US4744550A - Vacuum wafer expander apparatus - Google Patents

Vacuum wafer expander apparatus Download PDF

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Publication number
US4744550A
US4744550A US06/855,841 US85584186A US4744550A US 4744550 A US4744550 A US 4744550A US 85584186 A US85584186 A US 85584186A US 4744550 A US4744550 A US 4744550A
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United States
Prior art keywords
member
means
vacuum
mounting bracket
upper portion
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Expired - Fee Related
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US06/855,841
Inventor
Ivan W. Oglesbee
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ASM America Inc
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ASM America Inc
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Publication date
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Priority to US06/855,841 priority Critical patent/US4744550A/en
Assigned to ASM AMERICA, INC. reassignment ASM AMERICA, INC. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: OGLESBEE, IVAN W.
Application granted granted Critical
Publication of US4744550A publication Critical patent/US4744550A/en
Assigned to ASM AMERICA, INC. reassignment ASM AMERICA, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ADVANCED SEMICONDUCTOR MATERIALS AMERICA, INC.
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052Means for supporting or holding work during breaking
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043Making grooves, e.g. cutting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/10Methods
    • Y10T225/12With preliminary weakening
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/307Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321Preliminary weakener
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49789Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979Breaking through weakened portion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53961Means to assemble or disassemble with work-holder for assembly
    • Y10T29/53974Means to assemble or disassemble with work-holder for assembly having means to permit support movement while work is thereon

Abstract

A vacuum wafer expander apparatus and method of wafers for use in electrical circuitry. A plurality of electronic semiconductor devices being connected to a flexible member means suitable for are mounted on a brace or bracket frame member means. The brace or bracket frame member means is suitable for being removably mounted on a bracket mounting means having a groove therearound for accommodating a vacuum therein to allow an abutting portion of the flexible material to be pushed in said groove; thus expanding the flexible member means as well as the plurality of electronic semiconductor devices thereon. The electronic semiconductor devices can thereafter be optically inspected and individually picked up from the flexible member means for processing.

Description

BACKGROUND OF THE INVENTION

This invention relates generally to a vacuum wafer expander apparatus and method of making wafers for use in electronic circuitry. More particularly, the invention relates to diced wafers comprising a plurality of electronic semiconductor devices being connected to a flexible member being mounted on a bracket member means. The bracket member means is suitable for being removably mounted on a bracket mounting means having a groove therearound for accommodating a vacuum therein to allow an abutting flexible material to be pulled into said groove; thus expanding the flexible member as well as the diced wafer of electronic semiconductor devices connected thereto.

It is known that appratuses for use in examining wafers are readily available. Further apparatuses suitable for expanding wafers by use of abutting members having the wafers located therebetween wherein an abutting member physically impinges upon the flexible member against an opposing member to cause the wafers to expand. However, the existing apparatus, as described, is cumbersome and expensive. Also, the expansion derived therefrom tends not to be uniform due to the extraneous friction forces applied onto the surfaces of the flexible material when the wafer expansion procedure is in operation.

Accordingly, there is a dire need for an efficient, economical, simply constructed and easily installed vacuum wafer expander apparatus and method for mounting onto an easily accessible wafer inspection and processing apparatus and suitable for efficiently and uniformly expanding a plurality of electronic semiconductor devices. Moreover, the vacuum wafer expander apparatus and method of the present invention embodies a simply constructed combination of inexpensive, easily accessible and rapidly manufactured parts, yet efficient to function in effectively expanding wafers for inspection and processing.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a wafer vacuum expander apparatus and method for use generally in expanding a diced wafer having a plurality of semiconductor devices for inspection and processing thereof.

It is still another object of the present invention to provide a wafer expander apparatus and method for use in removably mounting onto a bracket mounting member suitable for accommodating a vacuum means to expand said wafers.

It is a further object of the present invention to provide a wafer expander apparatus and method for mounting onto a readily available wafer inspection and processing apparatus.

It is a further object of the present invention to provide a wafer expander apparatus and method which may be economically assembled in a compact form having few parts which may be operably coupled to an easily accessible wafer inspection and processing apparatus.

It is yet a further object of the present invention to provide a wafer expander apparatus and method which may be removably mounted onto a bracket mounting means suitable for being adjusted in an incremental manner when a plurality of electronic semiconductor devices are being inspected and processed thereon.

