TW202221778A - Extension device and extension method that suppresses the possibility of an undivided region being produced in a workpiece to be lower - Google Patents

Extension device and extension method that suppresses the possibility of an undivided region being produced in a workpiece to be lower Download PDF

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TW202221778A
TW202221778A TW110141900A TW110141900A TW202221778A TW 202221778 A TW202221778 A TW 202221778A TW 110141900 A TW110141900 A TW 110141900A TW 110141900 A TW110141900 A TW 110141900A TW 202221778 A TW202221778 A TW 202221778A
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sheet
workpiece
expansion
area
unit
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陳曄
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

Provided is an extension device that can suppress the possibility of an undivided region being produced in a workpiece to be lower. The solution is an extension device that divides a workpiece by preforming extension on an extension piece of the workpiece attached with a formed dividing start point, i.e., a modified layer. The extension device includes: an extension mechanism that extends an extension piece; and a cooling unit that cools a region between an inner edge of an annular frame of the extension piece and an outer edge of the workpiece to become lower in temperature than a region of the extension piece that is further inward of the outer edge of the workpiece.

Description

擴展裝置及擴展方法Expansion device and expansion method

本發明是有關於一種對貼附有已形成分割起點的被加工物之片材進行擴張來分割被加工物之擴展裝置及擴展方法。The present invention relates to an expanding device and an expanding method for dividing a workpiece by expanding a sheet to which a workpiece having a division starting point is attached.

藉由將擴展片貼附在沿著預定之分割預定線形成有分割起點之被加工物的背面，並對擴展片進行擴張來分割被加工物之擴展裝置已在使用中(參照例如專利文獻1)。An expansion device is already in use that divides a workpiece by attaching an expansion sheet to the back of a workpiece having a division starting point formed along a predetermined dividing line, and expanding the expansion sheet (see, for example, Patent Document 1). ).

專利文獻1所示之擴展裝置在被加工物包含DAF(黏晶薄膜)或金屬膜等延性材的情況下，會在擴展時冷卻被加工物，來使分割性提升。 先前技術文獻 專利文獻 The expansion apparatus shown in Patent Document 1 cools the workpiece during expansion to improve the splitability when the workpiece includes a ductile material such as DAF (die-bonded thin film) or metal film. prior art literature Patent Literature

專利文獻1：日本特開2019-186437號公報Patent Document 1: Japanese Patent Laid-Open No. 2019-186437

發明欲解決之課題The problem to be solved by the invention

另一方面，已貼附於被加工物之擴展片也具有延性，且延性會因被冷卻而受到抑制。若在僅對貼附有被加工物之區域的擴展片進行冷卻，且不對被加工物的外側之區域的擴展片進行冷卻的狀態下對擴展片進行擴展時，會在擴展片的被加工物的外周側之區域可被擴張而貼附有被加工物之區域的擴展片未充分地被擴張的情形下，導致產生被加工物未被分割之區域。On the other hand, the spread sheet attached to the workpiece also has ductility, and the ductility is suppressed by cooling. If the expansion sheet is expanded in a state where only the expansion sheet in the region to which the workpiece is attached is cooled, and the expansion sheet in the outer region of the workpiece is not cooled, the expansion sheet may be damaged in the workpiece. When the area on the outer peripheral side of the workpiece can be expanded and the expansion sheet of the area to which the workpiece is attached is not sufficiently expanded, a region in which the workpiece is not divided is generated.

據此，本發明的目的在於提供一種可以將在被加工物產生未被分割之區域的可能性抑制得較低之擴展裝置及擴展方法。 用以解決課題之手段 Accordingly, an object of the present invention is to provide an expansion device and an expansion method that can reduce the possibility of occurrence of undivided regions in a workpiece. means of solving problems

根據本發明的一個層面，可提供一種擴展裝置，對貼附有已形成分割起點的被加工物之片材進行擴張來分割被加工物，前述擴展裝置包含：擴張機構，擴張該片材；及冷卻單元，將該片材之未貼附有被加工物的區域冷卻成變得比該片材之貼附有被加工物的區域更低溫。According to one aspect of the present invention, there can be provided an expanding device for expanding the sheet to which the workpiece to which the dividing starting point has been formed is attached to divide the workpiece, the expanding device comprising: an expanding mechanism for expanding the sheet; and The cooling unit cools the region of the sheet to which the object to be processed is not attached to a lower temperature than the region of the sheet to which the object to be processed is attached.

較佳的是，該擴張機構具備：片材夾持單元，具有在第1方向上隔著被加工物而互相相向，且分別夾持該片材之第1夾持部與第2夾持部、及在正交於該第1方向之第2方向上隔著被加工物而互相相向，且分別夾持該片材之第3夾持部與第4夾持部；第1移動單元，使該第1夾持部與該第2夾持部在該第1方向上朝互相遠離之方向移動；及第2移動單元，使該第3夾持部與該第4夾持部在該第2方向上朝互相遠離之方向移動， 該冷卻單元具備：冷卻工作台，具有抵接於已被該片材夾持單元所夾持之該片材之抵接面，且對該片材進行冷卻，該抵接面是由第1區域與第2區域所構成，前述第1區域是和貼附有被加工物之區域對應之區域，前述第2區域是圍繞該第1區域且和在被加工物與該第1、第2、第3、及第4夾持部之間的區域對應之區域，可將該第1區域設定為第1溫度，並將該第2區域設定為比該第1溫度更低溫之第2溫度。 Preferably, the expansion mechanism includes a sheet holding unit having a first holding portion and a second holding portion that face each other across the workpiece in the first direction and hold the sheet, respectively. , and face each other across the workpiece in the second direction orthogonal to the first direction, and respectively clamp the third and fourth clamping parts of the sheet; the first moving unit makes the The first gripping portion and the second gripping portion move in a direction away from each other in the first direction; and a second moving unit makes the third gripping portion and the fourth gripping portion move in the second gripping portion move in the direction away from each other, The cooling unit includes: a cooling table having an abutting surface abutting on the sheet held by the sheet holding unit, and cooling the sheet, the abutting surface being formed by the first area It consists of the second area, the first area is an area corresponding to the area to which the workpiece is attached, and the second area surrounds the first area and is in contact with the workpiece and the first, second, and second areas. 3. In the region corresponding to the region between the fourth clamping portion, the first region can be set to a first temperature, and the second region can be set to a second temperature lower than the first temperature.

根據本發明的另一個層面，可提供一種擴展方法，對貼附有已形成分割起點的被加工物之片材進行擴張來分割被加工物，前述擴展方法包含以下步驟： 片材冷卻步驟，將該片材之未貼附有被加工物的區域冷卻成變得比該片材之貼附有被加工物的區域更低溫；及 分割步驟，在實施該片材冷卻步驟之後，對該片材進行擴展來分割被加工物。 According to another aspect of the present invention, an expansion method can be provided, which divides the workpiece by expanding the sheet attached to the object to be processed that has formed the starting point of division, and the aforementioned expansion method includes the following steps: a sheet cooling step of cooling the area of the sheet to which the workpiece is not attached to a lower temperature than the area of the sheet to which the workpiece is attached; and In the dividing step, after the sheet cooling step is performed, the sheet is expanded to divide the workpiece.

較佳的是，該片材冷卻步驟是藉由使冷卻工作台抵接於該片材來實施， 冷卻工作台具有由第1區域及第2區域所構成之抵接面，前述第1區域是和貼附有被加工物之區域對應之區域，前述第2區域是圍繞該第1區域且和在被加工物與第1、第2、第3、及第4夾持部之間的區域對應之區域，可將該第1區域設定為第1溫度，並將該第2區域設定為比該第1溫度更低溫之第2溫度， 在該分割步驟中，是使在第1方向上隔著被加工物而互相相向且已夾持該片材之第1夾持部與第2夾持部在該第1方向上朝互相遠離之方向移動，並且使在正交於該第1方向之第2方向上隔著被加工物而互相相向且已夾持該片材之第3夾持部與第4夾持部在該第2方向上朝互相遠離之方向移動，藉此對該片材進行擴展。 發明效果 Preferably, the sheet cooling step is performed by abutting the cooling table against the sheet, The cooling table has a contact surface composed of a first area and a second area, the first area is an area corresponding to the area where the workpiece is attached, and the second area surrounds the first area and is in The region corresponding to the region between the workpiece and the first, second, third, and fourth clamping parts, the first region can be set to the first temperature, and the second region can be set to be higher than the first temperature. The 1st temperature is the lower 2nd temperature, In this dividing step, the first clamping portion and the second clamping portion, which face each other across the workpiece in the first direction and have clamped the sheet, are moved away from each other in the first direction. The direction of movement, and in the second direction orthogonal to the first direction, the third clamping part and the fourth clamping part that have clamped the sheet and face each other across the workpiece are in the second direction The sheet is expanded by moving upwards away from each other. Invention effect

本發明會發揮以下之效果：可以將在被加工物產生未被分割之區域的可能性抑制得較低。The present invention has the effect of suppressing the possibility of occurrence of undivided regions in the workpiece to be low.

用以實施發明之形態Form for carrying out the invention

以下，針對本發明的實施形態，一面參照附加圖式一面詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又，在以下所記載之構成要素中，包含所屬技術領域中具有通常知識者可以容易地設想得到的構成要素、實質上相同的構成要素。此外，以下所記載之構成是可適當組合的。又，只要在不脫離本發明之要旨的範圍內，可進行構成的各種省略、置換或變更。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include components that can be easily assumed by those skilled in the art, and components that are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made within a range that does not deviate from the gist of the present invention.

[第1實施形態] 依據圖式來說明本發明的第1實施形態之擴展裝置及擴展方法。圖1是顯示第1實施形態之擴展裝置的的構成例的立體圖。圖2是顯示可藉由圖1所示之擴展裝置而被分割之被加工物的一例的立體圖。圖3是顯示可藉由圖1所示之擴展裝置而被分割之被加工物的其他例的立體圖。圖4是顯示第1實施形態之擴展方法的流程的流程圖。 [1st Embodiment] An expansion apparatus and an expansion method according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the expansion device according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece that can be divided by the expansion device shown in FIG. 1 . FIG. 3 is a perspective view showing another example of a workpiece that can be divided by the expansion device shown in FIG. 1 . FIG. 4 is a flowchart showing the flow of the expansion method according to the first embodiment.

第1實施形態之圖1所示的擴展裝置1是對圖2所示之貼附有被加工物200之片材即擴展片201進行擴張，而將被加工物200分割成一個個的晶片202之裝置。如圖2所示，第1實施形態之擴展裝置1的加工對象即被加工物200是包含以矽、藍寶石、砷化鎵或SiC(碳化矽)等所形成之基板203的圓板狀的半導體晶圓或光器件晶圓等之晶圓。The expansion apparatus 1 shown in FIG. 1 according to the first embodiment expands the expansion sheet 201, which is a sheet to which the workpiece 200 is attached, as shown in FIG. 2, and divides the workpiece 200 into individual wafers 202. device. As shown in FIG. 2 , the workpiece 200 , which is the processing object of the expansion device 1 of the first embodiment, is a disk-shaped semiconductor including a substrate 203 formed of silicon, sapphire, gallium arsenide, or SiC (silicon carbide). Wafers such as wafers or optical device wafers.

如圖2所示，在第1實施形態中，被加工物200在基板203的正面204之以互相交叉的複數條分割預定線205所區劃出的各區域中各自形成有器件206。器件206是例如IC(積體電路，Integrated Circuit)、或LSI(大型積體電路，Large Scale Integration)等的積體電路、CCD(電荷耦合器件，Charge Coupled Device)、或CMOS(互補式金屬氧化物半導體，Complementary Metal Oxide Semiconductor)等之影像感測器。As shown in FIG. 2 , in the first embodiment, a device 206 is formed in each region of the workpiece 200 on the front surface 204 of the substrate 203 demarcated by a plurality of planned dividing lines 205 intersecting with each other. The device 206 is an integrated circuit such as IC (Integrated Circuit), LSI (Large Scale Integration), CCD (Charge Coupled Device), or CMOS (Complementary Metal Oxide) image sensor such as material semiconductor, Complementary Metal Oxide Semiconductor).

被加工物200沿著分割預定線205在基板203的內部形成有分割起點即改質層207(在圖2中以虛線表示)。改質層207意指密度、折射率、機械強度或其他的物理特性變得與周圍的該特性不同之狀態的區域，可為熔融處理區域，裂隙(crack)區域、絕緣破壞區域、折射率變化區域、及混合了這些區域之區域等。在第1實施形態中，改質層207的機械性強度會比基板203的其他部分更低。The workpiece 200 has a modified layer 207 (indicated by a dotted line in FIG. 2 ) formed inside the substrate 203 along the line 205 to be divided. The modified layer 207 means a region in which the density, refractive index, mechanical strength or other physical properties become different from the surrounding state, and may be a melting process region, a crack region, a dielectric breakdown region, a refractive index change region regions, and regions that mix these regions, etc. In the first embodiment, the mechanical strength of the modified layer 207 is lower than that of other parts of the substrate 203 .

