KR101212042B1 - 전자 회로 시험 장치 - Google Patents

전자 회로 시험 장치 Download PDF

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Publication number
KR101212042B1
KR101212042B1 KR1020077009061A KR20077009061A KR101212042B1 KR 101212042 B1 KR101212042 B1 KR 101212042B1 KR 1020077009061 A KR1020077009061 A KR 1020077009061A KR 20077009061 A KR20077009061 A KR 20077009061A KR 101212042 B1 KR101212042 B1 KR 101212042B1
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KR
South Korea
Prior art keywords
electronic circuit
lsi chip
lsi
probe
coil
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Expired - Lifetime
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KR1020077009061A
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English (en)
Korean (ko)
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KR20070067160A (ko
Inventor
다다히로 구로다
다이스케 미조구치
노리유키 미우라
Original Assignee
각고호우징 게이오기주크
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Application filed by 각고호우징 게이오기주크 filed Critical 각고호우징 게이오기주크
Publication of KR20070067160A publication Critical patent/KR20070067160A/ko
Application granted granted Critical
Publication of KR101212042B1 publication Critical patent/KR101212042B1/ko
Assigned to 가부시키가이샤 트루칩 재팬 reassignment 가부시키가이샤 트루칩 재팬 권리의 전부이전등록 Assignors: 각고호우징 게이오기주크
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/315—Contactless testing by inductive methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020077009061A 2004-09-30 2005-09-21 전자 회로 시험 장치 Expired - Lifetime KR101212042B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004289268A JP5024740B2 (ja) 2004-09-30 2004-09-30 Ｌｓｉチップ試験装置
JPJP-P-2004-00289268 2004-09-30

Publications (2)

Publication Number Publication Date
KR20070067160A KR20070067160A (ko) 2007-06-27
KR101212042B1 true KR101212042B1 (ko) 2012-12-13

Family

ID=36118793

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077009061A Expired - Lifetime KR101212042B1 (ko) 2004-09-30 2005-09-21 전자 회로 시험 장치

Country Status (5)

Country Link
US (1) US8648614B2 (https=)
JP (1) JP5024740B2 (https=)
KR (1) KR101212042B1 (https=)
TW (1) TW200619652A (https=)
WO (1) WO2006035644A1 (https=)

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US7999383B2 (en) * 2006-07-21 2011-08-16 Bae Systems Information And Electronic Systems Integration Inc. High speed, high density, low power die interconnect system
DE102007030745A1 (de) * 2007-07-02 2009-01-08 Siemens Medical Instruments Pte. Ltd. Mehrkomponentiges Hörgerätesystem und ein Verfahren zu seinem Betrieb
JP5491868B2 (ja) 2007-11-26 2014-05-14 学校法人慶應義塾 電子回路
JP5600237B2 (ja) 2008-02-02 2014-10-01 学校法人慶應義塾 集積回路
JP5475962B2 (ja) 2008-04-28 2014-04-16 学校法人慶應義塾 電子回路
JP5252486B2 (ja) 2008-05-14 2013-07-31 学校法人慶應義塾 インダクタ素子、集積回路装置、及び、三次元実装回路装置
JP5671200B2 (ja) 2008-06-03 2015-02-18 学校法人慶應義塾 電子回路
JP4982778B2 (ja) 2008-07-04 2012-07-25 学校法人慶應義塾 電子回路装置
KR20100015206A (ko) * 2008-08-04 2010-02-12 삼성전자주식회사 무선 테스트용 인터페이스 장치, 그것을 포함하는 반도체소자와 반도체 패키지 및 그것을 이용한 무선 테스트 방법
JP5325495B2 (ja) 2008-08-12 2013-10-23 学校法人慶應義塾 半導体装置及びその製造方法
JP5433199B2 (ja) 2008-10-21 2014-03-05 学校法人慶應義塾 電子回路
JP5326088B2 (ja) 2008-10-21 2013-10-30 学校法人慶應義塾 電子回路と通信機能検査方法
US7935549B2 (en) * 2008-12-09 2011-05-03 Renesas Electronics Corporation Seminconductor device
JP5283075B2 (ja) 2008-12-26 2013-09-04 学校法人慶應義塾 電子回路
JP5395458B2 (ja) 2009-02-25 2014-01-22 学校法人慶應義塾 インダクタ素子及び集積回路装置
JP5554937B2 (ja) * 2009-04-22 2014-07-23 パナソニック株式会社 非接触給電システム
JP5374246B2 (ja) 2009-06-12 2013-12-25 学校法人慶應義塾 密封型半導体記録媒体及び密封型半導体記録装置
JP5635759B2 (ja) 2009-10-15 2014-12-03 学校法人慶應義塾 積層半導体集積回路装置
JP5750031B2 (ja) 2010-11-19 2015-07-15 株式会社半導体エネルギー研究所 電子回路及び半導体装置
KR101313555B1 (ko) * 2011-11-10 2013-10-01 삼성중공업 주식회사 인쇄 회로 기판에 실장된 아이솔레이터의 검사 장치
JP2013197988A (ja) 2012-03-21 2013-09-30 Advantest Corp 無線通信装置および無線通信システム
TWI482971B (zh) * 2013-09-13 2015-05-01 Nat University Of Kaohsuing Inductive three - dimensional double - sided electrical measurement fixture
CN105676109B (zh) * 2016-01-08 2019-08-02 青岛海信电器股份有限公司 一种主板测试方法及设备
US10612992B2 (en) * 2017-11-03 2020-04-07 Lockheed Martin Corporation Strain gauge detection and orientation system