It is yet a further object of the present invention to accomplish the above by a wafer expander apparatus and method utilizing therefrom parts which will be durable in construction, long lasting, economical and efficient when in use.

The foregoing and other object, features and advantages of this invention will be apparent from the following, more particular description of the preferred embodiments of this invention, as illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a conventional wafer holder apparatus for attaching to a wafer inspection and processing apparatus.

FIG. 2 is a side elevational view of the wafer holder apparatus.

FIG. 3 is a top elevational view of the vacuum wafer expander apparatus of the present invention with an associated vacuum hose member connected to a mounting member.

FIG. 4 is a cross-sectional view taken along line 4--4 of FIG. 3 showing the manner in which the wafer holder apparatus mounts onto the associated mounting member of the vacuum expander apparatus of the present invention.

FIG. 5 is a cross-sectional view taken along line 5--5 of FIG. 3 showing the manner in which a flexible member joined therebelow a plurality of electronic semiconductor devices is initially placed thereabove the associated mounting member of the wafer expander apparatus of the present invention.

FIG. 6 is a sequential view of FIG. 5 showing the manner in which the flexible member is pulled into an associated groove inherent to the mounting member.

FIG. 7 is a perspective view of the manner in which a pick-up tool member lifts up at least one electronic semiconductor device from the associated flexible member.

FIG. 8 is a partial cross-sectional view taken along line 8--8 of FIG. 3 showing the manner in which an adjusting screw member is operably coupled to the associated mounting member.

FIG. 9 is a partial cross-sectional view taken along line 9--9 of FIG. 3 further showing the manner in which the adjusting screw member is operably coupled to the associated mounting member.

FIG. 10 is a front perspective view of a wafer inspection and processing apparatus suitable for accommodating therein the vacuum wafer apparatus of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 is a perspective view of a conventional wafer holder, generally referred to be reference number 1, generally comprising a brace or bracket member 3, a flexible member 5, and a diced wafer having a plurality of electronic semiconductor devices 7 attached thereto. The brace or bracket member 3 is preferably configured like a ring to permit coverage therearound the flexible member 5. Also, the brace member 3 has at least one indented portion 9, 10 for being accommodated by at least one pin 12 integral to an upper portion 14 of a mounting bracket member 16 (see FIG. 3, infra). In FIG. 2, the wafer holder 1 is shown in a side elevational view for purposes of illustrating the relative connective positioning of the brace or bracket member 3, the flexible member 5, and the diced wafer having a plurality of electronic semiconductor devices 7.

As illustrated in FIG. 3, the wafer holder 1 is mounted on the upper portion 14 of the mounting bracket member 16 wherein the indented portions 9, 10 of the brace member 3 abut the pins 12 on the mounting bracket member 16. As further shown in FIG. 3, a tubular member 18 is accommodated in a snug fitting manner onto a vacuum spout member 20, having a series of inclined precipices 22, integrally connected to the upper portion 14 of the mounting bracket member 16. Between the spout member 20 and the mounting bracket member 16 a washer member 23 snugly fitted thereto as a sealant when the vacuum wafer holder 1 is in use. The tubular member 18 is connected to a vacuum-producing apparatus (not shown).

The upper portion 14 of the mounting bracket member 16 has a groove 25 therearound to permit a vacuum to develop therein when the wafer holder 1 is in use, as will later be discussed. To create a suitable vacuum, an aperture 28 passes therethrough the upper portion 14 to allow the accommodtion of another spout member (not shown) therein, if desired. When the aperture 28 is not in use, a bolt member 30 is accommodated therein to suitably sustain the vacuum developed in the groove 25.

As better illustrated in FIG. 4, the upper portion 14 is fitted onto the mounting bracket member 16. Here, the upper portion 14 has a downwardly protruding member 17 integral thereto for abutting onto the internal surface portion 19 of the mounting bracket member 16. As also illustrataed in FIG. 4, the groove 25 is shown being located therebelow the flexible member 5 of the vacuum wafer expander 1. Integral to the mounting bracket member 16 is an adjusting screw member 27 for adjusting the position of the upper portion 14 relative to the mounting bracket member (see FIGS. 8-9, infra).