又，如圖2所示，在第1實施形態中，被加工物200在基板203的背面208側貼附有已被貼附於擴展片201之DAF(黏晶薄膜，Die Attach Film)209，且在擴展片201的外緣部裝設有環狀框架210，而可藉由擴展片201支撐在環狀框架210的內側的開口211內。被加工物200是在基板203的背面208貼附有DAF209以及擴展片201的狀態下，藉由擴展裝置1而和DAF209一起沿著改質層207被分割成一個個的晶片202。Furthermore, as shown in FIG. 2, in the first embodiment, the workpiece 200 is attached with a DAF (Die Attach Film) 209 attached to the expansion sheet 201 on the back surface 208 side of the substrate 203, An annular frame 210 is mounted on the outer edge of the expansion piece 201 , and can be supported in the opening 211 inside the annular frame 210 by the expansion piece 201 . The workpiece 200 is a wafer 202 which is divided into individual wafers 202 along the modified layer 207 together with the DAF 209 by the expansion device 1 in a state where the DAF 209 and the expansion sheet 201 are attached to the back surface 208 of the substrate 203 .

晶片202具備基板203的一部分、及形成於基板203的正面204之器件206，且可將DAF209的一部分貼附於背面208。DAF209是用於將已從被加工物200被分割成一個個的晶片202固定於基板等之構成。在第1實施形態中，DAF209形成為直徑比被加工物200更大之圓板狀，且已被貼附在基板203的背面208與擴展片201。The wafer 202 includes a part of the substrate 203 and a device 206 formed on the front surface 204 of the substrate 203 , and a part of the DAF 209 can be attached to the back surface 208 . The DAF 209 is a structure for fixing the wafer 202 which has been divided into the individual wafers 202 from the workpiece 200 to a substrate or the like. In the first embodiment, the DAF 209 is formed in a disk shape with a diameter larger than that of the workpiece 200 , and is attached to the back surface 208 of the substrate 203 and the expansion sheet 201 .

擴展片201具有伸縮性，且是例如將已加熱之合成樹脂一邊沿著第1方向212伸長，一邊在相對於第1方向212正交之第2方向213上延伸而成形。擴展片201具備藉由具有伸縮性之合成樹脂所構成之基材層、及積層於基材層且藉由具有伸縮性與黏著性之合成樹脂所構成之黏著層。在第1實施形態中，第1方向212是所謂流程方向(MD：Machine　Direction，縱向方向)，第2方向213是所謂垂直方向(TD: Transverse　Direction，橫向方向)。再者，擴展片201在冷卻後伸縮性會降低，並且伸長性會隨著變成低溫而降低。The expansion sheet 201 has stretchability, and is formed by extending, for example, a heated synthetic resin in the second direction 213 orthogonal to the first direction 212 while extending along the first direction 212 . The expansion sheet 201 includes a base material layer made of a stretchable synthetic resin, and an adhesive layer laminated on the base material layer and made of a stretchable and adhesive synthetic resin. In the first embodiment, the first direction 212 is a so-called flow direction (MD: Machine Direction, vertical direction), and the second direction 213 is a so-called vertical direction (TD: Transverse Direction, lateral direction). Furthermore, the stretchability of the expansion sheet 201 decreases after cooling, and the stretchability decreases as the temperature becomes low.

又，圖1所示之擴展裝置1的加工對象即被加工物200亦可為以下之晶圓：如圖3所示，在基板203的背面208上形成金屬膜214，且於金屬膜214貼附擴展片201，並於擴展片201的外緣部裝設環狀框架210而藉由擴展片201被支撐在環狀框架210的內側的開口211內。圖3所示之被加工物200是在已將擴展片201貼附於基板203的背面208上的金屬膜214的狀態下，藉由擴展裝置1將基板203及金屬膜214沿著改質層207分割成一個個的晶片202。再者，在圖3所示之被加工物200的情況下，晶片202具備基板203的一部分、形成於基板203的正面204之器件206、及已形成於背面208上之金屬膜214的一部分。圖3對和圖2相同的部分會附加相同的符號而省略說明。In addition, the processing object of the expansion device 1 shown in FIG. 1 , that is, the workpiece 200 may be the following wafer: as shown in FIG. The expansion piece 201 is attached, and an annular frame 210 is installed on the outer edge of the expansion piece 201 to be supported in the inner opening 211 of the annular frame 210 by the expansion piece 201 . The workpiece 200 shown in FIG. 3 is in a state where the expansion sheet 201 has been attached to the metal film 214 on the back surface 208 of the substrate 203 , the substrate 203 and the metal film 214 are stretched along the modified layer by the expansion device 1 207 is divided into individual wafers 202 . 3, the wafer 202 includes a part of the substrate 203, the device 206 formed on the front surface 204 of the substrate 203, and a part of the metal film 214 formed on the back surface 208. In FIG. 3 , the same reference numerals are attached to the same parts as those in FIG. 2 , and descriptions thereof are omitted.

圖2所示之被加工物200比沿著分割預定線205形成有改質層207且在背面208未貼附有DAF209之被加工物更難以分割成一個個的晶片202。又，圖3所示之被加工物200比沿著分割預定線205形成有改質層207且在背面208未形成有金屬膜214之被加工物更難以分割成一個個的晶片202。如此，被加工物200代表性的是圖2所示之在背面208貼附有DAF209、或圖3所示之在背面208形成有金屬膜214，而難以分割成晶片202之晶圓。The workpiece 200 shown in FIG. 2 is more difficult to be divided into individual wafers 202 than the workpiece 200 having the modified layer 207 formed along the line 205 to be divided and no DAF 209 attached to the back surface 208 . Furthermore, the workpiece 200 shown in FIG. 3 is more difficult to be divided into individual wafers 202 than the workpiece having the modified layer 207 formed along the line 205 to be divided and the metal film 214 not formed on the back surface 208 . In this way, the workpiece 200 is typically a wafer having a DAF 209 attached to the back surface 208 shown in FIG. 2 or a metal film 214 formed on the back surface 208 shown in FIG.

再者，在第1實施形態中，雖然是將改質層207形成於被加工物200來作為分割起點，但並非受限於改質層207，例如亦可將切削刀片從正面204側切削而形成之切削溝、或對被加工物200具有吸收性之波長的雷射光束從正面204側照射而形成之雷射加工溝，作為分割起點來形成在被加工物200。Furthermore, in the first embodiment, although the modified layer 207 is formed on the workpiece 200 as the starting point of division, it is not limited to the modified layer 207. The formed cutting grooves or the laser processing grooves formed by irradiating the laser beam with a wavelength having absorption to the workpiece 200 from the front surface 204 are formed in the workpiece 200 as the starting point of division.

第1實施形態之擴展裝置1是以下之裝置：對貼附有已形成改質層207的被加工物200之擴展片201進行擴張，而將被加工物200分割成一個個的晶片202，並且將DAF209按一個個的晶片202來分割。如圖1所示，第1實施形態之擴展裝置1具備擴張機構即擴張單元10、冷卻單元20與控制單元30。The expansion apparatus 1 of the first embodiment is an apparatus that expands the expansion sheet 201 to which the workpiece 200 having the modified layer 207 formed thereon is attached, and divides the workpiece 200 into individual wafers 202, and The DAF 209 is divided into individual wafers 202 . As shown in FIG. 1 , the expansion apparatus 1 of the first embodiment includes an expansion unit 10 , a cooling unit 20 , and a control unit 30 as an expansion mechanism.

擴張單元10是對擴展片201進行擴張之單元。擴張單元10具備圓盤狀的基台11、框架保持單元12、擴張圓筒13與升降單元14。The expansion unit 10 is a unit for expanding the expansion sheet 201 . The expansion unit 10 includes a disk-shaped base 11 , a frame holding unit 12 , an expansion cylinder 13 , and an elevating unit 14 .

框架保持單元12是保持環狀框架210之單元。框架保持單元12具有設置於基台11上之圓環狀的框架保持構件15、及配設於框架保持構件15的外緣部之複數個夾具16。框架保持構件15的內徑比環狀框架210的內徑更小且比被加工物200的外徑更大。框架保持構件15的外徑和環狀框架210的外徑同等。框架保持構件15是上表面作為載置環狀框架210的載置面17。載置面17沿著水平方向且是平坦的。夾具16會夾持已載置於載置面17之環狀框架210，而將環狀框架210固定於框架保持構件15。在第1實施形態中，夾具16在圓周方向上等間隔地配置有4個。The frame holding unit 12 is a unit that holds the annular frame 210 . The frame holding unit 12 includes an annular frame holding member 15 provided on the base 11 , and a plurality of clips 16 disposed on the outer edge of the frame holding member 15 . The inner diameter of the frame holding member 15 is smaller than the inner diameter of the annular frame 210 and larger than the outer diameter of the workpiece 200 . The outer diameter of the frame holding member 15 is equal to the outer diameter of the annular frame 210 . The frame holding member 15 has an upper surface serving as a placement surface 17 on which the annular frame 210 is placed. The placement surface 17 is flat along the horizontal direction. The jig 16 clamps the annular frame 210 placed on the placement surface 17 , and fixes the annular frame 210 to the frame holding member 15 . In the first embodiment, four jigs 16 are arranged at equal intervals in the circumferential direction.

擴張圓筒13設置在基台11上且形成為圓筒狀。擴張圓筒13是配置在框架保持構件15的內側且和框架保持構件15成為同軸之位置。擴張圓筒13的內徑及外徑比環狀框架210及框架保持構件15的內徑更小，且比被加工物200的外徑更大。The expansion cylinder 13 is provided on the base 11 and is formed in a cylindrical shape. The expansion cylinder 13 is disposed inside the frame holding member 15 at a position coaxial with the frame holding member 15 . The inner diameter and outer diameter of the expansion cylinder 13 are smaller than the inner diameters of the annular frame 210 and the frame holding member 15 and larger than the outer diameter of the workpiece 200 .

升降單元14是使框架保持單元12與擴張圓筒13沿著鉛直方向相對地移動之單元。在第1實施形態中，升降單元14會讓框架保持單元12涵蓋載置面17位在和擴張圓筒13的上端相同平面上的位置、與載置面17比擴張圓筒13的上端更下方的位置來升降。在第1實施形態中，升降單元14是具備有缸筒18與活塞桿19之氣缸，前述缸筒18安裝於基台11，前述活塞桿19從缸筒18伸縮自如且在上端安裝有框架保持構件15。第1實施形態中，升降單元14是在基台11的圓周方向上隔著間隔而設置有複數個。The elevating unit 14 is a unit that relatively moves the frame holding unit 12 and the expansion cylinder 13 in the vertical direction. In the first embodiment, the elevating unit 14 makes the frame holding unit 12 cover the position where the mounting surface 17 is located on the same plane as the upper end of the expansion cylinder 13 , and the mounting surface 17 is lower than the upper end of the expansion cylinder 13 position to lift. In the first embodiment, the elevating unit 14 is an air cylinder including a cylinder tube 18 and a piston rod 19, the cylinder tube 18 is attached to the base 11, the piston rod 19 is retractable from the cylinder tube 18, and a frame holder is attached to the upper end. member 15. In the first embodiment, a plurality of elevating units 14 are provided at intervals in the circumferential direction of the base 11 .

冷卻單元20是以如下的方式來將擴展片201冷卻之單元：讓貼附於已保持在框架保持單元12的環狀框架210上之擴展片201的未貼附有被加工物200之區域即環狀框架210的內緣與被加工物200的外緣之間的區域215(顯示於圖2及圖3)，變得比擴展片201的貼附有被加工物200之區域即比被加工物200的外緣更內側的區域216(顯示於圖2及圖3)更低溫。在第1實施形態中，冷卻單元20是形成為外徑和框架保持構件15的內徑同等的圓盤狀。在第1實施形態中，已在擴張圓筒13及框架保持構件15的上方，將冷卻單元20配置在和擴張圓筒13及框架保持構件15成為同軸之位置。The cooling unit 20 is a unit for cooling the expansion sheet 201 as follows: the area of the expansion sheet 201 that is attached to the annular frame 210 held by the frame holding unit 12 to which the workpiece 200 is not attached is The region 215 (shown in FIGS. 2 and 3 ) between the inner edge of the annular frame 210 and the outer edge of the workpiece 200 is smaller than the region of the expansion sheet 201 to which the workpiece 200 is attached, that is, the region 215 to be processed. Regions 216 (shown in FIGS. 2 and 3 ) that are more inward of the outer edge of object 200 are cooler. In the first embodiment, the cooling unit 20 is formed in a disk shape having the same outer diameter as the inner diameter of the frame holding member 15 . In the first embodiment, the cooling unit 20 has been disposed above the expansion cylinder 13 and the frame holding member 15 at a position coaxial with the expansion cylinder 13 and the frame holding member 15 .

