KR101144537B1 - 전도체 및 이의 제조방법 - Google Patents

전도체 및 이의 제조방법 Download PDF

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Publication number
KR101144537B1
KR101144537B1 KR1020100069157A KR20100069157A KR101144537B1 KR 101144537 B1 KR101144537 B1 KR 101144537B1 KR 1020100069157 A KR1020100069157 A KR 1020100069157A KR 20100069157 A KR20100069157 A KR 20100069157A KR 101144537 B1 KR101144537 B1 KR 101144537B1
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KR
South Korea
Prior art keywords
pattern
electrically conductive
conductor
conductive pattern
transparent substrate
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KR1020100069157A
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English (en)
Korean (ko)
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KR20110007593A (ko
Inventor
이동욱
황인석
전상기
황지영
최현
홍영준
김수진
김기환
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주식회사 엘지화학
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Priority to PCT/KR2010/004675 priority Critical patent/WO2011008055A2/ko
Priority to JP2012520547A priority patent/JP5726869B2/ja
Priority to CN201080032114.4A priority patent/CN102598891B/zh
Priority to US13/384,096 priority patent/US8692445B2/en
Publication of KR20110007593A publication Critical patent/KR20110007593A/ko
Application granted granted Critical
Publication of KR101144537B1 publication Critical patent/KR101144537B1/ko
Priority to US13/785,715 priority patent/US9049788B2/en
Priority to JP2013207574A priority patent/JP5766759B2/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Position Input By Displaying (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020100069157A 2009-07-16 2010-07-16 전도체 및 이의 제조방법 Active KR101144537B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/KR2010/004675 WO2011008055A2 (ko) 2009-07-16 2010-07-16 전도체 및 이의 제조방법
JP2012520547A JP5726869B2 (ja) 2009-07-16 2010-07-16 伝導体およびその製造方法
CN201080032114.4A CN102598891B (zh) 2009-07-16 2010-07-16 电导体及其制造方法
US13/384,096 US8692445B2 (en) 2009-07-16 2010-07-16 Electrical conductor and a production method therefor
US13/785,715 US9049788B2 (en) 2009-07-16 2013-03-05 Electrical conductor and a production method therefor
JP2013207574A JP5766759B2 (ja) 2009-07-16 2013-10-02 伝導体およびその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090065106 2009-07-16
KR1020090065103 2009-07-16
KR20090065103 2009-07-16
KR1020090065106 2009-07-16

Publications (2)

Publication Number Publication Date
KR20110007593A KR20110007593A (ko) 2011-01-24
KR101144537B1 true KR101144537B1 (ko) 2012-05-11

Family

ID=43614002

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KR1020100069157A Active KR101144537B1 (ko) 2009-07-16 2010-07-16 전도체 및 이의 제조방법

Country Status (5)

