WO1999039885A1 - Apparatus and process for membrane mounted die breaking with automated visualization - Google Patents

Apparatus and process for membrane mounted die breaking with automated visualization Download PDF

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Publication number
WO1999039885A1
WO1999039885A1 PCT/US1999/002605 US9902605W WO9939885A1 WO 1999039885 A1 WO1999039885 A1 WO 1999039885A1 US 9902605 W US9902605 W US 9902605W WO 9939885 A1 WO9939885 A1 WO 9939885A1
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WO
WIPO (PCT)
Prior art keywords
dies
membrane
wafer
scribing
underlying
Prior art date
Application number
PCT/US1999/002605
Other languages
French (fr)
Inventor
Peter Thomas Frazer
Original Assignee
Dynatex International
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynatex International filed Critical Dynatex International
Publication of WO1999039885A1 publication Critical patent/WO1999039885A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052Means for supporting or holding work during breaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material

Definitions

  • This invention relates to scribing and breaking dies and wafers mounted on and
  • the flexible membrane is utilized for both scribing and breaking.
  • the flexible membrane is utilized for both scribing and breaking.
  • dies are supported on a flexible membrane. Movement of the flexible
  • the process and apparatus here disclosed is especially adapted for the
  • Dies for laser diodes are known. These dies are scribed and broken from
  • elongate rectangular crystals which can be in the range of VA inches long and 1/8
  • rectilinear dies extends at right angles to the underlying breaker bar. Initially, the dies
  • the dies are capable of being individually recognized by machine vision, angularly
  • the scribes commence at an inset from the die
  • the dies are automatically scribed from the middle to the die ends. As each
  • the disclosed die alignment is particularly
  • these dies can be
  • breaking station With initial alignment of a street of alley for breaking, breaking
  • Fig. 1 is a schematic of rectilinear laser die arrayed on a flexible membrane
  • Fig. 2A is a perspective enlarged view of a membrane, a supported die, the
  • Fig. 2B is an enlarged section of an individual die illustrating the scribe across
  • Fig. 3 is a block schematic of an automated computer program working form
  • Fig. 4 illustrates a normal die with scribed "streets and intersecting streets" for
  • Fig. 5 is a block diagram of automated break visualization necessitated by
  • membrane M is shown having array A of individual dies D
  • dies D are supported on membrane M from
  • peripheral ring R As set forth in Apparatus for Scribing and/or Breaking
  • scribe S overlies breaker bar B at knife edge K.
  • dies D are about VA inches long, 1/8 inches in
  • Nision Pro a product of Cognex Co. of ⁇ atick, Massachusetts. It is
  • each scribe line 18 must be inset form edges 16 and 17 of die D. It will be seen that each scribe line 18
  • membrane M is unduly stretched or alternatively the die section is dislodged from membrane M.
  • the scribe must end at scribe inset 20 from opposite edge 16 to prevent
  • FIG. 3 a block diagram of the machine vision program of this
  • center 31 of first die D is
  • processed must be delimited. This is done at process delineation step 33 by moving
  • the first question asked is whether the die D is within the area delimited; that
  • first street 50 is scribed at first street scribing step 52. This scribing
  • scribing commences in the middle and scribes to one end utilizing position
  • die delineation step 40 is repeated, and presuming a
  • wafer W. is shown scribed with streets 64 and intersecting streets 62.
  • fiducials can be used to break intersecting streets 62 and streets 64.
  • Presuming star 72 indexing to next street step 74 occurs. Thereafter, identify and
  • fiducial step 80 Assuming a "Yes" answer - and using the fiducial as the position
  • street alignment query step 82 follows. In the usual case, the "No"
  • break current street step 88 will follow.
  • program interrogation will occur at end of wafer step 90.
  • program end step 92 will occur.
  • wafer step 90 indicates that wafer W has not been fully broken, looping to indexing to
  • next street step 74 occurs.