冷卻單元20具備：第1冷卻空氣噴出孔21，和貼附於已保持在框架保持單元12的環狀框架210上之擴展片201的比被加工物200的外緣更內側的區域216即已貼附於擴展片201之被加工物200沿著鉛直方向相面對；及第2冷卻空氣噴出孔22，和貼附於已保持在框架保持單元12的環狀框架210上之擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215沿著鉛直方向相面對。第1冷卻空氣噴出孔21與第2冷卻空氣噴出孔22各自設置有複數個。The cooling unit 20 includes a first cooling air ejection hole 21 and a region 216 of the expansion piece 201 which is attached to the annular frame 210 of the frame holding unit 12 and which is located on the inner side of the outer edge of the workpiece 200 . The workpiece 200 attached to the expansion sheet 201 faces in the vertical direction; and the second cooling air ejection hole 22 and the expansion sheet 201 attached to the annular frame 210 of the frame holding unit 12 A region 215 between the inner edge of the annular frame 210 and the outer edge of the workpiece 200 faces in the vertical direction. Each of the first cooling air ejection holes 21 and the second cooling air ejection holes 22 is provided in plural.

第1冷卻空氣噴出孔21是將比常溫更低溫的第1溫度(在第1實施形態中是例如-5℃)之冷卻空氣23(在圖5中以箭頭表示)朝向貼附於已保持在框架保持單元12的環狀框架210上之擴展片201的比被加工物200的外緣更內側的區域216，亦即貼附於擴展片201之被加工物200噴射。第1冷卻空氣噴出孔21是隔著被加工物200將擴展片201的比被加工物200的外緣更內側的區域216冷卻至第1溫度。The first cooling air ejection holes 21 are formed by affixing the cooling air 23 (indicated by arrows in FIG. 5 ) of a first temperature (for example, −5° C. in the first embodiment) lower than normal temperature toward the already maintained The region 216 of the expansion sheet 201 on the annular frame 210 of the frame holding unit 12 is more inward than the outer edge of the workpiece 200 , that is, the workpiece 200 attached to the expansion sheet 201 is sprayed. The first cooling air ejection hole 21 cools the region 216 of the expansion sheet 201 inside the outer edge of the workpiece 200 to the first temperature through the workpiece 200 .

第2冷卻空氣噴出孔22會將比常溫及第1溫度更低溫的第2溫度(在第1實施形態中是例如-10℃)之冷卻空氣24(在圖5中以箭頭表示)朝向貼附於已保持在框架保持單元12的環狀框架210上之擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215噴射。第2冷卻空氣噴出孔22會將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215冷卻至第2溫度。The second cooling air ejection holes 22 direct the cooling air 24 (indicated by arrows in FIG. 5 ) of a second temperature (for example, −10° C. in the first embodiment) lower than the normal temperature and the first temperature toward the The injection is carried out in the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 held on the annular frame 210 of the frame holding unit 12 . The second cooling air ejection hole 22 cools the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 to the second temperature.

控制單元30是分別控制擴展裝置1的各構成要素，並使擴展裝置1實施將擴展片201擴張的擴張動作之單元。再者，控制單元30是具有運算處理裝置、記憶裝置及輸入輸出介面裝置的電腦，前述運算處理裝置具有CPU(中央處理單元，central processing unit)之類的微處理器，前述記憶裝置具有ROM(唯讀記憶體，read only memory)或RAM(隨機存取記憶體，random access memory)之類的記憶體。控制單元30的運算處理裝置會依照已記憶於記憶裝置之電腦程式實施運算處理，並透過輸入輸出介面裝置將用於控制擴展裝置1之控制訊號輸出到擴展裝置1的各構成要素。The control unit 30 is a unit that controls each component of the expansion device 1 and causes the expansion device 1 to perform the expansion operation of expanding the expansion sheet 201 . Furthermore, the control unit 30 is a computer with an arithmetic processing device, a memory device, and an input/output interface device. The arithmetic processing device has a microprocessor such as a CPU (central processing unit), and the memory device has a ROM ( Read-only memory, read only memory) or RAM (random access memory, random access memory). The arithmetic processing device of the control unit 30 performs arithmetic processing according to the computer program stored in the memory device, and outputs control signals for controlling the expansion device 1 to each component of the expansion device 1 through the input/output interface device.

又，控制單元30已連接於未圖示之顯示單元及未圖示之輸入單元，前述顯示單元是藉由顯示加工動作之狀態或圖像等的液晶顯示裝置等所構成，前述輸入單元是在操作人員登錄加工內容資訊等之時使用。輸入單元是藉由設置於顯示單元的觸控面板、與鍵盤等之外部輸入裝置當中至少一種所構成。In addition, the control unit 30 is connected to a display unit (not shown) and an input unit (not shown), the display unit is constituted by a liquid crystal display device or the like that displays the state of the processing operation, images, etc., and the input unit is in the It is used when the operator logs in the processing content information, etc. The input unit is formed by at least one of external input devices such as a touch panel provided on the display unit and a keyboard.

接著，說明第1實施形態之擴展方法。第1實施形態之擴展方法是對貼附有已形成改質層207的被加工物200之擴展片201進行擴張，而將被加工物200分割成一個個的晶片202之方法。第1實施形態之擴展方法是藉由控制單元30控制擴展裝置1的各構成要素來實施，且如圖4所示，具備保持步驟1001、片材冷卻步驟1002與分割步驟1003。Next, the expansion method of the first embodiment will be described. The expansion method of the first embodiment is a method of dividing the workpiece 200 into individual wafers 202 by expanding the expansion sheet 201 to which the modified layer 207 has been attached to the workpiece 200 . The spreading method of the first embodiment is implemented by the control unit 30 controlling each component of the spreading apparatus 1, and as shown in FIG.

(保持步驟) 保持步驟1001是以擴展裝置1的框架保持單元12保持貼附有被加工物200之擴展片201的外緣部、與已貼附於擴展片201的外緣部之環狀框架210的步驟。在保持步驟1001中，擴展裝置1會將升降單元14的活塞桿19伸長而將框架保持構件15的載置面17與擴張圓筒13的上端配置在同一平面上。 (hold step) The holding step 1001 is a step in which the frame holding unit 12 of the expanding apparatus 1 holds the outer edge of the expansion piece 201 to which the workpiece 200 is attached, and the annular frame 210 attached to the outer edge of the expansion piece 201 . In the holding step 1001 , the expansion apparatus 1 extends the piston rod 19 of the elevating unit 14 to arrange the mounting surface 17 of the frame holding member 15 and the upper end of the expansion cylinder 13 on the same plane.

在保持步驟1001中，擴展裝置1會將已貼附於擴展片201之環狀框架210及擴展片201的外緣部載置在框架保持構件15的載置面17上。在保持步驟1001中，擴展裝置1會以夾具16將已貼附於擴展片201之環狀框架210及擴展片201的外緣部夾持在框架保持構件15的載置面17上，來固定於框架保持構件15。此時，擴張圓筒13的上端會抵接於已貼附在被框架保持單元12所保持之環狀框架210上之擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215。In the holding step 1001 , the expansion device 1 places the annular frame 210 attached to the expansion piece 201 and the outer edge of the expansion piece 201 on the mounting surface 17 of the frame holding member 15 . In the holding step 1001 , the expansion device 1 clamps the annular frame 210 attached to the expansion piece 201 and the outer edge of the expansion piece 201 on the mounting surface 17 of the frame holding member 15 with the clamp 16 for fixing to the frame holding member 15 . At this time, the upper end of the expansion cylinder 13 abuts the inner edge of the annular frame 210 of the expansion piece 201 that has been attached to the annular frame 210 held by the frame holding unit 12 and the outer edge of the workpiece 200 area 215 in between.

(片材冷卻步驟) 圖5是示意地顯示圖4所示之擴展方法的片材冷卻步驟的剖面圖。片材冷卻步驟1002是將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215冷卻成變得比擴展片201的比被加工物200的外緣更內側的區域216更低溫之步驟。 (sheet cooling step) FIG. 5 is a cross-sectional view schematically showing a sheet cooling step of the expansion method shown in FIG. 4 . The sheet cooling step 1002 is to cool the region 215 between the inner edge of the annular frame 210 of the expansion sheet 201 and the outer edge of the workpiece 200 to be more inside than the outer edge of the workpiece 200 of the expansion sheet 201 region 216 of the lower temperature step.

在第1實施形態中，在片材冷卻步驟1002中，擴展裝置1是如圖5所示，冷卻單元20從第1冷卻空氣噴出孔21將第1溫度的冷卻空氣23朝向已貼附在被框架保持單元12所保持之環狀框架210上之擴展片201的比被加工物200的外緣更內側的區域216亦即貼附在擴展片201之被加工物200噴射預定時間。在第1實施形態中，在片材冷卻步驟1002中，擴展裝置1是隔著被加工物200將擴展片201的比被加工物200的外緣更內側的區域216冷卻至第1溫度。In the first embodiment, in the sheet cooling step 1002, as shown in FIG. 5, the expansion device 1 is configured such that the cooling unit 20 directs the cooling air 23 of the first temperature from the first cooling air ejection holes 21 toward the surface already attached to the substrate. The region 216 of the expansion sheet 201 on the annular frame 210 held by the frame holding unit 12 is more inward than the outer edge of the workpiece 200 , that is, the workpiece 200 attached to the expansion sheet 201 is sprayed for a predetermined time. In the first embodiment, in the sheet cooling step 1002 , the expanding device 1 cools the region 216 of the expanding sheet 201 inside the outer edge of the workpiece 200 to the first temperature through the workpiece 200 .

又，在第1實施形態中，在片材冷卻步驟1002中，擴展裝置1是如圖5所示，冷卻單元20會和來自第1冷卻空氣噴出孔21之冷卻空氣23的噴射同時地從第2冷卻空氣噴出孔22將第2溫度的冷卻空氣24朝向已貼附在被框架保持單元12所保持之環狀框架210上之擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215噴射預定時間。在第1實施形態中，在片材冷卻步驟1002中，擴展裝置1會將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215冷卻至比第1溫度更低溫之第2溫度。如此一來，因為第2溫度比第1溫度更低溫，所以擴展片201為：比被加工物200的外緣更內側的區域216變得比環狀框架210的內緣與被加工物200的外緣之間的區域215更容易擴張。Further, in the first embodiment, in the sheet cooling step 1002, the expansion device 1 is configured such that the cooling unit 20 simultaneously sprays the cooling air 23 from the first cooling air ejection holes 21 from the first cooling air ejection hole 21 as shown in FIG. 5 . 2. The cooling air ejection hole 22 directs the cooling air 24 of the second temperature toward the inner edge of the annular frame 210 of the expansion piece 201 that has been attached to the annular frame 210 held by the frame holding unit 12 and the workpiece 200. The area 215 between the outer edges is sprayed for a predetermined time. In the first embodiment, in the sheet cooling step 1002, the expansion device 1 cools the region 215 between the inner edge of the annular frame 210 of the expansion sheet 201 and the outer edge of the workpiece 200 to a temperature lower than the first temperature The lower second temperature. In this way, since the second temperature is lower than the first temperature, the expansion sheet 201 is such that the region 216 inside the outer edge of the workpiece 200 becomes smaller than the distance between the inner edge of the annular frame 210 and the workpiece 200 . The region 215 between the outer edges expands more easily.

(分割步驟) 圖6是示意地顯示圖4所示之擴展方法的分割步驟的剖面圖。分割步驟1003是在實施片材冷卻步驟1002後，對擴展片201進行擴展，而將被加工物200分割成一個個的晶片202之步驟。在第1實施形態中，在分割步驟1003中，擴展裝置1會停止來自冷卻單元20之冷卻空氣23、24的噴射，並如圖6所示，將升降單元14的活塞桿19縮小，使框架保持單元12下降，而使框架保持單元12與擴張圓筒13在鉛直方向上相對地移動。 (split step) FIG. 6 is a cross-sectional view schematically showing a dividing step of the expansion method shown in FIG. 4 . The dividing step 1003 is a step of dividing the workpiece 200 into individual wafers 202 by expanding the expansion sheet 201 after the sheet cooling step 1002 is performed. In the first embodiment, in the dividing step 1003, the expansion device 1 stops the injection of the cooling air 23, 24 from the cooling unit 20, and, as shown in FIG. When the holding unit 12 descends, the frame holding unit 12 and the expansion cylinder 13 are moved relatively in the vertical direction.

如此一來，因為已貼附在被框架保持單元12所保持之環狀框架210上的擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215已接觸於擴張圓筒13的上端，所以可將擴展片201朝面方向擴張。在分割步驟1003中，擴張的結果，放射狀的拉伸力會作用於擴展片201。In this way, since the area 215 between the inner edge of the annular frame 210 of the expansion piece 201 that has been attached to the annular frame 210 held by the frame holding unit 12 and the outer edge of the workpiece 200 has come into contact with Since the upper end of the cylinder 13 is expanded, the expansion sheet 201 can be expanded toward the surface. In the dividing step 1003 , as a result of the expansion, a radial tensile force acts on the expansion sheet 201 .

