TWI734873B - Split device - Google Patents

Abstract

[Problem] Dividing the wafer reliably without deteriorating the pick-up of the wafer. [Solution] A dicing device is to divide the wafer supported on the ring frame through the tape through the expansion of the tape and start from the modified layer. The dicing device is formed with a table , Frame holding equipment, lifting equipment, control equipment, and shrinking equipment, the workbench is to hold the wafer through the tape, the frame holding equipment is to hold the ring frame around the wafer, the lifting equipment is to make the The table and the frame holding device are relatively close to and away from each other. The control device controls the lifting device to form a predetermined interval between the wafers after the wafer is divided. The shrinking device maintains the gap between the wafers at The state of the predetermined interval is used to shrink the loosened tape between the outer periphery of the wafer and the inner periphery of the ring frame to fix the interval between the wafers.

Description

Split device Field of invention

The present invention relates to a dividing device for dividing a wafer into individual wafers.

Background of the invention

In the past, known as such a dividing device is the following dividing device: the wafer supported on the ring frame through the tape is expanded along the starting point of the wafer that has been formed by the tape. Dividing device (see, for example, Patent Documents 1-3). In these dividing devices, the wafer is held on the dividing table, the ring frame is held on the ring table, and the wafer is pushed up relative to the ring frame, thereby moving the tape in the radial direction Divide the wafer into individual wafers by expanding. The divided wafer is picked up from the tape by a picker or the like in the next step.

Prior art literature Patent literature

Patent Document 1: Japanese Patent Laid-Open No. 2016-004832

Patent Document 2: Japanese Patent Laid-Open No. 2007-027250

Patent Document 3: Japanese Patent Laid-Open No. 2015-204362

Summary of the invention

However, in order to divide the wafer size into smaller wafers, the tape must be expanded larger. When the tape is expanded larger, the distance between the wafers is too wide, and it becomes impossible to pick up the wafers in the next step, or the picking time becomes longer. On the other hand, although it is also considered to reduce the gap between the wafers by suppressing the expansion of the tape to improve the pick-up of the wafers, it may not be possible to appropriately divide wafers with smaller wafer sizes. In this way, the following problem has arisen: When the tape expands greatly, it will cause a problem in picking, and if the expansion of the tape is suppressed, the wafer cannot be properly divided.

The present invention was made in view of the above-mentioned problems, and one of its objects is to provide a dividing device that can reliably divide a wafer without deteriorating the pick-up properties of the wafer.

In one aspect of the dividing device of the present invention, a wafer formed with a dividing starting point is attached to a tape that blocks the opening of a ring frame to be attached, so that the ring frame, the tape and the wafer are integrated The tape of the resultant work set is expanded, and the wafer is divided using the starting point of division as a starting point. The division device includes: a frame holding device for holding the ring frame; The holding surface is to hold the wafer through the tape of the workpiece group held by the frame holding device; the lifting device makes the table and the frame holding device relatively approach and move away from each other in a direction orthogonal to the holding surface ； The control device moves the workbench and the frame holding device in a direction away from each other to expand the tape, and after dividing the wafer with the starting point of division as a starting point, make the workbench and the frame holding device move in the direction of approaching each other Move adjacent chips to approach and form a preset narrowing interval; and a shrinking device, by which the control device forms the interval, and the holding surface attracts and maintains the expanded tape to maintain the interval, And make the workbench and the frame holding device closer, and shrink the loosened tape between the outer circumference of the wafer and the inner circumference of the ring frame, and fix the interval between adjacent wafers.

According to this configuration, when the wafer is divided, the table is separated from the frame holding device, so that the tape expands greatly, and the wafer is reliably divided from the starting point of the division. After the wafer is divided, the workbench is brought close to the frame holding device to release the expansion of the tape and narrow the distance between adjacent wafers. In addition, in a state where the interval between adjacent chips has been narrowed to a predetermined interval, the gap between the chips can be fixed by removing the slack of the tape around the wafer. According to this, there is no possibility that uneven dispersion occurs in the pickup position of the wafer, or the pickup time becomes longer. In this way, the pick-up performance of the wafer is not deteriorated, and the wafer can be reliably divided.

According to the present invention, the tape can be expanded and relaxed after the wafer is divided, and the slack of the tape around the wafer can be removed, so that the interval between adjacent wafers can be fixed at a predetermined interval. According to this, you can use When the pick-up of the wafer deteriorates, the wafer is surely divided.

