WO2013095078A1 - 전도성 기판 및 이를 포함하는 전자소자 - Google Patents
전도성 기판 및 이를 포함하는 전자소자 Download PDFInfo
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- WO2013095078A1 WO2013095078A1 PCT/KR2012/011398 KR2012011398W WO2013095078A1 WO 2013095078 A1 WO2013095078 A1 WO 2013095078A1 KR 2012011398 W KR2012011398 W KR 2012011398W WO 2013095078 A1 WO2013095078 A1 WO 2013095078A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 252
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 28
- 238000002310 reflectometry Methods 0.000 claims description 23
- 238000005286 illumination Methods 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 48
- 239000011295 pitch Substances 0.000 description 46
- 239000010410 layer Substances 0.000 description 21
- 230000008569 process Effects 0.000 description 17
- 238000007639 printing Methods 0.000 description 16
- 238000005530 etching Methods 0.000 description 9
- -1 silver halide Chemical class 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000007645 offset printing Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 210000001525 retina Anatomy 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000008447 perception Effects 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Definitions
- the present invention relates to a conductive substrate and an electronic device including the same. Specifically, the present invention relates to a conductive substrate that not only has excellent conductivity but also does not obscure a field of view, and an electronic device including the same.
- the touch panel having the above function may be classified as follows according to a signal detection method.
- the most common resistive and capacitive touch panels use a transparent conductive film such as an ITO film to recognize whether the touch is caused by electrical contact or change in capacitance.
- the transparent conductive film as described above has a high resistance of 150 ohm / square or more, so the sensitivity is large at the time of enlargement, and as the size of the screen increases, the price of the ⁇ film is not easy to be commercialized.
- an attempt has been made to implement an enlargement by using a metal pattern with high conductivity.
- highly conductive metal patterns there are problems that obscure the field of view.
- a conductive substrate comprising a transparent substrate and a conductive pattern comprising a conductive line provided on the transparent substrate
- the conductive pattern includes a cell closed by the conductive line, and defines a square value of 0.5 of the area of the cell as the Characteristic Length Lc of the cells,
- a graph 1 representing the following equation 1 and a graph 2 representing the following equation 2 are shown with the average length Lc av of the characteristic lengths Lc of the cells as the X axis and the line width W of the conductive line as the Y axis. Wherein, at the intersection of the lower region of the graph 1 and the lower region of the graph 2, the line width W of the conductive line and the average length Lc av of the characteristic lengths of the cells are included.
- W is the line width of the conductive line
- Lc av is the average of the characteristic length of the cell closed by the conductive line
- AR is the aperture ratio of the conductive pattern
- Q is a constant.
- a conductive substrate comprising a transparent substrate and a conductive pattern comprising a conductive line provided on the transparent substrate
- the conductive pattern includes a cell closed by the conductive line, and characterized in that the characteristic length Lc of the cells defined as 0.5 square values of the area of the cell satisfies Equation 3 below.
- ⁇ is the number of subpixels that are listed in one direction in each pixel of the display to which the conductive substrate applied, "
- ⁇ and Y 2 are each represented by the following formula:
- Q is the diagonal length (inch) of the effective surface portion of the display to which the conductive substrate is applied.
- a conductive substrate comprising a transparent substrate and a conductive pattern including conductive lines provided on the transparent substrate
- the conductive pattern includes a cell closed by the conductive line, and characterized in that the characteristic length Lc of the cell, which is defined as 0.5 square value of the area of the cell, satisfies Equation 4 below.
- n is the number of sub pixels arranged in one direction in each pixel of the display to which the conductive substrate is applied
- Lp is the characteristic length Lp of the pixel defined as the 0.5th square of the area of each pixel of the display to which the conductive substrate is applied.
- a conductive substrate comprising a transparent substrate and a conductive pattern comprising a conductive line provided on the transparent substrate
- Line width (W) of the conductive line is characterized in that the following relation 6 To provide a conductive substrate:
- W is the line width of the conductive line
- ⁇ 3 is a real number in the range ⁇ ⁇ ⁇ 3 ⁇ ⁇ 2 , where ⁇ and Y 2 are each represented by the following formula:
- Q is the diagonal length (inch) of the effective surface portion of the display to which the conductive substrate is applied.
