KR101293381B1 - 전자 장치를 테스트하기 위한 시스템의 동작 주파수를증가시키는 방법 및 장치 - Google Patents
전자 장치를 테스트하기 위한 시스템의 동작 주파수를증가시키는 방법 및 장치 Download PDFInfo
- Publication number
- KR101293381B1 KR101293381B1 KR1020077018038A KR20077018038A KR101293381B1 KR 101293381 B1 KR101293381 B1 KR 101293381B1 KR 1020077018038 A KR1020077018038 A KR 1020077018038A KR 20077018038 A KR20077018038 A KR 20077018038A KR 101293381 B1 KR101293381 B1 KR 101293381B1
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- resistors
- terminals
- shunt
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/031,504 US7414418B2 (en) | 2005-01-07 | 2005-01-07 | Method and apparatus for increasing operating frequency of a system for testing electronic devices |
| US11/031,504 | 2005-01-07 | ||
| PCT/US2005/045583 WO2006073737A2 (en) | 2005-01-07 | 2005-12-15 | A method and apparatus for increasing the operating frequency of a system for testing electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070097095A KR20070097095A (ko) | 2007-10-02 |
| KR101293381B1 true KR101293381B1 (ko) | 2013-08-05 |
Family
ID=36647974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077018038A Expired - Fee Related KR101293381B1 (ko) | 2005-01-07 | 2005-12-15 | 전자 장치를 테스트하기 위한 시스템의 동작 주파수를증가시키는 방법 및 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7414418B2 (enExample) |
| EP (1) | EP1839062A4 (enExample) |
| JP (2) | JP2008527346A (enExample) |
| KR (1) | KR101293381B1 (enExample) |
| CN (1) | CN101099085B (enExample) |
| TW (1) | TWI404948B (enExample) |
| WO (1) | WO2006073737A2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7064566B2 (en) * | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
| US7414418B2 (en) * | 2005-01-07 | 2008-08-19 | Formfactor, Inc. | Method and apparatus for increasing operating frequency of a system for testing electronic devices |
| JP2006343146A (ja) * | 2005-06-07 | 2006-12-21 | Advantest Corp | 試験装置 |
| US7970971B2 (en) * | 2007-01-30 | 2011-06-28 | Finisar Corporation | Tapping systems and methods |
| KR100978233B1 (ko) * | 2008-05-19 | 2010-08-26 | 티에스씨멤시스(주) | 전기 검사 장치 그리고 이의 제조 방법, 이의 전기 신호인터페이싱 어셈블리, 및 이의 전기 신호 인터페이싱 방법 |
| KR20100083364A (ko) * | 2009-01-13 | 2010-07-22 | 삼성전자주식회사 | 전기적 특성 검사 장치 |
| US8410804B1 (en) * | 2009-02-24 | 2013-04-02 | Keithley Instruments, Inc. | Measurement system with high frequency ground switch |
| US8098076B2 (en) * | 2009-04-01 | 2012-01-17 | Formfactor, Inc. | Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test |
| CN101949961B (zh) * | 2010-08-16 | 2012-09-12 | 南京国博电子有限公司 | 射频测试用直流偏置探针卡 |
| JP5621523B2 (ja) * | 2010-11-09 | 2014-11-12 | パナソニック株式会社 | 入力装置 |
| EP2561759A1 (en) | 2011-08-26 | 2013-02-27 | Bayer Cropscience AG | Fluoroalkyl-substituted 2-amidobenzimidazoles and their effect on plant growth |
| KR102168688B1 (ko) * | 2013-12-19 | 2020-10-22 | 삼성디스플레이 주식회사 | 구동 칩 및 이를 포함하는 표시 장치 |
| US10698020B2 (en) * | 2014-03-26 | 2020-06-30 | Teradyne, Inc. | Current regulation for accurate and low-cost voltage measurements at the wafer level |
| US11041900B2 (en) * | 2014-03-26 | 2021-06-22 | Teradyne, Inc. | Equi-resistant probe distribution for high-accuracy voltage measurements at the wafer level |
| CN105548752B (zh) * | 2015-12-09 | 2018-06-26 | 上海华岭集成电路技术股份有限公司 | 可提高激励信号信噪比的测试系统 |
| TWI595248B (zh) * | 2016-01-20 | 2017-08-11 | 新特系統股份有限公司 | 使用開關切換單一訊號通道與複數個連接墊之連結的測試電路 |
| US10642671B2 (en) * | 2018-02-22 | 2020-05-05 | Elite Semiconductor Memory Tecnology Inc. | Testing apparatus and folded probe card testing system |
| KR102594695B1 (ko) * | 2018-06-29 | 2023-10-25 | 주식회사 엘지에너지솔루션 | 배터리 관리 시스템, 그것을 포함하는 배터리팩 및 전류 측정 회로의 고장 판정 방법 |
| US11573264B2 (en) * | 2019-04-10 | 2023-02-07 | Mediatek Inc. | Device for testing chip or die with better system IR drop |
| CN114019338A (zh) * | 2021-10-26 | 2022-02-08 | 上海华虹宏力半导体制造有限公司 | 分立器件的晶圆测试方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001296335A (ja) * | 2000-04-14 | 2001-10-26 | Nec Corp | 半導体装置の検査方法及び検査装置 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3512083A (en) * | 1966-12-12 | 1970-05-12 | Automated Measurements Corp | Sampling system and apparatus for testing electronic devices using a plurality of self-contained probes |
