US4744550A - Vacuum wafer expander apparatus - Google Patents
Vacuum wafer expander apparatus Download PDFInfo
- Publication number
- US4744550A US4744550A US06/855,841 US85584186A US4744550A US 4744550 A US4744550 A US 4744550A US 85584186 A US85584186 A US 85584186A US 4744550 A US4744550 A US 4744550A
- Authority
- US
- United States
- Prior art keywords
- vacuum
- mounting bracket
- upper portion
- expander apparatus
- member means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 58
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007689 inspection Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 2
- 239000005041 Mylar™ Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 230000007547 defect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/4979—Breaking through weakened portion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
- Y10T29/53974—Means to assemble or disassemble with work-holder for assembly having means to permit support movement while work is thereon
Definitions
- This invention relates generally to a vacuum wafer expander apparatus and method of making wafers for use in electronic circuitry. More particularly, the invention relates to diced wafers comprising a plurality of electronic semiconductor devices being connected to a flexible member being mounted on a bracket member means.
- the bracket member means is suitable for being removably mounted on a bracket mounting means having a groove therearound for accommodating a vacuum therein to allow an abutting flexible material to be pulled into said groove; thus expanding the flexible member as well as the diced wafer of electronic semiconductor devices connected thereto.
- the vacuum wafer expander apparatus and method of the present invention embodies a simply constructed combination of inexpensive, easily accessible and rapidly manufactured parts, yet efficient to function in effectively expanding wafers for inspection and processing.
- FIG. 1 is a perspective view of a conventional wafer holder apparatus for attaching to a wafer inspection and processing apparatus.
- FIG. 2 is a side elevational view of the wafer holder apparatus.
- FIG. 3 is a top elevational view of the vacuum wafer expander apparatus of the present invention with an associated vacuum hose member connected to a mounting member.
- FIG. 4 is a cross-sectional view taken along line 4--4 of FIG. 3 showing the manner in which the wafer holder apparatus mounts onto the associated mounting member of the vacuum expander apparatus of the present invention.
- FIG. 5 is a cross-sectional view taken along line 5--5 of FIG. 3 showing the manner in which a flexible member joined therebelow a plurality of electronic semiconductor devices is initially placed thereabove the associated mounting member of the wafer expander apparatus of the present invention.
- FIG. 6 is a sequential view of FIG. 5 showing the manner in which the flexible member is pulled into an associated groove inherent to the mounting member.
- FIG. 7 is a perspective view of the manner in which a pick-up tool member lifts up at least one electronic semiconductor device from the associated flexible member.
- FIG. 8 is a partial cross-sectional view taken along line 8--8 of FIG. 3 showing the manner in which an adjusting screw member is operably coupled to the associated mounting member.
- FIG. 9 is a partial cross-sectional view taken along line 9--9 of FIG. 3 further showing the manner in which the adjusting screw member is operably coupled to the associated mounting member.
- FIG. 10 is a front perspective view of a wafer inspection and processing apparatus suitable for accommodating therein the vacuum wafer apparatus of the present invention.
- FIG. 1 is a perspective view of a conventional wafer holder, generally referred to be reference number 1, generally comprising a brace or bracket member 3, a flexible member 5, and a diced wafer having a plurality of electronic semiconductor devices 7 attached thereto.
- the brace or bracket member 3 is preferably configured like a ring to permit coverage therearound the flexible member 5.
- the brace member 3 has at least one indented portion 9, 10 for being accommodated by at least one pin 12 integral to an upper portion 14 of a mounting bracket member 16 (see FIG. 3, infra).
- the wafer holder 1 is shown in a side elevational view for purposes of illustrating the relative connective positioning of the brace or bracket member 3, the flexible member 5, and the diced wafer having a plurality of electronic semiconductor devices 7.
- the wafer holder 1 is mounted on the upper portion 14 of the mounting bracket member 16 wherein the indented portions 9, 10 of the brace member 3 abut the pins 12 on the mounting bracket member 16.
- a tubular member 18 is accommodated in a snug fitting manner onto a vacuum spout member 20, having a series of inclined precipices 22, integrally connected to the upper portion 14 of the mounting bracket member 16. Between the spout member 20 and the mounting bracket member 16 a washer member 23 snugly fitted thereto as a sealant when the vacuum wafer holder 1 is in use.
