KR101285967B1 - 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템 - Google Patents

검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템 Download PDF

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KR101285967B1
KR101285967B1 KR1020087014775A KR20087014775A KR101285967B1 KR 101285967 B1 KR101285967 B1 KR 101285967B1 KR 1020087014775 A KR1020087014775 A KR 1020087014775A KR 20087014775 A KR20087014775 A KR 20087014775A KR 101285967 B1 KR101285967 B1 KR 101285967B1
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South Korea
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delete delete
data
inspection
design data
wafer
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KR1020087014775A
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English (en)
Korean (ko)
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KR20080080130A (ko
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아쇽 쿨카니
브라이언 더피
카이스 마야
고든 로우즈
쿠람 자파
사가 크케어
엘리스 창
알렌 팍
피터 로즈
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케이엘에이-텐코 코포레이션
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Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Publication of KR20080080130A publication Critical patent/KR20080080130A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR1020087014775A 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템 KR101285967B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US73829005P 2005-11-18 2005-11-18
US73794705P 2005-11-18 2005-11-18
US60/737,947 2005-11-18
US60/738,290 2005-11-18
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 2006-11-20
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 2006-11-20

Related Child Applications (1)

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KR1020137006368A Division KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

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KR20080080130A KR20080080130A (ko) 2008-09-02
KR101285967B1 true KR101285967B1 (ko) 2013-07-12

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KR1020187021977A KR20180088924A (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020167033159A KR101789004B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020087014775A KR101285967B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및시스템
KR1020177029140A KR101885585B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009231A KR101370154B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157000055A KR101613048B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009234A KR101530456B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157002473A KR101682838B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137006368A KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020147015035A KR101565071B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157030359A KR101672157B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

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KR1020187021977A KR20180088924A (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020167033159A KR101789004B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

Family Applications After (8)

Application Number Title Priority Date Filing Date
KR1020177029140A KR101885585B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009231A KR101370154B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157000055A KR101613048B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137009234A KR101530456B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157002473A KR101682838B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020137006368A KR101665168B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020147015035A KR101565071B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
KR1020157030359A KR101672157B1 (ko) 2005-11-18 2006-11-20 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

Country Status (5)

Country Link
EP (1) EP1955225A4 (ja)
JP (12) JP5465880B2 (ja)
KR (11) KR20180088924A (ja)
IL (14) IL191527A (ja)
WO (2) WO2007120280A2 (ja)

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US10713778B2 (en) 2017-12-19 2020-07-14 Samsung Electronics Co., Ltd. Semiconductor defect classification device, method for classifying defect of semiconductor, and semiconductor defect classification system

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