Abstract

An automated vision scribing and breaking process for a membrane supported die array (D) on a transfer table wherein the die array is mounted on a membrane (M), the array and individual dies of the array are accurately positioned for scribing or breaking with the assistance of machine vision (C), and the array is scribed by a scribe (S) and/or broken by an underlying breaker bar (B) into individual dies. The dies are individually recognized, angularly aligned to be normal to the underlying and supporting breaker bar. The dies are individually scribed, preferably, by 'skip scribing' to avoid edging that might interfere with subsequent chip performance. As each die is independently scribed, automated indexing occurs to compensate for membrane stretching. Once properly scribed to the desired dimension, these dies can be further processed including utilizing the scribes to produce square ends to produce precise reflective laser cavities.

Description

APPARATUS AND PROCESS FOR MEMBRANE MOUNTED DIE BREAKING WITH AUTOMATED VISUALIZATION
This invention relates to scribing and breaking dies and wafers mounted on and
supported by a flexible membrane. A method and apparatus utilizing machine
visualization in combination with a scriber/breaker having a breaker bar supporting the
flexible membrane is utilized for both scribing and breaking. In one embodiment, the
method finds preferable usage in the scribing of lasing diodes from larger dies.
Alternately, the automated breaking of dies along sectors delineated by previously
scribe "streets and intersecting streets" is disclosed. In this latter case, essentially
unpredictable movement of the wafer relative to a broken die supported on a flexible
membrane occurs with each break requiring real time readjustment utilizing the
machine herein disclosed.
Background of the Invention
We have developed a new scriber breaker set forth in Apparatus for Scribing
and/or Breaking Semiconductor Wafers filed April 3, 1996 as U.S. Patent Application
Serial No. 08/624,339 now U.S. Patent 5,820,006 issued October 13, 1998. In this
apparatus, dies are supported on a flexible membrane. Movement of the flexible
membrane occurs between a scribing station and a breaking station. During scribing,
the support of the die to be scribed at the scribing station occurs through the membrane
by the breaker bar. Further, the breaking of wafers into dies delineated by previously
scribed streets and intersecting streets is disclosed. In this disclosure, I set forth an apparatus and process utilizing machine
visualization for the automated scribing of elongate rectangular dies for lasers into
laser diodes. The process and apparatus here disclosed is especially adapted for the
above scriber/breaker.
Dies for laser diodes are known. These dies are scribed and broken from
elongate rectangular crystals which can be in the range of VA inches long and 1/8
inches of width. The reader will understand that the disclosed equipment and process
can handle dies D of any dimension. Automated scribing of such dies to secure square
ends to ensure an accurate lasing cavity within the die is included in the subject matter
of this invention.
Summary of the Invention
A membrane supported die array of rectilinear dies having an appropriate
dimension of the range of VA inches long and 1/8 inches of width is positioned for
scribing on transfer table where the membrane is supported only at the edges. Scribing
occurs on dies supported through the membrane by an underlying breaker bar. Novelty
is set forth in supporting the dies on the membrane so that the major axis of the
rectilinear dies extends at right angles to the underlying breaker bar. Initially, the dies
are arrayed on the membrane in side-by-side arrays to an angular accuracy in the range
of ± 3° with spacing between the dies being in the range of 200 microns. In this array,
the dies are capable of being individually recognized by machine vision, angularly
aligned to be normal to the underlying and supporting breaker bar and individually scribed. To avoid either damage to the die edge or extensive forces displacing the die
on the elastic membrane to one side, the scribes commence at an inset from the die
edge and this extend only partially across the l/8th inch surface of the die. Scribing
occurs at the desired vertical intervals along the major axis of the die - in the
exemplary ranger of 0.020 to 0.030 of an inch along the major axis (any dimension can