當拉伸力像這樣地呈放射狀地作用於隔著DAF209貼附於被加工物200的基板203的背面208側之擴展片201時，因為第2溫度比第1溫度更低溫，所以擴展片201的比被加工物200的外緣更內側的區域216會比擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215更被擴張。在第1實施形態中，在分割步驟1003中，如圖6所示，被加工物200因為形成有沿著分割預定線205之改質層207，所以會以改質層207作為斷裂起點而按一個個的器件206被分割，且按一個個的晶片202被個體化，並且因為被加工物200沿著改質層207斷裂，所以DAF209也會沿著改質層207斷裂。When the tensile force acts radially on the expansion sheet 201 attached to the back surface 208 side of the substrate 203 of the workpiece 200 via the DAF 209, the second temperature is lower than the first temperature, so the expansion sheet The region 216 of the 201 which is further inward than the outer edge of the workpiece 200 is expanded more than the region 215 between the inner edge of the annular frame 210 of the expansion sheet 201 and the outer edge of the workpiece 200 . In the first embodiment, in the dividing step 1003, as shown in FIG. 6, since the modified layer 207 along the line 205 to be divided is formed on the workpiece 200, the modified layer 207 is used as the starting point of fracture The individual devices 206 are divided and individualized for each wafer 202 , and since the workpiece 200 is fractured along the modified layer 207 , the DAF 209 is also fractured along the modified layer 207 .

再者，在第1實施形態中，雖然在分割步驟1003中使框架保持單元12下降來將擴展片201擴張，但本發明並非限定於此，亦可使擴張圓筒13上升，簡而言之，只要使擴張圓筒13相對於框架保持單元12相對地上升，且使框架保持單元12相對於擴張圓筒13相對地下降即可。如此進行，第1實施形態會在分割步驟1003中對擴展片201進行擴張而將被加工物200分割成一個個的晶片202。In addition, in the first embodiment, in the dividing step 1003, the frame holding unit 12 is lowered to expand the expansion piece 201, but the present invention is not limited to this, and the expansion cylinder 13 may be raised, in short , the expansion cylinder 13 may be relatively raised relative to the frame holding unit 12 , and the frame holding unit 12 may be relatively lowered relative to the expansion cylinder 13 . In this way, in the first embodiment, the expansion sheet 201 is expanded in the dividing step 1003 to divide the workpiece 200 into individual wafers 202 .

如以上所說明，第1實施形態之擴展裝置1具備有冷卻單元20，前述冷卻單元20是將擴展片201的比被加工物200的外緣更內側的區域216冷卻至第1溫度，並且將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215冷卻至比第1溫度更低溫之第2溫度。因此，第1實施形態之擴展裝置1可以將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215，以比擴展片201的比被加工物200的外緣更內側的區域216更低溫來冷卻，而可以在將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215之伸縮性，相較於比被加工物200的外緣更內側的區域216更加抑制的狀態下，來對擴展片201進行擴展。As described above, the expanding apparatus 1 according to the first embodiment includes the cooling unit 20 that cools the region 216 of the expanding sheet 201 inward from the outer edge of the workpiece 200 to the first temperature and cools the The region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 is cooled to a second temperature that is lower than the first temperature. Therefore, in the expansion device 1 of the first embodiment, the area 215 between the inner edge of the annular frame 210 of the expansion sheet 201 and the outer edge of the workpiece 200 can be set to a ratio of the expansion sheet 201 to the outer edge of the workpiece 200 The inner edge of the region 216 is cooled at a lower temperature, and the flexibility of the region 215 between the inner edge of the annular frame 210 of the expansion sheet 201 and the outer edge of the workpiece 200 can be compared with that of the workpiece. The expansion sheet 201 is expanded in a state where the region 216 on the inner side of the outer edge of the 200 is more restrained.

其結果，第1實施形態之擴展裝置1會發揮以下效果：可以將擴展片201的比被加工物200的外緣更內側的區域216充分地擴張，而可以將在被加工物200產生未被分割之區域的可能性抑制得較低。As a result, the expansion device 1 of the first embodiment can sufficiently expand the region 216 of the expansion sheet 201 that is inward of the outer edge of the workpiece 200 , and can reduce the occurrence of unintended defects in the workpiece 200 . The probability of segmented regions is suppressed lower.

又，第1實施形態之擴展方法，由於實施將擴展片201的比被加工物200的外緣更內側的區域216冷卻至第1溫度，並且將擴展片201的環狀框架210的內緣與被加工物200的外緣之間的區域215冷卻至比第1溫度更低溫之第2溫度之片材冷卻步驟1002，因此會發揮以下效果：可以將擴展片201的比被加工物200的外緣更內側的區域216充分地擴張，而可以將在被加工物200產生未被分割之區域的可能性抑制得較低。Furthermore, in the expanding method of the first embodiment, the area 216 of the expanding sheet 201 that is inward of the outer edge of the workpiece 200 is cooled to the first temperature, and the inner edge of the annular frame 210 of the expanding sheet 201 is In the sheet cooling step 1002 in which the region 215 between the outer edges of the workpiece 200 is cooled to a second temperature that is lower than the first temperature, the following effect is achieved: The region 216 on the inner side of the edge is sufficiently expanded, and the possibility of generating an undivided region in the workpiece 200 can be suppressed to a low level.

[第2實施形態] 依據圖式來說明本發明的第2實施形態之擴展裝置及擴展方法。圖7是顯示第2實施形態之擴展裝置的構成例的立體圖。圖8是顯示圖7所示之擴展裝置的片材夾持單元與冷卻工作台的平面圖。圖9是顯示圖7所示之擴展裝置的冷卻工作台的構成的剖面圖。圖10是示意地顯示第2實施形態之擴展方法的冷卻步驟的剖面圖。圖11是示意地顯示第2實施形態之擴展方法的分割步驟的擴展片擴張前之狀態的剖面圖。圖12是示意地顯示第2實施形態之擴展方法的分割步驟的已將擴展片擴張之狀態的剖面圖。圖13是示意地顯示第2實施形態之擴展方法的分割步驟後的冷卻工作台的剖面圖。再者，圖7至圖13對和第1實施形態相同的部分會附加相同的符號而省略說明。 [Second Embodiment] An expansion apparatus and an expansion method according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a perspective view showing a configuration example of an expansion device according to the second embodiment. FIG. 8 is a plan view showing a sheet clamping unit and a cooling table of the expansion device shown in FIG. 7 . FIG. 9 is a cross-sectional view showing the configuration of a cooling stage of the expansion device shown in FIG. 7 . FIG. 10 is a cross-sectional view schematically showing a cooling step in the expansion method of the second embodiment. 11 is a cross-sectional view schematically showing a state before expansion of the expansion sheet in the dividing step of the expansion method of the second embodiment. 12 is a cross-sectional view schematically showing a state in which the expansion sheet has been expanded in the dividing step of the expansion method of the second embodiment. FIG. 13 is a cross-sectional view schematically showing a cooling stage after the dividing step of the expansion method of the second embodiment. 7 to 13, the same reference numerals are attached to the same parts as those of the first embodiment, and descriptions thereof will be omitted.

第2實施形態之擴展裝置1-2是以下之裝置：將貼附有被加工物200之擴展片201朝第1方向212與第2方向213擴張，來將被加工物200分割成一個個的晶片202，並且將DAF209按一個個的晶片202來分割。又，擴展裝置1-2亦可為以下之裝置：於對擴展片201進行擴展而將被加工物200分割成一個個的晶片202後，再將環狀框架210貼附於擴展片201，來將被加工物200支撐於環狀框架210的開口211內。The expanding device 1-2 according to the second embodiment is a device for dividing the workpiece 200 into individual pieces by expanding the expanding sheet 201 to which the workpiece 200 is attached in the first direction 212 and the second direction 213. The wafers 202 are separated, and the DAF 209 is divided into individual wafers 202 . In addition, the expansion device 1-2 may also be a device that expands the expansion sheet 201 to divide the workpiece 200 into individual wafers 202, and then attaches the annular frame 210 to the expansion sheet 201 to The workpiece 200 is supported in the opening 211 of the annular frame 210 .

如圖7所示，擴展裝置1-2具備平板狀的固定基台31、冷卻單元40、未圖示之工件搬送單元、擴張機構即擴張單元60、未圖示之框架搬送單元、未圖示之片材切斷單元與控制單元100。As shown in FIG. 7 , the expansion device 1-2 includes a flat fixed base 31, a cooling unit 40, a workpiece conveying unit (not shown), an expansion unit 60 that is an expansion mechanism, a frame conveying unit (not shown), and a not shown frame conveying unit. The sheet cutting unit and the control unit 100.

冷卻單元40具備設置於固定基台31的中央之冷卻工作台41。如圖8所示，冷卻工作台41將平面形狀形成為四角形(在第2實施形態中為正方形)，並在上表面即抵接面42上載置被擴張單元60的片材夾持單元61所夾持且貼附有DAF209之擴展片201。亦即，冷卻工作台41具有抵接面42，前述抵接面42抵接於已被片材夾持單元61所夾持之擴展片201。冷卻工作台41是藉由移動機構而在鉛直方向上移動自如地設置。抵接面42是沿著水平方向平坦地形成，且可隔著擴展片201來載置被加工物200。抵接面42會隔著擴展片201來載置被加工物200。The cooling unit 40 includes a cooling table 41 provided in the center of the fixed base 31 . As shown in FIG. 8 , the cooling table 41 has a quadrangular planar shape (square in the second embodiment), and the upper surface, ie, the contact surface 42 , is placed on the sheet holding unit 61 of the expansion unit 60 . The expansion sheet 201 of the DAF209 is clamped and attached. That is, the cooling table 41 has the abutment surface 42 , and the abutment surface 42 abuts against the expansion piece 201 which has been clamped by the sheet clamping unit 61 . The cooling table 41 is installed movably in the vertical direction by a moving mechanism. The contact surface 42 is formed flat along the horizontal direction, and the workpiece 200 can be placed via the expansion sheet 201 . On the contact surface 42 , the workpiece 200 is placed with the expansion sheet 201 interposed therebetween.

又，在第2實施形態中，如圖8及圖9所示，冷卻工作台41的抵接面42是由第1區域43與第2區域44所構成，前述第1區域43和已被片材夾持單元61所夾持之擴展片201的貼附有被加工物200之區域對應，前述第2區域44圍繞第1區域43，且和已被片材夾持單元61所夾持之擴展片201的被加工物200與擴張單元60的片材夾持單元61的第1夾持部62-1、第2夾持部62-2、第3夾持部62-3以及第4夾持部62-4之間的區域對應。Moreover, in the second embodiment, as shown in FIGS. 8 and 9 , the contact surface 42 of the cooling table 41 is constituted by a first area 43 and a second area 44, and the first area 43 and the already-quilted sheet are formed. The expansion sheet 201 held by the sheet holding unit 61 corresponds to the area to which the workpiece 200 is attached. The second area 44 surrounds the first area 43 and is the same as the expansion sheet held by the sheet holding unit 61. The workpiece 200 of the sheet 201 and the first gripping portion 62-1, the second gripping portion 62-2, the third gripping portion 62-3, and the fourth gripping portion 62-1 of the sheet gripping unit 61 of the expansion unit 60 The regions between sections 62-4 correspond.

第1區域43是已被片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217(顯示於圖8)所重疊之區域，且在第2實施形態中是設置於抵接面42的中央，平面形狀形成為四角形(在第2實施形態中為正方形)。再者，已被片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217相當於擴展片201的貼附有被加工物200的區域。The first area 43 is an area where the area 217 (shown in FIG. 8 ) of the expansion sheet 201 held by the sheet holding unit 61 to be attached to the workpiece 200 overlaps, and in the second embodiment is It is provided in the center of the contact surface 42, and the planar shape is formed in a quadrangle (square in the second embodiment). In addition, the region 217 of the expansion sheet 201 held by the sheet clamping unit 61 to which the workpiece 200 is attached corresponds to the region of the expansion sheet 201 to which the workpiece 200 is attached.

