JP5435925B2 - Expanding apparatus and expanding method - Google Patents

Description

  The present invention relates to an expanding apparatus and an expanding method for cutting an adherend such as a semiconductor wafer attached to an adhesive sheet into a plurality of small pieces and stretching the adhesive sheet to form a gap between the small pieces.

  As one of semiconductor manufacturing processes, there is a bonding process performed after a dicing process. In the dicing process, a semiconductor wafer (hereinafter simply referred to as “wafer”) integrated with the ring frame via an adhesive sheet is cut into a plurality of semiconductor chips (hereinafter simply referred to as “chips”). Also, in the bonding process, an adhesive sheet is stretched using an expanding device to form a gap between the chips. In this state, the chip is picked up one by one and the chip is bonded to a predetermined position on the circuit board. Done.

Conventionally, a device described in Patent Document 1 is known as such an expanding device. The expanding device includes a cylindrical expanding ring, a press ring, a plurality of bolts screwed into the press ring, and a tightening device for these bolts. Then, the adhesive sheet is placed on the expand ring, the press ring is placed on the ring frame, and the bolts are tightened to perform expansion, thereby forming a gap between the chips.
JP-A-9-190988

  The conventional expanding device requires a press ring, a bolt tightening device, and the like, and there is a problem that the device becomes large. In addition, after placing the adhesive sheet on the expanding ring, it is necessary to set a mechanical part composed of a press ring and a bolt, and there is a problem that this setting work is troublesome.

  In view of the above points, an object of the present invention is to provide a small and simple expanding device and an expanding method that do not require labor-intensive setting of machine parts.

  In order to solve the above-described problem, the expanding device according to claim 1 is configured to cut an adherend attached to an adhesive sheet having a size protruding from an outer edge of the adherend into a plurality of small pieces, and stretch the adhesive sheet. An expanding apparatus for forming a gap between the small pieces, a stage on which the adherend is placed with the adhesive sheet sandwiched between the adherend, and an adhesive sheet protruding from an outer edge of the adherend A groove formed on the surface of the stage on which the region is placed, and suction means for applying a suction force to the groove. The groove is formed in the groove by the suction force applied by the suction means. The adhesive sheet is sucked to stretch the adhesive sheet positioned inward of the groove.

  Moreover, in the said expand apparatus, the low friction member with which the said adhesive sheet can slip easily may be provided in the inner edge of the said ditch | groove.

  Further, in the expanding apparatus, a high friction member that is difficult to slip the adhesive sheet may be provided on an outer edge of the concave groove.

  The expanding device may further include length measuring means for measuring the distance between the small pieces and control means for adjusting the suction force of the suction means based on measurement data of the length measuring means.

  Furthermore, the expanding device may include a second suction unit that sucks an adhesive sheet positioned inward of the concave groove.

  Moreover, the said expansion apparatus WHEREIN: The said ditch | groove may be provided in the both sides of the orthogonal biaxial direction on both sides of the said to-be-adhered body.

  In order to solve the above-mentioned problem, the expanding method according to claim 7, the adherend adhered to an adhesive sheet having a size protruding from the outer edge of the adherend is cut into a plurality of small pieces, and the adhesive sheet is An expanding method for forming a gap between the small pieces by stretching, the step of placing the adherend on a stage so that the adhesive sheet is sandwiched therebetween, and an adhesive sheet protruding from the outer edge of the adherend A step of sucking a concave groove formed on the surface of the stage on which the region is placed, sucking the adhesive sheet into the concave groove, and stretching the adhesive sheet positioned inward of the concave groove, To do.

  In the expanding device and the expanding method of the present invention, the adhesive sheet positioned inside the concave groove, that is, the adherend of the adhesive sheet is pasted by sucking and drawing the adhesive sheet into the concave groove. Is stretched, and a gap is formed between a plurality of small pieces obtained by cutting the adherend. In the present invention, it is basically sufficient to provide a stage and suction means, and mechanical equipment such as a press ring and a bolt fastening device is not required, and the device structure is simple and small. Furthermore, it is not necessary to set mechanical parts after placing the adhesive sheet on the stage, and workability is improved.

  Moreover, if the low friction member is provided in the inner edge of the ditch | groove, the adhesive sheet located inside rather than a ditch | groove can be extended efficiently.

  Furthermore, if a high friction member is provided on the outer edge of the groove, the adhesive sheet positioned outward from the groove is prevented from being pulled into the groove, and is positioned inward from the groove. The adhesive sheet can be stretched more efficiently.

  Further, if the length measuring means and the control means are provided, the adhesive sheet can be stretched so that the distance between the small pieces becomes a required value.

  Furthermore, if the second suction means is provided, when picking up the small piece, the adhesive sheet can be prevented from being lifted from the surface of the stage by being pulled together with the small piece, and the pick-up operation can be performed with good workability. it can.

  In addition, if the concave grooves are provided on both sides of the orthogonal biaxial direction with the adherend interposed therebetween, the adhesive sheet can be stretched independently for each axial direction.