1.61: Dividing device

10: Workbench

11: Pillar

12: Perforated plate

13: Keep the noodles

14: On-off valve

15: Roller part

16: Attraction source

20: Frame holding equipment

21: Place the workbench

22: cover

23, 24: round opening

26: Lifting equipment

27: cylinder rod

30: Shrinking equipment

31: Spiral arm

32: heater

33: Up and down movement part

34: Rotating motor

40: control equipment

45: peripheral shooting equipment

46: Computing equipment

48: shooting equipment

49: measuring equipment

65: Pickup

F: ring frame

T: Tape

C: chip

W: Wafer

WS: Workpiece group

L: Pre-divided line

D1, D2: outer diameter

S1, S2: interval

P1, P2: outer peripheral position

R: allowable range

Fig. 1 is a perspective view of the dividing device of this embodiment.

Fig. 2 is an explanatory diagram of a wafer dividing operation and a picking operation in a comparative example.

3A to 3D are diagrams showing the adjustment process of the wafer spacing in this embodiment.

4A to 4D are explanatory diagrams of the dividing operation performed by the dividing device of this embodiment.

5A to 5B are diagrams showing the adjustment process of the wafer gap in a modification example.

The form used to implement the invention

Hereinafter, the dividing device of this embodiment will be described with reference to the attached drawings. Fig. 1 is a perspective view of the dividing device of this embodiment. Fig. 2 is an explanatory diagram of a wafer dividing operation and a picking operation in a comparative example. In addition, the dividing device is not limited to the configuration described in FIG. 1, but can be appropriately changed.

As shown in FIG. 1, the dividing device 1 is configured to divide the wafer W supported on the ring frame F through the tape T into individual wafers C by the expansion of the tape T (refer to FIG. 3A) . In addition, the dividing device 1 is configured to remove the slack of the tape T occurring between the outer periphery of the wafer W and the inner periphery of the ring frame F by heat shrink when the expansion of the tape T is released. In this way, only the place where the tape T is stretched and slack is thermally shrunk to maintain the gap between the wafers C so as to prevent the wafers C from each other after the wafer W is divided. Damaged by contact.

A grid-shaped planned dividing line L is provided on the front surface of the wafer W, and various devices (not shown) are formed in each area delimited by the planned dividing line L. Furthermore, the wafer W may also be a semiconductor wafer in which IC, LSI and other devices are formed on a semiconductor substrate such as silicon and gallium arsenide, or it may be a ceramic, glass, or sapphire-based inorganic material substrate formed with LEDs, etc. Optical device wafer. The wafer W is attached to the tape T that has been attached to the ring frame F, and the workpiece group WS in which the wafer W, the ring frame F, and the tape T are integrated is carried into the dividing device 1.

The ring frame F of the workpiece group WS has the opening part closed by the tape T having heat shrinkability, and the wafer W is attached to the tape T inside the opening part. Inside the wafer W, a modified layer (not shown) is formed along the planned dividing line L as a starting point for dividing. Furthermore, the modified layer refers to an area where the density, refractive index, mechanical strength, and other physical properties inside the wafer W become different from the surroundings by laser irradiation, and the intensity is also lower than the surroundings. . The modified layer may be, for example, a melt-processed area, a cracked area, a dielectric breakdown area, or a refractive index change area, or a mixed area of these areas.

In addition, in the following description, although the modified layer formed in the inside of the wafer W is exemplified as the starting point of the division, it is not limited to this configuration. The starting point of division may be a starting point when the wafer W is divided, and it may be constituted by, for example, a laser processing groove, a dicing groove, or a scribe line. In addition, the material of the tape T is not particularly limited as long as it has stretchability and heat shrinkability. Furthermore, the tape substrate Preferably, it is formed from, for example, polyolefin (PO) or polyvinyl chloride (PVC).

The dividing device 1 is provided with a table 10 that can suck and hold the wafer W through the tape T of the workpiece group WS, and a ring frame F that holds the workpiece group WS is arranged around the table 10 Frame holding device 20. The workbench 10 is supported by a plurality of pillars 11, and a porous plate 12 is arranged on the upper surface of the workbench 10. With this porous plate 12, a holding surface 13 for attracting and holding the wafer W is formed on the upper surface of the table 10. The holding surface 13 is connected to a suction source 16 (see FIG. 4A) through a flow path in the table 10, and the wafer W is sucked and held by the negative pressure generated by the holding surface 13.

