a third line sensor that scans an image of the object viewed from an angle different from the image scanned by the first line sensor and the image scanned by the second line sensor via an optical system that reduces the influence of parallax; May be. According to this aspect, it is possible to reduce the range that becomes the blind spot of the inspection as compared with the case where the image of the inspected object is acquired only by the first and second line sensors.
- a scanning direction changing unit that changes a direction in which the scanning line scanned by the first line sensor and the second line sensor faces the object to be inspected may be further provided.
- components mounted on a board are often arranged side by side in the width direction and length direction of the board.
- the main scanning direction can be changed with respect to the direction in which the components to be mounted are arranged. For this reason, it is possible to change the main scanning direction with respect to the substrate so as to reduce the range of the blind spot of the inspection by arranging the mounted components.
- the scanning direction changing means may change the direction in which the scanning line faces with respect to the object to be inspected by 45 degrees.
- scanning an object to be inspected such as a substrate, with a line sensor
- scanning is generally performed in the width direction or length direction of the substrate.
- main scanning direction by changing the main scanning direction by 45 degrees, it is possible to reduce a range of blind spots for inspection, such as between components mounted side by side in the width direction or length direction of the substrate.
- the three-dimensional shape of the inspection surface of the inspection object can be grasped at high speed and with high accuracy.
- FIG. 1 is a diagram illustrating a configuration of a substrate inspection system 10 according to the first embodiment.
- the substrate inspection system 10 includes a substrate transport mechanism 12, an imaging system 14, an image processing unit, a slave PC, a master PC, and the like which will be described later.
- the substrate transport mechanism 12 includes a support plate 18 and two transport rails 20. The transport rail 20 is supported by the support plate 18.
- the transport rail 20 has a transport belt (not shown) for transporting the substrate 2 by driving a motor (not shown), and transports the substrate 2 placed on the transport belt to the approximate center of the substrate transport mechanism 12.
- a conveyance sensor (not shown) such as an optical sensor for detecting the conveyance of the substrate 2 is provided above the conveyance rail 20 and substantially in the center of the inspection table. When this transport sensor detects the end face of the substrate 2 or a detection hole provided in the substrate 2, the substrate inspection system 10 determines that the substrate 2 has been transported to the approximate center of the substrate transport mechanism 12, and the substrate 2 by the transport rail 20. Stop the transport of.
- a ball screw 22 extending in a direction orthogonal to the extending direction of the transport rail 20 is provided below the substrate transport mechanism 12.
- the ball screw 22 is driven by a transport motor (not shown).
- the substrate transport mechanism 12 together with the support plate 18 is moved in a direction perpendicular to the extending direction of the transport rail 20.
- the substrate inspection system 10 thus transports the substrate 2 transported by the transport rail 20 below the imaging system 14.
- the substrate inspection system 10 rotates the ball motor 22 in the reverse direction by rotating the conveyance motor to move the substrate conveyance mechanism 12 to the original position.
- the substrate inspection system 10 transports the substrate 2 thus moved to the next process by the transport rail 20. If there is a substrate to be inspected next, the substrate 2 to be inspected next is again conveyed to the approximate center of the substrate conveyance mechanism 12 by the conveyance rail 20 and the above operation is repeated.
- the transport rail 20 on the front side of the figure is provided with a clamp that presses the substrate 2 placed on the transport rail 20 from above to correct the shape of the substrate 2.
- the substrate 2 transported to the approximate center of the substrate transport mechanism 12 is transported to the imaging system 14 with the distortion corrected by this clamp.
- the imaging system 14 includes an imaging unit 24 and a rotation mechanism 26.
- the imaging unit 24 irradiates the substrate 2 with light and images the substrate 2 to generate image data.
- the rotation mechanism 26 has a unit rotation motor (not shown) and a speed reduction mechanism (not shown). When the unit rotation motor operates, an axis perpendicular to the surface to be inspected of the substrate 2 is provided via the speed reduction mechanism.