be used). The dies are automatically scribed from the middle to the die ends. As each
die is independently scribed, automated indexing occurs to the next available dies -
indexing in rows of dies from left to right. The disclosed die alignment is particularly
suitable for automated visualization and can be delimited to preselected vision areas on
the membrane. Once properly scribed to the desired dimension, these dies can be
further processed including utilizing the scribes to produce square ends to produce
precise reflective laser cavities.
Alternatively, and utilizing the same machine visualization apparatus, a wafer
scribe with streets and intersecting streets to delimit discrete dies in moved to a
breaking station. With initial alignment of a street of alley for breaking, breaking
occurs. Concomitant with such breaking, inevitable and unpredictable movement of
both the broken portion of the wafer and the remaining portion of the wafer occurs as a
result of die support on the elastic membrane. A process of machine visualization
followed by membrane repositioning of the membrane occurs to align the next
available street for breaking. This process is continued until all streets and intersecting
streets are broken to delimit from the wafer the discrete dies delimited by the streets
and intersecting streets. Brief Description of the Drawings
Fig. 1 is a schematic of rectilinear laser die arrayed on a flexible membrane
illustrating schematically the side-by-side array of dies, a selected group of the side-by-
side array for processing, and an underlying "breaker bar" for individually supporting
each die during each scribe to separate out upon breaking laser diodes.
Fig. 2A is a perspective enlarged view of a membrane, a supported die, the
underlying and supporting breaker bar, and the overlying scribe with a line drawn on
the die surface schematically illustrating the start of the scribe from one die edge
through to the opposite die edge - this drawing schematically illustrating machine
visualization of the membrane and supported dies.
Fig. 2B is an enlarged section of an individual die illustrating the scribe across
the material and illustrating in particular the beginning of the scribe inset from the edge
of the die - this scribe here continuing through to a point that is the same inset distance
from the opposite edge of the die.
Fig. 3 is a block schematic of an automated computer program working form
the machine visualization of Fig. 2 for scribing dies within the schematically delimited
area illustrated in Fig. 1.
Fig. 4 illustrates a normal die with scribed "streets and intersecting streets" for
ultimately isolating delimited dies within the wafer sectors and illustrating automated breaking of the die with inevitable membrane stretching to displace both the main bulk
of the unbroken wafer and those sections of the wafer previously separated.
Fig. 5 is a block diagram of automated break visualization necessitated by
stretching of the membrane, it being noted that this visualization and corresponding
detected required positioning occurs as each wafer sector is broken away.
Description of the Preferred Embodiment
Referring to Fig. 1, membrane M is shown having array A of individual dies D
fastened to the membrane. The scribing which is about to occur is for the purpose of
delimiting individual lasing diodes L from dies D.
As can be seen from Figs. 1 and 2, dies D are supported on membrane M from
peripheral ring R. As set forth in Apparatus for Scribing and/or Breaking
Semiconductor Wafers filed April 3, 1996 as U.S. Patent Application Serial No.
08/624,339 now U.S. Patent 5,820,006 issued October 13, 1998, this table is moveable
in X, Y, and θ as indicated on Figs. 1 and 2. Such movement occurs relative to
underlying breaker bar B, schematically shown through membrane M as a straight line.
I will be understood that scribe S overlies breaker bar B at knife edge K.
Referring to Fig. 2, it can be seen that membrane M is supported at the edges
only by peripheral ring R. This leaves the bottom of membrane M underlying breaker
bar B directly exposed to breaker bar B at knife edge K. It is into this environment that
the scribing of dies D with automated visualization is now made possible. First, a word about the scale of Figs. 1, 2A, and 2B. In one embodiment in
which this technique has been used, dies D are about VA inches long, 1/8 inches in
width, and about 1/16 inches thick. The reader will understand that the scale shown
