KR101151023B1 - 익스팬드방법 및 익스팬드장치 - Google Patents

익스팬드방법 및 익스팬드장치 Download PDF

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Publication number
KR101151023B1
KR101151023B1 KR1020057007336A KR20057007336A KR101151023B1 KR 101151023 B1 KR101151023 B1 KR 101151023B1 KR 1020057007336 A KR1020057007336 A KR 1020057007336A KR 20057007336 A KR20057007336 A KR 20057007336A KR 101151023 B1 KR101151023 B1 KR 101151023B1
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KR
South Korea
Prior art keywords
adhesive sheet
plate
frame
dicing
expand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057007336A
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English (en)
Korean (ko)
Other versions
KR20050059315A (ko
Inventor
유이치 쿠보
마사테루 오사다
마사유키 아즈마
야스유키 사카야
유우스케 아라이
도모히로 다마키
Original Assignee
가부시키가이샤 토쿄 세이미쯔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002312456A external-priority patent/JP2004146727A/ja
Priority claimed from JP2003179680A external-priority patent/JP4306337B2/ja
Priority claimed from JP2003277272A external-priority patent/JP4247670B2/ja
Priority claimed from JP2003279713A external-priority patent/JP4306359B2/ja
Priority claimed from JP2003288492A external-priority patent/JP4238669B2/ja
Priority claimed from JP2003338796A external-priority patent/JP4385705B2/ja
Priority claimed from JP2003338795A external-priority patent/JP4288392B2/ja
Application filed by 가부시키가이샤 토쿄 세이미쯔 filed Critical 가부시키가이샤 토쿄 세이미쯔
Publication of KR20050059315A publication Critical patent/KR20050059315A/ko
Publication of KR101151023B1 publication Critical patent/KR101151023B1/ko
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020057007336A 2002-10-28 2003-10-27 익스팬드방법 및 익스팬드장치 Expired - Fee Related KR101151023B1 (ko)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00312456 2002-10-28
JP2002312456A JP2004146727A (ja) 2002-10-28 2002-10-28 ウェーハの搬送方法
JP2003179680A JP4306337B2 (ja) 2003-06-24 2003-06-24 エキスパンド方法
JPJP-P-2003-00179680 2003-06-24
JP2003277272A JP4247670B2 (ja) 2003-07-22 2003-07-22 エキスパンド方法及びエキスパンド装置
JPJP-P-2003-00277272 2003-07-22
JP2003279713A JP4306359B2 (ja) 2003-07-25 2003-07-25 エキスパンド方法
JPJP-P-2003-00279713 2003-07-25
JPJP-P-2003-00288492 2003-08-07
JP2003288492A JP4238669B2 (ja) 2003-08-07 2003-08-07 エキスパンド方法及びエキスパンド装置
JPJP-P-2003-00338795 2003-09-29
JPJP-P-2003-00338796 2003-09-29
JP2003338796A JP4385705B2 (ja) 2003-09-29 2003-09-29 エキスパンド方法
JP2003338795A JP4288392B2 (ja) 2003-09-29 2003-09-29 エキスパンド方法
PCT/JP2003/013711 WO2004038779A1 (ja) 2002-10-28 2003-10-27 エキスパンド方法及びエキスパンド装置

Publications (2)

Publication Number Publication Date
KR20050059315A KR20050059315A (ko) 2005-06-17
KR101151023B1 true KR101151023B1 (ko) 2012-05-30

Family

ID=32180845

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057007336A Expired - Fee Related KR101151023B1 (ko) 2002-10-28 2003-10-27 익스팬드방법 및 익스팬드장치

Country Status (5)

Country Link
US (1) US7886798B2 (enExample)
EP (1) EP1575081A1 (enExample)
KR (1) KR101151023B1 (enExample)
TW (1) TW200414336A (enExample)
WO (1) WO2004038779A1 (enExample)

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JP4624813B2 (ja) 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
JP2008544516A (ja) * 2005-06-16 2008-12-04 エヌエックスピー ビー ヴィ ホイルキャリアのホイルを延伸させる手段、ウエハからダイ片を剥離させる機構及びダイ片剥離方法
US7608523B2 (en) * 2005-08-26 2009-10-27 Disco Corporation Wafer processing method and adhesive tape used in the wafer processing method
US7838331B2 (en) 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
US7517725B2 (en) * 2005-11-28 2009-04-14 Xci, Inc. System and method for separating and packaging integrated circuits
DE102008041250A1 (de) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
DE102008058310B3 (de) * 2008-11-18 2010-06-17 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Randentschichten beschichteter Substrate und Trennen in einzelne Module
CN101850538B (zh) * 2009-04-01 2012-10-10 日月光半导体制造股份有限公司 晶圆的支撑治具与研磨、输送及切割晶圆的方法
JP5854215B2 (ja) * 2011-02-16 2016-02-09 株式会社東京精密 ワーク分割装置及びワーク分割方法
KR101248313B1 (ko) * 2012-06-29 2013-03-27 세메스 주식회사 헤드 교체 장치 및 이를 포함하는 다이 본딩 시스템
CN104303277B (zh) * 2012-12-21 2017-05-10 株式会社新川 覆晶黏晶机以及黏晶平台的平坦度与变形量补正方法
US9236305B2 (en) 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
JP6110257B2 (ja) * 2013-08-23 2017-04-05 株式会社ディスコ ウエーハユニットの処理方法
JP2015207604A (ja) * 2014-04-17 2015-11-19 株式会社ディスコ ウェーハの加工方法
JP6266429B2 (ja) * 2014-05-08 2018-01-24 株式会社ディスコ チップ間隔維持装置及びチップ間隔維持方法
US11195756B2 (en) * 2014-09-19 2021-12-07 Applied Materials, Inc. Proximity contact cover ring for plasma dicing
JP6366447B2 (ja) * 2014-09-30 2018-08-01 株式会社ディスコ 拡張装置、及び接着シートの破断方法
WO2018013769A1 (en) * 2016-07-13 2018-01-18 Universal Instruments Corporation Modular die handling system
JP6934327B2 (ja) * 2017-06-07 2021-09-15 株式会社ディスコ ウエーハの分割方法及び分割装置
KR102416073B1 (ko) * 2018-02-28 2022-07-01 미쓰이 가가쿠 토세로 가부시키가이샤 부품 제조 방법, 보지 필름 및 보지구 형성 장치
US11171031B2 (en) * 2018-07-23 2021-11-09 Texas Instruments Incorporated Die matrix expander with partitioned subring
US11483937B2 (en) * 2018-12-28 2022-10-25 X Display Company Technology Limited Methods of making printed structures
JP7362202B2 (ja) * 2019-04-15 2023-10-17 株式会社ディスコ エキスパンド装置、エキスパンド方法
US11508606B2 (en) 2019-11-05 2022-11-22 Nxp B.V. Technique for handling diced wafers of integrated circuits
US11658056B2 (en) * 2019-11-05 2023-05-23 Nxp B.V. Technique for handling diced wafers of integrated circuits
CN112967968B (zh) * 2020-05-20 2022-05-31 重庆康佳光电技术研究院有限公司 一种转移装置及转移方法
CN112967970B (zh) * 2020-05-21 2022-09-27 重庆康佳光电技术研究院有限公司 一种转移方法及显示背板
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法
CN112642807B (zh) * 2020-12-26 2021-12-17 枣庄科顺数码有限公司 一种用于计算机主机震动除尘装置
TWI831174B (zh) * 2021-04-21 2024-02-01 南韓商杰宜斯科技有限公司 基板清洗裝置及其控制方法
KR20220144989A (ko) 2021-04-21 2022-10-28 주식회사 제우스 기판세정장치
KR102913863B1 (ko) * 2021-04-21 2026-01-19 주식회사 제우스 기판처리장치 및 기판처리방법
CN114038783A (zh) * 2021-07-27 2022-02-11 重庆康佳光电技术研究院有限公司 扩膜装置及晶圆的加工方法
DE112022006550T5 (de) * 2022-04-27 2025-01-02 Yamaha Hatsudoki Kabushiki Kaisha Ausdehnungsvorrichtung, Verfahren zur Herstellung von Halbleiterchips, sowie Halbleiterchip

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US3936204A (en) * 1974-10-02 1976-02-03 Central Research Laboratories, Inc. Tape clamp
US5186775A (en) * 1988-10-05 1993-02-16 Cullen John S Method of fabrication of a container for bulk material
US6176966B1 (en) * 1997-06-12 2001-01-23 Lintec Corporation Method of die bonding electronic component and die bonding apparatus thereof
US6344402B1 (en) * 1999-07-28 2002-02-05 Disco Corporation Method of dicing workpiece

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JPH07321070A (ja) 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
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JP3538070B2 (ja) 1999-07-08 2004-06-14 株式会社東芝 半導体装置の製造方法
JP4488590B2 (ja) 1999-07-28 2010-06-23 株式会社ディスコ 被加工物の分割方法
JP4744742B2 (ja) * 2001-08-06 2011-08-10 株式会社ディスコ 被加工物の分割処理方法および分割処理方法に用いるチップ間隔拡張装置
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US3936204A (en) * 1974-10-02 1976-02-03 Central Research Laboratories, Inc. Tape clamp
US5186775A (en) * 1988-10-05 1993-02-16 Cullen John S Method of fabrication of a container for bulk material
US6176966B1 (en) * 1997-06-12 2001-01-23 Lintec Corporation Method of die bonding electronic component and die bonding apparatus thereof
US6344402B1 (en) * 1999-07-28 2002-02-05 Disco Corporation Method of dicing workpiece

Also Published As

Publication number Publication date
US20080105383A1 (en) 2008-05-08
EP1575081A1 (en) 2005-09-14
TW200414336A (en) 2004-08-01
KR20050059315A (ko) 2005-06-17
TWI295818B (enExample) 2008-04-11
US7886798B2 (en) 2011-02-15
WO2004038779A1 (ja) 2004-05-06

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