TWI295818B - - Google Patents

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Publication number
TWI295818B
TWI295818B TW092129921A TW92129921A TWI295818B TW I295818 B TWI295818 B TW I295818B TW 092129921 A TW092129921 A TW 092129921A TW 92129921 A TW92129921 A TW 92129921A TW I295818 B TWI295818 B TW I295818B
Authority
TW
Taiwan
Prior art keywords
adhesive film
plate
frame
expansion
mentioned
Prior art date
Application number
TW092129921A
Other languages
English (en)
Chinese (zh)
Other versions
TW200414336A (en
Inventor
Yuichi Kubo
Masateru Osada
Masayuki Azuma
Yasuyuki Sakaya
Yuusuke Arai
Tomohiro Tamaki
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002312456A external-priority patent/JP2004146727A/ja
Priority claimed from JP2003179680A external-priority patent/JP4306337B2/ja
Priority claimed from JP2003277272A external-priority patent/JP4247670B2/ja
Priority claimed from JP2003279713A external-priority patent/JP4306359B2/ja
Priority claimed from JP2003288492A external-priority patent/JP4238669B2/ja
Priority claimed from JP2003338796A external-priority patent/JP4385705B2/ja
Priority claimed from JP2003338795A external-priority patent/JP4288392B2/ja
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200414336A publication Critical patent/TW200414336A/zh
Application granted granted Critical
Publication of TWI295818B publication Critical patent/TWI295818B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW092129921A 2002-10-28 2003-10-28 Adhesive sheet expansion method and device TW200414336A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2002312456A JP2004146727A (ja) 2002-10-28 2002-10-28 ウェーハの搬送方法
JP2003179680A JP4306337B2 (ja) 2003-06-24 2003-06-24 エキスパンド方法
JP2003277272A JP4247670B2 (ja) 2003-07-22 2003-07-22 エキスパンド方法及びエキスパンド装置
JP2003279713A JP4306359B2 (ja) 2003-07-25 2003-07-25 エキスパンド方法
JP2003288492A JP4238669B2 (ja) 2003-08-07 2003-08-07 エキスパンド方法及びエキスパンド装置
JP2003338796A JP4385705B2 (ja) 2003-09-29 2003-09-29 エキスパンド方法
JP2003338795A JP4288392B2 (ja) 2003-09-29 2003-09-29 エキスパンド方法

Publications (2)

Publication Number Publication Date
TW200414336A TW200414336A (en) 2004-08-01
TWI295818B true TWI295818B (enExample) 2008-04-11

Family

ID=32180845

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092129921A TW200414336A (en) 2002-10-28 2003-10-28 Adhesive sheet expansion method and device

Country Status (5)

Country Link
US (1) US7886798B2 (enExample)
EP (1) EP1575081A1 (enExample)
KR (1) KR101151023B1 (enExample)
TW (1) TW200414336A (enExample)
WO (1) WO2004038779A1 (enExample)