changes from Figs. 1, 2 A, and 2B. This is done so that the reader can understand the
subject matter set forth.
Visualization is likewise schematically shown. Specifically, video camera C is
connected to a computer (not shown), this computer having loaded that software
product known as Nision Pro, a product of Cognex Co. of Νatick, Massachusetts. It is
important to note that the alignments here illustrated are important to the cooperating
machine vision. In short, the membrane support here illustrated has been found to
make possible the machine visualization which we utilize. Further, the alignments
illustrated for the scribing and breaking interact with both the machine vision and the
scribing and breaking apparatus to produce the reproducible and automated scribing
and breaking illustrated here.
As those having skill in the art understand, the scribes must be normal to the
major axis 14 of dies D. Further, and in scribing illustrated in Figs. 1 and 2a, scribe S
must be inset form edges 16 and 17 of die D. It will be seen that each scribe line 18
must commence at scribe inset 20 from edge 17. This prevents scribe S from "hanging
up" on edge 17 and exerting undue sideways pressure on die D so that either
membrane M is unduly stretched or alternatively the die section is dislodged from membrane M. The scribe must end at scribe inset 20 from opposite edge 16 to prevent
damage to the lasing diode.
Referring to Fig. 3, a block diagram of the machine vision program of this
invention is set forth. Movement of membrane M relative to breaker bar B at knife
edge K will be assumed from the above described Apparatus for Scribing and/or
Breaking Semiconductor Wafers.
With respect to Fig. 1, presuming start 30 of the illustrated scribing routine
occurs, it first must occur that those dies D to be processed must be delimited.
Accordingly, and in a video view that is analogous to Fig. 1, center 31 of first die D is
identified at centering step 32. Thereafter, the total area containing those dies D to be
processed must be delimited. This is done at process delineation step 33 by moving
visualization cross-hairs (not shown) between upper left position 34 and lower right
position 36 (see Fig. 1). There results a delimited rectangular area of membrane M
shown by broken lines 38.
Stopping here, the reader will understand that four dies D are now ready to be
processed utilizing the invention here. These individual dies D have been placed on
membrane M at a fixed distance apart. This distance is here on the order of 200
microns. Naturally, other increments can be used.
In addition to the side-by-side spacing, the utilization of this technique requires
that the angular alignment of dies D occur within certain gross limits. Those limits WO 99/39885 "°- PCT/US99/02605
require that initial placement of dies D to membrane M be within ± 3°. This gross
alignment is illustrated in Fig. 1.
Commencing with the automated vision process made possible with this
invention, the first question asked is whether the die D is within the area delimited; that
is, within broken lines 38. This occurs at die delineation step 40. Assuming a "Yes"
answer, accurate alignment step 42 occurs. Specifically, and as shown in Fig. 2A, the
position of top 44, and bottom 46 are measured. Presuming that these respective points
do no overlie one another, rotation of membrane M supported on peripheral ring R
occurs. Thereafter, measurement of top 44 and bottom 46 is repeated to verify that
rotation of peripheral ring R in θ has brought die D into alignment; if alignment is not
verified, the process is repeated.
Thereafter, first street 50 is scribed at first street scribing step 52. This scribing
causes knife edge K of breaker bar B to move underlying first street 50 with scribe tool
S descending to scribe first street 50. This scribing of first street 50 is inset from edge
17 by scribe inset 20 and scribes from a position adjacent edge 17 to within inset 20 of
opposite edge 16. The direction of movement of membrane M during scribing is
indicated by arrow 21.
After first street scribing step 52, scribe remaining streets step 54 occurs. As
here shown, scribing commences in the middle and scribes to one end utilizing position
information previously gathered in accurate alignment step 42. Thereafter, scribing
recommences one street displaced from first street 50 and scribing to the opposite end occurs - again utilizing position information gathered during accurate alignment step
