KR102426263B1 - Dividing apparatus - Google Patents

Abstract

An object of the present invention is to reliably divide a wafer without deteriorating the pick-up property of the chip.
A dividing device (1) for dividing a wafer (W) supported on a ring frame (F) via a tape (T) with a modified layer (51) as a starting point by extension of the tape, the wafer holding the wafer via the tape (T) The table 10, the frame holding means 20 for holding the ring frame around the wafer, the lifting means 26 for relatively approaching and separating the table and the frame holding means, and the space between the chips after dividing the wafer in advance Control means 40 for controlling the elevating means to reach a set interval, and while maintaining the interval between the chips at a preset interval, shrink the tape stretched between the outer periphery of the wafer and the inner periphery of the ring frame to reduce the chip spacing It was set as the structure provided with the contraction means 30 to fix.

Description

DIVIDING APPARATUS {DIVIDING APPARATUS}

The present invention relates to a dividing device for dividing a wafer into individual chips.

Conventionally, as this kind of dividing apparatus, dividing a wafer supported on a ring frame via a tape is known by expanding the tape along a division origin formed on the wafer (for example, refer to Patent Documents 1-3). In these dividing devices, a wafer is held on a dividing table and a ring frame is held on a ring-shaped table, and the wafer is pushed up relative to the ring frame, so that the tape is radially expanded and the wafer is divided into individual chips. The chips after division are picked up from the tape by a picker or the like in the next step.

[Patent Document 1] Japanese Patent Laid-Open No. 2016-004832 [Patent Document 2] Japanese Patent Laid-Open No. 2007-027250 [Patent Document 3] Japanese Patent Laid-Open No. 2015-204362

However, in order to divide a wafer having a small chip size, it is necessary to greatly expand the tape. When the tape is greatly expanded, the gap between the chips becomes too wide, and the chips cannot be picked up in the next step, or the pick-up time becomes long. On the other hand, it is also considered to improve the pick-up property of a chip by suppressing the expansion of a tape and making the space|interval between chips small, but a wafer with a small chip size cannot be divided|segmented appropriately. As described above, when the tape is greatly expanded, a problem arises in pickup, and when the expansion of the tape is suppressed, there is a problem that the wafer cannot be properly divided.

The present invention has been made in view of such a point, and an object of the present invention is to provide a dividing device capable of reliably dividing a wafer without deteriorating the pick-up property of the chip.

A dividing device according to an aspect of the present invention extends the tape of a work set in which the ring frame and the tape and the wafer are integrated by adhering a wafer having a dividing starting point to the adhesive tape by blocking the opening of the ring frame to expand the dividing starting point A dividing device for dividing a wafer from a starting point, comprising: a table having frame holding means for holding the ring frame; Elevating means for approaching and separating the frame holding means relatively in a direction perpendicular to the holding surface, and moving the table and the frame holding means apart in a direction to expand the tape to form a wafer with the dividing starting point as a starting point after dividing the table and the frame holding means by moving the table and the frame holding means in an approaching direction, a control means for forming a preset narrow gap by bringing adjacent chips closer; The gap is maintained by suctioning and holding the tape to the holding surface, the table and the frame holding means are brought closer to each other, and the tape stretched between the outer periphery of the wafer and the inner periphery of the ring frame is contracted to reduce the gap between adjacent chips. A contraction means for fixing is provided.

According to this configuration, when the wafer is divided, the table and the frame holding means are spaced apart, so that the tape is greatly expanded, so that the wafer is reliably divided with the starting point of division as a starting point. After the wafer is divided, when the table and the frame holding means approach each other, the expansion of the tape is released and the gap between adjacent chips is narrowed. Then, in a state in which the interval between adjacent chips is narrowed to a predetermined interval, the sagging of the tape around the wafer is removed, thereby fixing the interval between the chips. Therefore, the pickup position of the chip does not fluctuate or the pickup time becomes long. In this way, the wafer can be reliably divided without deteriorating the pick-up property of the chip.

According to the present invention, the tape is loosened after division of the wafer, and the tape sagging around the wafer is eliminated so that the interval between adjacent chips is fixed at a preset interval. Therefore, it is possible to reliably divide the wafer without deteriorating the pick-up property of the chip.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view of the division|segmentation apparatus of this embodiment.
2 is an explanatory diagram of a wafer division operation and a pickup operation of a comparative example.
Fig. 3 is a diagram showing an adjustment process for a chip interval according to the present embodiment.
It is explanatory drawing of the division|segmentation operation|movement by the division|segmentation apparatus of this embodiment.
Fig. 5 is a diagram showing a process for adjusting the chip spacing of the modified example.

Hereinafter, the division|segmentation apparatus of this embodiment is demonstrated with reference to an accompanying drawing. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view of the division|segmentation apparatus of this embodiment. 2 is an explanatory diagram of a wafer division operation and a pickup operation of a comparative example. In addition, the division|segmentation apparatus is not limited to the structure described in FIG. 1, It is possible to change suitably.

As shown in Fig. 1, the dividing device 1 divides the wafer W supported on the ring frame F via the tape T, and the individual chips C ( 3a)). In addition, the dividing device 1 thermally shrinks (heat shrink) the sagging of the tape T that occurs between the outer periphery of the wafer W and the inner periphery of the ring frame F at the time of releasing the expansion of the tape T. ) to remove it. In this way, the distance between the chips C is maintained so that only the portions where the tape T is stretched and stretched are thermally shrunk so that the chips C after the division of the wafer W do not come into contact with each other and are damaged.

A grid-like division line L is formed on the surface of the wafer W, and various devices (not shown) are formed in each region partitioned by the division line L. On the other hand, the wafer W may be a semiconductor wafer in which a device such as IC or LSI is formed on a semiconductor substrate such as silicon or gallium arsenide, or an optical device in which an optical device such as an LED is formed on a ceramic, glass, or sapphire-based inorganic material substrate. A wafer may be sufficient. The wafer W is adhered to the tape T pasted to the ring frame F, and the work set WS in which the wafer W, the ring frame F, and the tape T are integrated is attached to the dividing device 1 . are brought in

In the ring frame F of the work set WS, the opening is blocked by a tape T having heat shrinkability, and the wafer W is adhered to the tape T inside the opening. A modified layer (not shown) is formed inside the wafer W as a division starting point along the division scheduled line L. On the other hand, the modified layer refers to a region in which the density, refractive index, mechanical strength, and other physical properties of the wafer W are different from those of the surrounding area by laser irradiation, and the strength is lowered than the surrounding area. The modified layer may be, for example, a melt processing region, a crack region, a dielectric breakdown region, or a refractive index change region, and a region in which these are mixed.

In addition, in the following description, although the modified layer formed inside the wafer W is illustrated as a division|segmentation starting point, it is not limited to this structure. The division starting point may be a starting point at the time of division of the wafer W, and may be composed of, for example, a laser processing groove, a cutting groove, and a scribe line. In addition, the tape T should just have elasticity and heat shrinkability, and a material in particular is not limited. On the other hand, the tape base material (基材), for example, is preferably formed of PO (Polyolefin), PVC (Polyvinyl Chloride).

In the dividing device 1, a table 10 capable of sucking and holding the wafer W through the tape T of the work set WS is arranged, and around the table 10 is a ring frame ( Frame holding means 20 for holding F) are arranged. The table 10 is supported by a plurality of struts 11 , and a porous porous plate 12 is disposed on the upper surface of the table 10 . A holding surface 13 for sucking and holding the wafer W is formed on the upper surface of the table 10 by the porous porous plate 12 . The holding surface 13 is connected to a suction source 16 (refer to FIG. 4A ) through a flow path in the table 10 , and the wafer W is sucked and held by the negative pressure generated on the holding surface 13 .

In addition, an on/off valve 14 (refer to FIG. 4A ) is provided in the flow path extending from the holding surface 13 to the suction source 16 , and the holding surface 13 for the wafer W is provided by the on/off valve 14 . Suction hold and suction release are switched. In the outer peripheral edge of the table 10, the some roller part 15 is rotatably provided over the whole perimeter. The plurality of roller units 15 are in rolling contact with the tape T around the wafer W from below in a state where the wafer W is held by the holding surface 13 . The friction of the tape T which arises in the outer peripheral edge of the table 10 at the time of the expansion of the tape T by the some roller part 15 rolling-contacting the tape T is suppressed.

The frame holding means 20 sandwiches the ring frame F on the placement table 21 from above with the cover plate 22 , and holds the ring frame F on the placement table 21 . are doing In the center of the arrangement table 21 and the cover plate 22 , circular openings 23 and 24 having a larger diameter than the table 10 are respectively formed. When the cover plate 22 is put on the placement table 21 , the ring frame F is held by the cover plate 22 and the placement table 21 , and the placement table 21 and the cover plate 22 are Part of the wafer W and the tape T are exposed from the circular openings 23 and 24 to the outside.

In the frame holding means 20, in a state in which the cover plate 22 is covered on the ring frame F on the placement table 21, for example, the cover plate 22 is secured to the placement table 21 by a clamp unit (not shown). is fixed on The frame holding means 20 is supported by the lifting means 26 which separates and approaches the table 10 and the frame holding means 20 in the direction orthogonal to the holding surface 13 relatively. The raising/lowering means 26 is comprised by the four electric cylinders which support the four corners of the placement table 21. As shown in FIG. By controlling the amount of protrusion of the cylinder rod 27 of the lifting means 26 , the distance between the wafer W on the table 10 and the frame holding means 20 is adjusted.

Above the frame holding means 20, a shrinking means 30 for shrinking the sagging generated in the tape T is provided. The shrinking means 30 is provided on the central axis of the wafer W, and a pair of heaters 32 are disposed at both ends of the swing arm 31 so as to face each other with the center of the wafer W interposed therebetween. . The heater 32 is configured to spot-irradiate far-infrared rays having a peak waveform of 3 µm to 25 µm, which is difficult to be absorbed by a metal material, for example. Thereby, heating of each part of the apparatus is suppressed, and the sagging of the tape T between the outer periphery of the wafer W and the inner periphery of the ring frame F is partially heated and thermally shrunk.

In addition, in the pivot arm 31 of the shrinking means 30 , a vertical operation unit 33 for moving the pair of heaters 32 up and down, and the pair of heaters 32 around the central axis of the wafer W are provided. A rotation motor 34 for rotating the furnace is provided. The vertical operation unit 33 adjusts the height of the pair of heaters 32 with respect to the tape T in accordance with the lifting operation of the frame holding means 20 . The rotation motor 34 turns the pair of heaters 32 so that the sagging of the tape T around the wafer W is heated over the entire circumference. By properly positioning the pair of heaters 32 with respect to the tape T by the up-and-down operation part 33 and the rotation motor 34, the tape T around the wafer W is well heated.

Moreover, the division|segmentation apparatus 1 is provided with the control means 40 which collectively controls each part of the apparatus. The control means 40 is comprised by a processor, a memory, etc. which execute various processes. The memory is constituted by one or a plurality of storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) depending on the purpose. The table 10 and the frame holding means 20 are moved relative to each other by the control means 40 to control the expansion operation of the tape T, and the tape (T) by a pair of heaters 32 of the shrinking means 30 The sagging of T) is removed so that the shrinking operation of the tape T is controlled. Moreover, the adjustment process of the chip|tip space|interval mentioned later is controlled by the control means 40. As shown in FIG.

In this dividing device 1, the frame holding means 20 is lowered while holding the ring frame F, so that the table ( 10) is projected. As the table 10 is pushed up relative to the frame holding means 20 , the tape T is expanded in the radial direction so that the wafer W is divided into individual chips C . Further, when the frame holding means 20 is raised to release the extension of the tape T, the tension of the tape T is loosened. At this time, the tape T is heated by the heater 32 so that the tape T around the wafer W does not sag so that it is thermally contracted.

However, as shown in Fig. 2, in the general dividing device 61, every time the wafer W is divided, the interval of the chips C varies. ), the position of the chip (C) must be recognized when picking up. In addition, in order to divide the wafer W with a small chip size, it is necessary to greatly expand the tape T so that the chips C do not rub against each other, and when the chip C is picked up by the picker 65 . The longer the travel distance, the longer the pickup time. In addition, when the chip C is positioned outside the movement range of the picker 65, the chip C cannot be picked up.

Therefore, in the division apparatus 1 (refer FIG. 1) of this embodiment, after the tape T is enlarged and the wafer W is divided into individual chips C, the space|interval of the adjacent chips C The tape T is loosened so that it may become this preset space|interval. In this case, while the outer periphery of the divided wafer W is imaged by the outer periphery imaging means 45 provided above the table 10, the position of the outer periphery of the wafer W in the captured image is matched with a predetermined outer periphery position The spacing of the chips (C) is being adjusted. And, by removing the sagging of the tape T around the wafer W by thermal shrinkage, the adjacent chips C are fixed at an interval suitable for the pickup operation.

