TW201604944A - Tape expansion device - Google Patents

Abstract

To provide a tape expansion device, said tape expansion device can forcefully hold an expansion tape between the outer periphery of a wafer and the inner periphery of an annular frame, and prevent the expansion tape from being peeled from a relaxation portion of the expansion tape as a starting point. A tape expansion device which shrinks, after extending an expansion tape onto which a plate-like workpiece was affixed while the outer peripheral part of the expansion tape is mounted on an annular frame, the expansion tape in a relaxation area between the inner periphery of the annular frame and the outside periphery of the workpiece, is characterized by comprising: a frame holding means for holding the annular frame which holds, through the expansion tape, a workpiece defining a division starting point at the scribe lines or a workpiece divided into a plurality of chips at an opening; a chuck table for sucking and holding the workpiece at the holding surface, wherein the workpiece is supported by the annular frame through the extension tape; an expansion means for expanding the expansion tape by making the frame holding means and the chuck table move relatively in the direction perpendicular to the holding surface; and a shrinking means for shrinking the expansion tape by applying an external stimulation to the relaxation area of the expansion tape. The holding surface of the chuck table is provided with: a workpiece holding area corresponding to the workpiece, and a tape holding area surrounding the workpiece holding area and attracting the expansion tape.

Description

Tape expansion device Field of invention

The present invention relates to a tape expanding device for expanding an expansion tape to which a workpiece such as a wafer is attached to a surface.

Background of the invention

A plurality of devices, such as an IC and an LSI, are formed in a wafer such as a semiconductor wafer in a region in which a plurality of predetermined dividing lines are formed in a lattice shape, and are divided into individual element wafers by a dicing device or a laser processing device, and are divided. The component wafer is widely used in various electronic devices such as mobile phones and personal computers.

In recent years, among the segmentation methods using widely used laser processing devices, there is a method of focusing a light collecting spot of a laser beam having a penetrating wavelength for a wafer inside a wafer, and along The predetermined line is irradiated to form a modified layer inside the wafer, and then the expanded tape to which the wafer is attached is expanded and an external force is applied to the wafer, and the wafer is broken along the reforming layer and divided into individual component wafers ( For example, refer to Japanese Patent No. 3408805.

The workpiece to be processed by the tape expanding device also includes, for example, a DAF (Die Attach Film) attached to the back surface of the wafer. Expand the expansion tape A DAF dividing device and a dividing method for dividing a DAF are disclosed in Japanese Laid-Open Patent Publication No. 2009-272503.

Because of the expansion of the extended tape, in addition to the area to which the wafer is originally attached, the extended tape of the outer peripheral region between the outer periphery of the wafer and the inner periphery of the annular frame also extends, so that the outer peripheral region is heated. On the other hand, it is heated and re-contracted, thereby returning to the original state without any problem in the subsequent processing (for example, refer to Japanese Laid-Open Patent Publication No. 2007-027562).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent No. 3408805

Patent Document 2: Japanese Patent Laid-Open Publication No. 2009-272503

Patent Document 3: Japanese Patent Laid-Open Publication No. 2007-027562

Summary of invention

However, when the expansion tape which is expanded and extended in the outer peripheral area is once shrunk, there is a fear that the expansion tape is peeled off from the holding surface of the work chuck holding the wafer, starting from the slack portion of the expansion tape. The expansion tape is kept in an expanded state.

The present invention has been made in view of such a problem, and an object thereof is to provide a tape expanding device which is an expansion tape which strongly holds a peripheral edge of a wafer and an inner periphery of an annular frame. It is suppressed that the expanded tape is peeled off from the holding surface starting from the slack portion of the expanded tape.

According to the present invention, there is provided a tape expanding device for expanding an inner circumference of the annular frame and a workpiece after the sheet-shaped workpiece is attached and the outer peripheral portion is expanded by the expansion tape fitted to the annular frame. The slack region of the expanded tape between the outer peripheral edges is shrunk, and is characterized by comprising: frame holding means for holding the annular frame, the annular frame is formed by dividing the predetermined line to form a dividing starting point The workpiece or the workpiece divided into a plurality of wafers is supported by the opening; the working clamping table sucks and holds the workpiece supported by the annular frame on the holding surface via the expansion tape; and the expansion means maintains the frame And the working clamp is relatively moved in a direction perpendicular to the holding surface to expand the expansion tape; and the shrinking means is provided with external stimulation in the loose area of the expansion tape to shrink the expansion tape, and the working clamping table The holding surface has: a workpiece holding area corresponding to the workpiece, and a tape holding area surrounding the workpiece holding area and attracting the expansion tape .

Preferably, the tape holding area is formed at a position which is lower than the workpiece holding area and has a lower position, preventing the expansion tape from being wound by the aforementioned holding surface due to the bulging of the expansion tape. Start.