- the imaging unit 24 is rotated around the center.
- FIG. 2 is a perspective view showing an internal configuration of the imaging unit 24 according to the first embodiment.
- the imaging unit 24 includes a first scanning unit 30, a second scanning unit 32, and a third scanning unit 34. Note that the imaging unit 24 also includes an illumination unit that irradiates the substrate 2 with light at the time of imaging.
- the first scanning unit 30, the second scanning unit 32, and the third scanning unit 34 are similarly configured, and each includes a line sensor 38, a lens 39, a telecentric lens 40, and a mirror 42 on the support plate 36. Note that the third scanning unit 34 may be deleted to reduce the cost, and the imaging unit 24 may be configured by the first scanning unit 30 and the second scanning unit 32.
- FIG. 3 is a diagram schematically illustrating the configuration of the imaging unit 24 according to the first embodiment.
- the imaging process of the substrate 2 is performed by the imaging unit 24 while the substrate 2 is being conveyed from the left side to the right side.
- the right direction in FIG. 3 is the first direction
- the left direction in FIG. 3 is the second direction.
- the imaging unit 24 may perform an imaging process for the substrate 2 while the substrate 2 is being transported in the second direction.
- each line sensor 38 of each of the first scanning unit 30, the second scanning unit 32, and the third scanning unit 34 is reflected by the mirror 42, and the image on the scanning line of the substrate 2 that has passed through the telecentric lens 40 and the lens 39. Scan. At this time, each line sensor 38 scans an image on the same scanning line. As a result, the line sensors 38 can simultaneously scan at the timing of irradiating the scanning line with light, and image data can be efficiently acquired.
- Imaging refers to an operation in which a light receiving element in the line sensor 38 converts an amount of light indicating an image of an object into an electric signal and outputs the electric signal.
- Imaging means scanning one scanning unit.
- One scanning unit refers to a unit of scanning of the line sensor 38 such as one unidirectional scanning from one end of the substrate to the other end and one reciprocating scanning.
- the line sensor 38 of the first scanning unit 30 scans an image when the surface to be inspected of the substrate 2 is viewed vertically.
- the line sensor 38 of the second scanning unit 32 scans an image when the surface to be inspected of the substrate 2 is viewed at an angle inclined by a first angle ⁇ from the direction perpendicular to the surface to be inspected.
- the line sensor 38 of the third scanning unit 34 scans an image when the surface to be inspected of the substrate 2 is viewed at an angle inclined to the second direction side by a second angle ⁇ from a direction perpendicular to the surface to be inspected.
- the first angle ⁇ and the second angle ⁇ are set to the same angle (both 10 degrees in the first embodiment). However, the first angle ⁇ and the second angle ⁇ may be set to different angles.
- the line sensors 38 of the first scanning unit 30, the second scanning unit 32, and the third scanning unit 34 may scan images on different scanning lines.
- each line sensor 38 may scan images on scanning lines parallel to each other.
- FIG. 4 is a diagram showing optical paths of chief rays of the first scanning unit 30, the second scanning unit 32, and the third scanning unit 34. As shown in FIG. In FIG. 4, the reflection of the principal ray by the mirror 42 is not shown.
- the line sensor 38 scans the image of the substrate 2 through the telecentric lens 40.
- the telecentric lens 40 collects the reflected light from the substrate 2 in parallel with the lens optical axis. For this reason, between the telecentric lens 40 and the substrate 2, the principal ray is parallel to the optical axis, that is, the field angle is substantially zero degrees.
- the telecentric lens 40 since the angle of view is zero degrees, the subject image is not affected by the parallax even if it is at the center of the optical axis or at a peripheral position away from the optical axis. An image without distortion due to parallax can be taken.
- FIG. 5 is a top view showing the imaging unit 24 at the initial position and the imaging unit 24 at the position rotated from the initial position by the rotation mechanism 26.
- the scanning line scanned by the first scanning unit 30, the second scanning unit 32, and the third scanning unit 34 when the imaging unit 24 is at the initial position is defined as a first main scanning line L1.
