KR101393478B1 - 무전해 금도금욕, 무전해 금도금 방법 및 전자 부품 - Google Patents

무전해 금도금욕, 무전해 금도금 방법 및 전자 부품 Download PDF

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Publication number
KR101393478B1
KR101393478B1 KR1020070126329A KR20070126329A KR101393478B1 KR 101393478 B1 KR101393478 B1 KR 101393478B1 KR 1020070126329 A KR1020070126329 A KR 1020070126329A KR 20070126329 A KR20070126329 A KR 20070126329A KR 101393478 B1 KR101393478 B1 KR 101393478B1
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KR
South Korea
Prior art keywords
electroless
gold
nickel
gold plating
palladium
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KR1020070126329A
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English (en)
Korean (ko)
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KR20080052479A (ko
Inventor
마사유키 기소
유키노리 오다
세이고 구로사카
도오루 가미타마리
요시카즈 사이조
가츠히사 다나베
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우에무라 고교 가부시키가이샤
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Publication of KR20080052479A publication Critical patent/KR20080052479A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020070126329A 2006-12-06 2007-12-06 무전해 금도금욕, 무전해 금도금 방법 및 전자 부품 Active KR101393478B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00328891 2006-12-06
JP2006328891A JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法

Publications (2)

Publication Number Publication Date
KR20080052479A KR20080052479A (ko) 2008-06-11
KR101393478B1 true KR101393478B1 (ko) 2014-05-13

Family

ID=39498391

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070126329A Active KR101393478B1 (ko) 2006-12-06 2007-12-06 무전해 금도금욕, 무전해 금도금 방법 및 전자 부품

Country Status (5)

Country Link
US (1) US7985285B2 (https=)
JP (1) JP5526458B2 (https=)
KR (1) KR101393478B1 (https=)
CN (1) CN101319319B (https=)
TW (1) TWI457462B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP5371465B2 (ja) * 2009-02-09 2013-12-18 メタローテクノロジーズジャパン株式会社 非シアン無電解金めっき液及び導体パターンのめっき方法
TW201038766A (en) * 2010-07-08 2010-11-01 Rong yi chemical co ltd Method of electroless gold plating over miniature circuits on substrate
KR101444687B1 (ko) 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
JP6619563B2 (ja) 2015-04-30 2019-12-11 日本高純度化学株式会社 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜
JP6722037B2 (ja) * 2016-05-12 2020-07-15 上村工業株式会社 無電解金めっき浴のめっき能維持管理方法
JP6901847B2 (ja) * 2016-05-12 2021-07-14 上村工業株式会社 無電解金めっき浴
JP6329589B2 (ja) * 2016-06-13 2018-05-23 上村工業株式会社 皮膜形成方法
ES2834877T3 (es) * 2018-01-26 2021-06-21 Atotech Deutschland Gmbh Baño de enchapado en oro electrolítico

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277942A (ja) * 2002-03-25 2003-10-02 Okuno Chem Ind Co Ltd 無電解金めっき液
JP2004137589A (ja) * 2002-10-21 2004-05-13 Okuno Chem Ind Co Ltd 無電解金めっき液

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
SE8302798L (sv) * 1982-06-07 1983-12-08 Occidental Chem Co Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet
JPS60121274A (ja) * 1983-12-06 1985-06-28 Electroplating Eng Of Japan Co 自己触媒型無電解金めっき液
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
ES2039403T3 (es) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) Metodo para depositar sin electricidad cobre de alta calidad.
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
JP3051683B2 (ja) * 1996-12-10 2000-06-12 栄電子工業株式会社 無電解金めっき方法
JP2000017448A (ja) * 1998-07-01 2000-01-18 Nippon Riironaaru Kk 無電解金めっき液及び無電解金めっき方法
JP2003518552A (ja) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー 無電解金めっき組成物及びその使用方法
JP4599599B2 (ja) * 2001-02-01 2010-12-15 奥野製薬工業株式会社 無電解金めっき液
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
KR100749992B1 (ko) 2003-06-10 2007-08-16 닛코킨조쿠 가부시키가이샤 무전해 금도금액
JP2005054267A (ja) * 2003-07-24 2005-03-03 Electroplating Eng Of Japan Co 無電解金めっき方法
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277942A (ja) * 2002-03-25 2003-10-02 Okuno Chem Ind Co Ltd 無電解金めっき液
JP2004137589A (ja) * 2002-10-21 2004-05-13 Okuno Chem Ind Co Ltd 無電解金めっき液

Also Published As

Publication number Publication date
JP2008144187A (ja) 2008-06-26
TWI457462B (zh) 2014-10-21
CN101319319A (zh) 2008-12-10
US20080138506A1 (en) 2008-06-12
JP5526458B2 (ja) 2014-06-18
US7985285B2 (en) 2011-07-26
CN101319319B (zh) 2012-04-25
KR20080052479A (ko) 2008-06-11
TW200902757A (en) 2009-01-16

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