In addition, an on-off valve 14 (see FIG. 4A) is provided in the flow path communicating from the holding surface 13 to the suction source 16, and the on-off valve 14 can switch between the holding surface 13 and the suction release of the wafer W. A plurality of roller parts 15 are rotatably provided on the outer peripheral edge of the worktable 10 so as to cover the entire circumference. The plurality of roller parts 15 can rotate the tape T contacting the periphery of the wafer W from the lower side in a state where the wafer W has been held on the holding surface 13. By rotating and contacting the tape T with the plurality of roller parts 15, the friction of the tape T generated on the outer peripheral edge of the table 10 when the tape T is expanded can be suppressed.

The frame holding device 20 is formed by sandwiching the ring frame F on the mounting table 21 with a cover plate 22 from above to hold the ring frame F on the mounting table 21. In the center of the mounting table 21 and the cover plate 22, circular openings 23 and 24 having a larger diameter than the table 10 are respectively formed. When the cover 22 has been covered on the mounting table 21, it is borrowed The ring frame F is held by the cover 22 and the mounting table 21, and a part of the wafer W and the tape T is exposed to the outside from the circular openings 23 and 24 of the mounting table 21 and the cover 22.

The frame holding device 20 is in a state where the cover 22 is covered on the ring frame F on the mounting table 21, and the cover 22 is fixed to the mounting table 21 by, for example, a clamp part not shown. The frame holding device 20 is supported on a lifting device 26 that makes the workbench 10 and the frame holding device 20 relatively move away and approach in a direction orthogonal to the holding surface 13. The lifting device 26 is composed of four electric cylinders, and the four electric cylinders support the four corners of the mounting table 21. By controlling the protrusion amount of the cylinder rod 27 of the lifting device 26, the distance between the wafer W on the worktable 10 and the frame holding device 20 can be adjusted.

A shrinking device 30 is provided above the frame holding device 20, and the shrinking device 30 is used to shrink the slack generated in the tape T. The shrinking device 30 is arranged on the center axis of the wafer W, and a pair of heaters 32 are arranged at both ends of the revolving arm 31 in a manner of sandwiching the center of the wafer W and facing each other. The heater 32 is configured, for example, to spot irradiate a far red line, and the far outer line has a peak waveform of 3 μm to 25 μm, which is difficult to be absorbed by a metal material. Thereby, heating of each part of the device can be suppressed, and the slack portion of the tape T between the outer circumference of the wafer W and the inner circumference of the ring frame F can be heated to perform thermal shrinkage.

In addition, the revolving arm 31 of the contracting device 30 is provided with an up-and-down moving part 33 and a rotating motor 34. The up-and-down moving part 33 moves the pair of heaters 32 up and down, and the rotating motor 34 moves the pair of heaters 32 around Wafer W The central axis rotates. The up-and-down action part 33 adjusts the height of the pair of heaters 32 to the tape T in accordance with the lifting action of the frame holding device 20. The rotation motor 34 winds the pair of heaters 32 so as to cover the entire circumference and heat the slack of the tape T around the wafer W. The pair of heaters 32 can be appropriately positioned with respect to the tape T by the up-and-down moving part 33 and the rotation motor 34, thereby heating the tape T around the wafer W well.

In addition, the dividing device 1 is provided with a control device 40 that integrates each part of the control device. The control device 40 is composed of a processor, a memory, and the like that execute various processes. The memory is composed of one or more storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) due to application. The expansion action of the tape T can be controlled by the control device 40 to move the workbench 10 and the frame holding device 20 relative to each other, and the slack of the tape T can be removed by one of the shrinking devices 30 to the heater 32 to control the contraction action of the tape T. In addition, the adjustment process of the wafer interval described later can be controlled by the control device 40.

In such a dividing device 1, the frame holding device 20 is lowered in a state where the ring frame F has been held, thereby removing the workbench 10 from the cover 22 and the circular openings 23, 24 of the mounting workbench 21 protrude. By pushing up the table 10 relative to the frame holding device 20, the tape T can be expanded in the radial direction to divide the wafer W into individual wafers C. In addition, when the frame holding device 20 is raised to release the expansion of the tape T, the tension of the tape T is relaxed. At this time, the tape T can be heated by the heater 32 to perform thermal shrinkage to prevent the tape T around the wafer W from slackening.

In addition, as shown in FIG. 2, in a general dividing device 61, every time the wafer W is divided, uneven dispersion occurs between the wafers C, and the wafer C must be picked up by the picker 65 in the next step. When, identify the position of chip C. In addition, in order to divide the wafer W with a smaller wafer size, the tape T must be expanded to prevent the wafers C from colliding with each other and being damaged, and the moving distance when the wafer C is picked up by the picker 65 becomes longer. Increase pickup time. In addition, when the wafer C is positioned outside the moving range of the picker 65, the wafer C may not be picked up.