第2區域44是區域218(顯示於圖8)所重疊之區域，且在第2實施形態中是設置於抵接面42的外緣部，並形成為內外緣為四角形(在第2實施形態中為正方形)的框狀，前述區域218是已被片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217與片材夾持單元61的第1夾持部62-1、第2夾持部62-2、第3夾持部62-3以及第4夾持部62-4之間的區域。再者，已被片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217與片材夾持單元61的第1夾持部62-1、第2夾持部62-2、第3夾持部62-3以及第4夾持部62-4之間的區域218是擴展片201之未貼附有被加工物200的區域。The second area 44 is an area where the area 218 (shown in FIG. 8 ) overlaps, and is provided on the outer edge of the contact surface 42 in the second embodiment, and is formed so that the inner and outer edges are quadrangular (in the second embodiment) The above-mentioned area 218 is the area 217 of the expansion sheet 201 that has been clamped by the sheet clamping unit 61 to which the workpiece 200 is attached and the first clamping of the sheet clamping unit 61 The area between the part 62-1, the 2nd clamping part 62-2, the 3rd clamping part 62-3, and the 4th clamping part 62-4. Furthermore, the region 217 of the expansion sheet 201 held by the sheet holding unit 61 to which the workpiece 200 is attached is held by the first holding portions 62 - 1 and the second holding portions 62 - 1 of the sheet holding unit 61 . The region 218 between the portion 62-2, the third holding portion 62-3, and the fourth holding portion 62-4 is a region of the expansion sheet 201 to which the workpiece 200 is not attached.

又，如圖9所示，冷卻工作台41具備工作台基台45、配置在工作台基台45上之第1帕耳帖元件層46-1、配置在工作台基台45上且圍繞第1帕耳帖元件層46-1的外緣之第2帕耳帖元件層46-2、與配置在帕耳帖元件層46-1、46-2上的冷卻板47。工作台基台45與冷卻板47的平面形狀會和冷卻工作台41的平面形狀相等。冷卻板47的上表面為前述之抵接面42。9 , the cooling stage 41 includes a stage base 45, a first Peltier element layer 46-1 arranged on the stage base 45, and a first Peltier element layer 46-1 arranged on the stage base 45 and surrounding the first Peltier element layer 46-1. The second Peltier element layer 46-2 at the outer edge of the first Peltier element layer 46-1, and the cooling plate 47 arranged on the Peltier element layers 46-1 and 46-2. The planar shape of the stage base 45 and the cooling plate 47 is equal to the planar shape of the cooling stage 41 . The upper surface of the cooling plate 47 is the aforementioned contact surface 42 .

第1帕耳帖元件層46-1、及第2帕耳帖元件層46-2具備有至少1個以上的帕耳帖元件，前述帕耳帖元件是由電源電路48供給電力。第1帕耳帖元件層46-1配置在抵接面42的第1區域43的下方，第2帕耳帖元件層46-2配置在抵接面42的第2區域44的下方。The first Peltier element layer 46 - 1 and the second Peltier element layer 46 - 2 include at least one or more Peltier elements, which are supplied with power from the power supply circuit 48 . The first Peltier element layer 46 - 1 is arranged below the first region 43 of the contact surface 42 , and the second Peltier element layer 46 - 2 is arranged below the second region 44 of the contact surface 42 .

電源電路48各自具備一對極性切換部49-1、49-2。極性切換部49-1、49-2具備直流電源50與開關51，電源電路48若將一邊的極性切換部49-1的直流電源50的電力供給到帕耳帖元件層46-1、46-2時，會將抵接面42亦即區域43、44冷卻到比常溫更低溫，而將另一邊的極性切換部49-2的直流電源50的電力供給到帕耳帖元件層46-1、46-2時，會將抵接面42即區域43、44加熱到比常溫更高溫。The power supply circuits 48 each include a pair of polarity switching units 49-1 and 49-2. The polarity switching sections 49-1 and 49-2 include a DC power supply 50 and a switch 51, and the power supply circuit 48 supplies the power of the DC power supply 50 of the polarity switching section 49-1 on one side to the Peltier element layers 46-1 and 46- 2, the contact surface 42, that is, the regions 43, 44, is cooled to a lower temperature than the normal temperature, and the power of the DC power supply 50 of the polarity switching portion 49-2 on the other side is supplied to the Peltier element layers 46-1, 46-2, the contact surface 42, that is, the regions 43 and 44, is heated to a higher temperature than normal temperature.

對第1帕耳帖元件層46-1供給電力之電源電路48的一邊的極性切換部49-1會對第1帕耳帖元件層46-1供給第1電壓之電力，而將第1區域43冷卻至第1溫度。對第2帕耳帖元件層46-2供給電力之電源電路48的一邊的極性切換部49-1會對第2帕耳帖元件層46-2供給比第1電壓更高的第2電壓之電力，而將第2區域44冷卻至第2溫度。如此進行，而將冷卻工作台41的抵接面42的第1區域43設定為第1溫度，並將第2區域44設定為比第1溫度更低溫之第2溫度。The polarity switching section 49-1 on one side of the power supply circuit 48 that supplies electric power to the first Peltier element layer 46-1 supplies electric power of the first voltage to the first Peltier element layer 46-1, and the first region 43 Cool to first temperature. The polarity switching unit 49-1 on one side of the power supply circuit 48 that supplies power to the second Peltier element layer 46-2 supplies a second voltage higher than the first voltage to the second Peltier element layer 46-2. Electric power is used to cool the second region 44 to the second temperature. In this way, the first region 43 of the contact surface 42 of the cooling table 41 is set to the first temperature, and the second region 44 is set to the second temperature lower than the first temperature.

被加工物搬送單元配置在片材夾持單元61的上方，且在下表面保持被加工物200。被加工物搬送單元藉由升降單元而在鉛直方向上移動自如地設置，並且藉由水平方向移動單元而在水平方向上移動自如地設置。被加工物搬送單元藉由水平方向移動單元而將已保持在下表面之被加工物200定位到和冷卻工作台41的第1區域43在鉛直方向上相面對之位置。又，被加工物搬送單元藉由升降單元而下降，藉此將被加工物200貼附到已被片材夾持單元61所夾持之擴展片201上的DAF209。The workpiece conveying unit is arranged above the sheet clamping unit 61 and holds the workpiece 200 on the lower surface. The workpiece conveying unit is installed movably in the vertical direction by the elevating unit, and is installed movably in the horizontal direction by the horizontal direction moving unit. The workpiece conveying unit positions the workpiece 200 held on the lower surface to a position facing the first region 43 of the cooling table 41 in the vertical direction by moving the unit in the horizontal direction. In addition, the workpiece conveying unit is lowered by the elevating unit, whereby the workpiece 200 is attached to the DAF 209 on the expansion sheet 201 held by the sheet holding unit 61 .

擴張單元60具備夾持擴展片201之片材夾持單元61、與移動單元70。The expansion unit 60 includes a sheet clamping unit 61 that clamps the expansion sheet 201 , and a moving unit 70 .

片材夾持單元61具有第1夾持部62-1、第2夾持部62-2、第3夾持部62-3與第4夾持部62-4。第1夾持部62-1、第2夾持部62-2、第3夾持部62-3以及第4夾持部62-4是夾持貼附有被加工物200之擴展片201的被加工物200的外周側之構成。The sheet clamping unit 61 has a first clamping part 62-1, a second clamping part 62-2, a third clamping part 62-3, and a fourth clamping part 62-4. The first gripping portion 62-1, the second gripping portion 62-2, the third gripping portion 62-3, and the fourth gripping portion 62-4 grip the expansion piece 201 to which the workpiece 200 is attached. The configuration of the outer peripheral side of the workpiece 200 .

第1夾持部62-1與第2夾持部62-2是在擴展片201的第1方向212上隔著被加工物200而互相相向。第3夾持部62-3與第4夾持部62-4是在擴展片201的第2方向213上隔著被加工物200而互相相向。第1夾持部62-1、第2夾持部62-2、第3夾持部62-3以及第4夾持部62-4由於彼此的構成大致相等，因此對相同部分會附加相同符號來說明。The first holding portion 62 - 1 and the second holding portion 62 - 2 face each other across the workpiece 200 in the first direction 212 of the expansion piece 201 . The third holding portion 62 - 3 and the fourth holding portion 62 - 4 face each other across the workpiece 200 in the second direction 213 of the expansion piece 201 . The first gripping portion 62-1, the second gripping portion 62-2, the third gripping portion 62-3, and the fourth gripping portion 62-4 have substantially the same configuration, and therefore the same reference numerals are assigned to the same portions. to explain.

第1夾持部62-1、第2夾持部62-2、第3夾持部62-3以及第4夾持部62-4具備設置在固定基台31上之柱狀的移動基台63、在移動基台63上朝鉛直方向移動自如地設置的一對夾持構件64、及使一對夾持構件64朝互相接近之方向以及互相分開之方向移動的移動機構65。The first holding part 62 - 1 , the second holding part 62 - 2 , the third holding part 62 - 3 , and the fourth holding part 62 - 4 include a columnar movable base provided on the fixed base 31 63. A pair of clamping members 64 provided on the movable base 63 so as to be movable in the vertical direction, and a moving mechanism 65 for moving the pair of clamping members 64 in the directions of approaching and separating from each other.

移動機構65設置於移動基台63。移動機構65具備使一對夾持構件64在鉛直方向上移動自如之馬達、藉由馬達而繞著軸心旋轉之滾珠螺桿、及螺合於滾珠螺桿且透過支撐臂66來和一對夾持構件64連結之螺帽。移動機構65藉由馬達使滾珠螺桿繞著軸心旋轉，而使螺帽、支撐臂66以及夾持構件64在鉛直方向上移動。The moving mechanism 65 is provided on the moving base 63 . The moving mechanism 65 includes a motor for moving the pair of clamping members 64 in the vertical direction, a ball screw rotated around the axis by the motor, and a pair of clamping members screwed to the ball screw through a support arm 66 . The nut to which the member 64 is connected. The moving mechanism 65 moves the nut, the support arm 66 and the clamping member 64 in the vertical direction by rotating the ball screw around the axis by the motor.

移動機構65藉由以馬達使滾珠螺桿繞著軸心旋轉，而使一對夾持構件64朝互相接近之方向移動，並將擴展片201夾持在一對夾持構件64之間。移動機構65藉由以馬達使滾珠螺桿繞著軸心旋轉，而使一對夾持構件64朝互相分開之方向移動，並解除一對夾持構件64之間的擴展片201的夾持。又，移動機構65也可以藉由以馬達使滾珠螺桿繞著軸心旋轉，而使一對夾持構件64在鉛直方向上朝同方向移動。又，各夾持部62-1、62-2、62-3、62-4之設置有一對夾持構件64以及移動機構65之移動基台63，以在第1方向212或第2方向213上移動自如的方式設置在固定基台31。The moving mechanism 65 moves the pair of clamping members 64 in the direction of approaching each other by rotating the ball screw around the axis with a motor, and clamps the expansion piece 201 between the pair of clamping members 64 . The moving mechanism 65 moves the pair of clamping members 64 in a direction to separate from each other by rotating the ball screw around the axis by a motor, and releases the clamping members 64 between the expansion pieces 201 . In addition, the moving mechanism 65 may move the pair of clamping members 64 in the same direction in the vertical direction by rotating the ball screw around the axis with the motor. In addition, a pair of gripping members 64 and a moving base 63 of the moving mechanism 65 are provided in each of the gripping parts 62-1, 62-2, 62-3, and 62-4, so that the first direction 212 or the second direction 213 It is installed on the fixed base 31 so as to be movable upward.

移動單元70具備第1移動單元71與第2移動單元72。The moving unit 70 includes a first moving unit 71 and a second moving unit 72 .

第1移動單元71是以下之單元：藉由使第1夾持部62-1的移動基台63與第2夾持部62-2的移動基台63沿著第1方向212移動，而使第1夾持部62-1的移動基台63與第2夾持部62-2的移動基台63在第1方向212上朝互相遠離之方向以及互相接近之方向移動。第1移動單元71亦可為以下之單元：藉由使第1夾持部62-1的移動基台63與第2夾持部62-2的移動基台63沿著第1方向212移動，而使第1夾持部62-1的夾持構件64與第2夾持部62-2的夾持構件64以可在第1方向212上接近遠離的方式地移動。第1移動單元71具備使第1夾持部62-1的移動基台63在第1方向212上移動之第1移動機構73-1、及使第2夾持部62-2的移動基台63在第1方向212上移動之第2移動機構73-2。The first moving unit 71 is a unit that moves the moving base 63 of the first holding part 62-1 and the moving base 63 of the second holding part 62-2 along the first direction 212 to move The moving base 63 of the first gripping portion 62-1 and the moving base 63 of the second gripping portion 62-2 move in the first direction 212 in a direction away from each other and a direction in which they approach each other. The first moving unit 71 may be a unit that moves the moving base 63 of the first holding part 62-1 and the moving base 63 of the second holding part 62-2 along the first direction 212, On the other hand, the gripping member 64 of the first gripping portion 62 - 1 and the gripping member 64 of the second gripping portion 62 - 2 are moved so as to be able to approach and separate in the first direction 212 . The first moving unit 71 includes a first moving mechanism 73-1 that moves the moving base 63 of the first gripping portion 62-1 in the first direction 212, and a moving base that moves the second gripping portion 62-2 63 A second moving mechanism 73-2 that moves in the first direction 212.