Country Link
US (2) US8692445B2 (https=)
JP (2) JP5726869B2 (https=)
KR (1) KR101144537B1 (https=)
CN (1) CN102598891B (https=)
TW (1) TWI550649B (https=)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5725818B2 (ja) * 2010-12-01 2015-05-27 富士フイルム株式会社 透明導電シートの製造方法、透明導電シート及びプログラム
KR101224282B1 (ko) * 2011-03-04 2013-01-21 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
KR101385898B1 (ko) 2011-03-28 2014-04-16 주식회사 엘지화학 전도성 기판 및 이를 포함하는 터치스크린
DE102011102999A1 (de) * 2011-05-24 2012-11-29 Leonhard Kurz Stiftung & Co. Kg Folie und deren Herstellungsverfahren
CN103649883B (zh) * 2011-07-11 2017-09-08 富士胶片株式会社 导电片及其制造方法、触摸屏以及显示装置
JP5734243B2 (ja) * 2011-07-11 2015-06-17 富士フイルム株式会社 導電シート、タッチパネル及び表示装置
JP5870555B2 (ja) * 2011-08-31 2016-03-01 大日本印刷株式会社 マイクロルーバー粘着シート及び画像表示装置
JP5991554B2 (ja) * 2011-09-27 2016-09-14 エルジー・ケム・リミテッド 透明基板の製造方法
CN103765356B (zh) * 2011-09-27 2016-12-07 Lg化学株式会社 包括导电图案的触控面板
JP5910913B2 (ja) * 2011-09-30 2016-04-27 大日本印刷株式会社 網状部材
JP5809117B2 (ja) * 2011-10-05 2015-11-10 富士フイルム株式会社 導電シート、タッチパネル、表示装置
KR101451075B1 (ko) * 2011-12-16 2014-10-15 후지필름 가부시키가이샤 도전 시트 및 터치 패널
WO2013095078A1 (ko) * 2011-12-23 2013-06-27 주식회사 엘지화학 전도성 기판 및 이를 포함하는 전자소자
JP5974587B2 (ja) * 2012-03-29 2016-08-23 大日本印刷株式会社 透明導電部材
KR101373044B1 (ko) * 2012-04-19 2014-03-11 삼성디스플레이 주식회사 터치 스크린 패널
CN102722279A (zh) * 2012-05-09 2012-10-10 崔铮 金属网格导电层及其具备该导电层的触摸面板
CN102903423B (zh) * 2012-10-25 2015-05-13 南昌欧菲光科技有限公司 透明导电膜中的导电结构、透明导电膜及制作方法
JP6289494B2 (ja) * 2012-12-07 2018-03-07 スリーエム イノベイティブ プロパティズ カンパニー 導電性物品
CN103426502B (zh) * 2013-02-05 2016-08-03 南昌欧菲光科技有限公司 图形化透明导电膜
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JP2014191445A (ja) * 2013-03-26 2014-10-06 Fujifilm Corp タッチパネル及び表示装置
CN103247366B (zh) * 2013-03-28 2015-04-08 南昌欧菲光科技有限公司 电容式透明导电膜及其制造方法
KR20140129805A (ko) * 2013-04-30 2014-11-07 삼성전기주식회사 터치센서
TWI632207B (zh) * 2013-07-01 2018-08-11 德商漢高智慧財產控股公司 奈米粒子墨水組成物、方法及應用
KR102108846B1 (ko) * 2013-07-16 2020-05-11 엘지이노텍 주식회사 터치 윈도우
DE102013215060A1 (de) * 2013-07-31 2015-02-05 Irlbacher Blickpunkt Glas Gmbh Kapazitive Sensorvorrichtung mit elektrisch leitfähig beschichteter Sensorplatte aus Dünnglas
FR3009436B1 (fr) * 2013-08-01 2015-07-24 Saint Gobain Fabrication d'une electrode grille par demouillage d'argent
JP6162897B2 (ja) * 2013-08-16 2017-07-12 エルジー ディスプレイ カンパニー リミテッド 導電性基板およびその製造方法
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WO2018054768A1 (en) 2016-09-21 2018-03-29 Koninklijke Philips N.V. Capacitive touchscreen mirror device and method of manufacturing
CN108062187A (zh) * 2016-11-07 2018-05-22 京东方科技集团股份有限公司 触控结构及其制作方法和触控装置
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CN114253420B (zh) * 2021-12-13 2023-08-22 合肥维信诺科技有限公司 触控显示面板及触控显示装置
KR102913375B1 (ko) * 2023-04-25 2026-01-16 주식회사 볼트크리에이션 화상 왜곡 방지 필터 및 그 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002318553A (ja) 2001-04-20 2002-10-31 Toshiba Corp 自己発光型表示装置
KR20080004556A (ko) * 2005-04-01 2008-01-09 니폰샤신인사츠가부시키가이샤 차량용 투명 안테나 및 안테나 부착 차량용 유리
KR20090048610A (ko) * 2006-08-30 2009-05-14 스미또모 가가꾸 가부시키가이샤 유기 전계 발광 소자
KR20090051007A (ko) * 2006-09-04 2009-05-20 도레이 카부시키가이샤 광 투과성 전자파 실드 부재 및 그 제조 방법