In FIG. 5, the wafer holder 1 is not in use, but simply mounted on the upper portion 14 of the mounting bracket member 16. Here, the flexible member 5 merely sits above the groove 25. In the FIG. 6, a vacuum is developed inside the groove 25; thus having the flexible member 5 thereabove pulled therein. upon the pulling of the flexible member 5 into the groove 25, the flexible member 5 is expanded; thus similarly expanding the diced wafer having a plurality of electronic semiconductor devices 7 connected thereabove. In order minimize the friction created therebetween the flexible member 5 and the upper portion 14, a chamfered portion 32 integral to the upper portion is provided.

Upon expansion, the electronic semiconductor devices 7 can be inspected and processed. The electronic semiconductor devices 7 are separated from each other when the flexible member 5 is expanded producing therefrom gaps 33 therebetwen. When separated from each other, each electronic semiconductor device 7 can be individually picked up by a conventional pick-up tool member 35, as shown in FIG. 7, infra. In FIG. 7, the pick-up tool member 35 may operate by means of a vacuum or the like. As also shown in FIG. 7, as well as shown in FIG. 5, the plurality of electronic semiconductor devices 7 have been initially scribed or sawn then broken apart to allow ease in the development of the gaps 33 therebetween when expanded.

In FIG. 8, a cross-sectional view is shown wherein an adjusting screw member 27 is operably connected to the upper portion 14 for location adjustment relative to the mounting bracket member 16. Here, the adjustment is made in a manner such that the X-Y relationship between the upper portion 14 and the mounting bracket member 16 can be manipulated for purposes of inspection of the plurality of electronic semiconductor devices 7 when expanded. As further shown in FIG. 8, the adjusting screw member 27 is mounted onto the upper portion 14 by a preferably removable member 38 having an aperture 40 passing therethrough for accommodating therein the screw member 27. The mounting bracket member 16 has an opening portion 42 fo accommodating therein a tubular member 43 having internal threads 45 therein operably accommodating therein a threaded portion 47 of the screw member 27.

In FIG. 9, when the adjusting screw member 27 is in place and in use, a rotation of the screw member 27 in one direction allows the screw member 27 to be threaded into the tubular member 43; thus a ring stopper member 45, see FIG. 8 supra, is impinged onto the member 38 resulting in a motion of the upper portion 14 relative to the mounting bracket member 16.

As shown in FIG. 10, the vacuum wafer expander 1 can be accommodated by an inspection and processing apparatus 50, such as an ASM (Advanced Semiconductor Materials) Desert 2000 or 2000H model. The inspection and processing apparatus 50 is suitable, e.g., for bonding die to leadframes or to pick up and place the wafers for packaging. When used for inspection purposes, the vacuum wafer expander 1 can be conventionally mounted onto the inspection and processing apparatus 50 so that when the plurality of electronic semiconductor devices 7 are expanded, as previously discussed, the electronic semiconductor devices 7 can be "optically recognized" by use of at least one television monitor 55. When the electronic semiconductor devices 7 are being "optically recognized", a process of pattern recognition of wafer defects can be implemented throughout the electronic semiconductor devices 7. Defects in wafer areas such as the corners, sides and center sections can be monitored.

The flexible material 5 is preferably made out of mylar film or the like. Further, the brace or bracket member 3 is preferably made out of plastic or metal, such as stainless steel or the like. Also, the upper portion 14, the mounting bracket member 16, as well as the associated parts previously described therewith are preferably made out hard plastic or metal, such as aluminum or stainless steel.

While the invention has been particularly shown and described in reference to preferred embodiments thereof, it will be understood by those skilled in the art that changes in form and details may be made without departing from the spirit and scope of the invention.