第2移動單元72是以下之單元：藉由使第3夾持部62-3的移動基台63與第4夾持部62-4的移動基台63沿著第2方向213移動，而使第3夾持部62-3的移動基台63與第4夾持部62-4的移動基台63在第2方向213上朝互相遠離之方向以及互相接近之方向移動。第2移動單元72亦可為以下之單元：藉由使第3夾持部62-3的移動基台63與第4夾持部62-4的移動基台63沿著第2方向213移動，而使第3夾持部62-3的夾持構件64與第4夾持部62-4的夾持構件64以可在第2方向213上接近遠離的方式移動。第2移動單元72具備使第3夾持部62-3的移動基台63在第2方向213上移動之第3移動機構73-3、及使第4夾持部62-4的移動基台63在第2方向213上移動之第4移動機構73-4。The second moving unit 72 is a unit that moves the moving base 63 of the third holding part 62-3 and the moving base 63 of the fourth holding part 62-4 along the second direction 213 to move The moving base 63 of the third gripping portion 62-3 and the moving base 63 of the fourth gripping portion 62-4 move in the second direction 213 in a direction away from each other and in a direction of approaching each other. The second moving unit 72 may be a unit that moves the moving base 63 of the third holding part 62-3 and the moving base 63 of the fourth holding part 62-4 along the second direction 213, On the other hand, the gripping member 64 of the third gripping portion 62 - 3 and the gripping member 64 of the fourth gripping portion 62 - 4 are moved so as to be able to approach and separate in the second direction 213 . The second moving unit 72 includes a third moving mechanism 73-3 that moves the moving base 63 of the third gripping portion 62-3 in the second direction 213, and a moving base that moves the fourth gripping portion 62-4 63 A fourth moving mechanism 73-4 that moves in the second direction 213.

第1移動機構73-1、第2移動機構73-2、第3移動機構73-3以及第4移動機構73-4由於互相使構成為大致相等，因此會對相同部分附加相同符號來說明。Since the first moving mechanism 73-1, the second moving mechanism 73-2, the third moving mechanism 73-3, and the fourth moving mechanism 73-4 are configured to be substantially equal to each other, the same parts will be described with the same reference numerals.

第1移動機構73-1、第2移動機構73-2、第3移動機構73-3以及第4移動機構73-4具有：馬達，將夾持部62-1、62-2、62-3、62-4的移動基台63設成可在第1方向212或第2方向213上移動；及滾珠螺桿，藉由馬達而繞著軸心旋轉並使移動基台63在第1方向212或第2方向213上移動。The first moving mechanism 73-1, the second moving mechanism 73-2, the third moving mechanism 73-3, and the fourth moving mechanism 73-4 include motors, and hold the gripping parts 62-1, 62-2, and 62-3. , The moving base 63 of 62-4 is set to be movable in the first direction 212 or the second direction 213; and the ball screw is rotated around the axis by the motor and makes the moving base 63 move in the first direction 212 or 213. Move in the second direction 213 .

第1移動機構73-1、第2移動機構73-2、第3移動機構73-3以及第4移動機構73-4是藉由使夾持部62-1、62-2、62-3、62-4朝互相遠離的方向移動，而對夾持部62-1、62-2、62-3、62-4所夾持之擴展片201進行擴展。The first moving mechanism 73-1, the second moving mechanism 73-2, the third moving mechanism 73-3, and the fourth moving mechanism 73-4 are formed by the clamping parts 62-1, 62-2, 62-3, 62-4 moves in a direction away from each other, and expands the expansion piece 201 held by the holding parts 62-1, 62-2, 62-3, and 62-4.

框架搬送單元配置於片材夾持單元61的上方，且在下表面保持環狀框架210。框架搬送單元是藉由升降單元而在鉛直方向上移動自如地設置，並且藉由未圖示之水平方向移動單元而在水平方向上移動自如地設置。框架搬送單元是藉由水平方向移動單元，而將環狀框架210定位在以下位置：已保持在下表面之環狀框架210的開口211和已貼附在被冷卻工作台41所載置之擴展片201上的被加工物200在鉛直方向上相面對的位置。又，框架搬送單元可藉由升降單元而下降，藉此將環狀框架210貼附到擴展片201。The frame conveying unit is arranged above the sheet holding unit 61 and holds the annular frame 210 on the lower surface. The frame conveying unit is installed movably in the vertical direction by the elevating unit, and is installed movably in the horizontal direction by the horizontal direction moving unit (not shown). The frame transfer unit moves the unit in the horizontal direction to position the annular frame 210 at the following positions: the opening 211 of the annular frame 210 that has been held on the lower surface and the expansion piece that has been attached to the cooling table 41 The position where the workpiece 200 on the 201 faces in the vertical direction. Also, the frame conveying unit can be lowered by the elevating unit, thereby attaching the annular frame 210 to the expansion sheet 201 .

片材切斷單元是以下之單元：將已貼附於環狀框架210之擴展片201沿著環狀框架210來切斷。片材切斷單元會在已將環狀框架210貼附於擴展片201之後，在擴展片201的環狀框架210的內緣與外緣之間進行切斷。The sheet cutting unit is a unit for cutting the expansion sheet 201 attached to the annular frame 210 along the annular frame 210 . The sheet cutting unit cuts between the inner edge and the outer edge of the annular frame 210 of the expansion sheet 201 after the annular frame 210 has been attached to the expansion sheet 201 .

控制單元100是以下之單元：控制擴展裝置1-2的各構成要素，並使擴展裝置1-2實施被加工物200對擴展片201之貼附動作、擴張擴展片201之擴張動作、以及環狀框架210對擴展片201之貼附動作等。再者，控制單元100是具有運算處理裝置、記憶裝置及輸入輸出介面裝置的電腦，前述運算處理裝置具有CPU(中央處理單元，central processing unit)之類的微處理器，前述記憶裝置具有ROM(唯讀記憶體，read only memory)或RAM(隨機存取記憶體，random access memory)之類的記憶體。控制單元100的運算處理裝置會依照已記憶於記憶裝置之電腦程式實施運算處理，並透過輸入輸出介面裝置將用於控制擴展裝置1-2之控制訊號輸出至擴展裝置1-2的各構成要素。The control unit 100 is a unit that controls each component of the expansion device 1-2, and causes the expansion device 1-2 to perform the attachment operation of the workpiece 200 to the expansion sheet 201, the expansion operation of the expansion expansion sheet 201, and the loop The sticking action of the shape frame 210 to the expansion sheet 201 and the like. Furthermore, the control unit 100 is a computer having an arithmetic processing device, a memory device, and an input/output interface device. The arithmetic processing device has a microprocessor such as a CPU (central processing unit), and the memory device has a ROM ( Read-only memory, read only memory) or RAM (random access memory, random access memory). The arithmetic processing device of the control unit 100 performs arithmetic processing according to the computer program stored in the memory device, and outputs the control signal for controlling the expansion device 1-2 to each component of the expansion device 1-2 through the input and output interface device .

又，控制單元100已連接於未圖示之顯示單元及未圖示之輸入單元，前述顯示單元是藉由顯示加工動作之狀態或圖像等的液晶顯示裝置等所構成，前述輸入單元是在操作人員登錄加工內容資訊等之時使用。輸入單元是藉由設置於顯示單元的觸控面板、與鍵盤等之外部輸入裝置當中至少一種所構成。In addition, the control unit 100 is connected to a display unit (not shown) and an input unit (not shown), the display unit is constituted by a liquid crystal display device or the like that displays the state of processing operations, images, etc., and the input unit is located in the It is used when the operator logs in the processing content information, etc. The input unit is formed by at least one of external input devices such as a touch panel provided on the display unit and a keyboard.

第2實施形態之擴展方法是對貼附有已形成改質層207的被加工物200之擴展片201進行擴張，而將被加工物200分割成一個個的晶片202之方法。第2實施形態之擴展方法是以控制單元100控制擴展裝置1-2的各構成要素之方式來實施，且和第1實施形態同樣地具備保持步驟1001、片材冷卻步驟1002與分割步驟1003。The expansion method of the second embodiment is a method of dividing the workpiece 200 into individual wafers 202 by expanding the expansion sheet 201 to which the modified layer 207 has been attached to the workpiece 200 . The expanding method of the second embodiment is implemented in such a manner that the control unit 100 controls each component of the expanding device 1-2, and includes a holding step 1001, a sheet cooling step 1002, and a dividing step 1003 as in the first embodiment.

在第2實施形態中，保持步驟1001是以擴展裝置1-2的片材夾持單元61來夾持並保持擴展片201之步驟。在第2實施形態中，在保持步驟1001中，是將貼附有DAF209之擴展片201載置於冷卻工作台41的抵接面42上，且擴展裝置1-2會以片材夾持單元61的各夾持部62-1、62-2、62-3、62-4來夾持已載置於冷卻工作台41的抵接面42之擴展片201。在第2實施形態中，在保持步驟1001中，是以被加工物搬送單元將被加工物200貼附在已被片材夾持單元61的各夾持部62-1、62-2、62-3、62-4所夾持之擴展片201的DAF209。In the second embodiment, the holding step 1001 is a step of holding and holding the expanding sheet 201 by the sheet holding unit 61 of the expanding apparatus 1-2. In the second embodiment, in the holding step 1001, the expansion sheet 201 with the DAF 209 attached thereto is placed on the contact surface 42 of the cooling table 41, and the expansion device 1-2 is held by the sheet clamping unit Each of the holding parts 62 - 1 , 62 - 2 , 62 - 3 , and 62 - 4 of the 61 holds the expansion piece 201 placed on the contact surface 42 of the cooling table 41 . In the second embodiment, in the holding step 1001, the workpiece conveying unit affixes the workpiece 200 to each of the gripping portions 62-1, 62-2, and 62 of the sheet gripping unit 61. -3, DAF209 of the expansion piece 201 held by 62-4.

在第2實施形態中，片材冷卻步驟1002可藉由將擴展片201抵接於冷卻工作台41的抵接面42來實施。在第2實施形態中，在片材冷卻步驟1002中，擴展裝置1-2是如圖10所示，電源電路48的一邊的極性切換部49-1對第1帕耳帖元件層46-1供給第1電壓的電力，而將第1區域43冷卻至第1溫度，且電源電路48的一邊的極性切換部49-1對第2帕耳帖元件層46-2供給第2電壓的電力，而將第2區域44冷卻至第2溫度。In the second embodiment, the sheet cooling step 1002 can be implemented by abutting the expansion sheet 201 with the contact surface 42 of the cooling table 41 . In the second embodiment, in the sheet cooling step 1002, the expansion device 1-2 is, as shown in FIG. 10, the polarity switching section 49-1 on one side of the power supply circuit 48 to the first Peltier element layer 46-1 The power of the first voltage is supplied to cool the first region 43 to the first temperature, and the polarity switching section 49-1 on one side of the power supply circuit 48 supplies power of the second voltage to the second Peltier element layer 46-2, On the other hand, the second region 44 is cooled to the second temperature.

如此進行，在第2實施形態中，在片材冷卻步驟1002中，擴展裝置1-2會將抵接面42的第1區域43設定為第1溫度，且將第2區域44設定為第2溫度，而將以片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217冷卻至第1溫度，並將以片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217與夾持部62-1、62-2、62-3、62-4之間的區域218冷卻至第2溫度。如此，在第2實施形態中，在片材冷卻步驟1002中，擴展裝置1-2是將以片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217與夾持部62-1、62-2、62-3、62-4之間的區域218，冷卻成變得比以片材夾持單元61所夾持之擴展片201的供被加工物200貼附的區域217更低溫。In this way, in the second embodiment, in the sheet cooling step 1002, the expansion device 1-2 sets the first region 43 of the contact surface 42 to the first temperature, and sets the second region 44 to the second temperature temperature, the area 217 of the expansion sheet 201 clamped by the sheet clamping unit 61 to which the workpiece 200 is attached is cooled to the first temperature, and the expansion sheet clamped by the sheet clamping unit 61 is cooled to the first temperature. The region 218 between the region 217 of the 201 to which the workpiece 200 is attached and the clamping parts 62-1, 62-2, 62-3, and 62-4 is cooled to the second temperature. In this way, in the second embodiment, in the sheet cooling step 1002, the expanding device 1-2 is to place the area 217 of the expanding sheet 201 held by the sheet holding unit 61 on which the workpiece 200 is attached to the The area 218 between the gripping parts 62-1, 62-2, 62-3, and 62-4 is cooled so that it becomes more affixed to the workpiece 200 than the expansion sheet 201 gripped by the sheet gripping unit 61. The attached region 217 is cooler.