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JP4624813B2 (ja) 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
JP2008544516A (ja) * 2005-06-16 2008-12-04 エヌエックスピー ビー ヴィ ホイルキャリアのホイルを延伸させる手段、ウエハからダイ片を剥離させる機構及びダイ片剥離方法
US7608523B2 (en) * 2005-08-26 2009-10-27 Disco Corporation Wafer processing method and adhesive tape used in the wafer processing method
US7838331B2 (en) 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
US7517725B2 (en) * 2005-11-28 2009-04-14 Xci, Inc. System and method for separating and packaging integrated circuits
DE102008041250A1 (de) * 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
DE102008058310B3 (de) * 2008-11-18 2010-06-17 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Randentschichten beschichteter Substrate und Trennen in einzelne Module
CN101850538B (zh) * 2009-04-01 2012-10-10 日月光半导体制造股份有限公司 晶圆的支撑治具与研磨、输送及切割晶圆的方法
JP5854215B2 (ja) * 2011-02-16 2016-02-09 株式会社東京精密 ワーク分割装置及びワーク分割方法
KR101248313B1 (ko) * 2012-06-29 2013-03-27 세메스 주식회사 헤드 교체 장치 및 이를 포함하는 다이 본딩 시스템
CN104303277B (zh) * 2012-12-21 2017-05-10 株式会社新川 覆晶黏晶机以及黏晶平台的平坦度与变形量补正方法
US9236305B2 (en) 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
JP6110257B2 (ja) * 2013-08-23 2017-04-05 株式会社ディスコ ウエーハユニットの処理方法
JP2015207604A (ja) * 2014-04-17 2015-11-19 株式会社ディスコ ウェーハの加工方法
JP6266429B2 (ja) * 2014-05-08 2018-01-24 株式会社ディスコ チップ間隔維持装置及びチップ間隔維持方法
US11195756B2 (en) * 2014-09-19 2021-12-07 Applied Materials, Inc. Proximity contact cover ring for plasma dicing
JP6366447B2 (ja) * 2014-09-30 2018-08-01 株式会社ディスコ 拡張装置、及び接着シートの破断方法
WO2018013769A1 (en) * 2016-07-13 2018-01-18 Universal Instruments Corporation Modular die handling system
JP6934327B2 (ja) * 2017-06-07 2021-09-15 株式会社ディスコ ウエーハの分割方法及び分割装置
KR102416073B1 (ko) * 2018-02-28 2022-07-01 미쓰이 가가쿠 토세로 가부시키가이샤 부품 제조 방법, 보지 필름 및 보지구 형성 장치
US11171031B2 (en) * 2018-07-23 2021-11-09 Texas Instruments Incorporated Die matrix expander with partitioned subring
US11483937B2 (en) * 2018-12-28 2022-10-25 X Display Company Technology Limited Methods of making printed structures
JP7362202B2 (ja) * 2019-04-15 2023-10-17 株式会社ディスコ エキスパンド装置、エキスパンド方法
US11508606B2 (en) 2019-11-05 2022-11-22 Nxp B.V. Technique for handling diced wafers of integrated circuits
US11658056B2 (en) * 2019-11-05 2023-05-23 Nxp B.V. Technique for handling diced wafers of integrated circuits
CN112967968B (zh) * 2020-05-20 2022-05-31 重庆康佳光电技术研究院有限公司 一种转移装置及转移方法
CN112967970B (zh) * 2020-05-21 2022-09-27 重庆康佳光电技术研究院有限公司 一种转移方法及显示背板
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法
CN112642807B (zh) * 2020-12-26 2021-12-17 枣庄科顺数码有限公司 一种用于计算机主机震动除尘装置
TWI831174B (zh) * 2021-04-21 2024-02-01 南韓商杰宜斯科技有限公司 基板清洗裝置及其控制方法
KR20220144989A (ko) 2021-04-21 2022-10-28 주식회사 제우스 기판세정장치
KR102913863B1 (ko) * 2021-04-21 2026-01-19 주식회사 제우스 기판처리장치 및 기판처리방법
CN114038783A (zh) * 2021-07-27 2022-02-11 重庆康佳光电技术研究院有限公司 扩膜装置及晶圆的加工方法
DE112022006550T5 (de) * 2022-04-27 2025-01-02 Yamaha Hatsudoki Kabushiki Kaisha Ausdehnungsvorrichtung, Verfahren zur Herstellung von Halbleiterchips, sowie Halbleiterchip

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Also Published As

Publication number Publication date
US20080105383A1 (en) 2008-05-08
KR101151023B1 (ko) 2012-05-30
EP1575081A1 (en) 2005-09-14
TW200414336A (en) 2004-08-01
KR20050059315A (ko) 2005-06-17
US7886798B2 (en) 2011-02-15
WO2004038779A1 (ja) 2004-05-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees