TW202135149A - Dicing method and dicing device for forming split grooves with desired width - Google Patents

Dicing method and dicing device for forming split grooves with desired width Download PDF

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Publication number
TW202135149A
TW202135149A TW110105835A TW110105835A TW202135149A TW 202135149 A TW202135149 A TW 202135149A TW 110105835 A TW110105835 A TW 110105835A TW 110105835 A TW110105835 A TW 110105835A TW 202135149 A TW202135149 A TW 202135149A
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Taiwan
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expansion
dividing
unit
workpiece
groove
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TW110105835A
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Chinese (zh)
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趙金艶
木篤
政田孝行
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Abstract

The subject of the invention is to form split grooves with desired width. The invention provides a dicing method, which is a method for dicing a workpiece formed with a modified layer along the predetermined slicing line and attached on the expansion sheet, and includes the following steps: a dicing step for dicing the workpiece along the modified layer by expanding the expansion sheet to form the split grooves along the predetermined dicing lines; an expansion release step for releasing the expansion of the expansion sheet after the dicing step is conducted; and, a groove width adjustment step for expanding the expansion sheet after performing the expansion release step and forming the split grooves with a desired width.

Description

分割方法及分割裝置Division method and division device

本發明是有關於一種可沿著分割預定線形成分割起點並且已貼附在擴展片之被加工物的分割方法及分割裝置。The present invention relates to a dividing method and a dividing device that can form a dividing starting point along a predetermined dividing line and a processed object that has been attached to an expansion sheet.

在將晶圓等被加工物沿著分割預定線分割成一個個的器件晶片時，將已貼附在可沿著分割預定線形成分割起點的被加工物之擴展片擴張(擴展)之分割方法及分割裝置已被使用(參照例如專利文獻1)。 先前技術文獻 專利文獻When dividing a processed object such as a wafer into individual device wafers along the planned dividing line, the method of expanding (expanding) the expansion sheet attached to the processed object that can form the dividing starting point along the planned dividing line And the dividing device has been used (see, for example, Patent Document 1). Prior art literature Patent literature

專利文獻1：日本特開2010-206136號公報Patent Document 1: Japanese Patent Application Laid-Open No. 2010-206136

發明欲解決之課題The problem to be solved by the invention

如專利文獻1所示之分割方法及分割裝置，在擴張擴展片來進行分割的情況下，因為分割起點的狀態並非均勻，所以破裂的時間點會產生偏差。並且，因為在較快破裂之處會將分割溝形成得較寬，在較慢破裂之處會將分割溝形成得較狹窄，所以在如專利文獻1所示之分割方法及分割裝置地擴張擴展片來進行分割的情況下，會在分割溝的寬度產生偏差。As in the dividing method and dividing device shown in Patent Document 1, when the expansion piece is expanded to perform the division, the state of the starting point of the division is not uniform, and therefore, the time point of rupture may vary. In addition, because the dividing groove is formed wider at the place where the rupture is relatively fast, and the dividing groove is formed narrower at the place where the rupture is relatively slow, the dividing method and dividing device shown in Patent Document 1 are expanded and expanded In the case of segmentation with slices, the width of the segmentation groove will vary.

若在晶片間未形成有充分的寬度的分割溝，恐有相鄰的晶片彼此在操作處理時接觸而導致損傷晶片之虞。有以下之要求：欲形成比有接觸之疑慮的寬度更寬之所期望的寬度的分割溝。If a dividing groove with a sufficient width is not formed between the wafers, there is a possibility that adjacent wafers may come into contact with each other during handling and the wafer may be damaged. There are the following requirements: It is desired to form a segmentation groove of a desired width wider than the width of the suspected contact.

據此，本發明之目的在於提供一種可以形成所期望的寬度的分割溝之分割方法及分割裝置。 用以解決課題之手段Accordingly, the object of the present invention is to provide a dividing method and a dividing device capable of forming a dividing groove of a desired width. Means to solve the problem

根據本發明的一個層面，可提供一種分割方法，前述分割方法是可沿著分割預定線形成分割起點並且已貼附在擴展片之被加工物的分割方法，並具備有以下步驟： 分割步驟，擴張該擴展片來沿著該分割起點分割被加工物，而形成沿著該分割預定線的分割溝； 擴張解除步驟，在實施該分割步驟後，解除該擴展片的擴張；及 溝寬調整步驟，在實施該擴張解除步驟後，擴張該擴展片並將該分割溝形成為所期望的寬度。According to one aspect of the present invention, a dividing method can be provided. The aforementioned dividing method is a method of dividing a processed object that can form a dividing starting point along a predetermined dividing line and has been attached to an expansion sheet, and has the following steps: In the dividing step, the expansion sheet is expanded to divide the object to be processed along the dividing starting point to form a dividing groove along the planned dividing line; An expansion release step, after the division step is implemented, the expansion of the expansion piece is released; and In the groove width adjustment step, after the expansion release step is performed, the expansion piece is expanded and the dividing groove is formed to a desired width.

較佳的是，在該分割步驟中，是以第1速度來擴張該擴展片，且在該溝寬調整步驟中，是以比該第1速度更低速的第2速度來擴張該擴展片。Preferably, in the dividing step, the expansion sheet is expanded at a first speed, and in the groove width adjustment step, the expansion sheet is expanded at a second speed lower than the first speed.

較佳的是，分割方法更具備有固定步驟，前述固定步驟是在實施該溝寬調整步驟後，以該所期望的寬度來將該分割溝固定。Preferably, the dividing method further includes a fixing step, and the aforementioned fixing step is to fix the dividing groove with the desired width after the groove width adjustment step is performed.

較佳的是，被加工物是形成為透過該擴展片而裝設在具有開口之環狀框架並且配置在該開口內之狀態，在該分割步驟與該溝寬調整步驟中，是藉由在已固定該環狀框架的狀態下，按壓被加工物的外周與該環狀框架的內周之間的該擴展片來擴張該擴展片，在該固定步驟中，是一面以吸引保持構件隔著該擴展片來吸引保持已在該溝寬調整步驟中將分割溝形成為該所期望的寬度的被加工物，一面對被加工物的外周與該環狀框架的內周之間的擴展片加熱來使其收縮，而去除因擴張所產生的鬆弛。Preferably, the object to be processed is formed in a state in which it is installed in a ring frame having an opening through the expansion sheet and is arranged in the opening. In the dividing step and the groove width adjusting step, In the state where the ring frame is fixed, the expansion piece between the outer circumference of the workpiece and the inner circumference of the ring frame is pressed to expand the expansion piece. In the fixing step, one side is sandwiched by the suction and holding member The expansion piece attracts and holds the workpiece whose dividing groove is formed in the groove width adjustment step to the desired width, and faces the expansion piece between the outer circumference of the workpiece and the inner circumference of the ring frame Heat it to shrink and remove the slack due to expansion.

較佳的是，在該固定步驟中，為了將被加工物配置在具有開口之環狀框架的該開口內，而在已在該溝寬調整步驟中擴張該擴展片的狀態下將該環狀框架貼附在該擴展片。Preferably, in the fixing step, in order to arrange the object to be processed in the opening of the ring-shaped frame having an opening, the ring-shaped expansion piece is expanded in the groove width adjusting step. The frame is attached to the expansion piece.

根據本發明的其他層面，可提供一種分割裝置，前述分割裝置是實施前述分割方法之分割裝置，並具備： 擴張單元，擴張該擴展片；及 控制器，控制該擴張單元， 該控制器包含： 分割控制部，擴張該擴展片來沿著該分割起點分割被加工物，而形成沿著該分割預定線的分割溝； 擴張解除部，在被加工物的分割後解除該擴展片的擴張；及 溝寬調整部，在解除該擴展片的擴張後，擴張該擴展片並將該分割溝形成為所期望的寬度。 發明效果According to another aspect of the present invention, a dividing device can be provided, the aforementioned dividing device is a dividing device implementing the aforementioned dividing method, and is provided with: Expansion unit to expand the expansion piece; and The controller controls the expansion unit, The controller contains: A division control unit, which expands the expansion sheet to divide the object to be processed along the division start point to form a division groove along the planned division line; The expansion releasing part releases the expansion of the expansion piece after the division of the workpiece; and After releasing the expansion of the expansion piece, the groove width adjusting portion expands the expansion piece and forms the dividing groove to a desired width. Invention effect

本發明會發揮可以形成所期望的寬度的分割溝之效果。The present invention exerts the effect of being able to form division grooves of a desired width.

用以實施發明之形態The form used to implement the invention

以下，針對本發明的實施形態，一面參照圖式一面詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又，在以下所記載之構成要素中，包含所屬技術領域中具有通常知識者可以輕易地設想得到的或實質上是相同的構成要素。此外，以下所記載之構成是可適當組合的。又，只要在不脫離本發明之要旨的範圍內，可進行構成的各種省略、置換或變更。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. This invention is not limited by the content described in the following embodiment. In addition, the constituent elements described below include constituent elements that can be easily imagined by a person having ordinary knowledge in the relevant technical field or that are substantially the same. In addition, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made as long as they do not depart from the gist of the present invention.

[第1實施形態] 依據圖式來說明本發明的第1實施形態之分割裝置。圖1是顯示第1實施形態之分割裝置的之構成例的立體圖。圖2是圖1所示的分割裝置之加工對象的被加工物的立體圖。[First Embodiment] The dividing device according to the first embodiment of the present invention will be explained based on the drawings. Fig. 1 is a perspective view showing a configuration example of the dividing device of the first embodiment. Fig. 2 is a perspective view of a to-be-processed object of the dividing device shown in Fig. 1.

第1實施形態之圖1所示的分割裝置1是將圖2所示之被加工物200分割成一個個的器件晶片201 的分割裝置。分割裝置1之加工對象即被加工物200是具有矽、藍寶石、砷化鎵等之基板202的圓板狀的半導體晶圓或光器件晶圓等的晶圓。The dividing apparatus 1 shown in FIG. 1 of the first embodiment is a dividing apparatus that divides the workpiece 200 shown in FIG. 2 into individual device wafers 201. The object to be processed 200 of the dividing device 1 is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer having a substrate 202 of silicon, sapphire, gallium arsenide, or the like.

如圖2所示，被加工物200在基板202的正面205於被設定成格子狀的複數條分割預定線203所區劃出的複數個區域中形成有器件204。器件204是例如IC(積體電路，Integrated Circuit)、或LSI(大型積體電路，Large Scale Integration)等的積體電路、CCD(電荷耦合元件，Charge Coupled Device)、或CMOS(互補式金屬氧化物半導體，Complementary Metal Oxide Semiconductor)等之影像感測器。As shown in FIG. 2, the workpiece 200 has devices 204 formed on the front surface 205 of the substrate 202 in a plurality of regions defined by a plurality of planned dividing lines 203 set in a grid shape. The device 204 is, for example, an integrated circuit such as IC (Integrated Circuit), or LSI (Large Scale Integration), CCD (Charge Coupled Device), or CMOS (Complementary Metal Oxidation). Semiconductor, Complementary Metal Oxide Semiconductor) and other image sensors.

在第1實施形態中，被加工物200是沿著分割預定線203而按一個個的器件204來分割，並分割成一個個的器件晶片201。器件晶片201具備基板202的一部分、及基板202上的器件204。In the first embodiment, the workpiece 200 is divided into individual devices 204 along the planned division line 203 and divided into individual device wafers 201. The device wafer 201 includes a part of a substrate 202 and a device 204 on the substrate 202.