- the scanning line when the imaging unit 24 rotates from the initial position is defined as a second main scanning line L2.
- the angle formed by the first main scanning line L1 and the second main scanning line L2 is an angle obtained by rotating the imaging unit 24 from the initial position.
- this angle is referred to as a scanning angle ⁇ .
- the rotation mechanism 26 functions as a scanning direction changing unit that changes the angle between the transport direction of the substrate 2 and the scanning line on the substrate 2.
- substrate width direction the resolution in the direction perpendicular to the conveyance direction of the substrate 2
- FIG. 6 is a functional block diagram of the substrate inspection system 10 according to the first embodiment.
- the substrate inspection system 10 includes a first slave PC 54, a second slave PC 56, a third slave PC 58, a master PC 70, and a display 86 in addition to the substrate transport mechanism 12 and the imaging system 14.
- a first slave PC 54, a second slave PC 56, a third slave PC 58, and a master PC 70 are a CPU that executes various arithmetic processes, a ROM that stores various control programs, and a work area for data storage and program execution.
- a functional block realized by the cooperation of hardware such as RAM and software used as the software is depicted. Therefore, these functional blocks can be realized in various forms by a combination of hardware and software.
- Image data captured and generated by the line sensor 38 of the first scanning unit 30 is subjected to image processing by the image processing unit 52 and then output to the first slave PC 54.
- Image data captured and generated by the line sensor 38 of the second scanning unit 32 is subjected to image processing by the image processing unit 52 and then output to the second slave PC 56.
- Image data captured and generated by the line sensor 38 of the third scanning unit 34 is subjected to image processing by the image processing unit 52 and then output to the third slave PC 58.
- Each of the first slave PC 54, the second slave PC 56, and the third slave PC 58 includes a memory 60, an analysis unit 62, a storage unit 64, and a transmission / reception unit 66.
- the memory 60 holds the received image data.
- the analysis unit 62 analyzes the image data held in the memory 60 and first acquires reference data.
- the reference data is, for example, the position data of the recognition mark indicating the position of the substrate 2 provided on the substrate 2 and the substrate 2 serial number obtained by analyzing the identification mark such as a barcode provided on the substrate 2.
- identification data such as the date of manufacture, images of parts imaged across different line sensors 38, and other data necessary for inspection of the board 2.
- the analysis unit 62 analyzes the image data held in the memory 60, and acquires position information data indicating the position of each component or solder location mounted on the board 2 using the acquired reference data.
- the storage unit 64 is configured by a hard disk, and preliminarily stores determination reference data used for substrate inspection.
- the analysis unit 62 uses the determination reference data stored in the storage unit 64 to inspect the mounting state of the components on the board 2 within a range that can be inspected by a planar image.
- the component mounting state is not only the presence / absence / position of a component such as an element mounted on the substrate 2 as an object to be inspected, the proper component, etc. but also the presence / absence of solder, the amount of solder, the presence / absence of a bridge, Including.
- the storage unit 64 holds the inspection result as inspection result data.
- the first slave PC 54, the second slave PC 56, and the third slave PC 58 transmit reference data, position information data, and inspection result data to the master PC 70 via the transmission / reception unit 66 and the hub 68, respectively.
- the first slave PC 54, the second slave PC 56, and the third slave PC 58 also transmit the received image of the board 2 to the master PC 70, respectively.
- the master PC 70 includes a transmission / reception unit 72, a conveyance control unit 74, a rotation control unit 76, an imaging control unit 78, a storage unit 80, a determination unit 82, and a display control unit 84.
- the transmission / reception unit 72 receives reference data, position information data, and inspection result data from the first slave PC 54, the second slave PC 56, and the third slave PC 58.
- the storage unit 80 is constituted by a hard disk, and these received data are stored in the storage unit 80.
- the conveyance motor 50 that conveys the substrate 2 in the first direction and the second direction is connected to the master PC 70.