42. In the embodiment here illustrated, scribing from the middle to the top occurs first,
with scribing from the middle to the bottom second.
Presuming that die D has been fully scribed, indexing to the next die D occurs
at die index step 56. Thereafter, die delineation step 40 is repeated, and presuming a
"Yes" answer, repeat automated step scribing occurs. Presuming a "No" answer,
unload wafer step 58 followed by end 60 follows.
The reader will understand that the machine vision utilized with this invention
can as well be used for the breaking of wafer W into individual dies Di . The problem
encountered in such individual breaking can best be understood by referring to Fig. 4.
In Fig. 4, wafer W. is shown scribed with streets 64 and intersecting streets 62.
As can be seen - and as described in Apparatus for Scribing and/or Breaking
Semiconductor Wafers filed April 3, 1996 as U.S. Patent Application Serial No.
08/624,339 now U.S. Patent 5,820,006 issued October 13, 1998 - breaking is occurring
along streets 64. Such breaking occurs by positioning of a streets 64 overlying knife
edge K of breaker bar B. Thereafter, impulse bar I is forced downward on wafer W
causing breaking of wafer W of knife edge K. Unfortunately, with each such breaking,
relative movement occurs. Specifically, small relative movement X of the bulk of
remaining wafer W occurs with larger relative movement Xj of the immediately
broken section of dies 70. Moreover, with each such break - and the relatively elastic
membrane M - these relative movements change and become vision control herein provided to substitute such vision for what otherwise would be extremely laborious
and tedious operation of the scriber/breaker utilized with this invention.
In this operation of breaking intersecting streets 62 and streets 64, fiducials can
be utilized. Specifically, an din the usual case, elaborate patterns of electronic
components individually appear on each of the dies D comprising wafer W. By having
the machine vision program "tuned" to recognize one such elaborate intersection - a
common task which user of Nision Pro undertake - each die will have a discrete
fiducial which is recognizable.
Having explained this much, the logic diagram of Fig. 5 may now be set forth.
Presuming star 72, indexing to next street step 74 occurs. Thereafter, identify and
position fiducial step 76 occurs. This is followed by image capture step 78.
Once image capture step 78 occurs, that image is observed for a fiducial in
fiducial step 80. Assuming a "Yes" answer - and using the fiducial as the position
information, street alignment query step 82 follows. In the usual case, the "No"
answer will cause error calculation step 84 follows by table movement step 86.
Thereafter, break current street step 88 will follow.
Thereafter, program interrogation will occur at end of wafer step 90.
Presuming the end is reached, program end step 92 will occur.
Those having skill in programming will understand that fiducial present step
80, street alignment query step 82, and end of wafer step 90 are all conditional WO 99/39885 -H- PCT/US99/02605
branches. Where a fiducial is not found at fiducial present step 80, breaking ends.
Likewise, and assuming the happy (and unusual) accident that streets 64 are properly
aligned - something that usually only happens once or twice in a scribing of a wafer -
proceeding to break current street step 88 can occur at once. Finally, and when end of
wafer step 90 indicates that wafer W has not been fully broken, looping to indexing to
next street step 74 occurs.
It will be seen that I have described an automated vision scribing and breaking
process. The reader should understand that this process has been specifically delimited
to the use of the scriber/breaker described and set forth in Apparatus for Scribing
and/or Breaking Semiconductor Wafers filed April 3, 1996 as U.S. Patent Application
Serial No. 08/624,339 now U.S. Patent 5,820,006 issued October 13, 1998. It is the
use of the flexible membrane and knife edge K support of wafer W or die D on breaker
bar B that makes possible both the scribing and breaking herein set forth.
While the foregoing has been with reference to a particular embodiment of the
invention, it will be appreciated by those skilled in the art that changes in this
embodiment may be made without departing from the principles and spirit of the
invention, the scope of which is defined by the appended claims.