可被圖1所示的分割裝置1分割成一個個的器件晶片201之被加工物200，在基板202的內部沿著分割預定線203而形成有分割起點即改質層206。改質層206是將對被加工物200的基板202具有穿透性之波長(在實施形態中為1064nm)的雷射光線在被加工物200的基板202的內部設定聚光點，並從正面205的背側之背面207側沿著分割預定線203來照射而形成。再者，所謂的改質層206，意指密度、折射率、機械強度或其他的物理特性變得與周圍的該特性不同之狀態的區域，且可以例示的有熔融處理區域，裂隙(crack)區域、絕緣破壞區域、折射率變化區域、及混合了這些區域的區域等。又，改質層206的機械性強度等比被加工物200的其他部分更低。The to-be-processed object 200 of the device wafer 201 that can be divided into individual device wafers 201 by the dividing apparatus 1 shown in FIG. In the modified layer 206, a laser beam with a wavelength (1064nm in the embodiment) that is penetrating to the substrate 202 of the workpiece 200 is set in the interior of the substrate 202 of the workpiece 200 to converge the light from the front side. The back 207 side of the back side of the back side of the 205 is formed by irradiating along the planned dividing line 203. Furthermore, the so-called modified layer 206 means a region in a state where the density, refractive index, mechanical strength, or other physical properties become different from the surrounding properties, and can be exemplified by melt-processed regions and cracks. Area, insulation breakdown area, refractive index change area, and area where these areas are mixed, etc. In addition, the mechanical strength of the modified layer 206 is lower than other parts of the workpiece 200.

再者，在第1實施形態中，被加工物200是在背面207側貼附有直徑比被加工物200更大的擴展片208，且在擴展片208的外周緣貼附有環狀的框架209，而被支撐在框架209的開口212內。如圖2所示，在第1實施形態中，被加工物200是透過擴展片208而被裝設在具有開口212的框架209，並且形成為配置在框架209的開口212內之狀態。Furthermore, in the first embodiment, the workpiece 200 is attached with an expansion sheet 208 having a larger diameter than the workpiece 200 on the back surface 207 side, and a ring-shaped frame is attached to the outer periphery of the expansion sheet 208 209, and is supported in the opening 212 of the frame 209. As shown in FIG. 2, in the first embodiment, the workpiece 200 is installed in the frame 209 having the opening 212 through the expansion sheet 208, and is formed in a state of being arranged in the opening 212 of the frame 209.

在第1實施形態中，雖然被加工物200在已貼附於背面207側的擴展片208的外周緣貼附有框架209，但在本發明中並非限定於此，亦可例如在被加工物200的背面207與擴展片208之間貼附圓板狀的DAF(黏晶薄膜)。又，在本發明中，亦可為貼附有DAF的被加工物200。再者，擴展片208是由以下的合成樹脂所構成：外徑形成得比被加工物200的外徑更大，並具有伸縮性，且若被加熱會收縮。In the first embodiment, the workpiece 200 has a frame 209 attached to the outer peripheral edge of the expansion sheet 208 attached to the back surface 207 side. However, the present invention is not limited to this. For example, it may be attached to the workpiece. A disc-shaped DAF (die-attach film) is attached between the back surface 207 of the 200 and the expansion sheet 208. In addition, in the present invention, the workpiece 200 to which DAF is attached may also be used. In addition, the expansion sheet 208 is composed of a synthetic resin whose outer diameter is formed larger than the outer diameter of the workpiece 200, is stretchable, and shrinks when heated.

第1實施形態之分割裝置1具備：未圖示之腔室、框架固定單元10、擴張單元20、固定單元即加熱單元30、吸引保持構件即工作夾台40、及控制器即控制單元50。The dividing device 1 of the first embodiment includes a chamber not shown, a frame fixing unit 10, an expansion unit 20, a heating unit 30 that is a fixing unit, a work chuck 40 that is a suction and holding member, and a control unit 50 that is a controller.

腔室是形成為上部開口之箱狀。腔室容置有框架固定單元10的框架載置板11、擴張單元20與工作夾台40。The chamber is formed in a box shape with an upper opening. The chamber contains the frame mounting plate 11 of the frame fixing unit 10, the expansion unit 20 and the work clamp 40.

框架固定單元10是保持並固定框架209之單元。框架固定單元10具備框架載置板11與框架按壓板12。The frame fixing unit 10 is a unit for holding and fixing the frame 209. The frame fixing unit 10 includes a frame mounting plate 11 and a frame pressing plate 12.

框架載置板11形成為以下之板狀：設有平面形狀為圓形的開口部13，且將上表面18與水平方向平行地形成為平坦。框架載置板11將四個角落藉由升降用汽缸15的桿件16來支撐。框架載置板11的開口部13的內徑形成得與框架209的內徑相等。框架載置板11於上表面18可藉由未圖示的搬送單元來載置支撐有被加工物200的框架209。The frame mounting plate 11 is formed in a plate shape in which an opening 13 having a circular planar shape is provided, and the upper surface 18 is formed flat in parallel with the horizontal direction. The frame mounting plate 11 supports the four corners by the rods 16 of the lifting cylinder 15. The inner diameter of the opening 13 of the frame mounting plate 11 is formed to be equal to the inner diameter of the frame 209. On the upper surface 18 of the frame mounting plate 11, the frame 209 supporting the workpiece 200 can be mounted by a conveying unit not shown.

框架按壓板12是形成為平面形狀比框架載置板11更大的板狀。框架按壓板12於中央設有與開口部13相同尺寸的圓形的開口部17。框架按壓板12是固定於腔室內，且將開口部17配置在與框架載置板11的開口部13成為同軸的位置。框架固定單元10將框架209夾在已藉由升降用汽缸15而上升之框架載置板11與框架按壓板12之間，來進行保持、固定。The frame pressing plate 12 is formed in a plate shape whose planar shape is larger than that of the frame mounting plate 11. The frame pressing plate 12 is provided with a circular opening 17 having the same size as the opening 13 in the center. The frame pressing plate 12 is fixed in the chamber, and the opening 17 is arranged at a position coaxial with the opening 13 of the frame mounting plate 11. The frame fixing unit 10 sandwiches the frame 209 between the frame mounting plate 11 and the frame pressing plate 12 that have been raised by the elevating cylinder 15 to hold and fix the frame.

擴張單元20是藉由相對於框架固定單元10將擴展片208頂推，且在垂直於已貼附於擴展片208的被加工物200的正面205的方向上移動預定距離，來擴張擴展片208之單元。擴張單元20亦可為藉由將貼附於已保持於框架固定單元10的框架209之擴展片208擴張，而將背面207貼附有擴展片208之被加工物200沿著分割預定線203分割成器件晶片201之單元。The expansion unit 20 expands the expansion sheet 208 by pushing the expansion sheet 208 relative to the frame fixing unit 10 and moving a predetermined distance in a direction perpendicular to the front surface 205 of the workpiece 200 attached to the expansion sheet 208 The unit. The expansion unit 20 can also be expanded by expanding the expansion sheet 208 attached to the frame 209 held by the frame fixing unit 10, and the workpiece 200 with the expansion sheet 208 attached to the back surface 207 is divided along the planned dividing line 203 As a unit of the device wafer 201.

擴張單元20具備擴張圓筒21及圓筒用升降單元22。擴張圓筒21形成為圓筒狀，且將外徑形成得比可載置於框架載置板11的上表面18之框架209的內徑更小。擴張圓筒21將內徑形成得比可貼附於擴展片208的被加工物200的外徑更大。擴張圓筒21配置在框架載置板11的開口部13的內側，並配置在與框架載置板11的開口部13及框架按壓板12的開口部17成為同軸的位置。The expansion unit 20 includes an expansion cylinder 21 and a cylinder lifting unit 22. The expansion cylinder 21 is formed in a cylindrical shape, and the outer diameter is formed to be smaller than the inner diameter of the frame 209 that can be placed on the upper surface 18 of the frame mounting plate 11. The expansion cylinder 21 has an inner diameter larger than the outer diameter of the workpiece 200 that can be attached to the expansion piece 208. The expansion cylinder 21 is arranged inside the opening 13 of the frame mounting plate 11, and is arranged at a position that is coaxial with the opening 13 of the frame mounting plate 11 and the opening 17 of the frame pressing plate 12.

在擴張圓筒21的上端旋轉自如地安裝有滾輪構件23(顯示於圖4等)。滾輪構件23會在擴張圓筒21頂推擴展片208時，緩和與擴展片208的摩擦。在第1實施形態中，擴張圓筒21是藉由圓筒用升降單元22而升降。A roller member 23 (shown in Fig. 4 etc.) is rotatably attached to the upper end of the expansion cylinder 21. The roller member 23 relaxes the friction with the expansion piece 208 when the expansion cylinder 21 pushes the expansion piece 208. In the first embodiment, the expansion cylinder 21 is raised and lowered by the cylinder lifting unit 22.

工作夾台40是以下之構成：吸引保持已擴張的擴展片208，而以保持面41隔著擴展片208來吸引保持已被分割成一個個的複數個器件晶片201。工作夾台40為圓板形狀。工作夾台40是將上表面以多孔陶瓷等的多孔質材來構成，且為連接於吸引源43(顯示於圖4等)的保持面41。The work chuck stage 40 is configured to suck and hold the expanded piece 208 while holding the expansion piece 208 via the holding surface 41 to suck and hold a plurality of device wafers 201 that have been divided into one. The work clamp table 40 has a circular plate shape. The work chuck 40 is composed of a porous material such as porous ceramics on its upper surface, and is a holding surface 41 connected to a suction source 43 (shown in FIG. 4 etc.).

工作夾台40配置在擴張圓筒21的內側，且配置在與開口部13、17及擴張圓筒21成為同軸的位置。工作夾台40隔著擴展片208於保持面41載置被加工物200的背面207側。工作夾台40藉由以吸引源43吸引保持面41，而將被加工物200的背面207側吸引保持於保持面41。又，工作夾台40藉由圖4等所示之工作台用升降單元42(顯示於圖4等)而被升降。The work chuck 40 is arranged inside the expansion cylinder 21 and is arranged at a position coaxial with the openings 13 and 17 and the expansion cylinder 21. The work chuck 40 places the back surface 207 side of the workpiece 200 on the holding surface 41 with the extension piece 208 interposed therebetween. The work chuck table 40 sucks and holds the back surface 207 side of the workpiece 200 on the holding surface 41 by sucking the holding surface 41 by the suction source 43. In addition, the work clamp table 40 is raised and lowered by the work table lifting unit 42 (shown in FIG. 4 etc.) shown in FIG. 4 and the like.

加熱單元30是將被加工物200的周圍的擴展片208加熱至預定溫度以上之單元。加熱單元30具備圓板狀的單元本體31、安裝於單元本體31之複數個熱源部32、旋轉單元33與升降單元34。The heating unit 30 is a unit that heats the expansion sheet 208 around the workpiece 200 to a predetermined temperature or higher. The heating unit 30 includes a disc-shaped unit main body 31, a plurality of heat source portions 32 mounted on the unit main body 31, a rotating unit 33, and an elevating unit 34.

單元本體31是配置成在工作夾台40的上方且與工作夾台40同軸。單元本體31藉由旋轉單元33而以繞著與鉛直方向平行之軸心的方式旋轉自如地設置。單元本體31藉由升降單元34而升降自如地設置。The unit body 31 is arranged above and coaxially with the work chuck table 40. The unit body 31 is rotatably installed by the rotating unit 33 around an axis parallel to the vertical direction. The unit main body 31 is set up and down freely by the lifting unit 34.