Therefore, in the dividing device 1 (refer to FIG. 1) of the present embodiment, after the tape T is expanded to divide the wafer W into individual wafers C, the tape T is relaxed to separate the adjacent wafers C. The interval is formed as a preset interval. In this case, while imaging the outer periphery of the divided wafer W by the outer periphery imaging device 45 installed above the table 10, the outer periphery position of the wafer W in the captured image is aligned with the prescribed outer periphery position. , To adjust the interval of chip C. In addition, the slack of the tape T around the wafer W is removed by thermal shrinkage, so that the adjacent wafers C are fixed at an interval suitable for the pickup operation.

Hereinafter, referring to FIG. 3, the wafer gap adjustment processing performed by the control device will be described. Fig. 3 is a diagram showing the adjustment process of the wafer interval in the present embodiment.

As shown in FIG. 3A, when the table 10 is pushed up relative to the frame holding device 20, the tape T is expanded and the wafer W is divided into individual wafers C. By expanding the divided wafer W to the outer diameter D1, a gap S1 can be formed between adjacent wafers C. After the wafer W is divided, The frame holding device 20 is brought close to the workbench 10 to release the expansion of the tape T. Thereby, the outer diameter of the divided wafer W starts to decrease due to the elastic recovery of the tape T, and the adjacent chips C gradually approach, and the interval between the adjacent chips C is narrowed.

At this time, above the table 10, a peripheral imaging device 45 is provided, and the peripheral imaging device 45 is used to photograph the outer periphery of the divided wafer W. The peripheral imaging device 45 is connected to the control device 40, and the captured image of the periphery of the wafer W is input to the control device 40 from the peripheral imaging device 45. In the control device 40, various image processing such as edge detection processing is performed with respect to the captured image, and the peripheral position of the wafer W is detected from the brightness difference of the captured image and the like. As described above, the tape T can be expanded during the division of the wafer W, and the peripheral position P1 can be detected by the peripheral imaging device 45 as the peripheral position of the wafer W.

As shown in FIG. 3B, when the outer periphery of the wafer W photographed by the outer periphery photographing device 45 is moved to the outer periphery position P2 by the proximity of the frame holding device 20 to the table 10, the tape T can be attracted and held at The holding surface 13 of the table 10 is up to maintain the gap between the wafers C. At this time, the wafer W is narrowed to the outer diameter D2, and a predetermined interval S2 can be formed between adjacent wafers C. Furthermore, the interval S2 is an interval suitable for the pick-up action in the next step. In this way, the peripheral imaging device 45 monitors the peripheral position of the wafer W that changes according to the interval between the adjacent wafers C, and adjusts the interval between the wafers C while indirectly measuring the interval between the wafers C.

Furthermore, as shown in FIG. 3C, the outer peripheral position P2 of the wafer W is connected to the computing device 46 (refer to FIG. 3B) connected to the control device 40 (see FIG. 3B). Figure 1) and calculated in advance. In more detail, the number of planned dividing lines of wafer W is determined by the wafer size of wafer W, and only the number of planned dividing lines is used to calculate the ratio of wafer W when chip C is expanded to interval S2. Outer diameter D2. The outer peripheral position P2 of the interval S2 of the wafer W corresponding to the wafer C can be calculated according to the outer diameter D2 of the wafer W. In addition, the computing device 46 is composed of a processor or a memory that executes various processing similarly to the control device 40.

Furthermore, as shown in FIG. 3D, the allowable range R shown by a dotted chain line may be set at the outer peripheral position P2 of the wafer W. In this case, when the outer periphery of the wafer W photographed by the outer periphery imaging device 45 is within the allowable range R due to the proximity of the frame holding device 20 to the table 10, it will be judged as an adjacent wafer C The interval is consistent with the preset interval S2. When adjusting the gap between the chips C in this way, the slack of the tape T around the wafer W is removed by thermal shrinkage, so that the chips C can be fixed while maintaining the predetermined gap S2.

Next, referring to FIG. 4, the division operation performed by the division device of this embodiment will be described. Fig. 4 is an explanatory diagram of the dividing operation performed by the dividing device of the present embodiment. Each shows that FIG. 4A is an example of a dividing step, FIG. 4B is an example of a wafer gap adjustment step, FIG. 4C is an example of a tape suction and holding step, and FIG. 4D is an example of a tape shrinking step.