- the conveyance control unit 74 moves the substrate 2 in the first direction and the second direction by operating the conveyance motor 50 by supplying a drive signal to the conveyance motor 50 and moving the substrate conveyance mechanism 12. Therefore, the transfer control unit 74 and the substrate transfer mechanism 12 function as a moving unit that moves the substrate 2.
- the unit rotation motor provided in the rotation mechanism 26 is connected to the master PC 70.
- the rotation control unit 76 controls the rotation angle of the imaging unit 24 by controlling a drive signal supplied to the unit rotation motor.
- the line sensors 38 of the first scanning unit 30, the second scanning unit 32, and the third scanning unit 34 are connected to the master PC 70.
- the imaging control unit 78 controls each imaging of the line sensor 38 so that the image of the substrate 2 is scanned at a timing when the illumination unit irradiates the substrate 2 with light.
- the determination unit 82 calculates the height of the component mounted on the board 2 using the reference data and the position information data received from the first slave PC 54, the second slave PC 56, and the third slave PC 58. For this reason, the determination part 82 functions as a height calculation part.
- the determination unit 82 includes each of the first slave PC 54, the second slave PC 56, and the third slave PC 58.
- the height of the component mounted on the board 2 is calculated on the basis of the amount of deviation of each component position indicated by the position information data received from.
- the storage unit 80 stores in advance inspection reference data relating to the height of components on the surface to be inspected of the substrate 2.
- the determination unit 82 uses the inspection reference data stored in the storage unit 80 to perform an abnormality determination that determines whether the height of each component is within the normal range height indicated by the inspection reference data, for example. To do. As a result, for example, it is possible to detect whether a foreign object is sandwiched between the legs of the electronic component and the substrate.
- the determination unit 82 may acquire reference data and position information data using images received from the first slave PC 54, the second slave PC 56, and the third slave PC 58.
- the display control unit 84 causes the display 86 to display the inspection result of the substrate 2 by the determination unit 82 including the result of the abnormality determination, and the inspection result of the substrate 2 indicated by the received inspection result data. At this time, for example, the display control unit 84 may display the image of the substrate 2 received from the first slave PC 54 from the vertically upper side and display the position of the part with the abnormality on the display 86.
- FIG. 7 is a flowchart showing the steps of substrate inspection processing of the substrate inspection system 10 according to the first embodiment. The processing in this flowchart starts when a start button provided in the substrate inspection system 10 is pressed by the user.
- the user can input the scanning angle ⁇ to the master PC 70 using an input device such as a mouse or a keyboard.
- Information indicating the scanning angle ⁇ input by the user is stored in the RAM of the master PC 70.
- the rotation control unit 76 refers to the RAM to determine whether or not the scanning angle ⁇ is input by the user (S10).
- the rotation control unit 76 supplies a drive signal to the unit rotation motor of the rotation mechanism 26 to rotate the imaging unit 24 by the scanning angle ⁇ from the initial position ( S12).
- the rotation control unit 76 skips the process of S12.
- the user may be able to select whether or not to change the direction in which the scanning line faces the substrate 2 using the input device such as a mouse or a keyboard.
- the rotation control unit 76 refers to the RAM and determines whether or not the user has selected to change the direction in which the scanning line faces.
- the rotation control unit 76 rotates the imaging unit 24 by 45 degrees from the initial position, and changes the direction in which the scanning line faces the substrate 2 by 45 degrees. Thereby, the range which becomes a blind spot of a test
- the imaging control unit 78 performs substrate imaging processing (S14).
- the conveyance control unit 74 conveys the substrate 2 in the first direction, and the imaging control unit 78 causes the line sensor 38 to start imaging the substrate 2 when the substrate 2 is conveyed in the first direction.
- the conveyance control unit 74 refers to the RAM and conveys the substrate 2 so that the interval between the scanning lines in the conveyance direction is L * cos ⁇ .