熱源部32在單元本體31之下表面的外緣部在圓周方向上等間隔地配置。熱源部32是配置在以下之位置：和已保持於工作夾台40及框架固定單元10的擴展片208之框架209的內緣與被加工物200的外緣之間在鉛直方向上相向。熱源部32是在擴展片208之框架209的內緣與被加工物200的外緣之間加熱。在實施形態中，雖然熱源部32設置有四個，但在本發明中並不限定於四個。雖然熱源部32是將紅外線朝下方照射，來對被加工物200的外周與框架209的內周之間的擴展片208進行加熱之形式的構成，且為例如若被施加電壓就會進行加熱並放射紅外線之紅外線陶瓷加熱器，但在本發明中並非限定於此。The heat source portions 32 are arranged at equal intervals in the circumferential direction on the outer edge portion of the lower surface of the unit main body 31. The heat source portion 32 is arranged at a position facing in the vertical direction between the inner edge of the frame 209 held by the work clamp table 40 and the extension piece 208 of the frame fixing unit 10 and the outer edge of the workpiece 200. The heat source portion 32 is heated between the inner edge of the frame 209 of the expansion sheet 208 and the outer edge of the workpiece 200. In the embodiment, although four heat source portions 32 are provided, in the present invention, it is not limited to four. Although the heat source portion 32 is configured to irradiate infrared rays downward to heat the expansion sheet 208 between the outer circumference of the workpiece 200 and the inner circumference of the frame 209, and for example, if a voltage is applied, it will heat and The infrared ceramic heater that emits infrared rays is not limited to this in the present invention.

旋轉單元33使單元本體31繞著軸心旋轉，而使熱源部32沿著圓周方向於被加工物200的外周移動。升降單元34藉由使單元本體31沿著鉛直方向升降，來調整加熱單元30的熱源部32與擴展片208的距離。The rotating unit 33 rotates the unit body 31 around the axis, and moves the heat source portion 32 along the circumferential direction on the outer periphery of the workpiece 200. The lifting unit 34 adjusts the distance between the heat source portion 32 of the heating unit 30 and the expansion piece 208 by lifting the unit main body 31 in the vertical direction.

控制單元50是分別控制分割裝置1的上述之構成要素，亦即擴張單元20及加熱單元30等，而使分割裝置1實施對被加工物200的加工動作之單元。控制單元50是具有運算處理裝置、記憶裝置及輸入輸出介面裝置的電腦，前述運算處理裝置具有例如CPU(中央處理單元，central processing unit)等的微處理器，前述記憶裝置具有ROM(唯讀記憶體，read only memory)或RAM(隨機存取記憶體，random access memory)等的記憶體。控制單元50連接於未圖示之顯示單元與未圖示之輸入單元，前述顯示單元是藉由顯示加工動作之狀態或圖像等的液晶顯示裝置等所構成，前述輸入單元是在操作人員登錄加工內容資訊等之時使用。輸入單元是藉由設置於顯示單元的觸控面板、與鍵盤等之外部輸入裝置當中至少一種所構成。The control unit 50 is a unit that controls the above-mentioned constituent elements of the dividing device 1, that is, the expansion unit 20 and the heating unit 30, and so on, so that the dividing device 1 performs processing operations on the workpiece 200. The control unit 50 is a computer with an arithmetic processing device, a memory device, and an input/output interface device. The arithmetic processing device has a microprocessor such as a CPU (central processing unit), and the memory device has a ROM (read-only memory). Memory, read only memory) or RAM (random access memory). The control unit 50 is connected to a display unit not shown in the figure and an input unit not shown in the figure. The display unit is constituted by a liquid crystal display device that displays the status of processing operations or images, etc. The input unit is registered by the operator Used when processing content information, etc. The input unit is constituted by at least one of external input devices such as a touch panel and a keyboard provided on the display unit.

又，如圖1所示，控制單元50具備分割控制部51、擴張解除部52與溝寬調整部53。In addition, as shown in FIG. 1, the control unit 50 includes a division control unit 51, an expansion cancellation unit 52, and a groove width adjustment unit 53.

分割控制部51是以下之構成：使於開口212內支撐有被加工物200之框架209保持、固定於框架固定單元10，並對已貼附於被框架固定單元10保持、固定之框架209的擴展片208進行擴張來將被加工物200沿著改質層206分割，而形成沿著分割預定線203的分割溝210(顯示於圖7)。擴張解除部52是在由分割控制部51所進行之被加工物200的分割後，解除擴展片208的擴張之構成。溝寬調整部53是在藉由擴張解除部52解除擴展片208的擴張後，將擴展片208再次擴張，而將分割溝210形成為所期望的寬度之構成。再者，分割控制部51、擴張解除部52與溝寬調整部53的功能是藉由運算處理裝置執行已記憶於記憶裝置的電腦程式而實現。The division control unit 51 has the following structure: the frame 209 supporting the workpiece 200 in the opening 212 is held and fixed to the frame fixing unit 10, and is attached to the frame 209 held and fixed by the frame fixing unit 10 The expansion sheet 208 is expanded to divide the workpiece 200 along the modified layer 206 to form a dividing groove 210 along the planned dividing line 203 (shown in FIG. 7). The expansion releasing unit 52 is configured to release the expansion of the expansion piece 208 after the division of the workpiece 200 by the division control unit 51. The groove width adjusting portion 53 is a structure in which the expansion piece 208 is expanded again after the expansion of the expansion piece 208 is released by the expansion releasing portion 52 to form the dividing groove 210 into a desired width. Furthermore, the functions of the division control unit 51, the expansion release unit 52, and the groove width adjustment unit 53 are realized by the arithmetic processing device executing a computer program stored in the memory device.

接著，說明第1實施形態之分割方法。圖3是顯示第1實施形態的分割方法之流程的流程圖。第1實施形態之分割方法是將已貼附於擴展片208的被加工物200分割成一個個的器件晶片201之被加工物200的分割方法。第1實施形態之分割方法是藉由圖1所示之分割裝置1來實施。亦即，圖1所示之分割裝置1是實施第1實施形態之分割方法的裝置。Next, the division method of the first embodiment will be explained. Fig. 3 is a flowchart showing the flow of the dividing method of the first embodiment. The dividing method of the first embodiment is a dividing method of dividing the workpiece 200 attached to the extension sheet 208 into individual device wafers 201. The dividing method of the first embodiment is implemented by the dividing device 1 shown in FIG. 1. That is, the dividing device 1 shown in FIG. 1 is a device that implements the dividing method of the first embodiment.

如圖3所示，第1實施形態之分割方法具備保持步驟1001、分割步驟1002、擴張解除步驟1003、溝寬調整步驟1004與固定步驟1005。As shown in FIG. 3, the dividing method of the first embodiment includes a holding step 1001, a dividing step 1002, an expansion releasing step 1003, a groove width adjusting step 1004, and a fixing step 1005.

(保持步驟) 圖4是以局部剖面方式顯示在圖3所示之分割方法的保持步驟中，已將框架載置於框架固定單元的框架載置板的上表面之狀態的側面圖。圖5是以局部剖面方式顯示在圖3所示之分割方法的保持步驟中，框架固定單元已保持、固定框架之狀態的側面圖。(Keep step) Fig. 4 is a side view showing a state in which the frame has been placed on the upper surface of the frame mounting plate of the frame fixing unit in the holding step of the dividing method shown in Fig. 3 in a partial cross section. Fig. 5 is a side view showing a state in which the frame fixing unit has been held and the frame is fixed in the holding step of the dividing method shown in Fig. 3 in a partial section.

保持步驟1001是框架固定單元10將於開口212內支撐有被加工物200之框架209保持、固定之步驟。在第1實施形態中為：在保持步驟1001中，分割裝置1使控制單元50的分割控制部51控制升降用汽缸15、圓筒用升降單元22、工作台用升降單元42而使框架載置板11、擴張圓筒21及工作夾台40下降，並控制升降單元34來使加熱單元30的單元本體31上升，且使吸引源43及熱源部32停止。在第1實施形態中為：在保持步驟1001中，如圖4所示，分割裝置1藉由未圖示的搬送單元來將於開口212內支撐有被加工物200的框架209載置到框架載置板11的上表面18。The holding step 1001 is a step in which the frame fixing unit 10 holds and fixes the frame 209 supporting the workpiece 200 in the opening 212. In the first embodiment, in the holding step 1001, the dividing device 1 causes the dividing control unit 51 of the control unit 50 to control the lifting cylinder 15, the cylinder lifting unit 22, and the table lifting unit 42 to place the frame The plate 11, the expansion cylinder 21, and the work clamp table 40 are lowered, and the lifting unit 34 is controlled to raise the unit body 31 of the heating unit 30 and stop the suction source 43 and the heat source part 32. In the first embodiment, in the holding step 1001, as shown in FIG. 4, the dividing device 1 places the frame 209 supporting the workpiece 200 in the opening 212 on the frame by a conveying unit not shown. Place the upper surface 18 of the board 11.

在第1實施形態中為：在保持步驟1001中，分割裝置1使控制單元50的分割控制部51控制升降用汽缸15來使框架載置板11上升，且如圖5所示，框架固定單元10將框架209夾持在框架載置板11與框架按壓板12之間來保持、固定框架209。分割方法即前進至分割步驟1002。In the first embodiment, in the holding step 1001, the dividing device 1 causes the dividing control unit 51 of the control unit 50 to control the lifting cylinder 15 to raise the frame mounting plate 11, and as shown in FIG. 5, the frame fixing unit 10 The frame 209 is sandwiched between the frame mounting plate 11 and the frame pressing plate 12 to hold and fix the frame 209. The dividing method then proceeds to the dividing step 1002.

(分割步驟) 圖6是以局部剖面方式顯示圖3所示之分割方法的分割步驟的側面圖。圖7是圖6所示之被加工物的主要部位的平面圖。分割步驟1002是擴張擴展片208來沿著改質層206分割被加工物200，而在被加工物200形成沿著分割預定線203的分割溝210之步驟。(Segmentation step) FIG. 6 is a side view showing the dividing step of the dividing method shown in FIG. 3 in a partial cross-sectional manner. Fig. 7 is a plan view of the main part of the workpiece shown in Fig. 6. The dividing step 1002 is a step of expanding the expanded sheet 208 to divide the workpiece 200 along the modified layer 206 and forming a dividing groove 210 along the planned dividing line 203 in the workpiece 200.

在第1實施形態中為：在分割步驟1002中，分割裝置1使控制單元50的分割控制部51控制圓筒用升降單元22來使擴張圓筒21上升，以使滾輪構件23位於比框架載置板11的上表面18更上方。如此一來，如圖6所示，已安裝於擴張圓筒21的上端的滾輪構件23在抵接於被加工物200的外周與框架209的內周之間的擴展片208後，會將擴展片208朝向上方按壓，而將擴展片208在面方向上擴張。在分割步驟1002中，是擴張的結果，讓擴展片208受到放射狀的拉伸力作用。In the first embodiment, in the dividing step 1002, the dividing device 1 causes the dividing control section 51 of the control unit 50 to control the cylinder lifting unit 22 to raise the expansion cylinder 21 so that the roller member 23 is positioned higher than the frame load. The upper surface 18 of the board 11 is further above. As a result, as shown in FIG. 6, the roller member 23 installed on the upper end of the expansion cylinder 21 will expand after abutting on the expansion piece 208 between the outer circumference of the workpiece 200 and the inner circumference of the frame 209. The piece 208 is pressed upward, and the expansion piece 208 is expanded in the surface direction. In the dividing step 1002, the expansion sheet 208 is subjected to radial stretching force as a result of expansion.

