TW201826373A - Splitting device including a work table, a frame holding device, a lifting device, a control device, and a shrinking device - Google Patents

Abstract

An object of this invention is to precisely split a wafer without deteriorating the feasibility of picking up chips. A solution of this invention is a splitting device that splits a wafer, which is supported by a ring frame via a tape, by using a modified layer as a starting point by means of expansion of the tape. The splitting device is formed to have a work table, a frame holding device, a lifting device, a control device, and a shrinking device. The work table holds the wafer through a tape. The frame holding device is a ring frame that holds the periphery of the wafer. The lifting device causes the work table to be relatively close to and away from the frame holding device. The control device controls the lifting device to form predetermined intervals among the chips after the wafer is split. The shrinking device maintains the intervals among the chips at the predetermined intervals and then fixes the intervals among the chips by shrinking the slack tape between the outer circumference of the wafer and the inner circumference of the ring frame.

Description

Dividing device

FIELD OF THE INVENTION The present invention relates to a slicing device that divides a wafer into individual wafers.

BACKGROUND OF THE INVENTION Conventionally, as such a singulation device, a singulation device is known. A wafer that is supported on a ring-shaped frame through an adhesive tape is expanded along the starting point of the slicing that has been formed on the wafer. A device for dividing (see, for example, Patent Documents 1-3). In these singulation apparatuses, the wafer is held on the slicing table, the ring frame is held on the ring table, and the wafer is pushed up relative to the ring frame, thereby pushing the tape in the radial direction. Expand and divide the wafer into individual wafers. In the next step, the divided wafer is picked up from the tape by a picker or the like. Prior Art Literature Patent Literature

Patent Literature 1: Japanese Patent Laid-Open No. 2016-004832 Patent Literature 2: Japanese Patent Laid-Open No. 2007-027250 Patent Literature 3: Japanese Patent Laid-Open No. 2015-204362

SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, in order to divide a wafer having a smaller wafer size, it is necessary to expand the adhesive tape to a large extent. When the tape is expanded to a large extent, the wafers are too wide apart from each other, so that the wafer cannot be picked up in the next step, or the pickup time becomes longer. On the other hand, although it is considered that the interval between the wafers is reduced by suppressing the expansion of the adhesive tape to improve the pickability of the wafers, the wafers with a smaller wafer size cannot be appropriately divided. In this way, a problem arises in that when the tape is expanded widely, a defect occurs in picking up, and if the expansion of the tape is suppressed, the wafer cannot be appropriately divided.

The present invention has been made in view of the problems described above, and an object of the present invention is to provide a slicing device that can surely singulate a wafer without deteriorating the pick-up property of the wafer. Means to solve the problem

According to one aspect of the present invention, a singulation device is formed by attaching a wafer having a starting point for slicing to an adhesive tape that closes an opening of a ring frame, and integrates the ring frame, the tape, and the wafer. The tape of the formed work set is expanded, and the wafer is divided with the dividing starting point as a starting point. The dividing device includes: a frame holding device that holds the ring frame; a worktable having a holding surface; The holding surface is used to hold the wafer through the tape of the workpiece group held by the frame holding equipment; the lifting equipment makes the table and the frame holding equipment relatively close to and away from each other in a direction orthogonal to the holding surface ; Controlling the equipment, moving the table and the frame holding device away from each other to expand the tape, and after dividing the wafer with the dividing starting point as a starting point, the table and the frame holding device are brought closer to each other Move in a direction to bring adjacent wafers closer to each other to form a predetermined narrowing interval; and a shrinking device, which forms the interval by the control device, and attracts and holds the holding surface The tape is expanded to maintain the interval, and brings the table closer to the frame holding equipment, shrinks the slackened tape between the outer periphery of the wafer and the inner periphery of the ring frame, and adjacently The interval between the wafers is fixed.