Citations (2)

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JP2004037213A (ja) 2002-07-02 2004-02-05 Konica Minolta Holdings Inc 半導体パッケージ及びその製造方法並びに半導体パッケージの検査方法
US20050253614A1 (en) 2004-05-13 2005-11-17 Fujitsu Limited Electrical connecting method

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JPH022967A (ja) 1988-06-17 1990-01-08 Nec Corp ブロービング装置
US5701037A (en) 1994-11-15 1997-12-23 Siemens Aktiengesellschaft Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit
DE19503329C2 (de) 1995-02-02 2000-05-18 Ita Ingb Testaufgaben Gmbh Testvorrichtung für elektronische Flachbaugruppen
JPH08334541A (ja) 1995-06-05 1996-12-17 Mitsubishi Electric Corp 電流検出器及びそれを利用したプリント板配線の接触部検出方法
JP3528367B2 (ja) * 1995-09-30 2004-05-17 ソニーケミカル株式会社 リーダ・ライタ用アンテナ
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
US6242923B1 (en) 1997-02-27 2001-06-05 International Business Machines Corporation Method for detecting power plane-to-power plane shorts and I/O net-to power plane shorts in modules and printed circuit boards
US6154043A (en) * 1997-05-07 2000-11-28 Advanced Micro Devices, Inc. Method and apparatus for identifying the position of a selected semiconductor die relative to other dice formed from the same semiconductor wafer
US6236223B1 (en) * 1998-11-09 2001-05-22 Intermec Ip Corp. Method and apparatus for wireless radio frequency testing of RFID integrated circuits
JP3603996B2 (ja) 1999-04-28 2004-12-22 シャープ株式会社 シート抵抗測定器
TW536627B (en) 2000-07-24 2003-06-11 Sentec Ltd Current sensor
WO2002063675A1 (en) * 2001-02-02 2002-08-15 Hitachi, Ltd. Integrated circuit, method of testing integrated circuit and method of manufacturing integrated circuit
US6693426B1 (en) * 2002-02-09 2004-02-17 Intematix Corporation Spatially resolved spin resonance detection
CA2404183C (en) * 2002-09-19 2008-09-02 Scanimetrics Inc. Non-contact tester for integrated circuits
US6958616B1 (en) * 2003-11-07 2005-10-25 Xilinx, Inc. Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pins
JP4131544B2 (ja) 2004-02-13 2008-08-13 学校法人慶應義塾 電子回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004037213A (ja) 2002-07-02 2004-02-05 Konica Minolta Holdings Inc 半導体パッケージ及びその製造方法並びに半導体パッケージの検査方法
US20050253614A1 (en) 2004-05-13 2005-11-17 Fujitsu Limited Electrical connecting method

Also Published As

Publication number Publication date
JP5024740B2 (ja) 2012-09-12
US8648614B2 (en) 2014-02-11
US20080258744A1 (en) 2008-10-23
WO2006035644A1 (ja) 2006-04-06
KR20070067160A (ko) 2007-06-27
JP2006105630A (ja) 2006-04-20
TWI377352B (https=) 2012-11-21
TW200619652A (en) 2006-06-16

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