當像這樣使拉伸力放射狀地作用在已貼附於被加工物200的基板202的背面207側之擴展片208時，因為被加工物200形成有沿著分割預定線203的改質層206，所以可將改質層206作為分割起點而按一個個的器件204來進行分割，並如圖7所示，按一個個的器件晶片201個體化而形成沿著分割預定線203的分割溝210。再者，因為改質層206並非均勻地形成，所以在分割步驟1002中，在擴展片208的擴張時斷裂的時間點會產生偏差。亦即，在分割步驟1002中幾乎沒有全部的改質層206同時地斷裂之情形。因此，如圖7所示，分割步驟1002後的分割溝210會在寬度上產生偏差。分割方法即前進至擴張解除步驟1003。In this way, when the tensile force is radially applied to the expansion sheet 208 attached to the back surface 207 of the substrate 202 of the workpiece 200, the workpiece 200 is formed with a modified layer along the planned dividing line 203 206, so the modified layer 206 can be used as the starting point for division to be divided into individual devices 204, and as shown in FIG. 7, the individual device wafers 201 are individualized to form division grooves along the planned division line 203 210. In addition, since the modified layer 206 is not uniformly formed, in the dividing step 1002, the time point when the expansion sheet 208 is broken during expansion may vary. That is, in the dividing step 1002, almost all the modified layers 206 are not broken at the same time. Therefore, as shown in FIG. 7, the dividing groove 210 after the dividing step 1002 may have a deviation in width. The dividing method then proceeds to step 1003 for releasing expansion.

(擴張解除步驟) 圖8是以局部剖面方式顯示圖3所示之分割方法的擴張解除步驟的側面圖。圖9是圖8所示之被加工物的主要部位的平面圖。擴張解除步驟1003是在實施分割步驟1002後，解除擴展片208的擴張之步驟。(Expansion release step) Fig. 8 is a side view showing, in partial cross-section, the expansion release step of the dividing method shown in Fig. 3. Fig. 9 is a plan view of the main part of the workpiece shown in Fig. 8. The expansion release step 1003 is a step for releasing the expansion of the expansion piece 208 after the division step 1002 is performed.

在第1實施形態為：在擴張解除步驟1003中，分割裝置1使控制單元50的擴張解除部52控制圓筒用升降單元22而使擴張圓筒21下降。如此一來，如圖8所示，已安裝於擴張圓筒21的上端的滾輪構件23會從被加工物200的外周與框架209的內周之間的擴展片208遠離，而變得未朝向上方按壓擴展片208，擴展片208之面方向的擴張即被解除。如此一來，如圖9所示，分割溝210是寬度比分割步驟1002後更縮小，而可抑制偏差。分割方法即前進至溝寬調整步驟1004。In the first embodiment, in the expansion release step 1003, the dividing device 1 causes the expansion release section 52 of the control unit 50 to control the cylinder lifting unit 22 to lower the expansion cylinder 21. As a result, as shown in FIG. 8, the roller member 23 installed on the upper end of the expansion cylinder 21 will move away from the expansion piece 208 between the outer circumference of the workpiece 200 and the inner circumference of the frame 209, and become not facing When the expansion piece 208 is pressed upward, the expansion of the expansion piece 208 in the surface direction is released. In this way, as shown in FIG. 9, the width of the dividing groove 210 is smaller than that after the dividing step 1002, and the deviation can be suppressed. The dividing method then proceeds to the groove width adjustment step 1004.

(溝寬調整步驟) 圖10是以局部剖面方式顯示圖3所示之分割方法的溝寬調整步驟的側面圖。圖11是圖10所示之被加工物的主要部位的平面圖。溝寬調整步驟1004是在實施擴張解除步驟1003後，擴張擴展片208並將分割溝210形成為所期望的寬度之步驟。(Steps to adjust groove width) Fig. 10 is a side view showing the groove width adjustment step of the dividing method shown in Fig. 3 in partial cross-section. Fig. 11 is a plan view of the main part of the workpiece shown in Fig. 10. The groove width adjustment step 1004 is a step of expanding the expansion piece 208 and forming the dividing groove 210 to a desired width after the expansion release step 1003 is performed.

在第1實施形態中為：在溝寬調整步驟1004中，分割裝置1使控制單元50的溝寬調整部53控制圓筒用升降單元22來使擴張圓筒21上升，以使滾輪構件23位於比框架載置板11的上表面18更上方。如此一來，如圖10所示，已安裝於擴張圓筒21的上端的滾輪構件23在抵接於被加工物200的外周與框架209的內周之間的擴展片208後，會將擴展片208朝向上方按壓，而將擴展片208在面方向上擴張。在溝寬調整步驟1004中，是擴張的結果，讓擴展片208受到放射狀的拉伸力作用。In the first embodiment, in the groove width adjustment step 1004, the dividing device 1 causes the groove width adjustment portion 53 of the control unit 50 to control the cylinder lifting unit 22 to raise the expansion cylinder 21 so that the roller member 23 is positioned It is higher than the upper surface 18 of the frame mounting plate 11. As a result, as shown in FIG. 10, the roller member 23 installed on the upper end of the expansion cylinder 21 will expand after abutting on the expansion piece 208 between the outer circumference of the workpiece 200 and the inner circumference of the frame 209. The piece 208 is pressed upward, and the expansion piece 208 is expanded in the surface direction. In the groove width adjustment step 1004, the expansion sheet 208 is subjected to radial stretching force as a result of expansion.

當像這樣使拉伸力放射狀地作用在已貼附於被加工物200的基板202的背面207側之擴展片208時，由於被加工物200在分割步驟1002中已經以沿著分割預定線203的改質層206為分割起點而被分割，並按一個個的器件晶片201被個體化，而形成有沿著分割預定線203的分割溝210，因此會僅擴張擴展片208，且分割溝210的寬度會比擴張解除步驟1003後更擴大。由於在溝寬調整步驟1004中僅擴張擴展片208，因此分割溝210會如圖11所示，寬度的偏差被抑制得比分割步驟1002後的偏差更低。When the tensile force acts radially on the expansion sheet 208 attached to the back surface 207 of the substrate 202 of the workpiece 200 in this way, the workpiece 200 has already moved along the planned dividing line in the dividing step 1002. The modified layer 206 of 203 is divided as the starting point of division, and individual device wafers 201 are individualized, and division grooves 210 along the planned division line 203 are formed. Therefore, only the expansion sheet 208 is expanded and the division grooves are formed. The width of 210 will be larger than that after the expansion cancellation step 1003. Since only the expansion piece 208 is expanded in the groove width adjustment step 1004, the divided groove 210 will be as shown in FIG.

又，在第1實施形態中為：在溝寬調整步驟1004中，分割裝置1使控制單元50的溝寬調整部53控制圓筒用升降單元22而將擴張圓筒21的上升速度設得比分割步驟1002更慢。因此，在分割步驟1002中，分割裝置1以第1速度301(於圖6及圖7中以箭頭來表示)來擴張擴展片208的情況下，在溝寬調整步驟1004中，分割裝置1會以比第1速度301更低速的第2速度302(於圖10及圖11中以箭頭來表示)來擴張擴展片208。In the first embodiment, in the groove width adjustment step 1004, the dividing device 1 causes the groove width adjustment section 53 of the control unit 50 to control the cylinder lifting unit 22 to set the ascending speed of the expansion cylinder 21 to be higher than The segmentation step 1002 is slower. Therefore, in the dividing step 1002, when the dividing device 1 expands the expansion piece 208 at the first speed 301 (indicated by arrows in FIGS. 6 and 7), in the groove width adjustment step 1004, the dividing device 1 The expansion piece 208 is expanded at a second speed 302 (indicated by arrows in FIGS. 10 and 11) which is lower than the first speed 301.

如此進行，由於在第1實施形態中為：在溝寬調整步驟1004中，分割裝置1以比第1速度301更低速的第2速度302來擴張擴展片208，因此可以將分割溝210的寬度的偏差抑制得比分割步驟1002後的偏差更低。再者，雖然在第1實施形態中為：在溝寬調整步驟1004中，分割裝置1以比第1速度301更低速的第2速度302來擴張擴展片208，但在本發明中，亦可為分割裝置1以與第1速度301相同的速度來擴張擴展片208，且亦可用比第1速度301更高速的方式來擴張擴展片208。In this way, in the first embodiment, in the groove width adjustment step 1004, the dividing device 1 expands the expansion piece 208 at the second speed 302, which is lower than the first speed 301, so that the width of the dividing groove 210 can be reduced. The deviation of is suppressed to be lower than the deviation after the segmentation step 1002. Furthermore, although in the first embodiment, in the groove width adjustment step 1004, the dividing device 1 expands the expansion piece 208 at a second speed 302 that is lower than the first speed 301, but in the present invention, In order for the dividing device 1 to expand the expansion piece 208 at the same speed as the first speed 301, it is also possible to expand the expansion piece 208 at a higher speed than the first speed 301.

又，在第1實施形態中為：在分割步驟1002與溝寬調整步驟1004中，在分割裝置1已固定框架209的狀態下，藉由按壓被加工物200的外周與框架209的內周之間的擴展片208來擴張擴展片。再者，雖然在第1實施形態中為：在分割步驟1002與溝寬調整步驟1004中，使擴張圓筒21上升來擴張擴展片208，但本發明並非限定於此，亦可讓保持、固定有框架209的框架固定單元10下降，簡而言之，只要使擴張圓筒21相對於框架固定單元10相對地上升，並使框架固定單元10相對於擴張圓筒21相對地下降即可。分割方法即前進至固定步驟1005。In the first embodiment, in the dividing step 1002 and the groove width adjusting step 1004, with the frame 209 fixed in the dividing device 1, the outer circumference of the workpiece 200 and the inner circumference of the frame 209 are pressed. Between the expansion piece 208 to expand the expansion piece. Furthermore, although in the first embodiment, in the dividing step 1002 and the groove width adjusting step 1004, the expansion cylinder 21 is raised to expand the expansion piece 208, but the present invention is not limited to this, and it may be held and fixed. The frame fixing unit 10 with the frame 209 is lowered. In short, it is only necessary to raise the expansion cylinder 21 relative to the frame fixing unit 10 and lower the frame fixing unit 10 relative to the expansion cylinder 21. The dividing method then proceeds to the fixing step 1005.

＜固定步驟＞ 圖12是以局部剖面方式顯示圖3所示之分割方法的固定步驟的側面圖。固定步驟1005是在實施溝寬調整步驟1004後，將分割溝210固定在已在溝寬調整步驟1004中經調整的所期望的寬度之步驟。＜Fixed procedure＞ Fig. 12 is a side view showing the fixing step of the dividing method shown in Fig. 3 in partial cross-section. The fixing step 1005 is a step of fixing the dividing groove 210 to the desired width adjusted in the groove width adjusting step 1004 after the groove width adjusting step 1004 is performed.

