KR101264571B1 - 대형 펠리클 프레임체 및 그 프레임체의 파지 방법 - Google Patents

대형 펠리클 프레임체 및 그 프레임체의 파지 방법 Download PDF

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Publication number
KR101264571B1
KR101264571B1 KR1020127015729A KR20127015729A KR101264571B1 KR 101264571 B1 KR101264571 B1 KR 101264571B1 KR 1020127015729 A KR1020127015729 A KR 1020127015729A KR 20127015729 A KR20127015729 A KR 20127015729A KR 101264571 B1 KR101264571 B1 KR 101264571B1
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KR
South Korea
Prior art keywords
frame body
pellicle
frame
gripping
present
Prior art date
Application number
KR1020127015729A
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English (en)
Korean (ko)
Other versions
KR20120074334A (ko
Inventor
아키히로 다니무라
다쿠로 마에다
Original Assignee
아사히 가세이 이-매터리얼즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 아사히 가세이 이-매터리얼즈 가부시키가이샤 filed Critical 아사히 가세이 이-매터리얼즈 가부시키가이샤
Publication of KR20120074334A publication Critical patent/KR20120074334A/ko
Application granted granted Critical
Publication of KR101264571B1 publication Critical patent/KR101264571B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020127015729A 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법 KR101264571B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2007-179054 2007-07-06
JP2007179041 2007-07-06
JP2007179054 2007-07-06
JPJP-P-2007-179041 2007-07-06
PCT/JP2008/061945 WO2009008294A1 (ja) 2007-07-06 2008-07-02 大型ペリクルの枠体及び該枠体の把持方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020097026229A Division KR101191055B1 (ko) 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법

Publications (2)

Publication Number Publication Date
KR20120074334A KR20120074334A (ko) 2012-07-05
KR101264571B1 true KR101264571B1 (ko) 2013-05-14

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ID=40228472

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020097026229A KR101191055B1 (ko) 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법
KR1020127015729A KR101264571B1 (ko) 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020097026229A KR101191055B1 (ko) 2007-07-06 2008-07-02 대형 펠리클 프레임체 및 그 프레임체의 파지 방법

Country Status (5)