Claims (8)

I claim:
1. A vacuum wafer expander apparatus for mounting onto a wafer inspection and processing apparatus, comprising:
a planar substantially ring-shaped brace frame member having at least one indented portion around a circumference thereof for accommodating a pin therein and having an aperture substantially centered therethrough;
flexible member means for receiving electronic semiconductor wafers, said flexible member means being attached to said planar substantially ring-shaped brace and subtending said aperture substantially centered therethrough;
substantially planar mounting bracket member means having an upper portion for mounting said brace frame member means thereon and downwardly protruding member integral thereto, said upper portion having groove means therein for accommodating a portion of said flexible member means and having adjustment means operably coupled thereto for adjusting said upper portion relative to said mounting bracket member means; and
a vacuum-producing apparatus operably joined to said upper portion of said mounting bracket member means for creating a vacuum in said groove means.
2. The vacuum wafer expander apparatus as in claim 1 wherein said flexible member is made of mylar film material.
3. The vacuum wafer expander apparatus as in claim 1 wherein said vacuum-producing apparatus is operably joined into said upper portion of said mounting bracket means by a tubular member fitted onto a spout member means integrally coupled to said upper portion of said mounting bracket means.
4. The vacuum wafer expander apparatus as in claim 1 wherein said adjusting means further comprises an adjusting screw member.
5. The vacuum wafer expander apparatus as in claim 4 wherein said brace frame member is made of a flexible metal.
6. The vacuum wafer expander apparatus as in claim 5 wherein said brace frame member is made of aluminum.
7. The vacuum wafer expander apparatus as in claim 4 wherein said mounting bracket member means is made of metal selected from the group of aluminum and stainless steel.
8. The vacuum wafer expander apparatus as in claim 4 wherein said mounting bracket member means is made of hard plastic.
US06/855,841 1986-04-24 1986-04-24 Vacuum wafer expander apparatus Expired - Fee Related US4744550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/855,841 US4744550A (en) 1986-04-24 1986-04-24 Vacuum wafer expander apparatus

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US06/855,841 US4744550A (en) 1986-04-24 1986-04-24 Vacuum wafer expander apparatus
JP8450787A JPS62256451A (en) 1986-04-24 1987-04-06 Method and apparatus for expanding vacuum wafer
FR8705952A FR2601842A1 (en) 1986-04-24 1987-04-21 Apparatus and method for expansion of depression electronic chips
GB8709586A GB2189647B (en) 1986-04-24 1987-04-23 Vacuum wafer expander apparatus and method
NL8700975A NL8700975A (en) 1986-04-24 1987-04-24 Device and method for expansioning a vacuum with vacuum
DE19873713817 DE3713817A1 (en) 1986-04-24 1987-04-24 Method and device for extending semiconductor disc

Publications (1)

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US4744550A true US4744550A (en) 1988-05-17

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US06/855,841 Expired - Fee Related US4744550A (en) 1986-04-24 1986-04-24 Vacuum wafer expander apparatus

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US (1) US4744550A (en)
JP (1) JPS62256451A (en)
DE (1) DE3713817A1 (en)
FR (1) FR2601842A1 (en)
GB (1) GB2189647B (en)
NL (1) NL8700975A (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981345A (en) * 1990-05-15 1991-01-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Sample holder support for microscopes
US5086477A (en) * 1990-08-07 1992-02-04 Northwest Technology Corp. Automated system for extracting design and layout information from an integrated circuit
US5195729A (en) * 1991-05-17 1993-03-23 National Semiconductor Corporation Wafer carrier
US5310104A (en) * 1991-12-16 1994-05-10 General Electric Company Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal
WO1999039885A1 (en) * 1998-02-06 1999-08-12 Dynatex International Apparatus and process for membrane mounted die breaking with automated visualization
US6106222A (en) * 1996-03-29 2000-08-22 Ngk Insulators, Ltd. Method of peeling off chips using peeling plate with integrally formed first and second protrusions
US20030051353A1 (en) * 2001-02-13 2003-03-20 Andreas Gartner Formation of a disk from a fracturable material
US20030153127A1 (en) * 2002-02-08 2003-08-14 Hitachi, Ltd. Hitachi Ulsi Systems Co., Ltd. Method of manufacturing a semiconductor device
WO2004038779A1 (en) * 2002-10-28 2004-05-06 Tokyo Seimitsu Co., Ltd. Expansion method and device
US6783486B1 (en) * 1998-11-25 2004-08-31 Matsushita Electric Industrial Co., Ltd. Outsert molded product, its manufacturing method, and its sorting method
US20050029725A1 (en) * 2003-08-07 2005-02-10 Glendo Corporation Holder for supporting workpiece in a fixed location pivotal about dual axes
US6901924B2 (en) * 2000-01-12 2005-06-07 Disco Corporation Method of cutting CSP substrates
US20050186517A1 (en) * 2004-02-19 2005-08-25 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
US20060005911A1 (en) * 2002-10-28 2006-01-12 Yuichi Kubo Expanding method and expanding device
US20060243710A1 (en) * 2003-05-22 2006-11-02 Tokyo Seimitsu Co., Ltd. Dicing device
US20070243317A1 (en) * 2002-07-15 2007-10-18 Du Bois Dale R Thermal Processing System and Configurable Vertical Chamber
US20080196229A1 (en) * 2005-06-16 2008-08-21 Nxp B.V. Tool For Stretching the Foil of a Foil Carrier, a Machine For Removing Dies From a Wafer and a Method For Removing Dies
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus
US20170213796A1 (en) * 2016-01-27 2017-07-27 Infineon Technologies Ag Electronic chip inspection by backside illumination