According to this configuration, when the wafer is divided, the tape is expanded by moving the table and the frame holding equipment away from each other, and the wafer is surely divided from the starting point of the division. After the wafer is divided, the space between adjacent wafers is narrowed by releasing the expansion of the tape by bringing the table and the frame holding equipment closer. In addition, in a state where the interval between adjacent wafers has been narrowed to a preset interval, the interval between the wafers can be fixed by removing the slackness of the tape around the wafer. Accordingly, there is no possibility that dispersion unevenness occurs at the pickup position of the wafer or the pickup time becomes longer. In this way, the wafer pick-up property is not deteriorated, and the wafer can be surely divided. Invention effect

According to the present invention, the expansion of the tape can be relaxed after the wafer is divided, and the slack of the tape around the wafer can be removed to fix the interval between adjacent wafers at a preset interval. This makes it possible to reliably divide the wafer without deteriorating the pick-up property of the wafer.

Mode for Carrying Out the Invention Hereinafter, a division device according to this embodiment will be described with reference to the attached drawings. FIG. 1 is a perspective view of a dividing device according to this embodiment. FIG. 2 is an explanatory diagram of a wafer dividing operation and a picking operation of a comparative example. The division device is not limited to the configuration shown in FIG. 1, and may be appropriately changed.

As shown in FIG. 1, the dividing device 1 is configured to divide the wafer W supported by the ring frame F through the adhesive tape T into individual wafers C by expanding the adhesive tape T (see FIG. 3A). . The slicing device 1 is configured to remove the slackness of the tape T occurring between the outer periphery of the wafer W and the inner periphery of the ring frame F by heat shrinking when the expansion of the tape T is released. In this way, only the portion where the tape T is stretched and slackened is thermally contracted to maintain the interval between the wafers C so as to prevent the wafers C after the wafers W from being in contact with each other and broken.

On the front side of the wafer W, a grid-like dividing plan line L is provided, and various devices (not shown) are formed in each area defined by the dividing plan line L. In addition, the wafer W may be a semiconductor wafer in which IC, LSI, and other devices are formed on a semiconductor substrate such as silicon or gallium arsenide, or an LED may be formed on a ceramic, glass, or sapphire-based inorganic material substrate. Optical device wafer for optical devices. The wafer W is attached to the tape T that has been attached to the ring frame F, and the workpiece group WS in which the wafer W, the ring frame F and the tape T are integrated is carried into the dividing device 1.

The ring frame F of the workpiece group WS is closed with an opening portion by a heat-shrinkable tape T, and a wafer W is attached to the tape T inside the opening portion. A modified layer (not shown) is formed inside the wafer W along the planned division line L as a division starting point. In addition, the modified layer refers to a state where the density, refractive index, mechanical strength, and other physical characteristics of the wafer W are different from those of the surroundings by the irradiation of the laser, and the areas where the strength is lower than the surroundings are also caused. . The modified layer may be, for example, a melt-processed region, a crack region, a dielectric breakdown region, a refractive index change region, or a region in which these regions are mixed.

In the following description, although a modified layer formed inside the wafer W is exemplified as a starting point of division, the configuration is not limited to this. The starting point of division may be a starting point at the time of division of the wafer W, and may be constituted by, for example, a laser processing groove, a dicing groove, or a scribe line. The tape T is not particularly limited as long as it is a tape having elasticity and heat shrinkability. Moreover, the tape substrate is preferably formed of, for example, Polyolefin (PO), Polyvinyl Chloride (PVC).

A table 10 is arranged on the dividing device 1. The table 10 can suck and hold the wafer W through the tape T of the work group WS, and a ring frame F holding the work group WS is arranged around the work table 10. Frame holding device 20. The table 10 is supported by a plurality of pillar portions 11, and a porous perforated plate 12 is arranged on the upper surface of the table 10. A holding surface 13 for holding the wafer W is formed on the upper surface of the table 10 by the porous porous plate 12. The holding surface 13 is connected to the suction source 16 (see FIG. 4A) through a flow path in the table 10, and sucks and holds the wafer W by the negative pressure generated by the holding surface 13.