- the tubular member 18 is connected to a vacuum-producing apparatus (not shown).
- the upper portion 14 of the mounting bracket member 16 has a groove 25 therearound to permit a vacuum to develop therein when the wafer holder 1 is in use, as will later be discussed.
- an aperture 28 passes therethrough the upper portion 14 to allow the accommodtion of another spout member (not shown) therein, if desired.
- a bolt member 30 is accommodated therein to suitably sustain the vacuum developed in the groove 25.
- the upper portion 14 is fitted onto the mounting bracket member 16.
- the upper portion 14 has a downwardly protruding member 17 integral thereto for abutting onto the internal surface portion 19 of the mounting bracket member 16.
- the groove 25 is shown being located therebelow the flexible member 5 of the vacuum wafer expander 1.
- Integral to the mounting bracket member 16 is an adjusting screw member 27 for adjusting the position of the upper portion 14 relative to the mounting bracket member (see FIGS. 8-9, infra).
- the wafer holder 1 is not in use, but simply mounted on the upper portion 14 of the mounting bracket member 16.
- the flexible member 5 merely sits above the groove 25.
- a vacuum is developed inside the groove 25; thus having the flexible member 5 thereabove pulled therein.
- the flexible member 5 is expanded; thus similarly expanding the diced wafer having a plurality of electronic semiconductor devices 7 connected thereabove.
- a chamfered portion 32 integral to the upper portion is provided.
- the electronic semiconductor devices 7 can be inspected and processed.
- the electronic semiconductor devices 7 are separated from each other when the flexible member 5 is expanded producing therefrom gaps 33 therebetwen.
- each electronic semiconductor device 7 can be individually picked up by a conventional pick-up tool member 35, as shown in FIG. 7, infra.
- the pick-up tool member 35 may operate by means of a vacuum or the like.
- the plurality of electronic semiconductor devices 7 have been initially scribed or sawn then broken apart to allow ease in the development of the gaps 33 therebetween when expanded.
- FIG. 8 a cross-sectional view is shown wherein an adjusting screw member 27 is operably connected to the upper portion 14 for location adjustment relative to the mounting bracket member 16.
- the adjustment is made in a manner such that the X-Y relationship between the upper portion 14 and the mounting bracket member 16 can be manipulated for purposes of inspection of the plurality of electronic semiconductor devices 7 when expanded.
- the adjusting screw member 27 is mounted onto the upper portion 14 by a preferably removable member 38 having an aperture 40 passing therethrough for accommodating therein the screw member 27.
- the mounting bracket member 16 has an opening portion 42 fo accommodating therein a tubular member 43 having internal threads 45 therein operably accommodating therein a threaded portion 47 of the screw member 27.
- the vacuum wafer expander 1 can be accommodated by an inspection and processing apparatus 50, such as an ASM (Advanced Semiconductor Materials) Desert 2000 or 2000H model.
- the inspection and processing apparatus 50 is suitable, e.g., for bonding die to leadframes or to pick up and place the wafers for packaging.
- the vacuum wafer expander 1 can be conventionally mounted onto the inspection and processing apparatus 50 so that when the plurality of electronic semiconductor devices 7 are expanded, as previously discussed, the electronic semiconductor devices 7 can be "optically recognized" by use of at least one television monitor 55.
- the electronic semiconductor devices 7 are being “optically recognized"
- a process of pattern recognition of wafer defects can be implemented throughout the electronic semiconductor devices 7. Defects in wafer areas such as the corners, sides and center sections can be monitored.
- the flexible material 5 is preferably made out of mylar film or the like.
- the brace or bracket member 3 is preferably made out of plastic or metal, such as stainless steel or the like.