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1236505A (en) 1914-06-06 1917-08-14 Dutchess Tool Co Dough-rounding-up machine.
JPS5197770A (en) 1975-02-25 1976-08-27 Haisenyododentaino himakukeiseihoho
JPS556833A (en) 1978-06-29 1980-01-18 Nippon Mektron Kk Cirucit board and method of manufacturing same
WO1980002459A1 (en) 1979-04-30 1980-11-13 Immunology Dev Corp New and improved methodology for the immunodiagnosis of multiple sclerosis and/or malignant diseases from blood sample analysis
DE3320183A1 (de) 1983-06-03 1984-12-06 ANT Nachrichtentechnik GmbH, 7150 Backnang Verfahren zum herstellen gedruckter schaltungen
JPH0554326A (ja) 1991-08-23 1993-03-05 Mitsubishi Electric Corp パターン形成法およびそれを用いた平面型薄膜磁気ヘツドの製法
JP3402637B2 (ja) 1992-12-28 2003-05-06 キヤノン株式会社 太陽電池の製造方法、その製造装置及び長尺シート基板の製造方法
JPH10200234A (ja) 1997-01-07 1998-07-31 Pfu Ltd 微細パターンのプリント配線板およびその製造方法
US6377138B1 (en) 1997-07-28 2002-04-23 Kabushiki Kaisha Toshiba Surface acoustic wave device with a layered conductive film and method of producing the same
KR100269520B1 (ko) 1997-07-29 2000-10-16 구본준 박막트랜지스터, 액정표시장치와 그 제조방법
JP2000114773A (ja) * 1998-10-08 2000-04-21 Nippon Sheet Glass Co Ltd 電磁波遮蔽用フィルタとプラズマディスプレ前面板
JP2000315890A (ja) 1999-04-30 2000-11-14 Hitachi Chem Co Ltd 電磁波シールドフィルムの製造方法、電磁波シールドフィルム並びにこの電磁波シールドフィルムを用いた電磁波遮蔽体及びディスプレイ
JP2000315683A (ja) 1999-05-06 2000-11-14 Hitachi Ltd 多層配線とその形成方法およびレジスト軟化装置
JP2001077098A (ja) 1999-09-03 2001-03-23 Toshiba Corp エッチング液、及びこれを用いる薄膜パターンの製造方法
TW493285B (en) 2000-10-23 2002-07-01 Nat Science Council A new grid electrode technique for LEDs fabrication
US7321362B2 (en) 2001-02-01 2008-01-22 3M Innovative Properties Company Touch screen panel with integral wiring traces
JP4803473B2 (ja) 2001-08-28 2011-10-26 大日本印刷株式会社 ドライフィルムレジストを用いた電子部品の製造方法、電子部品及びハードディスク用サスペンション
JP5046350B2 (ja) 2001-03-29 2012-10-10 大日本印刷株式会社 ウェットエッチングを採用した電子部品の製造方法、電子部品及びハードディスク用サスペンション
JP3854889B2 (ja) 2001-04-19 2006-12-06 キヤノン株式会社 金属または金属化合物パターンの製造方法および電子源の製造方法
JP4718725B2 (ja) 2001-07-03 2011-07-06 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置の製造方法
JP2003302742A (ja) * 2002-04-10 2003-10-24 Seiko Epson Corp マスク、光反射膜付き基板、光反射膜の製造方法、および液晶表示装置、並びに電子機器
TWI250342B (en) * 2002-09-30 2006-03-01 Seiko Epson Corp Electro-optic device and electronic apparatus
EP2099050A3 (en) 2002-12-27 2009-10-07 Fujifilm Corporation Method for producing a metallic silver pattern on a transparent substrate and manufacture of a light-transmitting electromagnetic wave-shielding film
JP4641719B2 (ja) 2002-12-27 2011-03-02 富士フイルム株式会社 透光性電磁波シールド膜の製造方法及び透光性電磁波シールド膜