- L indicates the interval between the scanning lines on the surface to be inspected of the substrate 2 when the substrate 2 is in the initial position.
- the resolution in the transport direction can be increased to 1 / cos ⁇ compared to when the substrate 2 is at the initial position.
- the resolution in the substrate width direction is 1 / cos ⁇ as described above. By adjusting the transport speed in this manner, the resolution in the transport direction can be matched with the resolution in the substrate width direction.
- the analysis units 62 of the first slave PC 54, the second slave PC 56, and the third slave PC 58 analyze the acquired image data and acquire position information data and the like as described above. .
- the transmission / reception unit 66 transmits the acquired position information data and the like to the master PC 70 (S16).
- the determination unit 82 calculates the height of each component on the surface to be inspected of the substrate 2 using the received position information data or the like (S18), and performs abnormality determination of the substrate 2 based on the calculated height (S20).
- the display control unit 84 displays the inspection result of the substrate 2 on the display 86 (S22), and ends the processing in this flowchart.
- FIG. 8 is a diagram illustrating the imaging unit 100 according to the second embodiment.
- the configuration of the substrate inspection system according to the second embodiment is the same as that of the substrate inspection system 10 according to the first embodiment except that the imaging unit 100 is provided instead of the imaging unit 24. Therefore, in the second embodiment, the rotation mechanism 26 rotates the imaging unit 100 around an axis perpendicular to the surface to be inspected of the substrate 2.
- the imaging unit 100 includes a first scanning unit 102, a second scanning unit 104, and a third scanning unit 106.
- Each of the first scanning unit 102, the second scanning unit 104, and the third scanning unit 106 includes a line sensor 108 and a lens array 110. Note that the third scanning unit 106 may be deleted to reduce the cost, and the imaging unit 100 may be configured by the first scanning unit 102 and the second scanning unit 104.
- Each line sensor 108 of the first scanning unit 102, the second scanning unit 104, and the third scanning unit 106 scans an image on the same scanning line on the surface to be inspected of the substrate 2. Also in the second embodiment, the position of the imaging unit 100 when the scanning line is perpendicular to the conveyance direction of the substrate 2 is referred to as an “initial position”.
- the line sensors 108 of the first scanning unit 102, the second scanning unit 104, and the third scanning unit 106 may scan images on different scanning lines. In this case, each line sensor 38 may scan images on scanning lines parallel to each other.
- the line sensor 108 of the first scanning unit 102 scans an image when the surface to be inspected is viewed vertically.
- the line sensor 108 of the second scanning unit 104 scans the image of the substrate 2 viewed from an angle inclined to the first direction side by a first angle ⁇ from a direction perpendicular to the surface to be inspected.
- the line sensor 108 of the third scanning unit 106 scans the image of the substrate 2 viewed at an angle inclined to the second direction side by the second angle ⁇ from the direction perpendicular to the surface to be inspected.
- the first angle ⁇ and the second angle ⁇ are set to the same angle (both 10 degrees in the second embodiment). However, the first angle ⁇ and the second angle ⁇ may be set to different angles.
- FIG. 9 is a diagram of the first scanning unit 102 viewed in the transport direction. Since the configurations of the second scanning unit 104 and the third scanning unit 106 are the same as those of the first scanning unit 102, the configuration of the first scanning unit 102 will be described to explain the second scanning unit 104 and the third scanning unit 106. The description of the configuration is omitted.
- the lens array 110 is a so-called equal-magnification optical system, and is configured as a rod lens array in which ultra-small rod lenses are arranged. Since the configuration of the rod lens array is known, the description thereof is omitted.
- the line sensor 108 is configured by arranging the light receiving elements in a line corresponding to the entire length of the substrate 2 in the width direction. The line sensor 108 scans the image of the inspection surface of the substrate 2 via the lens array 110.
- the equal-magnification optical system also condenses the reflected light from the substrate 2 substantially parallel to the lens optical axis. For this reason, by adopting the equal-magnification optical system in this way, it is possible to significantly reduce the influence of the parallax of the image of the substrate 2 acquired by the line sensor 108.