- the upper portion 14, the mounting bracket member 16, as well as the associated parts previously described therewith are preferably made out hard plastic or metal, such as aluminum or stainless steel.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Dicing (AREA)
Abstract
Description
Claims (8)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/855,841 US4744550A (en) | 1986-04-24 | 1986-04-24 | Vacuum wafer expander apparatus |
JP62084507A JPS62256451A (en) | 1986-04-24 | 1987-04-06 | Method and apparatus for expanding vacuum wafer |
FR8705952A FR2601842A1 (en) | 1986-04-24 | 1987-04-21 | APPARATUS AND METHOD FOR EXPANSION OF DEPRESSION ELECTRONIC CHIPS |
GB8709586A GB2189647B (en) | 1986-04-24 | 1987-04-23 | Vacuum wafer expander apparatus and method |
DE19873713817 DE3713817A1 (en) | 1986-04-24 | 1987-04-24 | METHOD AND DEVICE FOR EXTENDING SEMICONDUCTOR DISC |
NL8700975A NL8700975A (en) | 1986-04-24 | 1987-04-24 | DEVICE AND METHOD FOR EXPANSIONING A VACUUM WITH VACUUM |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/855,841 US4744550A (en) | 1986-04-24 | 1986-04-24 | Vacuum wafer expander apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
US4744550A true US4744550A (en) | 1988-05-17 |
Family
ID=25322215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/855,841 Expired - Fee Related US4744550A (en) | 1986-04-24 | 1986-04-24 | Vacuum wafer expander apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US4744550A (en) |
JP (1) | JPS62256451A (en) |
DE (1) | DE3713817A1 (en) |
FR (1) | FR2601842A1 (en) |
GB (1) | GB2189647B (en) |
NL (1) | NL8700975A (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981345A (en) * | 1990-05-15 | 1991-01-01 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Sample holder support for microscopes |
US5086477A (en) * | 1990-08-07 | 1992-02-04 | Northwest Technology Corp. | Automated system for extracting design and layout information from an integrated circuit |
US5195729A (en) * | 1991-05-17 | 1993-03-23 | National Semiconductor Corporation | Wafer carrier |
US5310104A (en) * | 1991-12-16 | 1994-05-10 | General Electric Company | Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal |
WO1999039885A1 (en) * | 1998-02-06 | 1999-08-12 | Dynatex International | Apparatus and process for membrane mounted die breaking with automated visualization |
US6106222A (en) * | 1996-03-29 | 2000-08-22 | Ngk Insulators, Ltd. | Method of peeling off chips using peeling plate with integrally formed first and second protrusions |
US20030051353A1 (en) * | 2001-02-13 | 2003-03-20 | Andreas Gartner | Formation of a disk from a fracturable material |
US20030153127A1 (en) * | 2002-02-08 | 2003-08-14 | Hitachi, Ltd. Hitachi Ulsi Systems Co., Ltd. | Method of manufacturing a semiconductor device |
WO2004038779A1 (en) * | 2002-10-28 | 2004-05-06 | Tokyo Seimitsu Co., Ltd. | Expansion method and device |
US6783486B1 (en) * | 1998-11-25 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Outsert molded product, its manufacturing method, and its sorting method |
US20050029725A1 (en) * | 2003-08-07 | 2005-02-10 | Glendo Corporation | Holder for supporting workpiece in a fixed location pivotal about dual axes |
US6901924B2 (en) * | 2000-01-12 | 2005-06-07 | Disco Corporation | Method of cutting CSP substrates |
US20050186517A1 (en) * | 2004-02-19 | 2005-08-25 | Asml Holding N.V. | Overlay correction by reducing wafer slipping after alignment |
US20060005911A1 (en) * | 2002-10-28 | 2006-01-12 | Yuichi Kubo | Expanding method and expanding device |
US20060243710A1 (en) * | 2003-05-22 | 2006-11-02 | Tokyo Seimitsu Co., Ltd. | Dicing device |
US20070243317A1 (en) * | 2002-07-15 | 2007-10-18 | Du Bois Dale R | Thermal Processing System and Configurable Vertical Chamber |
US20080196229A1 (en) * | 2005-06-16 | 2008-08-21 | Nxp B.V. | Tool For Stretching the Foil of a Foil Carrier, a Machine For Removing Dies From a Wafer and a Method For Removing Dies |
US20090061597A1 (en) * | 2007-08-30 | 2009-03-05 | Kavlico Corporation | Singulator method and apparatus |
US20170213796A1 (en) * | 2016-01-27 | 2017-07-27 | Infineon Technologies Ag | Electronic chip inspection by backside illumination |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5480842A (en) * | 1994-04-11 | 1996-01-02 | At&T Corp. | Method for fabricating thin, strong, and flexible die for smart cards |
DE102007033242A1 (en) * | 2007-07-12 | 2009-01-15 | Jenoptik Automatisierungstechnik Gmbh | Method and device for separating a plane plate made of brittle material into several individual plates by means of laser |
JP5435925B2 (en) * | 2008-10-28 | 2014-03-05 | リンテック株式会社 | Expanding apparatus and expanding method |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2970730A (en) * | 1957-01-08 | 1961-02-07 | Motorola Inc | Dicing semiconductor wafers |
US3537169A (en) * | 1967-07-08 | 1970-11-03 | Philips Corp | Method of severing a semiconductor wafer |
US3562058A (en) * | 1967-05-16 | 1971-02-09 | Texas Instruments Inc | Method for breaking and separating substrate material |
US3657791A (en) * | 1968-11-29 | 1972-04-25 | Philips Corp | Separating diced plate material |
US3677875A (en) * | 1970-08-19 | 1972-07-18 | Raychem Corp | Method and means of die matrix expansion |
US3727282A (en) * | 1970-02-05 | 1973-04-17 | Burroughs Corp | Semiconductor handling apparatus |
US3918150A (en) * | 1974-02-08 | 1975-11-11 | Gen Electric | System for separating a semiconductor wafer into discrete pellets |
US4296542A (en) * | 1980-07-11 | 1981-10-27 | Presco, Inc. | Control of small parts in a manufacturing operation |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3448510A (en) * | 1966-05-20 | 1969-06-10 | Western Electric Co | Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed |
JPS5011652A (en) * | 1973-06-01 | 1975-02-06 |
-
1986
- 1986-04-24 US US06/855,841 patent/US4744550A/en not_active Expired - Fee Related
-
1987
- 1987-04-06 JP JP62084507A patent/JPS62256451A/en active Pending
- 1987-04-21 FR FR8705952A patent/FR2601842A1/en active Pending
- 1987-04-23 GB GB8709586A patent/GB2189647B/en not_active Expired - Fee Related
- 1987-04-24 DE DE19873713817 patent/DE3713817A1/en not_active Withdrawn
- 1987-04-24 NL NL8700975A patent/NL8700975A/en not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2970730A (en) * | 1957-01-08 | 1961-02-07 | Motorola Inc | Dicing semiconductor wafers |
US3562058A (en) * | 1967-05-16 | 1971-02-09 | Texas Instruments Inc | Method for breaking and separating substrate material |
US3537169A (en) * | 1967-07-08 | 1970-11-03 | Philips Corp | Method of severing a semiconductor wafer |
US3657791A (en) * | 1968-11-29 | 1972-04-25 | Philips Corp | Separating diced plate material |
US3727282A (en) * | 1970-02-05 | 1973-04-17 | Burroughs Corp | Semiconductor handling apparatus |
US3677875A (en) * | 1970-08-19 | 1972-07-18 | Raychem Corp | Method and means of die matrix expansion |
US3918150A (en) * | 1974-02-08 | 1975-11-11 | Gen Electric | System for separating a semiconductor wafer into discrete pellets |
US4296542A (en) * | 1980-07-11 | 1981-10-27 | Presco, Inc. | Control of small parts in a manufacturing operation |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981345A (en) * | 1990-05-15 | 1991-01-01 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Sample holder support for microscopes |
US5086477A (en) * | 1990-08-07 | 1992-02-04 | Northwest Technology Corp. | Automated system for extracting design and layout information from an integrated circuit |
US5195729A (en) * | 1991-05-17 | 1993-03-23 | National Semiconductor Corporation | Wafer carrier |
US5310104A (en) * | 1991-12-16 | 1994-05-10 | General Electric Company | Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal |
US6106222A (en) * | 1996-03-29 | 2000-08-22 | Ngk Insulators, Ltd. | Method of peeling off chips using peeling plate with integrally formed first and second protrusions |
US6464444B1 (en) | 1996-03-29 | 2002-10-15 | Ngk Insulators, Ltd. | Apparatus for peeling off chips using a plurality of first and second protrusions |
WO1999039885A1 (en) * | 1998-02-06 | 1999-08-12 | Dynatex International | Apparatus and process for membrane mounted die breaking with automated visualization |
US6783486B1 (en) * | 1998-11-25 | 2004-08-31 | Matsushita Electric Industrial Co., Ltd. | Outsert molded product, its manufacturing method, and its sorting method |
US6901924B2 (en) * | 2000-01-12 | 2005-06-07 | Disco Corporation | Method of cutting CSP substrates |
US20030051353A1 (en) * | 2001-02-13 | 2003-03-20 | Andreas Gartner | Formation of a disk from a fracturable material |
US20030153127A1 (en) * | 2002-02-08 | 2003-08-14 | Hitachi, Ltd. Hitachi Ulsi Systems Co., Ltd. | Method of manufacturing a semiconductor device |
US6916686B2 (en) * | 2002-02-08 | 2005-07-12 | Renesas Technology Corporation | Method of manufacturing a semiconductor device |
US20070243317A1 (en) * | 2002-07-15 | 2007-10-18 | Du Bois Dale R | Thermal Processing System and Configurable Vertical Chamber |
WO2004038779A1 (en) * | 2002-10-28 | 2004-05-06 | Tokyo Seimitsu Co., Ltd. | Expansion method and device |
US7887665B2 (en) | 2002-10-28 | 2011-02-15 | Tokyo Seimitsu Co., Ltd. | Expanding method and expanding device |
US20060005911A1 (en) * | 2002-10-28 | 2006-01-12 | Yuichi Kubo | Expanding method and expanding device |
US7886798B2 (en) | 2002-10-28 | 2011-02-15 | Tokyo Seimitsu Co., Ltd. | Expanding method and expanding device |
US20080105383A1 (en) * | 2002-10-28 | 2008-05-08 | Tokyo Seimitsu Co., Ltd. | Expanding method and expanding device |
US20060243710A1 (en) * | 2003-05-22 | 2006-11-02 | Tokyo Seimitsu Co., Ltd. | Dicing device |
US20050029725A1 (en) * | 2003-08-07 | 2005-02-10 | Glendo Corporation | Holder for supporting workpiece in a fixed location pivotal about dual axes |
US20050186517A1 (en) * | 2004-02-19 | 2005-08-25 | Asml Holding N.V. | Overlay correction by reducing wafer slipping after alignment |
US7542263B2 (en) | 2004-02-19 | 2009-06-02 | Asml Holding N.V. | Overlay correction by reducing wafer slipping after alignment |
US7786607B2 (en) * | 2004-02-19 | 2010-08-31 | Asml Holding N.V. | Overlay correction by reducing wafer slipping after alignment |
US20070165357A1 (en) * | 2004-02-19 | 2007-07-19 | Asml Holding N.V. | Overlay Correction By Reducing Wafer Slipping After Alignment |
US20080196229A1 (en) * | 2005-06-16 | 2008-08-21 | Nxp B.V. | Tool For Stretching the Foil of a Foil Carrier, a Machine For Removing Dies From a Wafer and a Method For Removing Dies |
US20090061597A1 (en) * | 2007-08-30 | 2009-03-05 | Kavlico Corporation | Singulator method and apparatus |
US20170213796A1 (en) * | 2016-01-27 | 2017-07-27 | Infineon Technologies Ag | Electronic chip inspection by backside illumination |
US10388610B2 (en) * | 2016-01-27 | 2019-08-20 | Infineon Technologies Ag | Electronic chip inspection by backside illumination |
Also Published As
Publication number | Publication date |
---|---|
DE3713817A1 (en) | 1987-10-29 |
JPS62256451A (en) | 1987-11-09 |
NL8700975A (en) | 1987-11-16 |
GB2189647B (en) | 1990-09-12 |
GB8709586D0 (en) | 1987-05-28 |
GB2189647A (en) | 1987-10-28 |
FR2601842A1 (en) | 1988-01-22 |
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