KR100749992B1 - 무전해 금도금액 - Google Patents
무전해 금도금액 Download PDFInfo
- Publication number
- KR100749992B1 KR100749992B1 KR1020057023540A KR20057023540A KR100749992B1 KR 100749992 B1 KR100749992 B1 KR 100749992B1 KR 1020057023540 A KR1020057023540 A KR 1020057023540A KR 20057023540 A KR20057023540 A KR 20057023540A KR 100749992 B1 KR100749992 B1 KR 100749992B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- plating solution
- gold plating
- gold
- electroless gold
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Abstract
Description
실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | |
공식 | O | O | × | △ |
석출 속도(㎛/20min) | 0.12 | 0.10 | 0.081 | 0.055 |
시안화금칼륨(g/L) | 2 | 2 | 2 | 2 |
EDTA(g/L) | 10 | 10 | 0 | 10 |
트리에틸렌테트라민(g/L) | 10 | 10 | 0 | 10 |
인산2수소나트륨·2수화물(g/L) | 34 | 34 | 34 | 34 |
히드록시메탄술폰산나트륨(g/L) | 2 | - | 2 | 0 |
히드록시에탄술폰산나트륨(g/L) | - | 2 | - | - |
pH | 7.0 | 7.0 | 7.0 | 7.0 |
욕온도(℃) | 88 | 88 | 88 | 88 |
실시예 1 | 비교예 1 | |
최대치 | 1462 | 1377 |
최소치 | 1181 | 976 |
평균치 | 1321 | 1185 |
Claims (5)
- 제 1 항에 있어서, 인산계 화합물을 더 함유하는 것을 특징으로 하는 무전해 금도금액.
- 제 1 항에 있어서, 상기 일반식으로 표시되는 환원제가 히드록시메탄술폰산나트륨(HOCH2SO3Na)인 것을 특징으로 하는 무전해 금도금액.
- 제 1 항에 있어서, 상기 아민화합물이 트리에틸렌테트라민(H2N(CH2)2NH(CH2)2NH(CH2)2NH2)인 것을 특징으로 하는 무전해 금도금액.
- 전자공업부품의 단자 또는 회로표면에, 제 1 항 내지 제 4 항중의 어느 한 항에 기재된 무전해 금도금액을 이용하여 형성한, 표면에 공식(孔食)이 없는 금도금 피막을 갖는 것을 특징으로 하는 금도금물.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003164807 | 2003-06-10 | ||
JPJP-P-2003-00164807 | 2003-06-10 | ||
JPJP-P-2003-00416315 | 2003-12-15 | ||
JP2003416315 | 2003-12-15 | ||
PCT/JP2004/004656 WO2004111287A1 (ja) | 2003-06-10 | 2004-03-31 | 無電解金めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060031617A KR20060031617A (ko) | 2006-04-12 |
KR100749992B1 true KR100749992B1 (ko) | 2007-08-16 |
Family
ID=33554380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057023540A KR100749992B1 (ko) | 2003-06-10 | 2004-03-31 | 무전해 금도금액 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4638818B2 (ko) |
KR (1) | KR100749992B1 (ko) |
CN (1) | CN100510174C (ko) |
HK (1) | HK1090096A1 (ko) |
TW (1) | TWI284157B (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5526459B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
JP5526458B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
JP4941650B2 (ja) * | 2007-01-11 | 2012-05-30 | 上村工業株式会社 | 無電解金めっき浴のめっき能維持管理方法 |
JP5013077B2 (ja) * | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | 無電解金めっき方法及び電子部品 |
JP6619563B2 (ja) * | 2015-04-30 | 2019-12-11 | 日本高純度化学株式会社 | 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜 |
CN105543816A (zh) * | 2016-02-01 | 2016-05-04 | 哈尔滨工业大学(威海) | 一种化学镀金液 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000026977A (ja) * | 1998-07-13 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | 貴金属を化学的還元析出によって得るための水溶液 |
-
2004
- 2004-03-31 CN CNB2004800160274A patent/CN100510174C/zh not_active Expired - Lifetime
- 2004-03-31 KR KR1020057023540A patent/KR100749992B1/ko active IP Right Grant
- 2004-03-31 JP JP2005506873A patent/JP4638818B2/ja not_active Expired - Lifetime
- 2004-04-08 TW TW093109714A patent/TWI284157B/zh active
-
2006
- 2006-09-21 HK HK06110514.0A patent/HK1090096A1/xx not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000026977A (ja) * | 1998-07-13 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | 貴金属を化学的還元析出によって得るための水溶液 |
Also Published As
Publication number | Publication date |
---|---|
WO2004111287A2 (ja) | 2004-12-23 |
CN100510174C (zh) | 2009-07-08 |
TW200500496A (en) | 2005-01-01 |
CN1802452A (zh) | 2006-07-12 |
WO2004111287A3 (ja) | 2005-03-03 |
KR20060031617A (ko) | 2006-04-12 |
JPWO2004111287A1 (ja) | 2006-07-20 |
HK1090096A1 (en) | 2006-12-15 |
TWI284157B (en) | 2007-07-21 |
JP4638818B2 (ja) | 2011-02-23 |
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