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US5480842A (en) * 1994-04-11 1996-01-02 At&T Corp. Method for fabricating thin, strong, and flexible die for smart cards
DE102007033242A1 (en) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Method and device for separating a plane plate made of brittle material into several individual plates by means of laser
JP5435925B2 (en) * 2008-10-28 2014-03-05 リンテック株式会社 Expanding apparatus and expanding method

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981345A (en) * 1990-05-15 1991-01-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Sample holder support for microscopes
US5086477A (en) * 1990-08-07 1992-02-04 Northwest Technology Corp. Automated system for extracting design and layout information from an integrated circuit
US5195729A (en) * 1991-05-17 1993-03-23 National Semiconductor Corporation Wafer carrier
US5310104A (en) * 1991-12-16 1994-05-10 General Electric Company Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal
US6106222A (en) * 1996-03-29 2000-08-22 Ngk Insulators, Ltd. Method of peeling off chips using peeling plate with integrally formed first and second protrusions
US6464444B1 (en) 1996-03-29 2002-10-15 Ngk Insulators, Ltd. Apparatus for peeling off chips using a plurality of first and second protrusions
WO1999039885A1 (en) * 1998-02-06 1999-08-12 Dynatex International Apparatus and process for membrane mounted die breaking with automated visualization
US6783486B1 (en) * 1998-11-25 2004-08-31 Matsushita Electric Industrial Co., Ltd. Outsert molded product, its manufacturing method, and its sorting method
US6901924B2 (en) * 2000-01-12 2005-06-07 Disco Corporation Method of cutting CSP substrates
US20030051353A1 (en) * 2001-02-13 2003-03-20 Andreas Gartner Formation of a disk from a fracturable material
US20030153127A1 (en) * 2002-02-08 2003-08-14 Hitachi, Ltd. Hitachi Ulsi Systems Co., Ltd. Method of manufacturing a semiconductor device
US6916686B2 (en) * 2002-02-08 2005-07-12 Renesas Technology Corporation Method of manufacturing a semiconductor device
US20070243317A1 (en) * 2002-07-15 2007-10-18 Du Bois Dale R Thermal Processing System and Configurable Vertical Chamber
US7886798B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device
WO2004038779A1 (en) * 2002-10-28 2004-05-06 Tokyo Seimitsu Co., Ltd. Expansion method and device
US20060005911A1 (en) * 2002-10-28 2006-01-12 Yuichi Kubo Expanding method and expanding device
US7887665B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device
US20080105383A1 (en) * 2002-10-28 2008-05-08 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device
US20060243710A1 (en) * 2003-05-22 2006-11-02 Tokyo Seimitsu Co., Ltd. Dicing device
US20050029725A1 (en) * 2003-08-07 2005-02-10 Glendo Corporation Holder for supporting workpiece in a fixed location pivotal about dual axes
US20050186517A1 (en) * 2004-02-19 2005-08-25 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
US20070165357A1 (en) * 2004-02-19 2007-07-19 Asml Holding N.V. Overlay Correction By Reducing Wafer Slipping After Alignment
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US7786607B2 (en) * 2004-02-19 2010-08-31 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
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Also Published As

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FR2601842A1 (en) 1988-01-22
DE3713817A1 (en) 1987-10-29
GB2189647A (en) 1987-10-28
GB2189647B (en) 1990-09-12
NL8700975A (en) 1987-11-16
GB8709586D0 (en) 1987-05-28
JPS62256451A (en) 1987-11-09

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