KR101380879B1 - 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대 - Google Patents

이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대 Download PDF

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Publication number
KR101380879B1
KR101380879B1 KR1020060129234A KR20060129234A KR101380879B1 KR 101380879 B1 KR101380879 B1 KR 101380879B1 KR 1020060129234 A KR1020060129234 A KR 1020060129234A KR 20060129234 A KR20060129234 A KR 20060129234A KR 101380879 B1 KR101380879 B1 KR 101380879B1
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South Korea
Prior art keywords
substrate
ceramic puck
electrostatic chuck
ceramic
receiving
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Expired - Fee Related
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KR1020060129234A
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English (en)
Korean (ko)
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KR20070105828A (ko
Inventor
알렉산더 마츄쉬킨
데니스 쿠사우
테오도로스 파나고포우로스
존 홀랜드
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어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020060129234A 2006-04-27 2006-12-18 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대 Expired - Fee Related KR101380879B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79601306P 2006-04-27 2006-04-27
US60/796,013 2006-04-27

Publications (2)

Publication Number Publication Date
KR20070105828A KR20070105828A (ko) 2007-10-31
KR101380879B1 true KR101380879B1 (ko) 2014-04-02

Family

ID=38769279

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020060129234A Expired - Fee Related KR101380879B1 (ko) 2006-04-27 2006-12-18 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대
KR1020070041285A Expired - Fee Related KR101387598B1 (ko) 2006-04-27 2007-04-27 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020070041285A Expired - Fee Related KR101387598B1 (ko) 2006-04-27 2007-04-27 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대

Country Status (4)

Country Link
JP (2) JP5069452B2 (https=)
KR (2) KR101380879B1 (https=)
CN (4) CN102593031B (https=)
TW (2) TWI357629B (https=)

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JP5267603B2 (ja) * 2010-03-24 2013-08-21 Ｔｏｔｏ株式会社 静電チャック
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JP5961917B2 (ja) * 2011-03-24 2016-08-03 住友電気工業株式会社 ウェハ保持体
KR102103136B1 (ko) * 2011-09-30 2020-04-22 어플라이드 머티어리얼스, 인코포레이티드 온도 제어되는 정전 척
CN102931133B (zh) * 2012-11-12 2016-02-10 中微半导体设备(上海)有限公司 一种改善硅穿孔工艺中刻蚀均匀性的方法
CN103938186B (zh) * 2013-01-23 2016-12-07 北京北方微电子基地设备工艺研究中心有限责任公司 托盘、mocvd反应腔和mocvd设备
JP6080571B2 (ja) * 2013-01-31 2017-02-15 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US9196514B2 (en) * 2013-09-06 2015-11-24 Applied Materials, Inc. Electrostatic chuck with variable pixilated heating
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
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CN105474381B (zh) * 2014-07-23 2018-06-05 应用材料公司 可调谐温度受控的基板支撑组件
JP6392612B2 (ja) * 2014-09-30 2018-09-19 日本特殊陶業株式会社 静電チャック
JP6463938B2 (ja) * 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
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JP6937753B2 (ja) * 2015-12-07 2021-09-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 融合されたカバーリング
US10582570B2 (en) * 2016-01-22 2020-03-03 Applied Materials, Inc. Sensor system for multi-zone electrostatic chuck
US10079168B2 (en) * 2016-11-08 2018-09-18 Lam Research Corporation Ceramic electrostatic chuck including embedded Faraday cage for RF delivery and associated methods for operation, monitoring, and control
US10246777B2 (en) * 2017-06-12 2019-04-02 Asm Ip Holding B.V. Heater block having continuous concavity
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
US11387134B2 (en) 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
JP6522180B1 (ja) * 2018-02-08 2019-05-29 Ｓｐｐテクノロジーズ株式会社 基板載置台及びこれを備えたプラズマ処理装置及びプラズマ処理方法
JP6681522B1 (ja) * 2018-09-13 2020-04-15 日本碍子株式会社 ウエハ載置装置
KR102646838B1 (ko) * 2019-02-05 2024-03-11 어플라이드 머티어리얼스, 인코포레이티드 증착 프로세스들을 위한 마스크의 척킹을 위한 기판 지지부
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
CN110331386A (zh) * 2019-07-09 2019-10-15 长江存储科技有限责任公司 在半导体晶圆上形成薄膜的方法
JP7390880B2 (ja) * 2019-12-05 2023-12-04 東京エレクトロン株式会社 エッジリング及び基板処理装置
CN111161995B (zh) * 2020-03-07 2025-07-01 江苏先锋精密科技股份有限公司 一种等离子刻蚀机用全封闭式云母加热基座
KR102867189B1 (ko) * 2020-03-31 2025-09-30 어플라이드 머티어리얼스, 인코포레이티드 고온 마이크로-존 정전 척
US11551951B2 (en) 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
CN111607785A (zh) 2020-05-26 2020-09-01 北京北方华创微电子装备有限公司 一种加热装置及半导体加工设备
TWI748774B (zh) * 2020-12-01 2021-12-01 天虹科技股份有限公司 晶圓承載盤及應用晶圓承載盤的薄膜沉積裝置
CN114959654B (zh) * 2021-02-26 2024-01-09 鑫天虹(厦门)科技有限公司 晶圆承载盘及应用晶圆承载盘的薄膜沉积装置
KR20230107922A (ko) 2022-01-10 2023-07-18 삼성전자주식회사 반도체 장치 제조 장비 및 반도체 장치 제조 방법
TWI884424B (zh) * 2022-02-28 2025-05-21 美商恩特葛瑞斯股份有限公司 具有電荷消散結構之靜電卡盤
KR20250034429A (ko) * 2022-07-11 2025-03-11 어플라이드 머티어리얼스, 인코포레이티드 기판 지지부를 위한 프로세스 키트
JP7614405B1 (ja) * 2023-04-27 2025-01-15 日本碍子株式会社 給電部材及びウエハ載置台

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Also Published As

Publication number Publication date
TW200809999A (en) 2008-02-16
CN101887865B (zh) 2013-06-19
KR20070105828A (ko) 2007-10-31
CN101887865A (zh) 2010-11-17
JP5183092B2 (ja) 2013-04-17
JP5069452B2 (ja) 2012-11-07
TW200807606A (en) 2008-02-01
CN101093811A (zh) 2007-12-26
CN101093811B (zh) 2012-04-25
TWI463588B (zh) 2014-12-01
JP2007300119A (ja) 2007-11-15
CN102593031B (zh) 2015-09-16
JP2007300057A (ja) 2007-11-15
CN102593031A (zh) 2012-07-18
CN101093812A (zh) 2007-12-26
KR20070105929A (ko) 2007-10-31
TWI357629B (en) 2012-02-01
KR101387598B1 (ko) 2014-04-23

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