In the tape expanding device of the present invention, the working chuck has a tape holding region for sucking and holding the expanded tape in the outer side region of the plate-shaped workpiece, in addition to the workpiece holding region, so that the tape retaining region can be strongly expanded in the tape holding region. Tape and can inhibit the expansion of the adhesive Since the belt is the starting point and the expansion tape is peeled off from the holding surface of the work chuck, the expanded wafer interval can be maintained.

In the invention of claim 2, the tape holding area is formed at a position which is lower than the workpiece holding area and has a lower position, whereby the work chuck which is lifted upward is extended obliquely downward and is processed. The expansion tape on the outer side of the object easily follows the tape holding area, so that the suction holding of the expanded tape can be surely performed.

2‧‧‧ tape expansion device

4‧‧‧Shell

6‧‧‧Shell

8‧‧‧ cover

10‧‧‧ gate

11‧‧‧Semiconductor wafer

11a‧‧‧ surface

11b‧‧‧Back

12‧‧‧Abutment

13‧‧‧Division line

14,14A‧‧‧Working table

15‧‧‧ components

16,16A‧‧‧ frame

16a‧‧‧ Tape retention area

16b‧‧‧ recess

17‧‧‧DAF

18‧‧‧Attraction and Maintenance Department

18a‧‧‧ Wafer holding area

19‧‧‧ Wafer Unit

20‧‧‧Circle suction ditch

21‧‧‧Modified layer

22‧‧‧Attraction hole

23‧‧‧ wafer

24‧‧‧ height difference

25‧‧‧ slack part

26‧‧‧ Lifting mechanism

28‧‧‧ cylinder

30‧‧‧ piston rod

32‧‧‧Table

32a‧‧‧ openings

34‧‧‧ boards

34a‧‧‧ openings

36‧‧‧heater

38‧‧‧Support board

40‧‧‧ tube

F‧‧‧Ring frame

T‧‧‧Expansion tape

1 is a perspective view of a wafer unit supporting a wafer with an annular frame via an expansion tape.

Fig. 2 is a perspective view showing the appearance of a tape expanding device.

Fig. 3 is an exploded perspective view of the tape expanding device according to the embodiment of the present invention.

Fig. 4 (A) is a cross-sectional view of the work chuck of the first embodiment, and Fig. 4 (B) is a plan view thereof.

Fig. 5(A) is a cross-sectional view of the work chuck of the second embodiment, and Fig. 5(B) is a plan view thereof.

6(A) is a cross-sectional view showing a state in which a wafer is held by a spread tape on a working chuck of the tape expanding device and a ring frame is held by the frame holding unit, and FIG. 6(B) is a pull-down frame holding unit. A sectional view of the state.

Fig. 7(A) is a cross-sectional view showing a state in which the slack portion of the expanded tape between the outer periphery of the wafer and the inner periphery of the annular frame is heated, and Fig. 7(B) shows the relaxation of the expanded tape by heating. A sectional view of the state.

Fig. 8(A) shows the wafer holding the wafer in the working stage of the second embodiment and pulled down FIG. 8(B) is a cross-sectional view showing a state in which the frame holding unit is pulled down and raised to the original position.

Form for implementing the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to Fig. 1, a back surface of a semiconductor wafer (hereinafter, abbreviated as a wafer) 11 is attached to an outer peripheral portion of an extended tape T attached to an annular frame F via a DAF (Die Attach Film). A perspective view of the formed wafer unit 19.

The plurality of predetermined dividing lines are formed in a lattice shape on the surface 11a of the wafer 11, and elements 15 such as ICs and LSIs are formed in the respective regions partitioned by the predetermined line. A reforming layer serving as a starting point of division is formed along the dividing line 13 inside the wafer 11.

Referring to Fig. 2, there is shown a perspective view of a tape expanding device 2 according to an embodiment of the present invention. Fig. 3 is an exploded perspective view showing respective components of the tape expanding device. As shown in Fig. 2, the tape expanding device 2 includes a casing 4 that houses the respective constituent portions.

The casing 4 is constituted by a casing 6 having an opening in a cubic shape and a cover 8 closing the opening of the casing 6. For example, the cover 8 is coupled to the housing 6 via a hinge, and the hinge is used as a fulcrum switch.

On the side surface of the casing 6, a carry-in/out port for carrying out the loading and unloading of the wafer unit 19 shown in Fig. 1 is formed. A gate 10 for opening and closing the inlet and outlet is provided at a position covering the loading and unloading port. When the shutter 10 is in the open state, the wafer unit 19 can be carried out and carried into the inside of the casing 4.

Inside the casing 4, as shown in Fig. 3, a base 12 having a cubic shape is disposed. On the top of the base 12, a cylindrical working table 14 is fixed. The diameter of the work chuck 14 is smaller than the diameter of the inner circumference (opening) of the annular frame F.