- the equal magnification optical system is adopted for all of the first scanning unit 102, the second scanning unit 104, and the third scanning unit 106, images scanned from different angles are affected by parallax. Can be obtained in a state of little. For this reason, it becomes possible to grasp
- SELFOC registered trademark
- SLA SELFOC (registered trademark) lens array
- the user can input to the master PC 70 whether or not to inspect the height of the surface to be inspected of the substrate 2 using a mouse or a keyboard.
- the imaging control unit 78 uses the second scanning unit 32 and the third scanning unit 34 to perform the substrate inspection. 2, the substrate 2 is imaged only by the first scanning unit 30.
- the imaging control unit 78 images the substrate 2 only by the first scanning unit 102 without imaging the substrate 2 by the second scanning unit 104 and the third scanning unit 106.
- the imaging control unit 78 images the substrate 2 only by the first scanning unit 102 without imaging the substrate 2 by the second scanning unit 104 and the third scanning unit 106.
- the rotation control unit 76 selects the imaging unit 24 and the second imaging unit 24.
- the imaging unit 100 is rotated by the scanning angle ⁇ .
- a turntable is provided on the transport rail 20.
- the turntable is configured to rotate when the motor operates.
- the rotation control unit 76 operates this motor to rotate the turntable by the scanning angle ⁇ .
- the scanning angle ⁇ can also be changed by rotating the substrate 2 instead of rotating the imaging unit 24 and the imaging unit 100.
- the imaging unit 24 or the imaging unit 100 is fixed at a position where the scanning angle ⁇ is a value equal to or greater than zero. At this time, the scanning angle ⁇ may be 45 degrees. In this way, by fixing the direction in which the scanning line faces with respect to the conveyance direction of the substrate 2 in advance, the cost of the mechanism for rotating the imaging unit 24 or the imaging unit 100, the imaging unit 24 or the imaging unit, and the like. The time for rotating 100 can be reduced.
- the three-dimensional shape of the inspection surface of the inspection object can be grasped at high speed and with high accuracy.
Abstract
Description
図1は、第1の実施形態に係る基板検査システム10の構成を示す図である。基板検査システム10は、基板搬送機構12、撮像システム14、および後述する画像処理部、スレーブPC、マスターPCなどを有している。基板搬送機構12は、支持プレート18および2本の搬送レール20を有している。搬送レール20は、支持プレート18により支持される。
図8は、第2の実施形態に係る撮像ユニット100を示す図である。第2の実施形態に係る基板検査システムの構成は、撮像ユニット24に代えて撮像ユニット100が設けられている以外は、第1の実施形態に係る基板検査システム10と同様である。したがって、第2の実施形態では、回転機構26は基板2の被検査面と垂直な軸を中心に撮像ユニット100を回転させる。
Claims (7)
- 非検査体からの反射光をレンズ光軸に対して平行に集光する光学系を介して被検査体の映像を走査して第1画像データを生成する第1ラインセンサと、
非検査体からの反射光をレンズ光軸に対して平行に集光する光学系を介して、前記第1ラインセンサが走査する映像と異なる角度から見た被検査体の映像を走査して第2画像データを生成する第2ラインセンサと、
第1画像データおよび第2画像データを利用して被検査体の被検査面の高さを算出する高さ算出部と、
を備えることを特徴とする被検査体の検査装置。 - 前記第1ラインセンサまたは前記第2ラインセンサは、テレセントリックレンズを介して被検査体の映像を走査することを特徴とする請求項1に記載の被検査体の検査装置。
- 前記第1ラインセンサまたは前記第2ラインセンサは、等倍光学系を介して被検査体の映像を走査することを特徴とする請求項1に記載の被検査体の検査装置。
- 前記第1ラインセンサは、被検査体の被走査面を垂直に見た映像を走査することを特徴とする請求項1から3のいずれかに記載の被検査体の検査装置。
- 視差の影響を低減させる光学系を介して、前記第1ラインセンサが走査する映像および前記第2ラインセンサが走査する映像と異なる角度から見た被検査体の映像を走査する第3ラインセンサをさらに備えることを特徴とする請求項4に記載の被検査体の検査装置。