- a conductive substrate comprising a transparent substrate and a conductive pattern including a conductive line provided on the transparent substrate
- the line width (W) of the conductive line provides a conductive substrate, characterized by satisfying the following relation:
- W is the line width of the conductive line
- Lp is the characteristic length (Lp) of the pixel defined as the 0.5 squared value of the area of each pixel of the display to which the conductive substrate is applied.
- a conductive substrate comprising a transparent substrate and a conductive pattern comprising a conductive line provided on the transparent substrate
- the line width (W) of the conductive line provides a conductive substrate characterized by satisfying the following relation:
- W is the line width of the conductive line
- ⁇ 3 is a real number (um) in the range ⁇ ⁇ ⁇ 3 ⁇ ⁇ 2 , where and Y 2 are each represented by the following formula:
- Q is the validation of the display to which the conductive substrate is applied. Diagonal length in inches.
- a conductive substrate comprising a transparent substrate and a conductive pattern comprising a conductive line provided on the transparent substrate
- the line width (W) of the conductive line provides a conductive substrate, characterized by satisfying the following relation:
- W is the line width of the conductive line
- Lp is the characteristic length (um) of the pixel defined as the 0.5 squared value of the area of each pixel of the display to which the conductive substrate is applied.
- a conductive substrate comprising a transparent substrate and a conductive pattern including a conductive line provided on the transparent substrate, wherein the visible line width (W v ) of the conductive line satisfies the following Expression 12, and is greater than 0 and less than 3.6 dB.
- W is the line width of the conductive line
- R m is the reflectivity of the conductive line material constituting the conductive pattern.
- another exemplary embodiment of the present invention provides an electronic device including the conductive substrate.
- another exemplary embodiment of the present invention provides a display device including the conductive substrate.
- the present invention when the correlation between the average of the characteristic length of the cell closed by the conductive line and the line width of the conductive line is used, it is possible to provide a conductive substrate having excellent conductivity but not covering the field of view. As a result, it may be usefully used in an electronic device in which visibility is important, such as a touch panel or an organic light emitting device.
- the pitch according to the display and the pixel can be derived from the diagonal length (inch) of the effective screen portion of the display, and thus the pitch and the line width according to the pixel of the metal mesh pattern can be derived.
- the viewing characteristics of the conductive pattern can be improved more effectively.
- Fig. 1 shows the allowable area of the line width (W) of the conductive line defined by the graph of relations 1 and 2 defined in the present invention and the average value Lc av of the characteristic length of the cell closed by the conductive line according to the aperture ratio. It is shown.
- FIG. 2 is a diagram illustrating pixels and subpixels of a display according to an exemplary embodiment of the present invention.
- FIG. 3 is a diagram illustrating a correlation between pixel pitches and diagonal lines (inch) of an effective screen portion of a display according to an exemplary embodiment of the present invention.
- FIG. 4 is a diagram schematically illustrating nonuniformity of color of pixels of a display according to an exemplary embodiment of the present invention.
- FIG. 5 is a diagram schematically illustrating a region where a display is covered according to a metal mesh pattern according to an exemplary embodiment of the present invention.
- FIG. 6 and 7 illustrate a process of forming a conductive pattern of a touch panel according to the present invention.
- FIGS. 8 and 9 are diagrams showing conductive patterns according to examples and comparative examples of the present invention.
- 10 is a view showing the configuration and structure (Scheme) of the device for measuring the clear reflection in accordance with an embodiment of the present invention.
- 11 is a view schematically showing a relationship between visible line widths according to an exemplary embodiment of the present invention.
- CPD cycle per degree
- FIG. 13 is a diagram illustrating a luring function according to CPD according to an exemplary embodiment of the present invention.
- Conductive substrate according to the present invention a conductive substrate comprising a conductive substrate comprising a transparent substrate and a conductive line provided on the transparent substrate,
- the conductive pattern includes a cell closed by the conductive line, and defines a square value of 0.5 of the area of the cell as the Characteristic Length (Lc) of the cells,
- a graph 1 representing the following equation 1 and a graph 2 representing the following equation 2 are shown with the average length Lc av of the characteristic lengths Lc of the cells as the X axis and the line width W of the conductive line as the Y axis.