KR100741962B1 (ko) 2003-11-26 2007-07-23 삼성에스디아이 주식회사 평판표시장치
KR101192746B1 (ko) 2004-11-12 2012-10-18 엘지디스플레이 주식회사 폴리형 박막 트랜지스터 기판의 제조방법
KR20060060795A (ko) 2004-11-30 2006-06-05 삼성전자주식회사 박막 트랜지스터 및 디스플레이 픽셀 제조방법
CN100501459C (zh) * 2005-05-31 2009-06-17 索尼株式会社 液晶显示器，光学片的制造方法和光学片
JP4610416B2 (ja) 2005-06-10 2011-01-12 日本写真印刷株式会社 静電容量型タッチパネル
US8580128B2 (en) 2005-06-20 2013-11-12 Toray Industries, Inc. Method of manufacturing electromagnetic-wave shielding plate, electromagnetic-wave shielding plate manufactured thereby, and filter display using the same
US7418202B2 (en) 2005-08-04 2008-08-26 3M Innovative Properties Company Article having a birefringent surface and microstructured features having a variable pitch or angles for use as a blur filter
KR20070047956A (ko) 2005-11-03 2007-05-08 삼성전자주식회사 표시 기판의 제조방법
JP2007128091A (ja) 2005-11-03 2007-05-24 Samsung Electronics Co Ltd 表示基板及びその製造方法並びにそれを具備した表示パネル
CN100517075C (zh) 2006-03-09 2009-07-22 北京京东方光电科技有限公司 一种薄膜晶体管液晶显示器的阵列基板的制作方法
JP2008009921A (ja) 2006-06-30 2008-01-17 Optrex Corp 入力装置、及びその製造方法
JP4907456B2 (ja) * 2006-08-30 2012-03-28 住友化学株式会社 有機エレクトロルミネッセンス素子
JP2008083497A (ja) 2006-09-28 2008-04-10 Epson Imaging Devices Corp 電極基板の製造方法
US7932183B2 (en) 2006-11-14 2011-04-26 Mitsubishi Electric Corporation Method of manufacturing multilayer thin film pattern and display device
JP2008134975A (ja) 2006-11-29 2008-06-12 Optrex Corp 入力装置及びその製造方法
JP2008251822A (ja) * 2007-03-30 2008-10-16 Toray Ind Inc 網目状導電体被覆付き基板およびその製造方法
US7852002B2 (en) 2007-05-03 2010-12-14 Lg Electronics Inc. Filter and plasma display device thereof
KR20080104587A (ko) 2007-05-28 2008-12-03 엘지전자 주식회사 필터 및 그를 이용한 플라즈마 디스플레이 장치
JP2009009249A (ja) 2007-06-26 2009-01-15 Nissha Printing Co Ltd 静電容量式タッチパネル及びこれを用いた２方式併用タッチパネル
JP2009176198A (ja) 2008-01-28 2009-08-06 Hitachi Displays Ltd タッチパネル付表示装置
KR100940437B1 (ko) * 2008-06-13 2010-02-10 주식회사 엘지화학 발열체 및 이의 제조방법
JP5197418B2 (ja) 2008-08-26 2013-05-15 三菱電機株式会社 反射防止膜及びその製造方法、並びに表示装置
KR20110121679A (ko) * 2009-03-02 2011-11-08 도레이 카부시키가이샤 네트상 금속 미립자 적층 필름 및 그 제조방법
US8599150B2 (en) * 2009-10-29 2013-12-03 Atmel Corporation Touchscreen electrode configuration

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002318553A (ja) 2001-04-20 2002-10-31 Toshiba Corp 自己発光型表示装置
KR20080004556A (ko) * 2005-04-01 2008-01-09 니폰샤신인사츠가부시키가이샤 차량용 투명 안테나 및 안테나 부착 차량용 유리
KR20090048610A (ko) * 2006-08-30 2009-05-14 스미또모 가가꾸 가부시키가이샤 유기 전계 발광 소자
KR20090051007A (ko) * 2006-09-04 2009-05-20 도레이 카부시키가이샤 광 투과성 전자파 실드 부재 및 그 제조 방법

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