As is most clearly shown in FIG. 4, the work chuck 14 is a frame body 16 made of a metal such as SUS, and a suction holding portion 18 which is formed in a recess 16b of the frame body 16 and is formed of a porous member such as porous ceramic. .

The holding surface 18a of the suction holding portion 18 is flush with the upper surface 16a of the frame body 16, and the expansion tape T is held by both, so that the holding surface 18a of the suction holding portion 18 and the upper surface 16a of the frame body 16 are collectively 14 "holding face".

An annular suction groove 20 is formed in the upper surface 16a of the frame 16 surrounding the suction holding portion 18. The holding surface of the work chuck 14 has a tape holding region 16a that attracts the wafer holding region 18a of the wafer 11 and the expanded tape T that attracts the outside of the wafer 11.

As shown in FIG. 4(B), a plurality of (four in the present embodiment) suction holes 22 are opened in the annular suction groove 20. The annular suction groove 20 is selectively connected to the suction source through the suction hole 22, a suction path (not shown), and an electromagnetic switching valve. Similarly, the suction holding unit 18 is selectively connected to the suction source through a suction path (not shown) and an electromagnetic switching valve.

Referring to Fig. 3, four elevating mechanisms (tape expanding means) 26 are disposed at a position surrounding the base 12. Each of the lifting and lowering mechanisms 26 has a cylinder 18 and a piston rod 30, and a table (frame holding means) 32 on which the annular frame F is placed is fixed to the upper end portion of the piston rod 30. In the central part of the table 32, a working folder is formed The circular opening 32a of the diameter of the table 14 having a large diameter is inserted into the opening 32a of the working chuck 14.

Above the table 32, a plate (frame holding means) 34 which is fixed by pressing the annular frame F placed on the table 32 and fixed thereto is provided. In the central portion of the plate 34, an opening 34a corresponding to the opening 32a of the table 32 is formed.

Above the plate 34, a heater 36 is provided which is movable up and down. The heater 36 is attached to a disc-shaped support plate 38, and the support plate 38 is coupled to the tube 40. The tube 40 is coupled to the moving mechanism, and the heater 36 is moved in the vertical direction by actuating the moving mechanism.

Referring to Fig. 5(A), a cross-sectional view of the work chuck 14A according to the second embodiment of the present invention is shown. Fig. 5 (B) is a plan view of the work chuck 14A shown in Fig. 5 (A). In the work chuck 14A of the present embodiment, the tape holding region 16a is formed at a position having a predetermined height difference 24 with respect to the wafer holding region 18a and being low.

That is, the upper surface 16a of the casing 16A is formed at a position lower than the holding surface 18a of the suction holding portion 18. The rest of the configuration of the present embodiment is the same as that of the work table 14 shown in Fig. 4, and therefore the same reference numerals are attached thereto, and the description thereof is omitted.

Next, the action of the tape expanding device 2 described above will be described with reference to Figs. 6 to 8 . First, the shutter 10 shown in FIG. 2 is opened, and the wafer unit 19 is carried into the inside of the casing 4. As shown in FIG. 6(A), the wafer 11 is placed on the work chuck 14 via the spread tape T. And the annular frame F is placed on the table 32.

Then, a moving means (not shown) is actuated to press the annular frame F from the upper side with the plate 34. Thereby, the annular frame F is fixed to the table 32. Table The 32 and the plate 34 constitute a frame holding means.

Next, as shown in Fig. 6(B), the cylinder 28 of the elevating mechanism 26 is actuated to shorten the piston rod 30, and the annular frame F fixed to the table 32 and the plate 34 is pulled down relative to the working table 14.

In other words, the holding surface of the work chuck 14 becomes lifted up relative to the annular frame F. Thereby, the expanded tape T is expanded (expanded) in the radial direction. At this time, the suction holding portion 18 and the annular suction groove 20 of the work chuck 14 are not connected to the suction source.

As a result, the wafer 11 is divided into individual wafers 23 along the dividing line 13 with the modified layer 21 as the fracture starting point, and the DAF 17 attached to the back surface 11b of the wafer 11 is also broken along the dividing line 13 (expansion step) ).

After the expansion step is performed, the suction holding portion 18 and the annular suction groove 20 of the working chuck 14 are connected to the suction source by switching the electromagnetic switching valve to the communication position, and the wafer holding area 18a and the tape in the working chuck 14 are The holding area 16a attracts the expansion tape T in a state of being kept in an expanded state. Thereby, the interval between the adjacent wafers 23 of the wafers 11 divided into the respective wafers 23 is maintained in an enlarged state.

After the expansion step is performed, the cylinder 28 is actuated to extend the piston rod 30 to raise the annular frame F to the original position, and the expansion tape T between the outer periphery of the wafer 11 and the inner periphery of the annular frame F is slackened. Part 25.