在第1實施形態中為：在固定步驟1005中，分割裝置1使控制單元50的分割控制部51控制工作台用升降單元42，而使工作夾台40上升到保持面41與框架載置板11的上表面18位於相同平面上為止。在固定步驟1005中，分割裝置1是控制單元50的分割控制部51使吸引源43動作，而隔著擴展片208將從被加工物200分割且已調整分割溝210的寬度之複數個器件晶片201的背面207側吸引保持於保持面41。In the first embodiment, in the fixing step 1005, the dividing device 1 causes the dividing control section 51 of the control unit 50 to control the work table lifting unit 42 to raise the work chuck table 40 to the holding surface 41 and the frame mounting plate The upper surface 18 of 11 is located on the same plane. In the fixing step 1005, the dividing device 1 is the dividing control unit 51 of the control unit 50 operating the suction source 43, and the workpiece 200 is divided through the expansion piece 208, and the plurality of device wafers whose widths have been adjusted for the dividing grooves 210 are divided. The back surface 207 side of the 201 is sucked and held on the holding surface 41.

在第1實施形態中為：在固定步驟1005中，分割裝置1使控制單元50的分割控制部51控制圓筒用升降單元22而使擴張圓筒21下降。如此一來，雖然已被擴張的擴展片208欲進行收縮，但由於已將器件晶片201的背面207側隔著擴展片208吸引保持在保持面41，因此可限制保持面41上的擴展片208的收縮。因此，可將分割溝210的寬度維持在已在溝寬調整步驟1004中經調整之寬度，並如圖12所示，在被加工物200的外周與框架209的內周的擴展片208形成已鬆弛的鬆弛211。In the first embodiment, in the fixing step 1005, the dividing device 1 causes the dividing control section 51 of the control unit 50 to control the cylinder lifting unit 22 to lower the expansion cylinder 21. In this way, although the expanded piece 208 is intended to shrink, the back 207 side of the device wafer 201 is sucked and held on the holding surface 41 via the expanding piece 208, so the expanding piece 208 on the holding surface 41 can be restricted. Contraction. Therefore, the width of the dividing groove 210 can be maintained at the width adjusted in the groove width adjustment step 1004, and as shown in FIG. 12, the expanded piece 208 formed on the outer periphery of the workpiece 200 and the inner periphery of the frame 209 Relaxed relaxation 211.

在第1實施形態中為：在固定步驟1005中，分割裝置1使控制單元50的分割控制部51控制升降單元34來使加熱單元30的單元本體31下降而使熱源部32接近於擴展片208的鬆弛211，並使熱源部32沿著鉛直方向與鬆弛211相向。在第1實施形態中為：在固定步驟1005中，分割裝置1是控制單元50的分割控制部51使熱源部32作動，並且如圖12所示地控制旋轉單元33來使單元本體31繞著軸心旋轉，而以熱源部32涵蓋全周來加熱擴展片208的鬆弛211。In the first embodiment, in the fixing step 1005, the dividing device 1 causes the dividing control section 51 of the control unit 50 to control the lifting unit 34 to lower the unit body 31 of the heating unit 30 and bring the heat source section 32 close to the extension piece 208 The slack 211 is caused to face the slack 211 along the vertical direction. In the first embodiment, in the fixing step 1005, the dividing device 1 is such that the dividing control unit 51 of the control unit 50 activates the heat source unit 32, and controls the rotating unit 33 as shown in FIG. 12 to cause the unit body 31 to go around The shaft center rotates, and the slack 211 of the expansion sheet 208 is heated by covering the entire circumference of the heat source portion 32.

在第1實施形態中為：在固定步驟1005中，分割裝置1使鬆弛211收縮。在固定步驟1005中，分割裝置1在控制單元50的分割控制部51以熱源部32將鬆弛211加熱已預先決定之預定時間後，會停止熱源部32，並使加熱單元30的單元本體31上升，且停止吸引源43，並控制升降用汽缸15及工作台用升降單元42，使框架載置板11及工作夾台40下降，在第1實施形態中為：在固定步驟1005中，分割裝置1藉由未圖示之搬送單元將於開口212內支撐有被加工物200的框架209從框架載置板11的上表面18搬出，而結束分割方法。再者，在固定步驟1005中，由於即使停止吸引源43，擴展片208的鬆弛211為已收縮，因此可將分割溝210的寬度固定在已在溝寬調整步驟1004中經調整的所期望的寬度。In the first embodiment, in the fixing step 1005, the dividing device 1 shrinks the slack 211. In the fixing step 1005, after the dividing control section 51 of the control unit 50 heats the slack 211 with the heat source section 32 for a predetermined time, the dividing device 1 stops the heat source section 32 and raises the unit body 31 of the heating unit 30 , And stop the suction source 43, and control the lifting cylinder 15 and the table lifting unit 42 to lower the frame mounting plate 11 and the work clamp table 40. In the first embodiment, it is: in the fixing step 1005, the dividing device 1 The frame 209 supporting the workpiece 200 in the opening 212 is carried out from the upper surface 18 of the frame mounting plate 11 by a conveying unit not shown, and the dividing method is ended. Furthermore, in the fixing step 1005, even if the suction source 43 is stopped, the slack 211 of the expansion piece 208 has been contracted. Therefore, the width of the dividing groove 210 can be fixed to the desired value adjusted in the groove width adjustment step 1004. width.

如此進行，在第1實施形態中為：在固定步驟1005中，一面以工作夾台40隔著擴展片208吸引保持已在溝寬調整步驟1004中將分割溝210的寬度形成為所期望的寬度之被加工物200，一面對被加工物200的外周與框架209的內周之間的擴展片208加熱來使其收縮，而去除因擴張而產生的鬆弛211。In this way, in the first embodiment, in the fixing step 1005, the work clamp table 40 is used to suck and hold the expansion piece 208 through the expansion piece 208. In the groove width adjustment step 1004, the width of the dividing groove 210 is formed to a desired width. The workpiece 200 is heated to shrink the expansion sheet 208 between the outer circumference of the workpiece 200 and the inner circumference of the frame 209, and the slack 211 due to expansion is removed.

再者，將已分割成一個個的器件晶片201藉由未圖示的拾取裝置從擴展片208剝離並取下。Furthermore, the divided device wafer 201 is peeled off from the expansion sheet 208 by a pick-up device not shown, and then removed.

如以上所說明，第1實施形態之分割方法在分割步驟1002中分割被加工物200後，在擴張解除步驟1003中解除擴展片208的擴張。分割方法是藉由在擴張解除步驟1003中解除一次擴展片208的擴張，而讓已擴張的擴展片208收縮並使分割溝210的寬度縮小。分割方法因為在實施擴張解除步驟1003後，會實施溝寬調整步驟1004，而再次擴張擴展片208，且在溝寬調整步驟1004中僅擴張擴展片208，所以可以形成所期望的寬度的分割溝210，而抑制分割溝210的寬度的偏差。其結果，分割方法會發揮可以形成所期望的寬度的分割溝210之效果。從而，分割方法可以抑制已分割之器件晶片201彼此接觸之情形，而可以抑制已分割之器件晶片201的損傷。As described above, in the dividing method of the first embodiment, after dividing the workpiece 200 in the dividing step 1002, the expansion of the expansion piece 208 is released in the expansion releasing step 1003. The dividing method is to release the expansion of the expansion piece 208 once in the expansion release step 1003, so that the expanded expansion piece 208 is contracted and the width of the dividing groove 210 is reduced. In the division method, after the expansion release step 1003 is performed, the groove width adjustment step 1004 is performed, and the expansion piece 208 is expanded again, and only the expansion piece 208 is expanded in the groove width adjustment step 1004, so that a dividing groove of a desired width can be formed 210, and the deviation of the width of the dividing groove 210 is suppressed. As a result, the dividing method has the effect of being able to form the dividing groove 210 of a desired width. Therefore, the dividing method can prevent the divided device wafers 201 from contacting each other, and can suppress the damage of the divided device wafers 201.

又，雖然為了將被加工物200以改質層206為分割起點來分割，必須以高速來擴張擴展片208，但因為滾輪構件23的旋轉趕不上擴展片208的擴張，所以若以高速擴張擴展片208，會僅被加工物200的外周部分被擴張且被加工物200的中心側未充分地伸展，而使被加工物200的中心部的器件晶片201的間隔相較於外周部變得較狹窄。In addition, in order to divide the workpiece 200 with the modified layer 206 as the starting point for dividing, the expansion piece 208 must be expanded at a high speed. However, since the rotation of the roller member 23 cannot keep up with the expansion of the expansion piece 208, if the expansion piece 208 is expanded at a high speed 208, only the outer peripheral portion of the workpiece 200 is expanded and the center side of the workpiece 200 is not fully extended, so that the interval between the device wafers 201 in the center of the workpiece 200 becomes narrower than the outer peripheral portion .

然而，由於分割方法在溝寬調整步驟1004中，以比分割步驟1002的第1速度301更低速的第2速度302來擴張擴展片208，因此可以在溝寬調整步驟1004中將擴展片208均勻地擴張，而可以抑制分割溝210的寬度的偏差。However, since the dividing method expands the expanding piece 208 at the second speed 302 which is lower than the first speed 301 in the dividing step 1002 in the groove width adjusting step 1004, the expanding piece 208 can be evened in the groove width adjusting step 1004 The ground is expanded, and the deviation of the width of the dividing groove 210 can be suppressed.

第1實施形態之分割裝置1是控制單元50具有分割控制部51與擴張解除部52，前述分割控制部51擴張擴展片208來形成分割溝210，前述擴張解除部52在被加工物200的分割後解除擴展片208的擴張。分割裝置1藉由擴張解除部52解除一次擴展片208的擴張，而讓已擴張的擴展片208收縮並使分割溝210的寬度縮小。又，第1實施形態之分割裝置1由於控制單元50具有在解除擴展片208的擴張之後將擴展片208擴張的溝寬調整部53，因此在解除擴張後，會因為僅將擴展片208再次擴張，所以可以形成所期望的寬度的分割溝210，而抑制分割溝210的寬度的偏差。其結果，分割裝置1會發揮可以形成所期望的寬度的分割溝210之效果。In the dividing device 1 of the first embodiment, the control unit 50 has a dividing control unit 51 and an expansion releasing section 52. The dividing control section 51 expands the expansion piece 208 to form a dividing groove 210. The expansion releasing section 52 divides the workpiece 200 Then, the expansion of the expansion piece 208 is released. The dividing device 1 releases the expansion of the expansion piece 208 once by the expansion releasing part 52, so that the expanded expansion piece 208 is contracted and the width of the dividing groove 210 is reduced. Furthermore, in the dividing device 1 of the first embodiment, since the control unit 50 has the groove width adjusting portion 53 that expands the expansion piece 208 after releasing the expansion of the expansion piece 208, after the expansion is released, only the expansion piece 208 is expanded again. Therefore, the division groove 210 of a desired width can be formed, and the deviation of the width of the division groove 210 can be suppressed. As a result, the dividing device 1 has the effect of being able to form the dividing groove 210 of a desired width.