- 被検査体に対して前記第1ラインセンサおよび前記第2ラインセンサによって走査される走査ラインの向く方向を変更する走査方向変更手段をさらに備えることを特徴とする請求項1から5のいずれかに記載の被検査体の検査装置。
- 前記走査方向変更手段は、被検査体に対して走査ラインの向く方向を45度変化させることを特徴とする請求項6に記載の被検査体の検査装置。
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Application Number | Priority Date | Filing Date | Title |
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CN2009801020832A CN101910784A (zh) | 2008-01-15 | 2009-01-14 | 用于检查对象的检查装置 |
US12/812,801 US20100289891A1 (en) | 2008-01-15 | 2009-01-14 | Apparatus for inspecting object under inspection |
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JP2008006227A JP2009168581A (ja) | 2008-01-15 | 2008-01-15 | 被検査体の検査装置 |
JP2008-006227 | 2008-01-15 |
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JP (1) | JP2009168581A (ja) |
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Cited By (1)
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WO2023210154A1 (ja) * | 2022-04-27 | 2023-11-02 | 浜松ホトニクス株式会社 | 厚み分布計測装置および厚み分布計測方法 |
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US8313486B2 (en) | 2010-01-29 | 2012-11-20 | Vivant Medical, Inc. | System and method for performing an electrosurgical procedure using an ablation device with an integrated imaging device |
US20140152804A1 (en) * | 2012-12-05 | 2014-06-05 | Seagate Technology Llc | Sub-pixel imaging for enhanced pixel resolution |
CA2892952C (en) | 2015-01-19 | 2019-10-15 | Tetra Tech, Inc. | Protective shroud |
US10349491B2 (en) | 2015-01-19 | 2019-07-09 | Tetra Tech, Inc. | Light emission power control apparatus and method |
CA2893017C (en) | 2015-01-19 | 2020-03-24 | Tetra Tech, Inc. | Light emission power control apparatus and method |
CA2893007C (en) * | 2015-01-19 | 2020-04-28 | Tetra Tech, Inc. | Sensor synchronization apparatus and method |
CA2892885C (en) | 2015-02-20 | 2020-07-28 | Tetra Tech, Inc. | 3d track assessment system and method |
TW201930826A (zh) * | 2017-12-26 | 2019-08-01 | 日商索尼股份有限公司 | 外觀檢查裝置、外觀檢查方法、程式及工件之製造方法 |
US10730538B2 (en) | 2018-06-01 | 2020-08-04 | Tetra Tech, Inc. | Apparatus and method for calculating plate cut and rail seat abrasion based on measurements only of rail head elevation and crosstie surface elevation |
US11377130B2 (en) | 2018-06-01 | 2022-07-05 | Tetra Tech, Inc. | Autonomous track assessment system |
US10807623B2 (en) | 2018-06-01 | 2020-10-20 | Tetra Tech, Inc. | Apparatus and method for gathering data from sensors oriented at an oblique angle relative to a railway track |
US10625760B2 (en) | 2018-06-01 | 2020-04-21 | Tetra Tech, Inc. | Apparatus and method for calculating wooden crosstie plate cut measurements and rail seat abrasion measurements based on rail head height |
TWI708041B (zh) * | 2018-10-17 | 2020-10-21 | 所羅門股份有限公司 | 檢測與標記瑕疵的方法 |
US10908291B2 (en) | 2019-05-16 | 2021-02-02 | Tetra Tech, Inc. | System and method for generating and interpreting point clouds of a rail corridor along a survey path |
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US20100289891A1 (en) | 2010-11-18 |
JP2009168581A (ja) | 2009-07-30 |
CN101910784A (zh) | 2010-12-08 |
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