Hereinafter, with reference to FIG. 3, the adjustment process of the chip|tip space|interval by a control means is demonstrated. Fig. 3 is a diagram showing an adjustment process for a chip interval according to the present embodiment.

As shown in FIG. 3A , when the table 10 is pushed up relative to the frame holding means 20 , the tape T is expanded to divide the wafer W into individual chips C. As shown in FIG. As the wafer W after division is widened to the outer diameter D1, a gap S1 is formed between the adjacent chips C. As shown in FIG. After the division of the wafer W, the frame holding means 20 approaches the table 10 to release the expansion of the tape T. Thereby, the outer diameter of the wafer W after division|segmentation begins to become small by the elastic recovery of the tape T, the adjacent chip|tip C gradually approaches, and the space|interval of the adjacent chip|tip C narrows.

At this time, the outer periphery imaging means 45 is provided above the table 10, and the outer periphery of the wafer W after division|segmentation is imaged by the outer periphery imaging means 45. As shown in FIG. The outer peripheral imaging means 45 is connected to the control means 40 , and the captured image of the outer periphery of the wafer W is input to the control means 40 from the outer peripheral imaging means 45 . In the control means 40, various image processes, such as an edge detection process, are performed with respect to a captured image, and the outer peripheral position of the wafer W is detected from the luminance difference etc. of a captured image. As described above, when the wafer W is divided, the tape T is extended, and the outer peripheral position P1 is detected as the outer peripheral position of the wafer W by the outer peripheral imaging means 45 .

As shown in FIG. 3B, when the outer periphery of the wafer W imaged by the outer peripheral imaging means 45 moves to the outer peripheral position P2 by the approach of the frame holding means 20 to the table 10, The tape T is sucked and held on the holding surface 13 of the table 10 so that the gap between the chips C is maintained. At this time, the wafer W is narrowed down to the outer diameter D2, and a preset gap S2 is formed between the adjacent chips C. On the other hand, the space|interval S2 is a space|interval suitable for the pickup operation|movement of the next process. In this way, the outer periphery position of the wafer W, which changes according to the distance between the adjacent chips C, is monitored by the outer periphery imaging means 45, and the distance between the chips C is measured while indirectly the distance between the chips C is measured. is adjusting

On the other hand, as shown in FIG. 3C , the outer peripheral position P2 of the wafer W is calculated in advance by the calculation means 46 (see FIG. 1 ) connected to the control means 40 (see FIG. 3B ). has been More specifically, the number of division lines of the wafer W is determined according to the chip size of the wafer W, and the wafer W when the chip C is widened to the interval S2 by the number of division lines. ) of the outer diameter D2 is calculated. Based on the outer diameter D2 of the wafer W, the outer peripheral position P2 of the wafer W corresponding to the spacing S2 between the chips C is calculated. On the other hand, the calculation means 46, similar to the control means 40, is constituted by a processor, a memory, or the like that executes various processes.

In addition, as shown in FIG. 3D , an allowable range R as indicated by a dashed-dotted line may be set at the outer peripheral position P2 of the wafer W. As shown in FIG. In this case, when the outer periphery of the wafer W imaged by the outer periphery imaging means 45 falls within the allowable range R due to the approach of the frame holding means 20 to the table 10, the adjacent chips C It is determined that the interval of is coincided with the preset interval S2. When the distance between the chips C is adjusted in this way, the sagging of the tape T around the wafer W is removed by thermal contraction, so that the chips C maintain the preset distance S2. is fixed

Next, with reference to FIG. 4, the division|segmentation operation|movement by the division|segmentation apparatus of this embodiment is demonstrated. It is explanatory drawing of the division|segmentation operation|movement by the division|segmentation apparatus of this embodiment. Fig. 4A shows an example of a dividing step, Fig. 4B shows an example of a chip gap adjustment step, Fig. 4C shows an example of a tape suction holding step, and Fig. 4D shows an example of a tape shrinking step, respectively.

As shown in FIG. 4A , a division process is first performed. In the division process, the wafer W is placed on the table 10 via the tape T, and the ring frame F around the wafer W is held by the frame holding means 20 . At this time, the on-off valve 14 is closed, and the suction force to the table 10 from the suction source 16 is interrupted|blocked. Then, the frame holding means 20 is lowered by the control of the control means 40 , and the table 10 and the frame holding means 20 are separated from each other. Thereby, the tape T is expanded in the radial direction, and the wafer W is divided into individual chips C using the modified layer whose strength has been lowered through the tape T as a starting point.