| US4392107A (en) * | 1980-09-09 | 1983-07-05 | The Bendix Corporation | Switching equipment for testing apparatus |
| US4418314A (en) * | 1980-10-20 | 1983-11-29 | The United States Of America As Represented By The Secretary Of The Army | High impedance fast voltage probe |
| JP2556038B2 (ja) * | 1987-06-09 | 1996-11-20 | 日本電装株式会社 | 混成集積回路 |
| JPS6447973A (en) * | 1987-08-18 | 1989-02-22 | Yokogawa Electric Corp | Device tester |
| US5086271A (en) * | 1990-01-12 | 1992-02-04 | Reliability Incorporated | Driver system and distributed transmission line network for driving devices under test |
| JPH03226683A (ja) * | 1990-02-01 | 1991-10-07 | Fujitsu Ltd | Lsi試験方法 |
| US5172051A (en) * | 1991-04-24 | 1992-12-15 | Hewlett-Packard Company | Wide bandwidth passive probe |
| JPH06140484A (ja) * | 1992-10-28 | 1994-05-20 | Nippon Telegr & Teleph Corp <Ntt> | プローブカード |
| JPH0763788A (ja) * | 1993-08-21 | 1995-03-10 | Hewlett Packard Co <Hp> | プローブおよび電気部品/回路検査装置ならびに電気部品/回路検査方法 |
| EP0707214A3 (en) * | 1994-10-14 | 1997-04-16 | Hughes Aircraft Co | Multiport membrane probe to test complete semiconductor plates |
| US6175228B1 (en) * | 1998-10-30 | 2001-01-16 | Agilent Technologies | Electronic probe for measuring high impedance tri-state logic circuits |
| US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
| US6657455B2 (en) * | 2000-01-18 | 2003-12-02 | Formfactor, Inc. | Predictive, adaptive power supply for an integrated circuit under test |
| US6339338B1 (en) * | 2000-01-18 | 2002-01-15 | Formfactor, Inc. | Apparatus for reducing power supply noise in an integrated circuit |
| US6603323B1 (en) * | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
| JP2002131388A (ja) * | 2000-10-26 | 2002-05-09 | Ando Electric Co Ltd | 終端回路 |
| JP2002196048A (ja) * | 2000-12-26 | 2002-07-10 | Advantest Corp | 半導体試験装置のデバイスインタフェース |
| KR100693540B1 (ko) * | 2001-07-17 | 2007-03-14 | 주식회사 아도반테스토 | 입출력 회로, 및 시험 장치 |
| JP2003043066A (ja) * | 2001-07-26 | 2003-02-13 | Hoya Corp | コンタクトプローブ部材及びその製造方法 |
| JP2003121500A (ja) * | 2001-10-10 | 2003-04-23 | Mitsubishi Electric Corp | 半導体装置の試験装置及び試験方法 |
| US6784674B2 (en) * | 2002-05-08 | 2004-08-31 | Formfactor, Inc. | Test signal distribution system for IC tester |
| US6798225B2 (en) * | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
| JP2004020408A (ja) * | 2002-06-18 | 2004-01-22 | Advantest Corp | 半導体試験装置 |
| US6812691B2 (en) * | 2002-07-12 | 2004-11-02 | Formfactor, Inc. | Compensation for test signal degradation due to DUT fault |
| US7190119B2 (en) * | 2003-11-07 | 2007-03-13 | Lam Research Corporation | Methods and apparatus for optimizing a substrate in a plasma processing system |
| US7414418B2 (en) | 2005-01-07 | 2008-08-19 | Formfactor, Inc. | Method and apparatus for increasing operating frequency of a system for testing electronic devices |
-
2005
- 2005-01-07 US US11/031,504 patent/US7414418B2/en not_active Expired - Lifetime
- 2005-12-15 EP EP05854329A patent/EP1839062A4/en not_active Withdrawn
- 2005-12-15 KR KR1020077018038A patent/KR101293381B1/ko not_active Expired - Fee Related
- 2005-12-15 WO PCT/US2005/045583 patent/WO2006073737A2/en not_active Ceased
- 2005-12-15 JP JP2007550379A patent/JP2008527346A/ja active Pending
- 2005-12-15 CN CN2005800461810A patent/CN101099085B/zh not_active Expired - Fee Related
- 2005-12-27 TW TW094146759A patent/TWI404948B/zh not_active IP Right Cessation
-
2008
- 2008-08-19 US US12/194,423 patent/US7880486B2/en not_active Expired - Fee Related
-
2012
- 2012-05-25 JP JP2012119406A patent/JP2012189607A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001296335A (ja) * | 2000-04-14 | 2001-10-26 | Nec Corp | 半導体装置の検査方法及び検査装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI404948B (zh) | 2013-08-11 |
| US20060152234A1 (en) | 2006-07-13 |
| US20080303541A1 (en) | 2008-12-11 |
| CN101099085B (zh) | 2011-01-19 |
| JP2008527346A (ja) | 2008-07-24 |
| JP2012189607A (ja) | 2012-10-04 |
| CN101099085A (zh) | 2008-01-02 |
| KR20070097095A (ko) | 2007-10-02 |
| US7880486B2 (en) | 2011-02-01 |
| US7414418B2 (en) | 2008-08-19 |
| TW200636260A (en) | 2006-10-16 |
| EP1839062A4 (en) | 2010-09-29 |
| WO2006073737A3 (en) | 2007-03-08 |
| WO2006073737A2 (en) | 2006-07-13 |
| EP1839062A2 (en) | 2007-10-03 |
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