在第2實施形態中，在分割步驟1003中，擴展裝置1-2是在圖11所示之狀態下，以第1移動單元71使第1夾持部62-1與第2夾持部62-2在第1方向212上朝互相遠離的方向移動，藉此將擴展片201在第1方向212上擴張(擴展)，並且以第2移動單元72使第3夾持部62-3與第4夾持部62-4在第2方向213上朝互相遠離的方向移動，藉此將擴展片201在第2方向213上擴張(擴展)。In the second embodiment, in the dividing step 1003, the expansion device 1-2 is in the state shown in FIG. -2 The expansion sheet 201 is expanded (expanded) in the first direction 212 by moving in the direction away from each other in the first direction 212, and the third clamping portion 62-3 and the The clamping portion 62-4 moves in the direction away from each other in the second direction 213, thereby expanding (expanding) the expansion sheet 201 in the second direction 213.

如此一來，在分割步驟1003中，擴張的結果，擴展片201會因為放射狀的拉伸力作用，且第2溫度比第1溫度更低溫，因而讓擴展片201的貼附有被加工物200的區域217，比擴展片201的貼附有被加工物200的區域217與擴展片201的夾持部62-1、62-2、62-3、62-4之間的區域218更加被擴張。在第2實施形態中，在分割步驟1003中，被加工物200因為形成有沿著分割預定線205之改質層207，所以會以改質層207作為斷裂起點而按一個個的器件206被分割，且按一個個的晶片202被個體化，並且因為被加工物200沿著改質層207斷裂，所以DAF209也會沿著改質層207斷裂。In this way, in the dividing step 1003, as a result of the expansion, the expansion sheet 201 will be subjected to a radial tensile force, and the second temperature is lower than the first temperature, so that the expansion sheet 201 is attached to the workpiece. The area 217 of the expansion sheet 200 is more affected than the area 218 of the expansion sheet 201 between the area 217 of the expansion sheet 201 to which the workpiece 200 is attached and the clamping parts 62-1, 62-2, 62-3, and 62-4 of the expansion sheet 201. expansion. In the second embodiment, in the dividing step 1003, since the modified layer 207 along the line 205 to be divided is formed on the workpiece 200, the modified layer 207 is used as the starting point of fracture, and each device 206 is cut out. The wafers 202 are divided and individualized one by one, and since the workpiece 200 is fractured along the modified layer 207 , the DAF 209 is also fractured along the modified layer 207 .

在分割步驟1003後，擴展裝置1-2會以框架搬送單元將環狀框架210貼附到經擴展之擴展片201，並以片材切斷單元在擴展片201的環狀框架210的內緣與外緣之間進行切斷，且將被加工物200按每個擴展片201以及環狀框架210來搬出。在被加工物200的搬出後，擴展裝置1-2是如圖13所示，電源電路48的另一邊的極性切換部49-2對第1帕耳帖元件層46-1供給電力，而將第1區域43加熱至常溫，且電源電路48的另一邊的極性切換部49-2對第2帕耳帖元件層46-2供給電力，而將第2區域44加熱至常溫。After the dividing step 1003 , the expanding device 1 - 2 attaches the annular frame 210 to the expanded expanding sheet 201 by the frame conveying unit, and uses the sheet cutting unit to attach the annular frame 210 of the expanding sheet 201 to the inner edge of the expanding sheet 201 . It is cut between the outer edge and the workpiece 200 is carried out for each of the expansion pieces 201 and the annular frame 210 . After the workpiece 200 is unloaded, in the expansion device 1-2, as shown in FIG. 13, the polarity switching unit 49-2 on the other side of the power supply circuit 48 supplies power to the first Peltier element layer 46-1, and switches The first area 43 is heated to normal temperature, and the polarity switching unit 49-2 on the other side of the power supply circuit 48 supplies power to the second Peltier element layer 46-2, thereby heating the second area 44 to normal temperature.

第2實施形態之擴展裝置1-2具備有冷卻單元40，前述冷卻單元40是將擴展片201的貼附有被加工物200的區域217冷卻至第1溫度，並且將擴展片201的貼附有被加工物200的區域217與夾持部62-1、62-2、62-3、62-4之間的區域218冷卻至比第1溫度更低溫之第2溫度。因此，第2實施形態之擴展裝置1-2可以將擴展片201的貼附有被加工物200的區域與夾持部62-1、62-2、62-3、62-4之間，以比擴展片201的貼附有被加工物200的區域更低溫來冷卻。The expansion apparatus 1-2 of the second embodiment includes a cooling unit 40 that cools the region 217 of the expansion sheet 201 to which the workpiece 200 is attached to the first temperature, and also cools the expansion sheet 201 to the first temperature. The region 218 between the region 217 of the workpiece 200 and the clamping portions 62-1, 62-2, 62-3, and 62-4 is cooled to a second temperature that is lower than the first temperature. Therefore, in the expansion device 1-2 of the second embodiment, the expansion sheet 201 can be placed between the region where the workpiece 200 is attached and the clamping parts 62-1, 62-2, 62-3, and 62-4 to It is cooled at a lower temperature than the region of the expansion sheet 201 to which the workpiece 200 is attached.

其結果，第2實施形態之擴展裝置1-2會與第1實施形態同樣地發揮以下效果：可以將擴展片201的貼附有被加工物200的區域217充分地擴張，而可以將在被加工物200產生未被分割之區域的可能性抑制得較低。As a result, the expansion device 1-2 of the second embodiment can sufficiently expand the region 217 of the expansion sheet 201 to which the workpiece 200 is attached, as in the first embodiment. The possibility of generating undivided regions in the processed object 200 is suppressed low.

又，第2實施形態之擴展方法，由於實施將擴展片201的貼附有被加工物200的區域217冷卻至第1溫度，並且將擴展片201的貼附有被加工物200的區域217與夾持部62-1、62-2、62-3、62-4之間的區域218冷卻至比第1溫度更低溫之第2溫度之片材冷卻步驟1002，因此會發揮以下效果：可以將擴展片201的貼附有被加工物200的區域充分地擴張，而可以將在被加工物200產生未被分割之區域的可能性抑制得較低。In addition, in the expanding method of the second embodiment, the area 217 of the expansion sheet 201 to which the workpiece 200 is attached is cooled to the first temperature, and the area 217 of the expansion sheet 201 to which the workpiece 200 is attached is cooled to the first temperature. In the sheet cooling step 1002 of cooling the region 218 between the clamping portions 62-1, 62-2, 62-3, and 62-4 to a second temperature that is lower than the first temperature, the following effects can be achieved: The region of the expansion sheet 201 to which the workpiece 200 is attached is sufficiently expanded, and the possibility of occurrence of an undivided region in the workpiece 200 can be suppressed to a low level.

[變形例] 依據圖式來說明本發明之第2實施形態的變形例之擴展裝置。圖14是顯示第2實施形態的變形例之擴展裝置的冷卻工作台的構成的剖面圖。再者，圖14對和第2實施形態相同的部分會附加相同符號而省略說明。 [Variation] An expansion device according to a modification of the second embodiment of the present invention will be described with reference to the drawings. 14 is a cross-sectional view showing the configuration of a cooling stage of an expansion device according to a modification of the second embodiment. In addition, in FIG. 14, the same code|symbol is attached|subjected to the same part as 2nd Embodiment, and description is abbreviate|omitted.

第2實施形態的變形例之擴展裝置1-2，除了冷卻工作台41-1的構成相異以外，與第2實施形態相同。如圖14所示，第2實施形態的變形例之擴展裝置1-2的冷卻工作台41-1在工作台基台45上僅配置一個帕耳帖元件層46，前述帕耳帖元件層46具備有可由電源電路48供給電力之至少1個以上的帕耳帖元件，並且將冷卻板47以第1冷卻板47-1與第2冷卻板47-2來構成。The expansion device 1-2 of the modification of the second embodiment is the same as that of the second embodiment except that the configuration of the cooling table 41-1 is different. As shown in FIG. 14 , in the cooling table 41-1 of the expansion device 1-2 according to the modification of the second embodiment, only one Peltier element layer 46 is arranged on the table base 45, and the aforementioned Peltier element layer 46 is provided. The cooling plate 47 is provided with at least one Peltier element that can be supplied with electric power from the power supply circuit 48, and the cooling plate 47 is constituted by a first cooling plate 47-1 and a second cooling plate 47-2.

帕耳帖元件層46的平面形狀和冷卻工作台41-1的平面形狀相等。電源電路48和第2實施形態同樣地具備一對極性切換部49-1、49-2。The planar shape of the Peltier element layer 46 is equal to the planar shape of the cooling stage 41-1. The power supply circuit 48 is provided with a pair of polarity switching parts 49-1 and 49-2 similarly to 2nd Embodiment.

第1冷卻板47-1是上表面為第1區域43，且以樹脂來構成。第2冷卻板47-2是上表面為第2區域44，且由熱傳導率比構成第1冷卻板47-1之材料即樹脂更高的(亦即，易於傳導熱)材料即金屬來構成。The first cooling plate 47-1 has the upper surface as the first region 43 and is formed of resin. The second cooling plate 47-2 has the upper surface as the second region 44, and is made of metal, which is a material having a higher thermal conductivity (that is, easily conducts heat) than resin that constitutes the first cooling plate 47-1.

若電源電路48將一邊的極性切換部49-1的直流電源50的電力供給至帕耳帖元件層46時，冷卻工作台41-1會將抵接面42亦即區域43、44冷卻到比常溫更低溫，而將另一邊的極性切換部49-2的直流電源50的電力供給至帕耳帖元件層46時，則會將抵接面42亦即區域43、44加熱到比常溫更高溫。When the power supply circuit 48 supplies the electric power of the DC power supply 50 of the polarity switching portion 49-1 on one side to the Peltier element layer 46, the cooling stage 41-1 cools the contact surface 42, that is, the regions 43 and 44 to a lower level than the cooling stage 41-1. The normal temperature is lower, and when the power of the DC power supply 50 of the polarity switching portion 49-2 on the other side is supplied to the Peltier element layer 46, the contact surface 42, that is, the regions 43 and 44, is heated to a higher temperature than the normal temperature .

又，若電源電路48將一邊的極性切換部49-1的直流電源50的電力供給至帕耳帖元件層46時，冷卻工作台41-1會將第1區域43冷卻到第1溫度，並將第2區域44冷卻到第2溫度。如此進行，可將圖14所示之冷卻工作台41-1的抵接面42的第1區域43設定為第1溫度，並將第2區域44設定為比第1溫度更低溫之第2溫度。In addition, when the power supply circuit 48 supplies the electric power of the DC power supply 50 of the polarity switching section 49-1 on one side to the Peltier element layer 46, the cooling stage 41-1 cools the first region 43 to the first temperature, and cools the first region 43 to the first temperature. The second region 44 is cooled to the second temperature. In this way, the first region 43 of the contact surface 42 of the cooling table 41-1 shown in FIG. 14 can be set to the first temperature, and the second region 44 can be set to the second temperature lower than the first temperature .

變形例之擴展裝置1-2由於具備有冷卻單元40，且前述冷卻單元40將擴展片201的貼附有被加工物200的區域217冷卻至第1溫度，並且將擴展片201的貼附有被加工物200的區域217與夾持部62-1、62-2、62-3、62-4之間的區域218冷卻至比第1溫度更低溫之第2溫度，因此可和第2實施形態同樣地發揮以下效果：可以將在被加工物200產生無法被分割之區域的可能性抑制得較低。The expansion device 1-2 of the modified example includes the cooling unit 40, and the cooling unit 40 cools the region 217 of the expansion sheet 201 to which the workpiece 200 is attached to the first temperature, and cools the expansion sheet 201 with the Since the region 218 between the region 217 of the workpiece 200 and the clamping parts 62-1, 62-2, 62-3, and 62-4 is cooled to a second temperature that is lower than the first temperature, it is possible to perform the same operation as the second temperature. Similarly, the form has the effect of suppressing the possibility of occurrence of an undivided region in the workpiece 200 to a low level.

又，在本發明中，變形例的冷卻工作台41-1亦可具備和第2實施形態同樣的冷卻板47，且構成為：在第1區域43下的冷卻板47與帕耳帖元件層46之間設置隔熱材，在第2區域44下的冷卻板47與帕耳帖元件層46之間不設置隔熱材。In addition, in the present invention, the cooling stage 41-1 of the modified example may include the cooling plate 47 similar to that of the second embodiment, and may be configured such that the cooling plate 47 and the Peltier element layer below the first region 43 A heat insulating material is provided between 46 , and no heat insulating material is provided between the cooling plate 47 and the Peltier element layer 46 below the second region 44 .