As shown in FIG. 4B , a chip spacing adjustment process is performed after the division process. In the chip spacing adjustment process, the frame holding means 20 is raised by the control of the control means 40 , and the table 10 and the frame holding means 20 are approached. Thereby, the expansion of the tape T is cancelled|released, and the adjacent chip|tip C approaches gradually by the elastic recovery of the tape T. At this time, the outer periphery imaging means 45 is located above the table 10 , and the outer periphery of the divided wafer W is imaged by the outer periphery imaging means 45 . The outer peripheral position of the wafer W is detected from this captured image, and compared with the outer peripheral position of the wafer W calculated in advance by the calculation means 46 (refer to FIG. 1).

The table 10 and the frame holding means 20 approach by the control means 40 until the outer peripheral position of the wafer W detected from the captured image matches the outer peripheral position of the wafer W calculated in advance. do. Adjacent chips C are gradually approached, and the spacing between the chips C is adjusted to a preset interval. Since the on-off valve 14 is closed at the time of the interval adjustment of the chip|tip C, the deformation|transformation of the tape T is not inhibited by the table 10. In addition, due to the approach of the table 10 and the frame holding means 20, the tension of the tape T between the outer periphery of the wafer W and the inner periphery of the ring frame F is loosened, and the tape ( T) is stretched.

As shown in FIG. 4C , the tape suction holding process is performed after the chip spacing adjusting process. In the tape suction holding step, when a predetermined interval is formed between the chips C by the control means 40 , the on-off valve 14 is opened and a suction force is generated in the table 10 . Since the chip C is sucked and held through the tape T by the table 10, the tape T is not contracted by elastic recovery, and the adjacent chips C are held at a preset interval. In addition, the shrinking means 30 is positioned above the wafer W, and the pair of heaters 32 are rotated by the rotary motor 34 to initiate thermal shrinkage of the tape T sagging.

As shown in FIG. 4D , the tape shrinking process is performed after the tape suction holding process. In the tape shrinking step, the table 10 and the frame holding means 20 are further brought closer to each other by the control means 40, so that the tape T between the outer periphery of the wafer W and the inner periphery of the ring frame F is stretched. This happens. At this time, in accordance with the movement of the frame holding means 20 , the height of the heater 32 is adjusted by the vertical operation unit 33 , and the tape T around the wafer W is moved by a pair of heaters 32 . The sagging heat shrinks. Since only the tape T around the wafer W is thermally shrunk, even when the suction holding of the table 10 is released, the space between the adjacent chips C is maintained and fixed.

And the on-off valve 14 is closed after a tape shrinking process, suction of the tape T by the table 10 is cancelled|released, and conveyance of the work set WS is enabled. In this way, since the interval between the adjacent chips C is fixed at a preset interval after the division of the wafer W, the interval between the chips C is not too wide and the Pick-up time can be shortened by shortening the travel distance. Further, since the chips C do not fluctuate after the wafer W is divided, all the chips C can be properly picked up by moving the picker according to a prescribed operation program.

As described above, in the dividing apparatus 1 of the present embodiment, when the wafer W is divided, the table 10 and the frame holding means 20 are spaced apart, so that the tape T is greatly expanded and the wafer W is divided. is reliably divided with the modified layer as a starting point. After the wafer W is divided, when the table 10 and the frame holding means 20 approach each other, the expansion of the tape T is released and the gap between the adjacent chips C is narrowed. Then, in a state where the interval between the adjacent chips C is narrowed to a preset interval, the sagging of the tape T around the wafer W is removed, whereby the interval between the chips C is fixed. Therefore, the pick-up position of the chip|tip C does not generate|occur|produce a fluctuation|variation or the pick-up time becomes long. In this way, it is possible to reliably divide the wafer W without deteriorating the pickup property of the chip C.

In addition, in this embodiment, although it was set as the structure which imaged the outer periphery position of the divided wafer, and adjusted the space|interval of the adjacent chip|tip based on the outer periphery position of a wafer, it is not limited to this structure. As long as the interval between adjacent chips is adjusted at a preset interval, the interval between chips may be adjusted in any way. For example, it is good also as a structure which adjusts the space|interval of a chip|tip while imaging a divided wafer and measuring the space|interval of adjacent chips from a captured image.

Specifically, as shown in FIG. 5A , when the wafer W is divided by the expansion of the tape T, a gap S1 is formed between the adjacent chips C. As shown in FIG. After the wafer is divided, the expansion of the tape T is released, and the adjacent chips C are gradually approached by the elastic recovery of the tape T. At this time, the imaging means 48 is provided above the table 10, and the wafer W after division|segmentation is imaged by the imaging means 48. A measuring unit 49 is connected to the imaging unit 48 , and various image processing is performed on the captured image inputted from the imaging unit 48 , and the interval between adjacent chips C is performed by the measuring unit 49 . This is measured

And, as shown in FIG. 5B, by the approach of the frame holding means 20 to the table 10, the interval of the chips C measured by the measuring means 49 coincides with the preset interval S2. On the lower surface, the tape T is suction-held by the table 10, and the space|interval of the chip|tip C is maintained. In this way, the spacing between the adjacent chips C is monitored by the imaging means 48, and the spacing of the chips C is adjusted while the spacing of the chips C is directly measured. On the other hand, the measuring means 49, similarly to the control means 40, is comprised by a processor, a memory, etc. which execute various processes.

In addition, in this embodiment, although it was set as the structure in which a raising/lowering means raises/lowers a frame holding means with respect to a table, it is not limited to this structure. The raising/lowering means should just be a structure which makes a table and a frame holding means relatively approach and space|separate, and it is good also as a structure which raises/lowers a table with respect to a frame holding means, for example. In addition, the lifting means is not limited to an electric cylinder, You may be comprised by other actuators.

In the present embodiment, the outer periphery imaging means may have a configuration capable of imaging the outer periphery of the wafer, and for example, an imaging device such as a CCD (Charged Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) may be used. In addition, the imaging means of a modification may just be a structure which can image a wafer, For example, imaging devices, such as a CCD and CMOS, may be used.

In addition, although embodiment of this invention has been described, as another embodiment of this invention, what combined the said embodiment and modified example in whole or part may be sufficient.

In addition, embodiment of this invention is not limited to the above-mentioned embodiment and modified example, You may change, substitute, and deform variously in the range which does not deviate from the meaning of the technical idea of this invention. Furthermore, if the technical idea of the present invention can be realized in other ways due to technological advances or other derived technologies, it may be implemented using the method. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

In addition, in this embodiment, although the structure which applied this invention to a division|segmentation apparatus was demonstrated, it is also applicable to another expand apparatus which expands a tape suitably.

As described above, the present invention has the effect of reliably dividing a wafer without deteriorating the pick-up property of the chip, and is particularly useful for a dividing device for dividing a semiconductor wafer.

1: partition device 10: table
13: holding surface 20: frame holding means
26: lifting means 30: retracting means
40: control means 51: modified layer (partition origin)
C: Chip F: Ring Frame
T: Tape W: Wafer
WS: Workset

Claims (1)

In a dividing device for dividing the wafer from the dividing starting point by expanding the tape of the work set in which the ring frame and the tape and the wafer are integrated by attaching the wafer having the dividing origin to the adhesive tape by blocking the opening of the ring frame in,
frame holding means for holding the ring frame;
a table having a holding surface for holding a wafer through said tape of a set of works held by said frame holding means;
elevating means for approaching and separating the table and the frame holding means in a direction orthogonal to the holding surface relatively;
After moving the table and the frame holding means in a direction apart to expand the tape to divide the wafer from the dividing starting point, the table and the frame holding means are moved in an approaching direction to bring adjacent chips closer together. a control means for forming a narrowed gap by
imaging means for imaging the outer periphery of the divided wafer or the narrowed interval of the divided wafer;
The outer periphery of the wafer after division obtained by the imaging means while the distance between adjacent chips is approaching by the control means is set in advance so that the narrowed gap formed by the control means is equal to the preset gap When moving to a position or when the narrowed interval obtained by the imaging means becomes equal to a preset interval, the extended tape is sucked and held by the holding surface to maintain the narrowed interval, and the table and the frame Contracting means for further bringing the holding means closer, and for shrinking the tape stretched between the outer periphery of the wafer and the inner periphery of the ring frame, thereby fixing the gap between adjacent chips.
A partitioning device comprising a.

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