In addition, an on-off valve 14 (see FIG. 4A) is provided on the flow path that communicates from the holding surface 13 to the suction source 16, and the on-off valve 14 can be used to switch the suction holding of the wafer W by the holding surface 13 and the release of the suction. A plurality of roller portions 15 are rotatably provided on the outer peripheral edge of the table 10 so as to cover the entire periphery. The plurality of roller portions 15 can rotate to contact the tape T around the wafer W from the lower side while the wafer W is held on the holding surface 13. By the plurality of roller portions 15 rotatingly contacting the tape T, it is possible to suppress the friction of the tape T generated on the outer peripheral edge of the table 10 when the tape T is expanded.

The frame holding device 20 is formed by sandwiching a ring frame F on the mounting table 21 with a cover plate 22 from above to hold the ring frame F on the mounting table 21. At the center of the mounting table 21 and the cover plate 22, circular openings 23 and 24 having a larger diameter than the table 10 are formed, respectively. When the cover plate 22 has been covered on the mounting table 21, the ring frame F is held by the cover plate 22 and the mounting table 21, and the circular openings of the mounting table 21 and the cover plate 22 are maintained. 23 and 24, exposing a part of the wafer W and the tape T to the outside.

The frame holding device 20 fixes the cover plate 22 to the mounting table 21 in a state in which the cover frame 22 has covered the ring-shaped frame F on the mounting table 21 by, for example, a clamp portion (not shown). The frame holding device 20 is supported by a lifting device 26 which relatively moves and approaches the table 10 and the frame holding device 20 in a direction orthogonal to the holding surface 13. The lifting device 26 is composed of four electric cylinders which support the four corners of the table 21. The distance between the wafer W on the table 10 and the frame holding device 20 can be adjusted by controlling the protrusion amount of the cylinder rod 27 of the lifting device 26.

A shrinking device 30 is provided above the frame holding device 20. The shrinking device 30 is used to shrink and loosen the tape T. The shrinking device 30 is provided on the central axis of the wafer W, and a pair of heaters 32 are arranged at both ends of the winding arm 31 so as to sandwich the center of the wafer W and face each other. The heater 32 is configured, for example, to irradiate a far-red line with a spot, and the far-out line has a peak waveform of 3 μm to 25 μm, which is difficult to be absorbed by a metal material. Thereby, heating of each part of the apparatus can be suppressed, and the slack portion of the tape T between the outer periphery of the wafer W and the inner periphery of the ring frame F can be partially heated to perform heat shrinkage.

In addition, the winding arm 31 of the shrinking device 30 is provided with an up-and-down operation portion 33 that moves a pair of heaters 32 up and down and a rotation motor 34 that rotates the pair of heaters 32 The center of the wafer W is pivoted. The up-and-down operation portion 33 adjusts the height of the pair of heaters 32 to the tape T in cooperation with the ascending and descending operation of the frame holding device 20. The rotation motor 34 rotates a pair of heaters 32 so as to cover the entire periphery and heat the slack of the tape T around the wafer W. The pair of heaters 32 can be appropriately positioned with respect to the adhesive tape T by the up-and-down operation unit 33 and the rotation motor 34, so that the adhesive tape T around the wafer W can be heated well.

In addition, the division device 1 is provided with a control device 40 that integrates each unit of the control device. The control device 40 is composed of a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory), a RAM (Random Access Memory), and the like depending on the application. The expansion movement of the tape T can be controlled by the control device 40 moving the table 10 and the frame holding device 20 relatively, and the slack of the tape T can be removed by using one of the shrinking devices 30 to the heater 32 to control the shrinking movement of the tape T. In addition, the adjustment processing of a wafer interval described later can be controlled by the control device 40.

In such a dividing device 1, the frame holding device 20 is lowered in a state in which the ring frame F has been held, whereby the table 10 is removed from the cover plate 22 and the circular openings 23 and 24 on which the table 21 is placed. protruding. By pushing up the table 10 relative to the frame holding device 20, the tape T can be expanded in the radial direction to divide the wafer W into individual wafers C. When the frame holding device 20 is raised to release the expansion of the tape T, the tension of the tape T is relaxed. At this time, the tape T can be heated and contracted by the heater 32 to prevent the tape T around the wafer W from slackening.

In addition, as shown in FIG. 2, in the general dividing device 61, whenever wafer W is divided, uneven dispersion occurs at the interval between wafers C, and wafer C must be picked up by picker 65 in the next step. At this time, the position of the wafer C is identified. In addition, in order to divide the wafer W into a smaller wafer W, the tape T must be enlarged to prevent the wafers C from colliding with each other and broken, and the moving distance when the wafer C is picked up by the picker 65 becomes longer, and Increase pickup time. In addition, when the wafer C is positioned outside the moving range of the picker 65, the wafer C cannot be picked up.

Therefore, in the singulation device 1 (refer to FIG. 1) of this embodiment, after the tape T is expanded and the wafer W is divided into individual wafers C, the tape T is loosened to separate the adjacent wafers C. The interval is formed in advance. In this case, while the outer periphery of the divided wafer W is imaged by the imaging device 45 provided above the table 10, the outer periphery position of the imaged wafer W is aligned with the predetermined outer periphery position. To adjust the interval of the chip C. Then, the slackness of the tape T around the wafer W is removed by thermal shrinkage, so that the adjacent wafers C are fixed at intervals suitable for the pickup operation.

Hereinafter, a wafer gap adjustment process performed by the control device will be described with reference to FIG. 3. FIG. 3 is a diagram showing a wafer gap adjustment process in this embodiment.

As shown in FIG. 3A, when the table 10 is pushed up relatively to the frame holding device 20, the tape T is expanded and the wafer W is divided into individual wafers C. By extending the divided wafer W to the outer diameter D1, a space S1 can be formed between adjacent wafers C. After the wafer W is divided, the frame holding device 20 is brought close to the table 10 to release the expansion of the tape T. As a result, the outer diameter of the divided wafer W starts to decrease due to the elastic recovery of the tape T, and the adjacent wafers C gradually approach to narrow the interval between the adjacent wafers C.

At this time, an outer periphery photographing device 45 is provided above the table 10, and the outer periphery of the divided wafer W is photographed by the outer periphery photographing device 45. The peripheral imaging device 45 is connected to the control device 40 and inputs a captured image of the outer periphery of the wafer W from the peripheral imaging device 45 to the control device 40. In the control device 40, various image processing such as edge detection processing is performed with respect to the captured image, and the outer peripheral position of the wafer W is detected from the brightness difference and the like of the captured image. As described above, the tape T can be expanded during the division of the wafer W, and the peripheral position P1 can be detected by the peripheral imaging device 45 as the peripheral position of the wafer W.

As shown in FIG. 3B, when the outer periphery of the wafer W photographed by the outer periphery imaging device 45 is moved to the outer periphery position P2 by the proximity of the frame holding device 20 with respect to the table 10, the tape T can be attracted and held at The holding surface 13 of the table 10 is used to maintain the interval between the wafers C. At this time, the wafer W is narrowed to the outer diameter D2, and a predetermined interval S2 can be formed between adjacent wafers C. The interval S2 is an interval suitable for the pickup operation in the next step. In this way, the peripheral imaging device 45 monitors the peripheral position of the wafer W that changes according to the interval between adjacent wafers C, and adjusts the interval between the wafers C while measuring the interval between the wafers C indirectly.

Moreover, as shown in FIG. 3C, the outer peripheral position P2 of the wafer W is calculated in advance by a computing device 46 (see FIG. 1) connected to the control device 40 (see FIG. 3B). In more detail, the number of planned division lines of the wafer W is determined by the wafer size of the wafer W, and only the number of the predetermined division lines is used to calculate the wafer W when the wafer C is extended to the interval S2. Outside diameter D2. The outer peripheral position P2 of the wafer S corresponding to the interval S2 of the wafer C can be calculated based on the outer diameter D2 of the wafer W. It should be noted that the computing device 46 is composed of a processor, a memory, and the like that perform various processes similarly to the control device 40.

Further, as shown in FIG. 3D, an allowable range R indicated by a one-dot chain line may be set at the outer peripheral position P2 of the wafer W. In this case, when the outer periphery of the wafer W captured by the outer-peripheral imaging device 45 is within the allowable range R due to the proximity of the frame holding device 20 with respect to the table 10, it is judged as an adjacent wafer C The interval is the same as the preset interval S2. When the interval between the wafers C is adjusted in this way, the slackness of the tape T around the wafer W is removed by thermal shrinkage, so that the wafer C can be fixed while maintaining the state at a predetermined interval S2.

Next, a division operation performed by the division device according to this embodiment will be described with reference to FIG. 4. FIG. 4 is an explanatory diagram of a dividing operation performed by the dividing device according to this embodiment. 4A is an example of a dividing step, FIG. 4B is an example of a wafer interval adjustment step, FIG. 4C is an example of a tape suction holding step, and FIG. 4D is an example of a tape shrinking step.

As shown in FIG. 4A, the segmentation step may be performed first. In the dividing step, the wafer W is placed on the table 10 with the tape T therebetween, and the ring frame F around the wafer W is held by the frame holding device 20. At this time, the on-off valve 14 is closed, and the attraction force from the suction source 16 to the table 10 is blocked. Then, the frame holding device 20 is lowered by the control of the control device 40, and the table 10 and the frame holding device 20 are separated from each other. Thereby, the tape T is expanded in the radial direction, and the wafer W is divided into individual wafers C through the tape T using the modified layer having a reduced strength as a starting point.

As shown in FIG. 4B, a wafer interval adjustment step may be performed after the singulation step. In the wafer interval adjustment step, the frame holding device 20 is raised by the control of the control device 40, and the table 10 and the frame holding device 20 are brought close to each other. Thereby, the expansion of the tape T can be released, and the adjacent wafers C can be gradually approached by the elastic recovery of the tape T. At this time, the peripheral imaging device 45 is positioned above the table 10, and the periphery of the divided wafer W is photographed by the peripheral imaging device 45. The peripheral position of the wafer W can be detected from this captured image and compared with the peripheral position of the wafer W calculated in advance by the computing device 46 (see FIG. 1).

By the control device 40, the table 10 and the frame holding device 20 are brought close to each other until the outer peripheral position of the wafer W detected by the captured image coincides with the outer peripheral position of the wafer W that has been calculated in advance. The adjacent wafers C can be gradually approached, and the interval between the wafers C can be adjusted to a preset interval. Since the on-off valve 14 is closed when the interval between the wafers C is adjusted, there is no possibility that the deformation of the tape T is prevented by the table 10. In addition, by the proximity of the table 10 and the frame holding device 20, the tension of the tape T between the outer periphery of the wafer W and the inner periphery of the ring frame F can be relaxed, and the tape T around the wafer W can be relaxed. Produces slack.

As shown in FIG. 4C, the tape suction holding step may be performed after the wafer interval adjusting step. In the tape suction holding step, when a predetermined interval is formed between the wafers C by the control device 40, the on-off valve 14 can be opened to generate an attractive force on the table 10. Since the wafer C is attracted and held by the table 10 with the tape T interposed therebetween, there is no case where the tape T shrinks due to the elastic recovery, and adjacent wafers C can be maintained at a predetermined interval. In addition, the shrinking device 30 can be positioned above the wafer W, and the pair of heaters 32 can be rotated by the rotation motor 34 to start the thermal shrinkage of the tape T for relaxation.

As shown in FIG. 4D, the tape shrinking step may be performed after the tape suction holding step. In the tape shrinking step, the table 10 and the frame holding device 20 are brought closer to each other by the control device 40, thereby causing the tape T to relax between the outer periphery of the wafer W and the inner periphery of the ring frame F. At this time, while the height of the heater 32 is adjusted by the up-and-down operation portion 33 in accordance with the movement of the frame holding device 20, the pair of heaters 32 is used to thermally shrink the slack of the tape T around the wafer W. Since only the tape T around the wafer W is heat-shrinked, the interval between adjacent wafers C can be fixed in a maintained state even if the suction holding of the table 10 is released.

After the tape shrinking step, the on-off valve 14 is closed, and the suction of the tape T by the table 10 is released, so that the workpiece group WS can be transferred. In this way, since the interval between adjacent wafers C is fixed at a preset interval after the wafer W is divided, the interval between wafers C will not be excessively widened, and it can be used in the next step of the picking operation. Reduce the moving distance of the picker and reduce the picking time. In addition, since there is no uneven dispersion of the wafers C after the wafer W is divided, the picker can be operated in accordance with a predetermined operation program, and all the wafers C can be appropriately picked up.

As described above, in the dividing device 1 of the present embodiment, by separating the table 10 and the frame holding device 20 from each other when the wafer W is divided, the tape T can be expanded to a large extent and the modified layer can be used. As a starting point, the wafer W is surely divided. After the wafer W is divided, the table 10 and the frame holding device 20 are brought close to each other to release the expansion of the tape T and narrow the interval between adjacent wafers C. In addition, in a state where the interval between the adjacent wafers C has been narrowed to a predetermined interval, the interval between the wafers C can be fixed by removing the slack of the tape T around the wafer W. Accordingly, there is no case where uneven dispersion occurs at the pickup position of the wafer C or the pickup time becomes long. In this manner, the wafer W can be surely divided without deteriorating the pick-up property of the wafer C.

In addition, in this embodiment, although the structure is formed to image the outer peripheral position of the divided wafer and the interval between adjacent wafers is adjusted based on the outer peripheral position of the wafer, it is not limited to this configuration. . It is only necessary to have a configuration in which the interval between adjacent wafers can be adjusted to a preset interval, and the interval between wafers can be adjusted in any manner. For example, a configuration may be adopted in which the divided wafers are photographed, and the interval between adjacent wafers is measured from the photographed image, while the interval between the wafers is adjusted.

Specifically, as shown in FIG. 5A, when the wafer W is divided by the expansion of the tape T, a space S1 is formed between adjacent wafers C. After the wafer is divided, the expansion of the tape T is released, and the adjacent wafers C are gradually approached by the elastic recovery of the tape T. At this time, an imaging device 48 is provided above the table 10, and the divided wafer W is imaged by the imaging device 48. A measuring device 49 is connected to the photographing device 48, and various image processing can be performed on a captured image input from the photographing device 48, and the interval between adjacent wafers C can be measured by the measuring device 49.

Moreover, as shown in FIG. 5B, when the frame holding device 20 approaches the table 10 and the interval between the wafer C measured by the measuring device 49 and the preset interval S2 are consistent, the table 10 is used. To attract the holding tape T to maintain the interval between the wafers C. In this way, the interval between adjacent wafers C is monitored by the imaging device 48, and the interval between wafers C is adjusted while directly measuring the interval between wafers C. The measurement device 49 is configured by a processor, a memory, or the like that executes various processes in the same manner as the control device 40.

In addition, in this embodiment, although the structure which raises and lowers a frame holding facility with respect to a table is formed, it is not limited to this structure. As long as the lifting device is configured to allow the table and the frame holding device to be relatively close to and away from each other, for example, it may be configured to lift and lower the table relative to the frame holding device. The lifting device is not limited to an electric cylinder, and may be configured by other actuators.

Further, in this embodiment, the peripheral imaging device may be configured to image the outer periphery of a wafer, and for example, a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor may be used. , CMOS) and other imaging elements. In addition, the imaging device of the modification may be a structure capable of imaging a wafer, and may be an imaging element using a CCD, CMOS, or the like, for example.

In addition, although the embodiment of the present invention has been described, as another embodiment of the present invention, a form in which the above-mentioned embodiment and modification examples are combined in whole or in part may be used.

In addition, the embodiment of the present invention is not limited to the above-mentioned embodiments and modifications, and various changes, replacements, and modifications can be made without departing from the gist of the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used for implementation. Therefore, the scope of the patent claim covers all embodiments that can be included in the scope of the technical idea of the present invention.

In addition, in the present embodiment, the present invention will be described with respect to a configuration suitable for a dividing device, but it may be another expansion device suitable for appropriately expanding an adhesive tape. Industrial availability

As described above, the present invention has an effect that the wafer can be reliably divided without deteriorating the pick-up property of the wafer, and is particularly useful for a dividing device for dividing a semiconductor wafer.

1. 61‧‧‧ split device

10‧‧‧Workbench

11‧‧‧ pillar

12‧‧‧ multi-well plate

13‧‧‧ keep face

14‧‧‧On-off valve

15‧‧‧Roller Department

16‧‧‧ Attraction source

20‧‧‧Frame holding equipment

21‧‧‧ Loading table

22‧‧‧ Cover

23, 24‧‧‧ round opening

26‧‧‧Lifting equipment

27‧‧‧Cylinder rod

30‧‧‧ Shrinking Equipment

31‧‧‧ spiral arm

32‧‧‧heater

33‧‧‧Up and down action section

34‧‧‧Rotary motor

40‧‧‧Control equipment

45‧‧‧ peripheral photography equipment

46‧‧‧ Computing Equipment

48‧‧‧ shooting equipment

49‧‧‧ measuring equipment

51‧‧‧Modified layer (start of segmentation)

65‧‧‧ Picker

F‧‧‧ ring frame

T‧‧‧Tape

C‧‧‧Chip

W‧‧‧ Wafer

WS‧‧‧Article group

L‧‧‧ divided scheduled line

D1, D2‧‧‧

S1, S2‧‧‧ interval

P1, P2‧‧‧ peripheral position

R‧‧‧Allowable range

FIG. 1 is a perspective view of a dividing device according to this embodiment. FIG. 2 is an explanatory diagram of a wafer dividing operation and a picking operation of a comparative example. FIG. 3A to FIG. 3D are diagrams showing a wafer gap adjustment process in this embodiment. 4A to 4D are explanatory diagrams of a division operation performed by the division device according to this embodiment. 5A to 5B are diagrams illustrating a wafer gap adjustment process according to a modification.

Claims (1)

A slicing device is configured to attach a wafer formed with a slicing starting point to a tape formed by closing and opening an opening of a ring frame, and integrating the ring frame, the tape, and the wafer. The tape is expanded, and the wafer is divided using the dividing starting point as a starting point. The dividing device includes: a frame holding device that holds the ring-shaped frame; a table having a holding surface that is held by the holding device across the frame; Holding the wafer of the workpiece set to hold the wafer; lifting equipment to make the worktable and the frame holding equipment relatively close to and away from each other in a direction orthogonal to the holding surface; control equipment to make the worktable and the The frame holding equipment is moved in a direction away from each other to expand the tape, and after the wafer is divided with the starting point of the division as a starting point, the table and the frame holding equipment are moved in a close direction to bring adjacent wafers closer. And forming a narrowing interval set in advance; and a shrinking device, forming the interval by the control device, and maintaining the expanded tape with the holding surface to maintain The spacer, and that the stage holding device closer to the frame, between the inner circumference of the outer periphery of the annular frame and the wafer have been relaxed shrinkage of the adhesive tape, and the spacing of adjacent stationary wafer.