As shown in Figure 4A, the segmentation step can be implemented first. In the dividing step, the wafer W is placed on the table 10 via the tape T, and the ring frame F around the wafer W is held by the frame holding device 20. this At this time, the on-off valve 14 is closed, and the suction force from the suction source 16 to the table 10 is blocked. In addition, the frame holding device 20 is lowered under the control of the control device 40, and the workbench 10 and the frame holding device 20 are kept away from each other. Thereby, the tape T is expanded in the radial direction, and the wafer W is divided into individual wafers C through the tape T using the modified layer whose strength has been reduced as a starting point.

As shown in FIG. 4B, the wafer gap adjustment step may be implemented after the dividing step. In the step of adjusting the wafer interval, the frame holding device 20 is raised by the control of the control device 40 and the table 10 and the frame holding device 20 are brought close. Thereby, the expansion of the tape T can be released, and the adjacent chips C will gradually approach by the elastic recovery of the tape T. At this time, the peripheral imaging device 45 is positioned above the table 10, and the peripheral imaging device 45 is used to photograph the outer periphery of the divided wafer W. The peripheral position of the wafer W can be detected from this captured image and compared with the peripheral position of the wafer W calculated in advance by the computing device 46 (refer to FIG. 1).

By the control device 40, the table 10 and the frame holding device 20 are brought close until the outer peripheral position of the wafer W detected from the captured image is consistent with the outer peripheral position of the wafer W that has been calculated in advance. The adjacent chips C can be gradually approached, and the interval between the chips C can be adjusted to a preset interval. Since the on-off valve 14 is closed when the gap between the wafers C is adjusted, the work table 10 will not hinder the deformation of the tape T. In addition, by the proximity of the table 10 and the frame holding device 20, the tension of the tape T between the outer circumference of the wafer W and the inner circumference of the ring frame F can be relaxed, and the tape T around the wafer W Create slack.

As shown in Figure 4C, it can be implemented after the wafer spacing adjustment step Apply tape to attract and maintain step. In the tape suction and holding step, when a predetermined interval is formed between the wafers C by the control device 40, the on-off valve 14 can be opened to generate suction on the table 10. Since the wafer C is attracted and held by the worktable 10 with the tape T therebetween, the tape T does not shrink due to elastic recovery, and the adjacent wafers C can be maintained at a predetermined interval. In addition, the shrinking device 30 can be positioned above the wafer W, and the pair of heaters 32 can be wound by the rotating motor 34 to start the loose thermal shrinkage of the tape T.

As shown in FIG. 4D, the tape shrinking step may be implemented after the tape suction and holding step. In the tape shrinking step, the control device 40 brings the table 10 and the frame holding device 20 closer, thereby causing slack in the tape T between the outer periphery of the wafer W and the inner periphery of the ring frame F. At this time, in conjunction with the movement of the frame holding device 20, the height of the heater 32 is adjusted by the up-and-down movement part 33, while the slack of the tape T around the wafer W is thermally contracted by the pair of heaters 32. Since only the tape T around the wafer W is heat-shrinked, even if the suction and holding of the table 10 is released, the interval between adjacent wafers C can be fixed in a maintained state.

In addition, after the tape shrinking step, the on-off valve 14 is closed, and the suction of the tape T by the table 10 is released, and the workpiece group WS can be transported. In this way, after the wafer W is divided, the interval between adjacent wafers C is fixed at a predetermined interval, so the interval between the wafers C will not be excessively widened, and it can be used in the next step of the picking operation. Shorten the moving distance of the picker and reduce the picking time. In addition, since the uneven dispersion of the wafer C does not occur after the wafer W is divided, it is possible to pick up The picker operates in accordance with the prescribed action program, so that all chips C can be picked up appropriately.

As described above, in the dividing apparatus 1 of the present embodiment, by separating the table 10 from the frame holding device 20 during the division of the wafer W, the tape T can be expanded to a larger extent and the modified layer As a starting point, the wafer W is surely divided. After the wafer W is divided, by bringing the table 10 and the frame holding device 20 close together, the expansion of the tape T can be released and the interval between adjacent wafers C can be narrowed. Furthermore, in a state where the interval between adjacent wafers C has been narrowed to a predetermined interval, the interval between the wafers C can be fixed by removing the slack of the tape T around the wafer W. According to this, there will be no uneven dispersion in the pick-up position of the wafer C, or a longer pick-up time. In this way, the wafer W can be reliably divided without deteriorating the pick-up properties of the wafer C.