Country Link
JP (2) JP2010102357A (zh)
KR (2) KR101191055B1 (zh)
CN (2) CN101689018B (zh)
TW (2) TWI641904B (zh)
WO (1) WO2009008294A1 (zh)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5051840B2 (ja) * 2007-11-22 2012-10-17 信越化学工業株式会社 ペリクル収納容器内にペリクルを保管する方法
JP5134436B2 (ja) * 2008-05-27 2013-01-30 信越化学工業株式会社 リソグラフィ用ペリクル
JP4886070B2 (ja) * 2008-09-12 2012-02-29 旭化成イーマテリアルズ株式会社 ペリクル枠体、ペリクル及びペリクル枠体の使用方法
JP5411595B2 (ja) * 2009-06-24 2014-02-12 信越化学工業株式会社 ペリクルフレーム及びリソグラフィ用ペリクル
JP5411596B2 (ja) * 2009-06-24 2014-02-12 信越化学工業株式会社 ペリクルフレーム及びリソグラフィ用ペリクル
JP2011034020A (ja) * 2009-08-06 2011-02-17 Shin-Etsu Chemical Co Ltd ペリクル収納容器
WO2011043071A1 (ja) 2009-10-07 2011-04-14 三井化学株式会社 ペリクルおよびそのマスク接着剤
JP4879308B2 (ja) * 2009-10-29 2012-02-22 信越化学工業株式会社 ペリクル剥離用冶具および剥離方法
JP4951051B2 (ja) * 2009-10-30 2012-06-13 信越化学工業株式会社 ペリクルフレーム及びペリクル
JP5731147B2 (ja) * 2010-09-01 2015-06-10 旭化成イーマテリアルズ株式会社 ペリクル用枠体及びペリクル
JP5579545B2 (ja) * 2010-09-03 2014-08-27 旭化成イーマテリアルズ株式会社 大型ペリクル用枠体、大型ペリクル及び大型ペリクル用枠体の製造方法
JP2012093595A (ja) * 2010-10-28 2012-05-17 Shin Etsu Chem Co Ltd ペリクルフレームおよびペリクル
JP5649134B2 (ja) * 2011-02-08 2015-01-07 信越化学工業株式会社 ペリクルフレーム
JP5722760B2 (ja) * 2011-02-08 2015-05-27 信越化学工業株式会社 ペリクル製造用キット
JP5663376B2 (ja) * 2011-04-04 2015-02-04 信越化学工業株式会社 ペリクルフレーム、その製造方法、及びペリクル
JP5618888B2 (ja) * 2011-04-04 2014-11-05 信越化学工業株式会社 ペリクル及びペリクル膜の製造方法
JP5940283B2 (ja) * 2011-11-04 2016-06-29 信越化学工業株式会社 ペリクル
JP2013195950A (ja) * 2012-03-22 2013-09-30 Toppan Printing Co Ltd ベルクル及びフォトマスク
JP5795747B2 (ja) * 2012-04-04 2015-10-14 信越化学工業株式会社 ペリクルフレーム及びペリクル
EP2881792B1 (en) * 2012-08-02 2017-04-26 Mitsui Chemicals, Inc. Pellicle
JP5864399B2 (ja) * 2012-10-22 2016-02-17 信越化学工業株式会社 ペリクル収納容器
JP5984187B2 (ja) * 2013-04-22 2016-09-06 信越化学工業株式会社 ペリクルとフォトマスクのアセンブリ
JP5997380B2 (ja) * 2013-06-21 2016-09-28 三井屋工業株式会社 板材の端部の処理方法、板材の製造方法、板材の端部の処理装置、及び、板材
JP6389353B2 (ja) * 2013-08-15 2018-09-12 旭化成株式会社 ペリクル枠体及びペリクル
KR101918687B1 (ko) 2014-01-28 2018-11-14 삼성전자주식회사 펠리클
US10216081B2 (en) * 2014-05-02 2019-02-26 Mitsui Chemicals, Inc. Pellicle frame, pellicle and method of manufacturing the same, original plate for exposure and method of manufacturing the same, exposure device, and method of manufacturing semiconductor device
DE102014111995B4 (de) 2014-08-21 2022-10-13 Infineon Technologies Ag Verfahren zum ergreifen, zum bewegen und zum elektrischen testen eines halbleitermoduls
KR101910302B1 (ko) 2014-09-19 2018-10-19 미쯔이가가꾸가부시끼가이샤 펠리클, 펠리클의 제조 방법 및 펠리클을 사용한 노광 방법
EP3196699A4 (en) * 2014-09-19 2018-05-16 Mitsui Chemicals, Inc. Pellicle, production method thereof, exposure method
JP6304884B2 (ja) * 2014-09-22 2018-04-04 信越化学工業株式会社 ペリクルの貼り付け方法
NL2015795A (en) 2014-11-17 2016-09-06 Asml Netherlands Bv Mask assembly.
KR102082784B1 (ko) * 2014-12-11 2020-03-02 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
JP6347741B2 (ja) * 2014-12-25 2018-06-27 信越化学工業株式会社 ペリクル
JP6519190B2 (ja) * 2015-01-16 2019-05-29 日本軽金属株式会社 ペリクル用支持枠
JP2016139103A (ja) * 2015-01-29 2016-08-04 日本軽金属株式会社 ペリクル用支持枠
KR102501357B1 (ko) * 2015-02-19 2023-02-17 브이 테크놀로지 씨오. 엘티디 펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법
JP6376601B2 (ja) * 2015-05-18 2018-08-22 信越化学工業株式会社 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法
EP3391138A1 (en) 2015-12-14 2018-10-24 ASML Netherlands B.V. A membrane for euv lithography
EP3391140A1 (en) * 2015-12-14 2018-10-24 ASML Netherlands B.V. A membrane assembly
JP6559585B2 (ja) * 2016-01-25 2019-08-14 日本特殊陶業株式会社 ペリクル枠およびペリクル枠の製造方法
JP6604651B2 (ja) * 2016-02-22 2019-11-13 信越化学工業株式会社 ペリクル収納容器
JP6526588B2 (ja) * 2016-03-10 2019-06-05 日本特殊陶業株式会社 ペリクル枠およびペリクル枠の製造方法
JP6532428B2 (ja) * 2016-05-26 2019-06-19 信越化学工業株式会社 ペリクル