[第2實施形態] 依據圖式來說明本發明之第2實施形態的分割裝置及分割方法。圖13是顯示第2實施形態之分割裝置的構成例的立體圖。圖14是示意地顯示第2實施形態之分割方法的保持步驟的平面圖。圖15是示意地顯示第2實施形態之分割方法的分割步驟的平面圖。圖16是第2實施形態之分割方法的分割步驟之被加工物的主要部位的平面圖。圖17是第2實施形態之分割方法的擴張解除步驟之被加工物的主要部位的平面圖。圖18是第2實施形態之分割方法的寬度調整步驟之被加工物的主要部位的平面圖。圖19是示意地顯示第2實施形態之分割方法的固定步驟的平面圖。再者，圖13、圖14、圖15、圖16、圖17、圖18及圖19是對與第1實施形態相同的部分是附加相同的符號而省略說明。[Second Embodiment] The dividing device and dividing method according to the second embodiment of the present invention will be explained based on the drawings. Fig. 13 is a perspective view showing a configuration example of the dividing device of the second embodiment. Fig. 14 is a plan view schematically showing a holding step of the dividing method of the second embodiment. Fig. 15 is a plan view schematically showing the division procedure of the division method of the second embodiment. Fig. 16 is a plan view of the main part of the workpiece in the division step of the division method of the second embodiment. Fig. 17 is a plan view of the main part of the workpiece in the expansion release step of the dividing method of the second embodiment. Fig. 18 is a plan view of the main part of the workpiece in the width adjustment step of the dividing method of the second embodiment. Fig. 19 is a plan view schematically showing a fixing step of the dividing method of the second embodiment. In addition, in FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, FIG. 18, and FIG.

如圖13所示，第2實施形態之分割裝置1-2具備：固定基台150、設置於固定基台150的中央的工作夾台40、第一保持組件即第一保持單元131-1、第二保持組件即第二保持單元131-2、第三保持組件即第三保持單元131-3、第四保持組件即第四保持單元131-4、移動組件即第一移動單元133-1、移動組件即第二移動單元133-2、移動組件即第三移動單元133-3、及移動組件即第四移動單元133-4。As shown in FIG. 13, the dividing device 1-2 of the second embodiment includes a fixed base 150, a work clamp table 40 provided in the center of the fixed base 150, a first holding unit 131-1 which is a first holding assembly, The second holding assembly is the second holding unit 131-2, the third holding assembly is the third holding unit 131-3, the fourth holding assembly is the fourth holding unit 131-4, and the moving assembly is the first moving unit 133-1. The moving component is the second moving unit 133-2, the moving component is the third moving unit 133-3, and the moving component is the fourth moving unit 133-4.

工作夾台40於保持面41載置擴展片208。第一保持單元131-1與第二保持單元131-2是在與水平方向平行的第一方向111上，隔著載置擴展片208的工作夾台40互相相向而配設。亦即，第一保持單元131-1與第二保持單元131-2是沿著第一方向111互相相向，且在互相之間定位有工作夾台40。The work chuck table 40 places the expansion sheet 208 on the holding surface 41. The first holding unit 131-1 and the second holding unit 131-2 are arranged in the first direction 111 parallel to the horizontal direction, and are arranged to face each other via the work clamp table 40 on which the expansion sheet 208 is placed. That is, the first holding unit 131-1 and the second holding unit 131-2 are facing each other along the first direction 111, and a working clamping table 40 is positioned between each other.

第三保持單元131-3與第四保持單元131-4是在與水平方向平行且相對於第一方向111正交的第二方向112上，隔著載置擴展片208的工作夾台40互相相向而配設。亦即，第三保持單元131-3與第四保持單元131-4是沿著第二方向112互相相向，且在互相之間定位有工作夾台40。The third holding unit 131-3 and the fourth holding unit 131-4 are in a second direction 112 that is parallel to the horizontal direction and orthogonal to the first direction 111. Equipped in opposite directions. That is, the third holding unit 131-3 and the fourth holding unit 131-4 are opposed to each other along the second direction 112, and a work clamping table 40 is positioned between each other.

第一保持單元131-1、第二保持單元131-2、第三保持單元131-3及第四保持單元131-4，分別將擴展片208之比被加工物200更外周側夾住並保持。由於第一保持單元131-1、第二保持單元131-2、第三保持單元131-3及第四保持單元131-4互相使構成為大致相等，因此會對相同部分附加相同符號來說明。The first holding unit 131-1, the second holding unit 131-2, the third holding unit 131-3, and the fourth holding unit 131-4 respectively clamp and hold the expansion piece 208 on the outer peripheral side than the workpiece 200 . Since the first holding unit 131-1, the second holding unit 131-2, the third holding unit 131-3, and the fourth holding unit 131-4 are substantially equal to each other, the same parts will be described with the same reference numerals.

第一保持單元131-1、第二保持單元131-2、第三保持單元131-3及第四保持單元131-4具備：一對夾持構件154，在鉛直方向上移動自如地設置在已設置於固定基台150上之柱狀的移動基台153；及移動機構155，使一對夾持構件154朝互相接近的方向及互相遠離的方向移動。一對夾持構件154互相在鉛直方向上隔著間隔而配置，且藉由移動機構155互相接近而在互相之間夾住並保持擴展片208。移動機構155設置於移動基台153。又，設置有各保持單元131-1、131-2、131-3、131-4的一對夾持構件154及移動機構155的移動基台153，以在第一方向111或第二方向112上移動自如的方式設置在固定基台150。The first holding unit 131-1, the second holding unit 131-2, the third holding unit 131-3, and the fourth holding unit 131-4 are provided with a pair of clamping members 154, which are movably installed in the vertical direction. The columnar moving base 153 provided on the fixed base 150; and the moving mechanism 155, which moves the pair of clamping members 154 in the direction of approaching each other and the direction of moving away from each other. The pair of clamping members 154 are arranged at a distance from each other in the vertical direction, and the moving mechanism 155 approaches each other to clamp and hold the expansion piece 208 between each other. The moving mechanism 155 is installed on the moving base 153. In addition, a pair of clamping members 154 of the respective holding units 131-1, 131-2, 131-3, 131-4 and a moving base 153 of the moving mechanism 155 are provided to move in the first direction 111 or the second direction 112 It is installed on the fixed base 150 in a manner that it can move upwardly freely.

第一移動單元133-1與第二移動單元133-2是設成可讓第一保持單元131-1與第二保持單元131-2在第一方向111上朝互相離開的方向移動之單元。在第2實施形態中，第一移動單元133-1使設置有第一保持單元131-1的移動基台153相對於固定基台150在第一方向111上移動。在第1實施形態中，第二移動單元133-2使設置有第二保持單元131-2的移動基台153相對於固定基台150在第一方向111上移動。The first moving unit 133-1 and the second moving unit 133-2 are units configured to allow the first holding unit 131-1 and the second holding unit 131-2 to move away from each other in the first direction 111. In the second embodiment, the first moving unit 133-1 moves the moving base 153 provided with the first holding unit 131-1 relative to the fixed base 150 in the first direction 111. In the first embodiment, the second moving unit 133-2 moves the moving base 153 provided with the second holding unit 131-2 relative to the fixed base 150 in the first direction 111.

第三移動單元133-3與第四移動單元133-4是設成可讓第三保持單元131-3與第四保持單元131-4在第二方向112上朝互相離開的方向移動之單元。在第2實施形態中，第三移動單元133-3使設置有第三保持單元131-3的移動基台153相對於固定基台150在第二方向112上移動。在第2實施形態中，第四移動單元133-4使設置有第四保持單元131-4的移動基台153相對於固定基台150在第二方向112上移動。The third moving unit 133-3 and the fourth moving unit 133-4 are units configured to allow the third holding unit 131-3 and the fourth holding unit 131-4 to move away from each other in the second direction 112. In the second embodiment, the third moving unit 133-3 moves the moving base 153 provided with the third holding unit 131-3 relative to the fixed base 150 in the second direction 112. In the second embodiment, the fourth moving unit 133-4 moves the moving base 153 provided with the fourth holding unit 131-4 relative to the fixed base 150 in the second direction 112.

第一移動單元133-1、第二移動單元133-2、第三移動單元133-3及第四移動單元133-4為將第一保持單元131-1、第二保持單元131-2、第三保持單元131-3及第四保持單元131-4所保持的擴展片208擴張之擴張單元。由於第一移動單元133-1、第二移動單元133-2、第三移動單元133-3及第四移動單元133-4互相使構成為大致相等，因此會對相同部分附加相同符號來說明。The first moving unit 133-1, the second moving unit 133-2, the third moving unit 133-3, and the fourth moving unit 133-4 are the first holding unit 131-1, the second holding unit 131-2, and the first holding unit 131-1. The expansion unit in which the expansion sheet 208 held by the third holding unit 131-3 and the fourth holding unit 131-4 expands. Since the first mobile unit 133-1, the second mobile unit 133-2, the third mobile unit 133-3, and the fourth mobile unit 133-4 are configured to be substantially equal to each other, the same parts will be described with the same reference numerals.

第一移動單元133-1、第二移動單元133-2、第三移動單元133-3及第四移動單元133-4具有：馬達137-2，將保持單元131-1、131-2、131-3、131-4設成可在第一方向111或第二方向112上移動；及滾珠螺桿138-2，藉由馬達137-2而繞著軸心旋轉並使移動基台153在第一方向111或第二方向112上移動。The first moving unit 133-1, the second moving unit 133-2, the third moving unit 133-3, and the fourth moving unit 133-4 have a motor 137-2, and hold the units 131-1, 131-2, 131 -3, 131-4 is set to be movable in the first direction 111 or the second direction 112; and the ball screw 138-2 is rotated around the axis by the motor 137-2 and the moving base 153 is in the first Move in the direction 111 or the second direction 112.

又，分割裝置1-2具備未圖示之框架貼附單元、與切割器，前述框架貼附單元會保持框架209，且將框架209貼附於已保持於工作夾台40之擴展片208，前述切割器將已貼附於框架209之擴展片208的剩餘部分切斷。再者，剩餘部分是擴展片208的框架209的外周側之部分。In addition, the dividing device 1-2 is provided with a frame attaching unit and a cutter which are not shown in the figure. The frame attaching unit holds the frame 209 and attaches the frame 209 to the extension piece 208 held on the work clamp 40. The aforementioned cutter cuts off the remaining part of the extension piece 208 attached to the frame 209. In addition, the remaining part is the part on the outer peripheral side of the frame 209 of the expansion piece 208.

第2實施形態之分割方法與第1實施形態同樣地具備保持步驟1001、分割步驟1002、擴張解除步驟1003、溝寬調整步驟1004與固定步驟1005。The dividing method of the second embodiment includes a holding step 1001, a dividing step 1002, an expansion release step 1003, a groove width adjusting step 1004, and a fixing step 1005, as in the first embodiment.

第2實施形態之分割方法的保持步驟1001是將被加工物200貼附於擴展片208，並且對貼附有被加工物200的擴展片208之比被加工物200更外周側進行保持之步驟。在第2實施形態之分割方法的保持步驟1001中，是將被加工物200貼附到已纏繞在未圖示之輥的外周的長條的擴展片208，並且如圖14所示，在貼附被加工物200的前後處將長條的擴展片208切出成矩形。再者，在第2實施形態中，是將被加工物200的背面207側貼附於已切出矩形之擴展片208的中央。圖14是將器件204及改質層206省略。又，在本發明中，所期望的是，在第1實施形態之分割方法的保持步驟1001中，於被加工物200貼附有未圖示之表面保護膠帶的情況下，在將被加工物200貼附於擴展片208後剝離表面保護膠帶，以降低被加工物200的破損風險。The holding step 1001 of the dividing method of the second embodiment is a step of attaching the workpiece 200 to the expansion sheet 208 and holding the expansion sheet 208 to which the workpiece 200 is attached on the outer peripheral side of the workpiece 200 . In the holding step 1001 of the dividing method of the second embodiment, the workpiece 200 is attached to the elongated expansion sheet 208 wound around the outer circumference of a roller (not shown), and as shown in FIG. The long extended piece 208 is cut out into a rectangle at the front and rear of the attached workpiece 200. Furthermore, in the second embodiment, the back surface 207 side of the workpiece 200 is attached to the center of the rectangular expansion sheet 208. FIG. 14 omits the device 204 and the modified layer 206. Furthermore, in the present invention, it is desirable that in the holding step 1001 of the dividing method of the first embodiment, when a surface protection tape (not shown) is attached to the workpiece 200, the workpiece After the 200 is attached to the expansion sheet 208, the surface protection tape is peeled off to reduce the risk of damage to the processed object 200.