  FIG. 1 shows an expanding apparatus according to an embodiment of the present invention, and FIG. 2 shows a plan view thereof. In this expanding apparatus, a wafer W as an adherend integrated with the ring frame RF is diced through an adhesive sheet S and cut into a plurality of small chips WT, and then the adhesive sheet S is stretched between the chips WT. A gap is formed in

  The expanding apparatus has a stage 1 on which the wafer W and the ring frame RF are placed with the adhesive sheet S sandwiched between the wafer W, a groove 11 formed on the surface of the stage 1, and a suction force applied to the groove 11. Measuring the distance between the tip WT, the suction means 2 for applying and drawing the adhesive sheet S into the concave groove 11, the second suction means 3 for sucking the adhesive sheet S located inward of the concave groove 11 And a control means 5 for adjusting the suction force of the suction means 2 based on the measurement data of the length measurement means 4.

  On the surface of the stage 1, as shown in FIG. 2, an annular concave groove 11 is formed at a position where the adhesive sheet region protruding from the wafer W is placed. At the inner edge of the concave groove 11, a low friction member 12 that is curved in a sectional view and subjected to fluorine processing is provided so that the adhesive sheet S can be easily slipped. Moreover, the high friction member 13 which attached | subjected the fine unevenness | corrugation which the adhesive sheet S catches on the surface is provided in the outer edge of each concave groove 11 so that the adhesive sheet S cannot slip easily. These members 12 and 13 may be formed by processing the stage 1 directly.

  The suction means 2 includes a plurality of suction holes 21 penetrating the front and back of the stage 1 on which the adhesive sheet S outside the concave grooves 11 and the concave grooves 11 are placed, and a back plate 14 fixed to the back surface of the stage 1. A suction chamber 22 that is defined and communicates with the suction hole 21, a suction pipe 23 that connects the suction chamber 22 and the suction pump 24, and an open / close valve 25 interposed in the suction pipe 23.

  The second suction means 3 is defined by a number of suction holes 31 penetrating through the front and back of the stage 1 formed in the stage 1 inside the concave groove 11 and the back plate 14 fixed to the back surface of the stage 1 for suction. A suction chamber 32 that communicates with the hole 31, a suction pipe 33 that connects the suction chamber 32 and the suction pump 24, and an open / close valve 34 that is interposed in the suction pipe 33. In FIG. 2, the suction holes 21 and 31 are omitted for simplification of the drawing.

  The length measuring means 4 includes a camera 41 that captures an image of the wafer W on the stage 1 and an image processing circuit 42 connected to the camera 41. Then, the image of the wafer W taken by the camera 41 is processed by the image processing circuit 42, and the distance between the chips WT is measured.

  The control means 5 is composed of a controller 51 composed of a personal computer, a sequencer or the like to which measurement data from the image processing circuit 42 is input. The controller 51 controls the opening degree of the opening / closing valve 25 based on the distance between the chips WT measured by the length measuring means 4, and the negative pressure acting on the suction hole 21, that is, the suction force of the suction means 2 is controlled by the chip WT. Control the distance between them to the required value. The controller 51 also controls the suction pump 24 and the opening / closing valve 34.

  Next, an operation of stretching the adhesive sheet S to form a gap between the chips WT using the expanding apparatus of the present embodiment will be described.

  First, the wafer W integrated with the ring frame RF through the adhesive sheet S and separated into a plurality of chips WT by dicing is transferred to the adhesive sheet S as shown in FIG. Is placed on the stage 1 so that the adhesive sheet S is sandwiched between the wafer W and the adhesive sheet S.

  Next, the open / close valve 25 is opened with the open / close valve 34 closed. Then, the suction chamber 22 communicates with the suction pump 24 and negative pressure acts on the suction hole 21, and the outer edge portion of the adhesive sheet S located outside the concave groove 11 is located on the surface of the stage 1 as shown in FIG. The adhesive sheet S located on the concave groove 11 is sucked into the concave groove 11 and drawn. As the adhesive sheet S is pulled into the concave groove 11, the adhesive sheet S located inward of the concave groove 11, that is, the portion of the adhesive sheet S to which the wafer W is attached is stretched, and between the chips WT. A gap is formed. Then, the distance between the chips WT is measured by the length measuring means 4, and the opening / closing valve 25 is controlled by the controller 51 based on this measurement data, and the suction force is adjusted so that the measured distance between the chips WT becomes a required value. Adjusted.

  In the present embodiment, since the low friction member 12 is provided at the inner edge of the groove 11, the adhesive sheet S positioned inward of the groove 11 can be efficiently drawn into the groove 11. Can be stretched. Furthermore, since the high friction member 13 is provided on the outer edge of the groove 11, the outer edge portion of the adhesive sheet S positioned outward from the groove 11 is suppressed from being pulled into the groove 11. Only the adhesive sheet S positioned inward of the groove 11 can be stretched more efficiently.