JP7017900B2 (ja) * 2016-11-11 2022-02-09 旭化成株式会社 ペリクル構造体、ペリクル収納体及び固定方法
JP6706575B2 (ja) * 2016-12-22 2020-06-10 信越化学工業株式会社 ペリクルフレーム及びこれを用いたペリクル
JP7357432B2 (ja) * 2017-10-10 2023-10-06 信越化学工業株式会社 Ｅｕｖ用ペリクルフレーム、ペリクル、ペリクル付露光原版、露光方法、及び半導体の製造方法
WO2019081095A1 (en) * 2017-10-27 2019-05-02 Asml Netherlands B.V. FILM FRAME AND FILM ASSEMBLY
JP6899759B2 (ja) * 2017-12-12 2021-07-07 日本軽金属株式会社 Ｆｐｄ（フラットパネルディスプレイ）用ペリクル枠体及びその製造方法
EP3764161A4 (en) * 2018-03-05 2021-12-01 Mitsui Chemicals, Inc. PELLICLE, EXPOSURE MASTER, EXPOSURE DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
US10768534B2 (en) * 2018-08-14 2020-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. Photolithography apparatus and method and method for handling wafer
JP7103252B2 (ja) * 2019-02-01 2022-07-20 信越化学工業株式会社 ペリクルフレーム、ペリクル、マスク粘着剤付ペリクルフレーム、ペリクル付露光原版、露光方法及び半導体の製造方法
JP7347789B2 (ja) * 2019-07-09 2023-09-20 三井化学株式会社 ペリクル枠体及びペリクル
TW202129404A (zh) * 2020-01-21 2021-08-01 日商信越化學工業股份有限公司 防護薄膜框架、防護薄膜、帶防護薄膜的曝光原版及曝光方法、以及半導體或液晶顯示器的製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4833051A (en) * 1984-08-20 1989-05-23 Nippon Kogaku K.K. Protective device for photographic masks
JP2595993B2 (ja) * 1987-10-09 1997-04-02 株式会社ニコン 露光用原板作成装置及び方法
JP3242693B2 (ja) * 1992-05-15 2001-12-25 富士通株式会社 ペリクル貼り付け装置
JPH095982A (ja) * 1995-06-17 1997-01-10 Mitsui Petrochem Ind Ltd マスク保護装置の剥離方法
JPH09106066A (ja) * 1995-10-09 1997-04-22 Nikon Corp ペリクルライナーの剥離方法
JPH1048811A (ja) * 1996-08-07 1998-02-20 Mitsui Petrochem Ind Ltd マスク保護装置とペリクル枠
JP4007752B2 (ja) * 1999-07-30 2007-11-14 旭化成エレクトロニクス株式会社 大型ペリクル用枠体及び大型ペリクル
JP2002131892A (ja) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd ペリクルの剥離方法及びその装置
US6524754B2 (en) * 2001-01-22 2003-02-25 Photronics, Inc. Fused silica pellicle
JP2003222990A (ja) * 2001-11-21 2003-08-08 Asahi Glass Co Ltd ペリクルのフォトマスクへの装着構造
US7205074B2 (en) * 2002-12-31 2007-04-17 Intel Corporation Venting of pellicle cavity for a mask
JP2004240010A (ja) * 2003-02-04 2004-08-26 Asahi Kasei Electronics Co Ltd ペリクルの収納方法
JP4030888B2 (ja) * 2003-02-05 2008-01-09 Ｓｍｋ株式会社 モジュール用ソケット
JP4330377B2 (ja) * 2003-05-15 2009-09-16 旭化成イーマテリアルズ株式会社 大型ペリクルの組立方法及び大型ペリクルの組立装置
JP4497845B2 (ja) * 2003-06-04 2010-07-07 旭化成イーマテリアルズ株式会社 大型ペリクルの収納方法
JP2005202011A (ja) * 2004-01-14 2005-07-28 Mitsui Chemicals Inc ペリクル
JP2005308901A (ja) * 2004-04-19 2005-11-04 Shin Etsu Chem Co Ltd ペリクルフレーム及びそれを用いたフォトリソグラフィー用ペリクル
JP2005326634A (ja) * 2004-05-14 2005-11-24 Mitsui Chemicals Inc ペリクルの収納方法
JP2006146064A (ja) * 2004-11-24 2006-06-08 Asahi Kasei Electronics Co Ltd 大型ペリクル剥離用仮枠
JP4391435B2 (ja) * 2005-03-22 2009-12-24 信越化学工業株式会社 ペリクル収納容器
US20060246234A1 (en) * 2005-04-20 2006-11-02 Yazaki Corporation Photomask assembly incorporating a metal/scavenger pellicle frame
JP2006301525A (ja) * 2005-04-25 2006-11-02 Shin Etsu Chem Co Ltd ペリクルフレーム
JP2006323178A (ja) * 2005-05-19 2006-11-30 Shin Etsu Chem Co Ltd リソグラフィ用ペリクル及びその製造方法
JP4677632B2 (ja) * 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
JP2008083166A (ja) * 2006-09-26 2008-04-10 Toppan Printing Co Ltd ペリクルフレーム
JP5052106B2 (ja) * 2006-11-22 2012-10-17 旭化成イーマテリアルズ株式会社 ペリクルの収納方法

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Publication number Publication date
TWI498671B (zh) 2015-09-01
CN101689018B (zh) 2013-03-20
TW201523125A (zh) 2015-06-16
CN102681334B (zh) 2015-09-30
JP5792274B2 (ja) 2015-10-07
KR20120074334A (ko) 2012-07-05
CN102681334A (zh) 2012-09-19
WO2009008294A1 (ja) 2009-01-15
JP2014098913A (ja) 2014-05-29
KR20100028040A (ko) 2010-03-11
CN101689018A (zh) 2010-03-31
TWI641904B (zh) 2018-11-21
KR101191055B1 (ko) 2012-10-15
TW200919081A (en) 2009-05-01
JP2010102357A (ja) 2010-05-06

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