又，在第1實施形態之分割方法的保持步驟1001中，分割裝置1-2是控制單元50的分割控制部51控制各保持單元131-1、131-2、131-3、131-4，而將已切出成矩形且於中央貼附有被加工物200的擴展片208之比被加工物200更外周側夾在各保持單元131-1、131-2、131-3、131-4的一對夾持構件154之間來固定。In addition, in the holding step 1001 of the dividing method of the first embodiment, the dividing device 1-2 is the dividing control unit 51 of the control unit 50 that controls the respective holding units 131-1, 131-2, 131-3, and 131-4, And the expansion piece 208 which has been cut out into a rectangle and attached the workpiece 200 to the center is sandwiched on the holding units 131-1, 131-2, 131-3, 131-4 on the outer peripheral side of the workpiece 200. Between the pair of clamping members 154.

在第2實施形態之分割方法的分割步驟1002中，分割裝置1-2是控制單元50的分割控制部51控制各移動單元133-1、133-2、133-3、133-4，而以第1速度301使第一保持單元131-1與第二保持單元131-2朝互相遠離的方向移動，並且以第1速度301使第三保持單元131-3與第四保持單元131-4朝互相遠離的方向移動，而如圖15所示，將擴展片208在第一方向111與第二方向112上同時地擴張。被加工物200與第1實施形態同樣，將沿著分割預定線203的改質層206設為分割起點而按一個個的器件204來進行分割，並如圖16所示，按一個個的器件晶片201個體化而形成沿著分割預定線203的分割溝210。In the dividing step 1002 of the dividing method of the second embodiment, the dividing device 1-2 is the dividing control unit 51 of the control unit 50 that controls the respective moving units 133-1, 133-2, 133-3, and 133-4. The first speed 301 causes the first holding unit 131-1 and the second holding unit 131-2 to move away from each other, and at the first speed 301 to move the third holding unit 131-3 and the fourth holding unit 131-4 toward Move away from each other, and as shown in FIG. 15, the expansion piece 208 is simultaneously expanded in the first direction 111 and the second direction 112. As in the first embodiment, the workpiece 200 is divided into individual devices 204 with the modified layer 206 along the planned dividing line 203 as the starting point of division, and as shown in FIG. The wafer 201 is individualized to form a dividing groove 210 along the planned dividing line 203.

再者，因為改質層206並非均勻地形成，所以在分割步驟1002中，在擴展片208的擴張時斷裂的時間點會產生偏差。亦即，在分割步驟1002中幾乎沒有全部的改質層206同時地斷裂之情形。因此，如圖16所示，分割步驟1002後的分割溝210與第1實施形態同樣地在寬度上產生偏差。In addition, since the modified layer 206 is not uniformly formed, in the dividing step 1002, the time point when the expansion sheet 208 is broken during expansion may vary. That is, in the dividing step 1002, almost all the modified layers 206 are not broken at the same time. Therefore, as shown in FIG. 16, the dividing groove 210 after the dividing step 1002 has a deviation in the width similarly to the first embodiment.

再者，在第2實施形態中為：在分割步驟1002中，分割裝置1-2以例如200mm/sec作為第1速度301來使各保持單元131-1、131-2、131-3、131-4移動，並將擴展片208擴張例如10mm。又，雖然在第1實施形態中為：將擴展片208同時朝第一方向111與第二方向112擴張，但在本發明中並非限定於此，亦可例如在將擴展片208朝第一方向111擴張來進行分割後，朝第二方向112擴張來進行分割。又，在本發明中，亦可在分割步驟1002中，使擴張量及第1速度301在第一方向111與第二方向112上不同。Furthermore, in the second embodiment, in the dividing step 1002, the dividing device 1-2 uses, for example, 200 mm/sec as the first speed 301 to set the respective holding units 131-1, 131-2, 131-3, 131 -4 moves and expands the expansion piece 208 by, for example, 10 mm. Moreover, although in the first embodiment, the expansion piece 208 is expanded in the first direction 111 and the second direction 112 at the same time, the present invention is not limited to this. For example, the expansion piece 208 may be expanded in the first direction. After 111 is expanded for division, it is expanded in the second direction 112 for division. Furthermore, in the present invention, in the dividing step 1002, the amount of expansion and the first speed 301 may be different in the first direction 111 and the second direction 112.

在第2實施形態之分割方法的擴張解除步驟1003中，分割裝置1-2是控制單元50的擴張解除部52控制各移動單元133-1、133-2、133-3、133-4，而使第一保持單元131-1與第二保持單元131-2互相接近到保持步驟1001的位置，並且使第三保持單元131-3與第四保持單元131-4互相接近到保持步驟1001的位置，而解除擴展片208的面方向的擴張。如此一來，如圖17所示，分割溝210會與第1實施形態同樣地寬度比分割步驟1002後更縮小，而可抑制偏差。In the expansion release step 1003 of the division method of the second embodiment, the division device 1-2 is the expansion release section 52 of the control unit 50 controlling each of the moving units 133-1, 133-2, 133-3, and 133-4, and The first holding unit 131-1 and the second holding unit 131-2 are brought close to each other to the position of the holding step 1001, and the third holding unit 131-3 and the fourth holding unit 131-4 are brought close to each other to the position of the holding step 1001 , And the expansion of the expansion piece 208 in the surface direction is released. In this way, as shown in FIG. 17, the width of the dividing groove 210 is smaller than that after the dividing step 1002 as in the first embodiment, and the deviation can be suppressed.

在第2實施形態之分割方法的溝寬調整步驟1004中，分割裝置1-2是控制單元50的溝寬調整部53控制各移動單元133-1、133-2、133-3、133-4，而以比第1速度301更低速的第2速度302使第一保持單元131-1與第二保持單元131-2朝互相遠離的方向移動，並且以比第1速度301更低速的第2速度302使第三保持單元131-3與第四保持單元131-4朝互相遠離的方向移動，而如圖15所示，將擴展片208在第一方向111與第二方向112上同時地擴張。In the groove width adjustment step 1004 of the dividing method of the second embodiment, the dividing device 1-2 is the groove width adjusting section 53 of the control unit 50, which controls the respective moving units 133-1, 133-2, 133-3, and 133-4. , And move the first holding unit 131-1 and the second holding unit 131-2 away from each other at a second speed 302 that is lower than the first speed 301, and move at a second speed lower than the first speed 301 The speed 302 causes the third holding unit 131-3 and the fourth holding unit 131-4 to move away from each other, and as shown in FIG. 15, the expansion piece 208 is simultaneously expanded in the first direction 111 and the second direction 112 .

由於被加工物200在分割步驟1002中已經以沿著分割預定線203的改質層206為分割起點而被分割，並按一個個的器件晶片201被個體化，而形成有沿著分割預定線203的分割溝210，因此會僅擴張擴展片208，且分割溝210的寬度會比擴張解除步驟1003後更擴大。由於在溝寬調整步驟1004中僅擴張擴展片208，因此分割溝210會如圖18所示，寬度的偏差被抑制得比分割步驟1002後的偏差更低。Since the workpiece 200 has been divided in the dividing step 1002 with the modified layer 206 along the planned dividing line 203 as the starting point for dividing, and the individual device wafers 201 have been individualized, there are formed along the planned dividing line. Therefore, the dividing groove 210 of 203 will only expand the expansion piece 208, and the width of the dividing groove 210 will be larger than that after the expansion release step 1003. Since only the expansion piece 208 is expanded in the groove width adjustment step 1004, the divided groove 210 is as shown in FIG. 18, and the deviation of the width is suppressed to be lower than the deviation after the dividing step 1002.

在第2實施形態之分割方法的固定步驟1005中，分割裝置1-2是控制單元50的分割控制部51將擴展片208夾在各保持單元131-1、131-2、131-3、131-4的一對夾持構件154之間，並在已將分割溝210形成為所期望的寬度的狀態下，如圖19所示，控制框架貼附單元來將框架209貼附在擴展片208的被加工物200的周圍。在第2實施形態之分割方法的固定步驟1005中，分割裝置1-2是控制單元50的分割控制部51控制切割器來將已貼附於框架209的擴展片208的剩餘部分切斷，並在已將被加工物200的分割溝210的寬度保持於所期望的寬度的狀態下，透過擴展片208將被加工物200固定於框架209。In the fixing step 1005 of the dividing method of the second embodiment, the dividing device 1-2 is the dividing control unit 51 of the control unit 50 sandwiching the expansion sheet 208 on the respective holding units 131-1, 131-2, 131-3, 131 -4 between the pair of clamping members 154, and in a state where the dividing groove 210 has been formed to a desired width, as shown in FIG. 19, the frame attaching unit is controlled to attach the frame 209 to the extension piece 208 Around the 200 to be processed. In the fixing step 1005 of the dividing method of the second embodiment, the dividing device 1-2 is the dividing control unit 51 of the control unit 50 controlling the cutter to cut the remaining part of the extension piece 208 attached to the frame 209, and In a state where the width of the dividing groove 210 of the workpiece 200 has been maintained at a desired width, the workpiece 200 is fixed to the frame 209 through the expansion piece 208.

如此進行，在第2實施形態中為：在固定步驟1005中，為了將被加工物200配置在具有開口212之框架209的開口212內，而在已在溝寬調整步驟1004中擴張擴展片208的狀態下將框架209貼附於擴展片208，並以所期望的寬度來將分割溝210固定。In this way, in the second embodiment, in the fixing step 1005, in order to arrange the workpiece 200 in the opening 212 of the frame 209 having the opening 212, the expansion piece 208 is expanded in the groove width adjustment step 1004. The frame 209 is attached to the expansion piece 208 in the state of, and the dividing groove 210 is fixed with a desired width.

第2實施形態之分割方法及分割裝置1-2因為在分割被加工物200後，解除擴展片208的擴張，而使分割溝210的寬度暫時縮小，且僅將擴展片208再次擴張，所以可以形成所期望的寬度的分割溝210，並且抑制分割溝210的寬度的偏差。其結果，分割方法及分割裝置1-2和第1實施形態同樣地發揮可以形成所期望的寬度的分割溝210之效果。The dividing method and dividing device 1-2 of the second embodiment is because after dividing the workpiece 200, the expansion of the expansion piece 208 is released, so that the width of the dividing groove 210 is temporarily reduced, and only the expansion piece 208 is expanded again. The division groove 210 of a desired width is formed, and the deviation of the width of the division groove 210 is suppressed. As a result, the dividing method and dividing device 1-2 exhibit the effect that the dividing groove 210 of a desired width can be formed in the same manner as in the first embodiment.

再者，本發明並非限定於上述實施形態之發明。亦即，在不脫離本發明之要點的範圍內，可以進行各種變形來實施。在第1實施形態及第2實施形態中，雖然是使用改質層206作為分割起點，但在本發明中，分割起點並不限定於改質層206。在本發明中，分割起點亦可為從被加工物200的基板202的背面207凹陷之切削溝或雷射加工溝。In addition, this invention is not limited to the invention of the said embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention. In the first embodiment and the second embodiment, although the modified layer 206 is used as the starting point of division, in the present invention, the starting point of division is not limited to the modified layer 206. In the present invention, the starting point of division may be a cutting groove or a laser processing groove recessed from the back surface 207 of the substrate 202 of the workpiece 200.