Therefore, as shown in Fig. 7(A), a moving mechanism (not shown) is driven to lower the heater 36 to approach the slack portion 25, and the heater 36 heats the slack portion 25 of the spread tape T. By this heating, the slack is removed, and as shown in FIG. 7(B), the extended glue between the outer periphery of the wafer 11 and the inner periphery of the annular frame F is extended. The belt T is corrected to a flat shape.

In the state of FIG. 7(A) and FIG. 7(B), since the suction holding portion 18 and the annular suction groove 20 of the work chuck 14 are maintained in a state of being connected to the suction source, the expansion tape T is in addition to the crystal. In addition to the circular holding region 18a, the tape holding region 16a surrounding the wafer holding region 18a can be strongly sucked and held, and the expansion tape T can be prevented from being peeled off from the holding surface of the work chuck 14.

Therefore, in the wafer 23 to which the DAF 17 is attached and which is divided into the respective sides, the interval between the adjacent wafers 23 is maintained in an enlarged state. As a result, when the pickup process of picking up the individual wafers 23 by the expansion tape T is performed, it is possible to prevent the picked-up wafer 23 from colliding with the adjacent wafer and being damaged.

Referring to Fig. 8(A), a cross-sectional view showing a state in which the wafer 11 is held by the work chuck 14A of the second embodiment, and the piston rod 30 is pulled down to perform the expansion step is shown.

Fig. 8(B) is a cross-sectional view showing a state in which the cylinder rod 28 is actuated to extend the piston rod 30, and the annular frame F is returned to its original state. Since the expanded state is restored to the original state after the expansion step, the expanded tape T between the outer periphery of the wafer 11 and the inner periphery of the annular frame F generates the slack portion 25.

In the work chuck 14A of the present embodiment, since the tape holding region 16a is formed at a lower position one step lower than the wafer holding region 18a, the working chuck 14A is lifted upward and downward. The expanded tape T extending outside and outside the wafer 11 easily follows the tape holding region 16a, so that the suction holding of the expanded tape T can be performed more surely.

From the state shown in Fig. 8(B), the heater can be made as shown in Fig. 7(A). 36 is lowered and the relaxed portion 25 is heated and contracted by the heater 36, whereby the slack portion can be corrected to a flat shape.

In the above description, an example has been described in which the annular frame is pulled down against the work clamp, but it may be an embodiment in which the work clamp is lifted up toward the annular frame.

In the above-described embodiment, an example has been described in which the workpiece to which the DAF 17 is attached on the back surface of the wafer 11 is divided into individual wafers. However, even if the wafer 11 is directly attached to the expanded tape T without interposing the DAF. In the embodiment, the present invention can also exert the same operational effects as described above.

Further, although an example in which the reforming layer 21 as the dividing starting point is formed inside the wafer 11 along the dividing line 13 has been described, the wafer 11 has been divided into individual wafers 23 and attached to the back surface of the wafer 11. The tape expansion device 2 of the present invention can also exhibit the same effects as the workpiece to which the DAF 17 is attached.

2‧‧‧ tape expansion device

11‧‧‧Semiconductor wafer

14‧‧‧Working table

17‧‧‧DAF

18‧‧‧Attraction and Maintenance Department

18a‧‧‧ Wafer holding area

20‧‧‧Circle suction ditch

21‧‧‧Modified layer

23‧‧‧ wafer

30‧‧‧ piston rod

32‧‧‧Table

34‧‧‧ boards

F‧‧‧Ring frame

T‧‧‧Expansion tape

Claims (2)

A tape expanding device for expanding an inner peripheral edge of the annular frame and a periphery of the workpiece after the plate-shaped workpiece is attached and the outer peripheral portion is expanded by the expansion tape fitted to the annular frame The slack area of the expanded tape is shrunk, and is characterized by comprising: a frame holding means for holding an annular frame, the annular frame is formed by dividing the predetermined line to form a starting point of the starting point or dividing the dividing line The processed object of the plurality of wafers is supported by the opening; the working clamping table is configured to attract and hold the workpiece supported by the annular frame through the expansion tape on the holding surface; and the expanding means enables the frame holding means and the working clamp The table is relatively moved in a direction perpendicular to the holding surface to expand the expansion tape; and a shrinking means is provided with an external stimulus in the loose area of the expansion tape to shrink the expansion tape, and the holding surface of the working table has: A workpiece holding area of the workpiece, and a tape holding area surrounding the workpiece holding area and attracting the expansion tape. The tape expansion device of claim 1, wherein the tape holding area is formed at a position which is lower than the aforementioned workpiece holding area and is lower, preventing the expansion tape from being caused by the slack of the expansion tape. It is rolled up by the aforementioned holding surface.