In addition, in this embodiment, although it is formed to photograph the outer peripheral position of the divided wafer and adjust the distance between adjacent wafers based on the outer peripheral position of the wafer, it is not limited to this structure. . The distance between adjacent wafers can be adjusted to a preset distance, and the distance between wafers can be adjusted in any manner. For example, it may be configured to adjust the gap between the wafers while photographing the divided wafers to measure the distance between adjacent wafers from the photographed image.

Specifically, as shown in FIG. 5A, when the wafer W is divided by the expansion of the tape T, a gap S1 is formed between adjacent wafers C. After the wafer is divided, the expansion of the tape T is released, and the adjacent chips C are gradually approached by the elastic recovery of the tape T. At this time, at work A photographing device 48 is arranged above the stage 10, and the divided wafer W is photographed by the photographing device 48. A measuring device 49 is connected to the photographing device 48, and various image processing can be performed on the photographed image input from the photographing device 48, and the interval between adjacent chips C can be measured by the measuring device 49.

And, as shown in FIG. 5B, when the proximity of the device 20 to the table 10 is maintained by the frame, and the interval of the wafer C measured by the measuring device 49 is consistent with the preset interval S2, the table 10 is used. To attract and maintain the tape T to maintain the gap between the chips C. In this way, the imaging device 48 is used to monitor the interval between adjacent wafers C, and while directly measuring the interval between the wafers C, the interval between the wafers C is adjusted. Furthermore, the measuring device 49 is composed of a processor, a memory, or the like that executes various processes, similarly to the control device 40.

In addition, in this embodiment, although a structure is formed to raise and lower the frame holding device with respect to the table, it is not limited to this structure. As long as the lifting device has a structure that allows the workbench and the frame holding device to approach and distance relatively, for example, it may be formed as a structure that allows the workbench to be raised and lowered relative to the frame holding device. In addition, the elevating equipment is not limited to an electric cylinder, and may be constituted by another actuator (actuator).

In addition, in this embodiment, the peripheral imaging device may be configured to image the periphery of the wafer. For example, a charged coupled device (CCD) or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor) may be used. , CMOS) and other imaging components. In addition, the imaging device of the modified example only needs to have a structure capable of imaging wafers, and may also be imaging devices using CCD, CMOS, etc. Camera components.

In addition, although the embodiment of the present invention has been described, as another embodiment of the present invention, it is also possible to combine the above-mentioned embodiments and modifications in whole or in part.

In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and various changes, substitutions, and modifications may be made within the scope not departing from the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used to implement it. Therefore, the scope of the patent request covers all embodiments that can be included in the scope of the technical idea of the present invention.

In addition, in this embodiment, although the present invention has been described with respect to the configuration applicable to the dividing device, it may also be another expansion device suitable for appropriately expanding the tape.

Industrial availability

As described above, the present invention has the effect of reliably dividing wafers without deteriorating the pick-up properties of the wafers, and is particularly useful for a dividing device for dividing semiconductor wafers.

10‧‧‧Working table

14‧‧‧On-off valve

16‧‧‧Attraction source

20‧‧‧Frame holding equipment

30‧‧‧Shrinking equipment

32‧‧‧Heater

33‧‧‧Up and down movement part

34‧‧‧Rotating Motor

40‧‧‧Control equipment

45‧‧‧peripheral shooting equipment

F‧‧‧Ring frame

T‧‧‧Tape

C‧‧‧chip

W‧‧‧wafer

Claims (1)

A dividing device is used to attach a wafer with a starting point for dividing on a tape that blocks the opening of a ring frame and attach it to a work set that integrates the ring frame, the tape and the wafer The tape is expanded, and the wafer is divided using the dividing starting point as the starting point. The dividing device includes: a frame holding device to hold the ring frame; The tape of the workpiece group to be held is used to hold the wafer; the lifting device makes the workbench and the frame holding device relatively approach and move away in a direction orthogonal to the holding surface; control the device to make the workbench and the The frame holding device moves in the direction away from each other to expand the tape, and after dividing the wafer with the starting point of division as the starting point, move the table and the frame holding device in the direction of approaching to bring the adjacent wafers closer, And a preset narrowing interval is formed; and a shrinking device, the interval is formed by the control device, and the holding surface attracts and maintains the expanded tape to maintain the interval, and to keep the workbench and the frame The equipment gets closer and shrinks the loosened tape between the outer periphery of the wafer and the inner periphery of the ring frame, thereby fixing the interval between adjacent wafers.

Images