1,1-2:分割裝置 10:框架固定單元 11:框架載置板 12:框架按壓板 13,17:開口部 15:升降用汽缸 16:桿件 18:上表面 20:擴張單元 21:擴張圓筒 22:圓筒用升降單元 23:滾輪構件 30:加熱單元 31:單元本體 32:熱源部 33:旋轉單元 34:升降單元 40:工作夾台(吸引保持構件) 41:保持面 42:工作台用升降單元 43:吸引源 50:控制單元(控制器) 51:分割控制部 52:擴張解除部 53:溝寬調整部 111:第一方向 112:第二方向 131-1:第一保持單元 131-2:第二保持單元 131-3:第三保持單元 131-4:第四保持單元 133-1:第一移動單元(擴張單元) 133-2:第二移動單元(擴張單元) 133-3:第三移動單元(擴張單元) 133-4:第四移動單元(擴張單元) 137-2:馬達 138-2:滾珠螺桿 150:固定基台 153:移動基台 154:夾持構件 155:移動機構 200:被加工物 201:器件晶片 202:基板 203:分割預定線 204:器件 205:正面 206:改質層(分割起點) 207:背面 208:擴展片 209:框架 210:分割溝 211:鬆弛 212:開口 301:第1速度 302:第2速度 1001:保持步驟 1002:分割步驟 1003:擴張解除步驟 1004:溝寬調整步驟 1005:固定步驟1,1-2: Dividing device 10: Frame fixing unit 11: Frame mounting plate 12: Frame pressing plate 13,17: opening 15: Cylinder for lifting 16: Rod 18: upper surface 20: Expansion unit 21: Expansion cylinder 22: Lifting unit for cylinder 23: Roller component 30: heating unit 31: Unit body 32: Heat source department 33: Rotating unit 34: Lifting unit 40: Work clamp table (attractive holding member) 41: keep noodles 42: Lifting unit for workbench 43: Attraction source 50: control unit (controller) 51: Division control section 52: Expansion Release Department 53: Groove width adjustment part 111: first direction 112: second direction 131-1: The first holding unit 131-2: The second holding unit 131-3: The third holding unit 131-4: The fourth holding unit 133-1: The first mobile unit (expansion unit) 133-2: The second mobile unit (expansion unit) 133-3: The third mobile unit (expansion unit) 133-4: Fourth mobile unit (expansion unit) 137-2: Motor 138-2: Ball screw 150: fixed abutment 153: mobile abutment 154: Clamping member 155: Mobile Organization 200: processed objects 201: Device Wafer 202: substrate 203: Divide the pre-determined line 204: Device 205: front 206: modified layer (segmentation starting point) 207: Back 208: Expansion piece 209: Frame 210: segmentation groove 211: slack 212: open 301: 1st speed 302: 2nd speed 1001: Keep step 1002: Segmentation step 1003: Expansion release step 1004: Groove width adjustment steps 1005: fixed step

圖1是顯示第1實施形態之分割裝置的構成例的立體圖。 圖2是圖1所示的分割裝置之加工對象的被加工物的立體圖。 圖3是顯示第1實施形態的分割方法之流程的流程圖。 圖4是以局部剖面方式顯示在圖3所示之分割方法的保持步驟中，已將框架載置於框架固定單元的框架載置板的上表面之狀態的側面圖。 圖5是以局部剖面方式顯示在圖3所示之分割方法的保持步驟中，框架固定單元已保持、固定框架之狀態的側面圖。 圖6是以局部剖面方式顯示圖3所示之分割方法的分割步驟的側面圖。 圖7是圖6所示之被加工物的主要部位的平面圖。 圖8是以局部剖面方式顯示圖3所示之分割方法的擴張解除步驟的側面圖。 圖9是圖8所示之被加工物的主要部位的平面圖。 圖10是以局部剖面方式顯示圖3所示之分割方法的溝寬調整步驟的側面圖。 圖11是圖10所示之被加工物的主要部位的平面圖。 圖12是以局部剖面方式顯示圖3所示之分割方法的固定步驟的側面圖。 圖13是顯示第2實施形態之分割裝置的構成例的立體圖。 圖14是示意地顯示第2實施形態之分割方法的保持步驟的平面圖。 圖15是示意地顯示第2實施形態之分割方法的分割步驟的平面圖。 圖16是第2實施形態之分割方法的分割步驟之被加工物的主要部位的平面圖。 圖17是第2實施形態之分割方法的擴張解除步驟之被加工物的主要部位的平面圖。 圖18是第2實施形態之分割方法的溝寬調整步驟之被加工物的主要部位的平面圖。 圖19是示意地顯示第2實施形態之分割方法的固定步驟的平面圖。Fig. 1 is a perspective view showing a configuration example of the dividing device of the first embodiment. Fig. 2 is a perspective view of a to-be-processed object of the dividing device shown in Fig. 1. Fig. 3 is a flowchart showing the flow of the dividing method of the first embodiment. Fig. 4 is a side view showing a state in which the frame has been placed on the upper surface of the frame mounting plate of the frame fixing unit in the holding step of the dividing method shown in Fig. 3 in a partial cross section. Fig. 5 is a side view showing a state in which the frame fixing unit has been held and the frame is fixed in the holding step of the dividing method shown in Fig. 3 in a partial section. FIG. 6 is a side view showing the dividing step of the dividing method shown in FIG. 3 in a partial cross-sectional manner. Fig. 7 is a plan view of the main part of the workpiece shown in Fig. 6. Fig. 8 is a side view showing, in partial cross-section, the expansion release step of the dividing method shown in Fig. 3. Fig. 9 is a plan view of the main part of the workpiece shown in Fig. 8. Fig. 10 is a side view showing the groove width adjustment step of the dividing method shown in Fig. 3 in partial cross-section. Fig. 11 is a plan view of the main part of the workpiece shown in Fig. 10. Fig. 12 is a side view showing the fixing step of the dividing method shown in Fig. 3 in partial cross-section. Fig. 13 is a perspective view showing a configuration example of the dividing device of the second embodiment. Fig. 14 is a plan view schematically showing a holding step of the dividing method of the second embodiment. Fig. 15 is a plan view schematically showing the division procedure of the division method of the second embodiment. Fig. 16 is a plan view of the main part of the workpiece in the division step of the division method of the second embodiment. Fig. 17 is a plan view of the main part of the workpiece in the expansion release step of the dividing method of the second embodiment. Fig. 18 is a plan view of the main part of the workpiece in the groove width adjustment step of the dividing method of the second embodiment. Fig. 19 is a plan view schematically showing a fixing step of the dividing method of the second embodiment.

1001:保持步驟 1001: Keep step

1002:分割步驟 1002: Segmentation step

1003:擴張解除步驟 1003: Expansion release step

1004:溝寬調整步驟 1004: Groove width adjustment steps

1005:固定步驟 1005: fixed step

Claims (6)

一種分割方法，是可沿著分割預定線形成分割起點並且已貼附在擴展片之被加工物的分割方法，並具備有以下步驟： 分割步驟，擴張該擴展片來沿著該分割起點分割被加工物，而形成沿著該分割預定線的分割溝； 擴張解除步驟，在實施該分割步驟後，解除該擴展片的擴張；及 溝寬調整步驟，在實施該擴張解除步驟後，擴張該擴展片並將該分割溝形成為所期望的寬度。A method of dividing is a method of dividing the processed object that has been attached to the expansion sheet and formed the starting point of the dividing line along the planned dividing line, and has the following steps: In the dividing step, the expansion sheet is expanded to divide the object to be processed along the dividing starting point to form a dividing groove along the planned dividing line; An expansion release step, after the division step is implemented, the expansion of the expansion piece is released; and In the groove width adjustment step, after the expansion release step is performed, the expansion piece is expanded and the dividing groove is formed to a desired width. 如請求項1之分割方法，其中在該分割步驟中，是以第1速度來擴張該擴展片，且在該溝寬調整步驟中，是以比該第1速度更低速的第2速度來擴張該擴展片。Such as the dividing method of claim 1, wherein in the dividing step, the expansion piece is expanded at a first speed, and in the groove width adjusting step, the expansion piece is expanded at a second speed lower than the first speed The expansion piece. 如請求項1或2之分割方法，其更具備有固定步驟，前述固定步驟是在實施該溝寬調整步驟後，以該所期望的寬度來將該分割溝固定。For example, the dividing method of claim 1 or 2 is further provided with a fixing step. The aforementioned fixing step is to fix the dividing groove with the desired width after the groove width adjustment step is performed. 如請求項3之分割方法，其中被加工物是形成為透過該擴展片而裝設在具有開口之環狀框架並且配置在該開口內的狀態， 在該分割步驟與該溝寬調整步驟中，是藉由在已固定該環狀框架的狀態下，按壓被加工物的外周與該環狀框架的內周之間的該擴展片來擴張該擴展片， 在該固定步驟中，是一面以吸引保持構件隔著該擴展片來吸引保持已在該溝寬調整步驟中將該分割溝形成為該所期望的寬度的被加工物，一面對被加工物的外周與該環狀框架的內周之間的擴展片加熱來使其收縮，而去除因擴張所產生的鬆弛。Such as the dividing method of claim 3, wherein the object to be processed is formed into a state in which the object to be processed is installed in a ring frame having an opening through the expansion sheet, and is arranged in the opening, In the dividing step and the groove width adjusting step, the expansion piece is expanded by pressing the expansion piece between the outer periphery of the workpiece and the inner periphery of the annular frame in a state where the annular frame is fixed. piece, In the fixing step, a suction and holding member is used to suck and hold the workpiece whose width has been formed into the desired width in the groove width adjustment step through the expansion piece with the suction and holding member, and the other side faces the workpiece. The expansion sheet between the outer circumference of the ring frame and the inner circumference of the ring frame is heated to shrink it and remove the slack due to expansion. 如請求項3之分割方法，其中在該固定步驟中，為了將被加工物配置在具有開口之環狀框架的該開口內，而在已在該溝寬調整步驟中擴張該擴展片的狀態下將該環狀框架貼附在該擴展片。Such as the dividing method of claim 3, wherein in the fixing step, in order to arrange the object to be processed in the opening of the ring frame having an opening, the expansion piece has been expanded in the groove width adjustment step Attach the ring frame to the expansion sheet. 一種分割裝置，是實施請求項1至5中任一項之分割方法的分割裝置，並具備： 擴張單元，擴張該擴展片；及 控制器，控制該擴張單元， 該控制器包含： 分割控制部，擴張該擴展片來沿著該分割起點分割被加工物，而形成沿著該分割預定線的分割溝； 擴張解除部，在被加工物的分割後解除該擴展片的擴張；及 溝寬調整部，在解除該擴展片的擴張後，擴張該擴展片並將該分割溝形成為所期望的寬度。A segmentation device is a segmentation device that implements any one of the segmentation methods of claim items 1 to 5, and is provided with: Expansion unit to expand the expansion piece; and The controller controls the expansion unit, The controller contains: A division control unit, which expands the expansion sheet to divide the object to be processed along the division start point to form a division groove along the planned division line; The expansion releasing part releases the expansion of the expansion piece after the division of the workpiece; and After releasing the expansion of the expansion piece, the groove width adjusting portion expands the expansion piece and forms the dividing groove to a desired width.
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