TWI404948B - 用以於測試器與待測電子裝置間介接測試信號的設備及測試包含多個輸入端之電子裝置之方法 - Google Patents

用以於測試器與待測電子裝置間介接測試信號的設備及測試包含多個輸入端之電子裝置之方法 Download PDF

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Publication number
TWI404948B
TWI404948B TW094146759A TW94146759A TWI404948B TW I404948 B TWI404948 B TW I404948B TW 094146759 A TW094146759 A TW 094146759A TW 94146759 A TW94146759 A TW 94146759A TW I404948 B TWI404948 B TW I404948B
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TW
Taiwan
Prior art keywords
terminals
probe
probes
shunt resistors
channel
Prior art date
Application number
TW094146759A
Other languages
English (en)
Chinese (zh)
Other versions
TW200636260A (en
Inventor
Charles A Miller
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200636260A publication Critical patent/TW200636260A/zh
Application granted granted Critical
Publication of TWI404948B publication Critical patent/TWI404948B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
TW094146759A 2005-01-07 2005-12-27 用以於測試器與待測電子裝置間介接測試信號的設備及測試包含多個輸入端之電子裝置之方法 TWI404948B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/031,504 US7414418B2 (en) 2005-01-07 2005-01-07 Method and apparatus for increasing operating frequency of a system for testing electronic devices

Publications (2)

Publication Number Publication Date
TW200636260A TW200636260A (en) 2006-10-16
TWI404948B true TWI404948B (zh) 2013-08-11

Family

ID=36647974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146759A TWI404948B (zh) 2005-01-07 2005-12-27 用以於測試器與待測電子裝置間介接測試信號的設備及測試包含多個輸入端之電子裝置之方法

Country Status (7)

Country Link
US (2) US7414418B2 (enExample)
EP (1) EP1839062A4 (enExample)
JP (2) JP2008527346A (enExample)
KR (1) KR101293381B1 (enExample)
CN (1) CN101099085B (enExample)
TW (1) TWI404948B (enExample)
WO (1) WO2006073737A2 (enExample)

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US7414418B2 (en) * 2005-01-07 2008-08-19 Formfactor, Inc. Method and apparatus for increasing operating frequency of a system for testing electronic devices
JP2006343146A (ja) * 2005-06-07 2006-12-21 Advantest Corp 試験装置
US7970971B2 (en) * 2007-01-30 2011-06-28 Finisar Corporation Tapping systems and methods
KR100978233B1 (ko) * 2008-05-19 2010-08-26 티에스씨멤시스(주) 전기 검사 장치 그리고 이의 제조 방법, 이의 전기 신호인터페이싱 어셈블리, 및 이의 전기 신호 인터페이싱 방법
KR20100083364A (ko) * 2009-01-13 2010-07-22 삼성전자주식회사 전기적 특성 검사 장치
US8410804B1 (en) * 2009-02-24 2013-04-02 Keithley Instruments, Inc. Measurement system with high frequency ground switch
US8098076B2 (en) * 2009-04-01 2012-01-17 Formfactor, Inc. Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test
CN101949961B (zh) * 2010-08-16 2012-09-12 南京国博电子有限公司 射频测试用直流偏置探针卡
JP5621523B2 (ja) * 2010-11-09 2014-11-12 パナソニック株式会社 入力装置
EP2561759A1 (en) 2011-08-26 2013-02-27 Bayer Cropscience AG Fluoroalkyl-substituted 2-amidobenzimidazoles and their effect on plant growth
KR102168688B1 (ko) * 2013-12-19 2020-10-22 삼성디스플레이 주식회사 구동 칩 및 이를 포함하는 표시 장치
US10698020B2 (en) * 2014-03-26 2020-06-30 Teradyne, Inc. Current regulation for accurate and low-cost voltage measurements at the wafer level
US11041900B2 (en) * 2014-03-26 2021-06-22 Teradyne, Inc. Equi-resistant probe distribution for high-accuracy voltage measurements at the wafer level
CN105548752B (zh) * 2015-12-09 2018-06-26 上海华岭集成电路技术股份有限公司 可提高激励信号信噪比的测试系统
TWI595248B (zh) * 2016-01-20 2017-08-11 新特系統股份有限公司 使用開關切換單一訊號通道與複數個連接墊之連結的測試電路
US10642671B2 (en) * 2018-02-22 2020-05-05 Elite Semiconductor Memory Tecnology Inc. Testing apparatus and folded probe card testing system
KR102594695B1 (ko) * 2018-06-29 2023-10-25 주식회사 엘지에너지솔루션 배터리 관리 시스템, 그것을 포함하는 배터리팩 및 전류 측정 회로의 고장 판정 방법
US11573264B2 (en) * 2019-04-10 2023-02-07 Mediatek Inc. Device for testing chip or die with better system IR drop
CN114019338A (zh) * 2021-10-26 2022-02-08 上海华虹宏力半导体制造有限公司 分立器件的晶圆测试方法

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TW529232B (en) * 2000-01-18 2003-04-21 Formfactor Inc Apparatus for reducing power supply noise in an integrated circuit
TW200409923A (en) * 2002-07-12 2004-06-16 Formfactor Inc Compensation for test signal degradation due to DUT fault
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
CN1875466A (zh) * 2003-11-07 2006-12-06 朗姆研究公司 用于优化等离子体处理系统中的基板的方法和设备

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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW529232B (en) * 2000-01-18 2003-04-21 Formfactor Inc Apparatus for reducing power supply noise in an integrated circuit
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
TW200409923A (en) * 2002-07-12 2004-06-16 Formfactor Inc Compensation for test signal degradation due to DUT fault
CN1875466A (zh) * 2003-11-07 2006-12-06 朗姆研究公司 用于优化等离子体处理系统中的基板的方法和设备

Also Published As

Publication number Publication date
US20060152234A1 (en) 2006-07-13
US20080303541A1 (en) 2008-12-11
CN101099085B (zh) 2011-01-19
JP2008527346A (ja) 2008-07-24
JP2012189607A (ja) 2012-10-04
CN101099085A (zh) 2008-01-02
KR101293381B1 (ko) 2013-08-05
KR20070097095A (ko) 2007-10-02
US7880486B2 (en) 2011-02-01
US7414418B2 (en) 2008-08-19
TW200636260A (en) 2006-10-16
EP1839062A4 (en) 2010-09-29
WO2006073737A3 (en) 2007-03-08
WO2006073737A2 (en) 2006-07-13
EP1839062A2 (en) 2007-10-03

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