  When the distance between the chips WT reaches a required value and this is detected by the length measuring means 4, the controller 51 opens the on-off valve 34. As a result, a negative pressure acts on the suction hole 31, and the adhesive sheet S positioned inward from the concave groove 11 is sucked. In this state, the chips WT are picked up one by one by a pickup device (not shown), and the chips WT are bonded to predetermined positions on the circuit board (not shown).

  According to the present embodiment, a large-scale mechanical facility such as a press ring and a bolt tightening device as in the conventional example is not required, and the device structure is simple and small. Further, after the adhesive sheet S is placed on the stage 1, it is not necessary to set mechanical parts such as a press ring and a bolt as in the conventional example, and workability is improved.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to this. For example, as shown in FIG. 4, the cutting direction (two orthogonal directions) of the wafer W in dicing is defined as the X-axis direction and the Y-axis direction. Are formed on the surface of the stage 1 on both outer sides of the wafer W in the Y-axis direction, and the two grooves 11Y parallel to the X-axis direction are formed. The suction chambers 22 may be provided independently, and the suction pipes 23 and the open / close valves 25 may be provided in the respective suction chambers 22. With such a configuration, the distance between the chips WT can be controlled independently in the X-axis direction and the Y-axis direction. For example, when it is desired to increase only the interval in the X-axis direction, the suction of the concave groove 11X is possible. What is necessary is just to enlarge force, and after expanding the space | interval of the X-axis direction, the space | interval of the Y-axis direction can also be expanded.

  Alternatively, the adhesive sheet S may be of an ultraviolet curable type and may be configured to irradiate the adhesive sheet S with ultraviolet rays before being placed on the stage 1. Furthermore, you may form a hollow in the surface part of the stage 1 inward rather than the ditch | groove 11. FIG. According to this, the adhesive sheet S positioned inward from the concave groove 11 is easily stretched without receiving frictional resistance from the stage 1.

  Further, suction of the outer edge portion of the adhesive sheet S and the ring frame RF are not indispensable. For example, a clamp member that presses and clamps the outer edge portion of the adhesive sheet S against the surface of the stage 1 may be provided.

  Furthermore, the low friction member 12 can be appropriately changed according to the compatibility with the adhesive sheet S, such as a resin or a mirror-finished metal member. In addition, the high friction member 13 can be appropriately modified depending on the compatibility with the adhesive sheet S using a rubber or a pressure sensitive adhesive or the like by giving a resin or a metal member a fine unevenness that allows the adhesive sheet S to be easily caught. is there.

  Moreover, although the said embodiment applies this invention to the expanding apparatus used after the dicing process of the wafer W, for example, adherends other than wafers, such as a glass plate, a steel plate, earthenware, a wooden board, or a resin board, are attached. The present invention can also be widely applied to an expanding apparatus that cuts a plurality of small pieces in a state of being attached to the adhesive sheet and then stretches the adhesive sheet to form a gap between the small pieces. Further, the semiconductor wafer may be a silicon wafer or a compound wafer.

The cutting | disconnection side view which shows the expand apparatus of embodiment of this invention. The top view which shows the stage of the expanding apparatus of embodiment. The cut side view of the operation state of the expanding apparatus of an embodiment. The top view which shows the stage of the expand apparatus of other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS S ... Adhesive sheet, W ... Wafer (to-be-adhered body), WT ... Chip | tip (small piece), 1 ... Stage, 11 ... Groove, 12 ... Low friction member, 13 ... High friction member, 2 ... Suction means, 3 ... First 2 suction means, 4 ... length measuring means, 5 ... control means.

Claims (2)

An expanding device that cuts an adherend adhered to an adhesive sheet having a size protruding from the outer edge of the adherend into a plurality of small pieces, and stretches the adhesive sheet to form a gap between the small pieces,
A stage on which the adherend is placed with the adhesive sheet sandwiched between the adherend,
A concave groove formed on the surface of the stage on which the adhesive sheet region protruding from the outer edge of the adherend is placed;
A suction means for applying a suction force to the concave groove,
The concave groove is to stretch the adhesive sheet positioned inward than the concave groove by sucking the adhesive sheet into the concave groove by the suction force applied by the suction means,
The expanding apparatus further comprises a length measuring means for measuring a distance between the small pieces and a control means for adjusting a suction force of the suction means based on measurement data of the length measuring means . An expanding method of cutting an adherend adhered to an adhesive sheet having a size protruding from the outer edge of the adherend into a plurality of small pieces and stretching the adhesive sheet to form a gap between the small pieces,
Placing the adherend on a stage so that the adhesive sheet is sandwiched therebetween;
Adhesion located inside the concave groove by sucking the concave groove formed on the surface of the stage on which the adhesive sheet region protruding from the outer edge of the adherend is placed, and sucking the adhesive sheet into the concave groove A process of stretching the sheet ,
The expanding method , wherein the step of stretching the adhesive sheet includes a step of measuring a distance between the small pieces and adjusting a suction force applied to the concave groove based on the measurement data .

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