再者，本發明並非限定於上述實施形態之發明。亦即，在不脫離本發明之要點的範圍內，可以進行各種變形來實施。在前述之實施形態等中，雖然是將在背面208貼附有DAF209之被加工物200或可以在背面208形成有金屬膜214之被加工物200分割成一個個的晶片202，但並非限定於此。例如，本發明亦可將已貼附於擴展片201之被加工物200預先分割成一個個的晶片202且在背面208貼附DAF209，再對擴展片201進行擴張，而將DAF209按每個晶片202來分割。In addition, this invention is not limited to the invention of the said embodiment. That is, various deformation|transformation can be carried out in the range which does not deviate from the summary of this invention. In the aforementioned embodiments and the like, the workpiece 200 having the DAF 209 attached to the back surface 208 or the workpiece 200 having the metal film 214 formed on the back surface 208 is divided into individual wafers 202, but it is not limited to this. For example, in the present invention, the workpiece 200 attached to the expansion sheet 201 can be pre-divided into individual wafers 202, and the DAF 209 is attached to the back surface 208, and then the expansion sheet 201 is expanded, and the DAF 209 is divided for each wafer. 202 to split.

1,1-2:擴展裝置 10,60:擴張單元(擴張機構) 11:基台 12:保持單元 13:擴張圓筒 14:升降單元 15:框架保持構件 16:夾具 17:載置面 18:缸筒 19:活塞桿 20,40:冷卻單元 21:第1冷卻空氣噴出孔 22:第2冷卻空氣噴出孔 23,24:冷卻空氣 30,100:控制單元 31:固定基台 41,41-1:冷卻工作台 42:抵接面 43:第1區域 44:第2區域 45:工作台基台 46:帕耳帖元件層 46-1:第1帕耳帖元件層 46-2:第2帕耳帖元件層 47:冷卻板 47-1:第1冷卻板 47-2:第2冷卻板 48:電源電路 49-1,49-2:極性切換部 50:直流電源 51:開關 61:片材夾持單元 62-1:第1夾持部 62-2:第2夾持部 62-3:第3夾持部 62-4:第4夾持部 63:移動基台 64:夾持構件 65:移動機構 66:支撐臂 70:移動單元 71:第1移動單元 72:第2移動單元 73-1:第1移動機構 73-2:第2移動機構 73-3:第3移動機構 73-4:第4移動機構 200:被加工物 201:擴展片(片材) 202:晶片 203:基板 204:正面 205:分割預定線 206:器件 207:改質層(分割起點) 208:背面 209:DAF 210:環狀框架 211:開口 212:第1方向 213:第2方向 214:金屬膜 215,218:區域(未貼附有被加工物的區域) 216,217:區域(貼附有被加工物的區域) 1001:保持步驟 1002:片材冷卻步驟 1003:分割步驟 1,1-2: Expansion unit 10,60: Expansion unit (expansion mechanism) 11: Abutment 12: Holding unit 13: Expansion Cylinder 14: Lifting unit 15: Frame holding member 16: Fixtures 17: Mounting surface 18: Cylinder barrel 19: Piston rod 20,40: Cooling unit 21: 1st cooling air ejection hole 22: 2nd cooling air ejection hole 23, 24: cooling air 30,100: Control Unit 31: Fixed abutment 41, 41-1: Cooling table 42: abutting surface 43: Zone 1 44: Zone 2 45: Workbench base 46: Peltier element layer 46-1: 1st Peltier element layer 46-2: 2nd Peltier element layer 47: Cooling Plate 47-1: 1st cooling plate 47-2: 2nd cooling plate 48: Power circuit 49-1, 49-2: Polarity switching section 50: DC power supply 51: switch 61: Sheet clamping unit 62-1: 1st clamping part 62-2: 2nd clamping part 62-3: 3rd clamping part 62-4: 4th clamping part 63: Mobile Abutment 64: Clamping member 65: Moving Mechanisms 66: Support arm 70: Mobile Unit 71: 1st mobile unit 72: 2nd mobile unit 73-1: 1st Movement Mechanism 73-2: Second Movement Mechanism 73-3: 3rd Movement Mechanism 73-4: 4th Movement Mechanism 200: processed object 201: Extension Sheet (Sheet) 202: Wafer 203: Substrate 204: front 205: Divide the scheduled line 206: Device 207: Modified layer (split start point) 208: Back 209: DAF 210: Ring Frame 211: Opening 212: 1st direction 213: 2nd direction 214: Metal Film 215, 218: Area (area not attached to the processed object) 216, 217: Area (area attached to the processed object) 1001: Keep Steps 1002: Sheet Cooling Step 1003: Segmentation step

圖1是顯示第1實施形態之擴展裝置的構成例的立體圖。 圖2是顯示可藉由圖1所示之擴展裝置而被分割之被加工物的一例的立體圖。 圖3是顯示可藉由圖1所示之擴展裝置而被分割之被加工物的其他例的立體圖。 圖4是顯示第1實施形態之擴展方法的流程的流程圖。 圖5是示意地顯示圖4所示之擴展方法的片材冷卻步驟的剖面圖。 圖6是示意地顯示圖4所示之擴展方法的分割步驟的剖面圖。 圖7是顯示第2實施形態之擴展裝置的構成例的立體圖。 圖8是顯示圖7所示之擴展裝置的片材夾持單元與冷卻工作台的平面圖。 圖9是顯示圖7所示之擴展裝置的冷卻工作台的構成的剖面圖。 圖10是示意地顯示第2實施形態之擴展方法的冷卻步驟的剖面圖。 圖11是示意地顯示第2實施形態之擴展方法的分割步驟的擴展片擴張前之狀態的剖面圖。 圖12是示意地顯示第2實施形態之擴展方法的分割步驟的已將擴展片擴張之狀態的剖面圖。 圖13是示意地顯示第2實施形態之擴展方法的分割步驟後的冷卻工作台的剖面圖。 圖14是顯示第2實施形態的變形例之擴展裝置的冷卻工作台的構成的剖面圖。 FIG. 1 is a perspective view showing a configuration example of the expansion device according to the first embodiment. FIG. 2 is a perspective view showing an example of a workpiece that can be divided by the expansion device shown in FIG. 1 . FIG. 3 is a perspective view showing another example of a workpiece that can be divided by the expansion device shown in FIG. 1 . FIG. 4 is a flowchart showing the flow of the expansion method according to the first embodiment. FIG. 5 is a cross-sectional view schematically showing a sheet cooling step of the expansion method shown in FIG. 4 . FIG. 6 is a cross-sectional view schematically showing a dividing step of the expansion method shown in FIG. 4 . FIG. 7 is a perspective view showing a configuration example of an expansion device according to the second embodiment. FIG. 8 is a plan view showing a sheet clamping unit and a cooling table of the expansion device shown in FIG. 7 . FIG. 9 is a cross-sectional view showing the configuration of a cooling stage of the expansion device shown in FIG. 7 . FIG. 10 is a cross-sectional view schematically showing a cooling step in the expansion method of the second embodiment. 11 is a cross-sectional view schematically showing a state before expansion of the expansion sheet in the dividing step of the expansion method of the second embodiment. 12 is a cross-sectional view schematically showing a state in which the expansion sheet has been expanded in the dividing step of the expansion method of the second embodiment. FIG. 13 is a cross-sectional view schematically showing a cooling stage after the dividing step of the expansion method of the second embodiment. 14 is a cross-sectional view showing the configuration of a cooling stage of an expansion device according to a modification of the second embodiment.

1:擴展裝置 1: Expansion device

10:擴張單元(擴張機構) 10: Expansion unit (expansion mechanism)

11:基台 11: Abutment

12:保持單元 12: Holding unit

13:擴張圓筒 13: Expansion Cylinder

14:升降單元 14: Lifting unit

15:框架保持構件 15: Frame holding member

16:夾具 16: Fixtures

17:載置面 17: Mounting surface

18:缸筒 18: Cylinder barrel

19:活塞桿 19: Piston rod

20:冷卻單元 20: Cooling unit

21:第1冷卻空氣噴出孔 21: 1st cooling air ejection hole

22:第2冷卻空氣噴出孔 22: 2nd cooling air ejection hole

30:控制單元 30: Control unit

Claims (4)

一種擴展裝置，對貼附有已形成分割起點的被加工物之片材進行擴張來分割被加工物，前述擴展裝置包含： 擴張機構，擴張該片材；及 冷卻單元，將該片材之未貼附有被加工物的區域冷卻成變得比該片材之貼附有被加工物的區域更低溫。 An expansion device for dividing the workpiece by expanding the sheet attached to the workpiece that has formed the starting point of division, the expansion device comprising: an expansion mechanism to expand the sheet; and The cooling unit cools the region of the sheet to which the object to be processed is not attached to a lower temperature than the region of the sheet to which the object to be processed is attached. 如請求項1之擴展裝置，其中該擴張機構具備： 片材夾持單元，具有在第1方向上隔著被加工物而互相相向，且分別夾持該片材之第1夾持部與第2夾持部、及在正交於該第1方向之第2方向上隔著被加工物而互相相向，且分別夾持該片材之第3夾持部與第4夾持部； 第1移動單元，使該第1夾持部與該第2夾持部在該第1方向上朝互相遠離之方向移動；及 第2移動單元，使該第3夾持部與該第4夾持部在該第2方向上朝互相遠離之方向移動， 該冷卻單元具備： 冷卻工作台，具有抵接於已被該片材夾持單元所夾持之該片材之抵接面，且對該片材進行冷卻， 該抵接面是由第1區域與第2區域所構成，前述第1區域是和貼附有被加工物之區域對應之區域，前述第2區域是圍繞該第1區域且和被加工物與該第1、第2、第3、第4夾持部之間的區域對應之區域， 可將該第1區域設定為第1溫度，並將該第2區域設定為比該第1溫度更低溫之第2溫度。 The expansion device of claim 1, wherein the expansion mechanism has: The sheet holding unit has a first holding portion and a second holding portion that face each other across the workpiece in a first direction and hold the sheet, respectively, and has a first holding portion and a second holding portion that are perpendicular to the first direction. The second direction is opposite to each other across the workpiece, and the third clamping part and the fourth clamping part of the sheet are respectively clamped; a first moving unit for moving the first gripping portion and the second gripping portion in a direction away from each other in the first direction; and the second moving unit moves the third clamping part and the fourth clamping part in the direction away from each other in the second direction, The cooling unit has: a cooling table having an abutment surface abutting against the sheet held by the sheet holding unit, and cooling the sheet, The contact surface is composed of a first area and a second area, the first area is an area corresponding to the area to which the workpiece is attached, and the second area surrounds the first area and is adjacent to the workpiece and the workpiece. The area corresponding to the area between the first, second, third, and fourth clamping parts, The first region may be set to a first temperature, and the second region may be set to a second temperature lower than the first temperature. 一種擴展方法，對貼附有已形成分割起點的被加工物之片材進行擴張來分割被加工物，前述擴展方法包含以下步驟： 片材冷卻步驟，將該片材之未貼附有被加工物的區域冷卻成變得比該片材之貼附有被加工物的區域更低溫；及 分割步驟，在實施該片材冷卻步驟之後，對該片材進行擴展來分割被加工物。 An expansion method for dividing the processed object by expanding the sheet attached to the object to be processed that has formed the starting point of division, the expansion method comprising the following steps: a sheet cooling step of cooling the area of the sheet to which the workpiece is not attached to a lower temperature than the area of the sheet to which the workpiece is attached; and In the dividing step, after the sheet cooling step is performed, the sheet is expanded to divide the workpiece. 如請求項3之擴展方法，其中該片材冷卻步驟是藉由使冷卻工作台抵接於該片材來實施， 該冷卻工作台具有由第1區域及第2區域所構成之抵接面，前述第1區域是和貼附有被加工物之區域對應之區域，前述第2區域是圍繞該第1區域且和被加工物與第1、第2、第3、及第4夾持部之間的區域對應之區域，且可將該第1區域設定為第1溫度，並將該第2區域設定為比該第1溫度更低溫之第2溫度， 在該分割步驟中，是使在第1方向上隔著被加工物而互相相向且已夾持該片材之第1夾持部與第2夾持部在該第1方向上朝互相遠離之方向移動，並且使在正交於該第1方向之第2方向上隔著被加工物而互相相向且已夾持該片材之第3夾持部與第4夾持部在該第2方向上朝互相遠離之方向移動，藉此對該片材進行擴展。 The method of extension of claim 3, wherein the sheet cooling step is carried out by abutting a cooling table against the sheet, The cooling table has a contact surface composed of a first area and a second area, the first area is an area corresponding to the area to which the workpiece is attached, and the second area surrounds the first area and is The area corresponding to the area between the workpiece and the first, second, third, and fourth clamping parts, and the first area can be set to the first temperature, and the second area can be set to be higher than the The first temperature is lower than the second temperature, In this dividing step, the first clamping portion and the second clamping portion, which face each other across the workpiece in the first direction and have clamped the sheet, are moved away from each other in the first direction. The direction of movement, and in the second direction orthogonal to the first direction, the third clamping part and the fourth clamping part that have clamped the sheet and face each other across the workpiece are in the second direction The sheet is expanded by moving upwards away from each other.
TW110141900A 2020-11-16 2021-11-10 Extension device and extension method that suppresses the possibility of an undivided region being produced in a workpiece to be lower TW202221778A (en)

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