Claims

Claims:
1. In the combination of scribing apparatus having a membrane for
supporting dies, a breaker bar underlying the membrane for supporting discretely a die,
a plurality of elongate dies on the membrane, and a scriber for scribing the dies, the
process of scribing the dies comprising the steps of:
providing a membrane supported die array of rectilinear dies;
providing a transfer table for supporting the rectilinear dies at a periphery of the
transfer table leaving a central portion of the membrane with the supported die array on
top of the membrane and an underlying portion of the membrane exposed below the
transfer table;
providing a breaker bar underlying the transfer table and moveable between a
position of support of the membrane and a position of non support of the membrane;
arraying a plurality of rectilinear dies on the membrane so that a major axis of
the rectilinear dies extends at right angles to the underlying breaker bar;
individually detecting with machine vision and angularly aligning the
rectilinear dies to be normal to the underlying breaker bar;
moving the underlying breaker bar and membrane relative to one another to
support the rectilinear dies along a path to be scribed;
individually detecting with machine vision the edge of the aligned die; and
scribing the rectilinear dies partially across a width of such dies by
commencing the scribing at an inset from an edge of the rectilinear die.
2. The process of scribing dies according to claim 1 comprising the further
steps of:
repeating the scribing at discrete vertical intervals.
3. The process of scribing dies according to claim 2 comprising the further
steps of:
repeating the scribing at discrete vertical intervals of between 0.020 and 0.030
of an inch along the major axis of the rectilinear die.
4. The process of scribing dies according to claim 1 comprising the further
steps of:
arraying a plurality of rectilinear dies on the membrane so that the major axis of
the rectilinear dies extends at right angles to the underlying breaker bar within a
tolerance of ┬▒ 3┬░.
5. The process of scribing dies according to claim 1 comprising the further
steps of:
providing individual dies having an approximate dimension of a range of (but
not limited to) about 114 inches long and of about 1/8 inches of width.
6. The process of scribing dies according to claim 1 comprising the further
steps of:
placing the rectilinear dies in side-by-side arrays with spacing between the dies
being in a range of (but not limited to) about 200 microns.
7. In the combination of a scribing apparatus having a membrane for
supporting at least one wafer, a bar underlying the membrane for supporting the at least
one wafer along a scribe line, and means for breaking the at least one wafer, the
process of breaking dies from the at least one wafer comprising the steps of:
providing a membrane for supporting at least one wafer;
providing a transfer table for supporting the membrane at periphery of the
transfer table leaving a central portion of the membrane with the at least one wafer on
top of the membrane and an underlying portion of the membrane exposed below the
transfer table;
providing a breaker bar underlying the transfer table and moveable between a
position of support of the membrane and a position of non support of the membrane;
arraying the at least one wafer on the membrane so that a major axis of a first
scribe line extends parallel to the breaker bar underlying the transfer table;
determining an identifiable fiducial on a die defined within the wafer;
individually recognizing and angularly aligning the identifiable fiducial of at
least one wafer at the first scribe line to be parallel to the breaker bar underlying the
transfer table; moving the breaker bar and membrane relative to one another to support the at
least one wafer along the first scribe line;
breaking the at least one wafer across the first scribe line to cause relative
movement of a broken portion of the at least one wafer relative to a remainder of the at
least one wafer and the transfer table;
indexing the wafer from the first scribe line to a second scribe line on the at
least one wafer for support by the breaker bar underlying the membrane;
individually recognizing and aligning an identifiable fiducial to cause the at
least one wafer at the second scribe line to be directly above the knife edge to the
breaker bar underlying the transfer table; and
breaking the at least one wafer across the second scribe line.
8. In the combination of a scribing apparatus according the claim 7 and
wherein:
providing an anvil overlying the breaker bar; and
impacting the wafer on one side of the first or second scribe line to cause the
wafer to be broken along the scribe line.
PCT/US1999/002605 1998-02-06 1999-02-05 Apparatus and process for membrane mounted die breaking with automated visualization WO1999039885A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1986598A 1998-02-06 1998-02-06
US09/019,865 1998-02-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1941540A2 (en) * 2005-08-26 2008-07-09 Dynatex International (California Corporation) Method and apparatus for breaking semiconductor wafers

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057184A (en) * 1975-09-19 1977-11-08 Ppg Industries, Inc. Method of scoring glass using a scoring wheel having an arcuate scoring surface
US4296542A (en) * 1980-07-11 1981-10-27 Presco, Inc. Control of small parts in a manufacturing operation
US4653680A (en) * 1985-04-25 1987-03-31 Regan Barrie F Apparatus for breaking semiconductor wafers and the like
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
US5174188A (en) * 1989-06-07 1992-12-29 Commissariat A L'energie Atomique Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials
US5820006A (en) * 1994-01-18 1998-10-13 Dynatex International, Inc. Apparatus for scribing and/or breaking semiconductor wafers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057184A (en) * 1975-09-19 1977-11-08 Ppg Industries, Inc. Method of scoring glass using a scoring wheel having an arcuate scoring surface
US4296542A (en) * 1980-07-11 1981-10-27 Presco, Inc. Control of small parts in a manufacturing operation
US4653680A (en) * 1985-04-25 1987-03-31 Regan Barrie F Apparatus for breaking semiconductor wafers and the like
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
US5174188A (en) * 1989-06-07 1992-12-29 Commissariat A L'energie Atomique Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials
US5820006A (en) * 1994-01-18 1998-10-13 Dynatex International, Inc. Apparatus for scribing and/or breaking semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1941540A2 (en) * 2005-08-26 2008-07-09 Dynatex International (California Corporation) Method and apparatus for breaking semiconductor wafers
EP1941540A4 (en) * 2005-08-26 2011-03-23 Dynatex Internat California Corp Method and apparatus for breaking semiconductor wafers

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