- the line width W of the conductive line and the average length Lc av of the characteristic lengths of the cells are included.
- W is the line width of the conductive line
- Lc av is the average of the characteristic length of the cell closed by the conductive line
- AR is the aperture ratio of the conductive pattern
- ⁇ is a constant.
- the visibility of the conductive pattern does not depend solely on one or two conditions such as the opening ratio or the width of the conductive line, and the various conditions such as the shape, size, and opening ratio of the conductive pattern and the line width and line spacing of the conductive line. It is derived from the finding that it depends on all of them.
- the present invention if the conductive pattern includes cells closed by the conductive line, regardless of the shape of the conductive pattern, by adjusting the opening ratio or the line width of the conductive line within a specific range, the conductive pattern does not obscure the field of view Can be provided.
- the characteristic length (Lc) of the cell closed by the conductive line is defined as 0.5 square value of the area of the cell.
- the characteristic length of the cell may be an indicator of the shape and size of the conductive pattern and the line spacing of the conductive lines that affect the visibility of the conductive pattern.
- relation 1 is a relation between the characteristic length of the sal and the width of the conductive line according to the opening ratio.
- relation equation for determining visibility as well as the condition of the relation 1, relation 2 showing the relationship between the characteristic length of the sal and the width of the conductive line was derived.
- the visibility of the conductive pattern can be reliably ensured by satisfying not only the conditions of the lower region of the graph of relation 1, but also the conditions of the lower region of the graph of relation 2 above.
- ⁇ is a constant determined according to process materials or conditions, and may be generally determined by a real number of 0 to 2, and may be 2 as an example.
- the touch panel employed in the display is configured through a fine metal mesh wire, the diagonal length of the effective screen portion of the display for concealing the metal wire of the touch panel made of metal while maintaining the display performance is maintained.
- the relationship between line width and pitch of metal mesh lines according to (inch) is defined in relation to the reflectivity of the metal material.
- the most important factor in constructing the touch panel using the metal mesh pattern has been mainly used to reduce the perception of the line through the miniaturization of the line width of the metal mesh pattern.
- the perception of the line varies even with the pitch of the line and the distance between the lines constituting the mesh pattern along with the reduction of the line width.
- this pitch size has a correlation with optical characteristics such as moire and transmittance, and thus has a disadvantage of lowering the freedom of design for a manufacturer when manufacturing a touch panel using a para mesh pattern. have.
- the present invention preferentially set an appropriate pitch according to the diagonal length of the effective screen portion of the display. Also, such blood By adjusting the reflectivity of the metal, the problem of recognizing the line, which may occur in the existing invention according to the pitch, is changed, thereby minimizing the correlation between the pitch and the line width.
- the present invention proposes a method for allowing a user to conceal acid as much as possible in the manufacture of a touch panel, and at the same time, freely set a pitch in moire or transmittance.
- a display defines the size of pixels according to the distance a person looks at the display.
- the pixel refers to an aggregate of sub pixels composed of R / G / B. Since most of the pixels are almost square, the pixel is a pixel.
- the pitch of is the size of the pixel.
- the pixels used for display are about 75 / ⁇ for mobile, about 150 // m for tablets, laptops, and monitors, depending on the distance used, and for TV models. It is common to have a pixel size of about 200 Hz. 2 shows a pixel and a subpixel of a display according to an exemplary embodiment of the present invention.
- displays typically have a defined pitch of pixels based on the average distance that people use the display.
- the pitch of the pixels of such a display can be inferred from information on the display specification since the LCD can be assumed to have a square shape, for example.
- the pitch of the pixel inferred through the PPKpixel per inch shown on the display is as follows.
- the pixel pitch Ppixel may be represented by Equation 1 below.
- A represents the maximum horizontal resolution of the display
- B represents the maximum resolution of the vertical display
- the pitch range of the metal mesh pattern through the following analysis.
- the most preferable one is that in the display pixel because only one mesh line or the intersection point of the mesh is positioned per pixel when the mesh pattern is not rotated. It keeps the color evenly.
- the display pixel is generally composed of three subpixels having a length ratio of about 3: 1, and in the case of an OLED, the pentile method is composed of four sub pixels.
- the pitch of the mesh pattern When the pitch of the mesh pattern is introduced at 0.25 times or less of the pitch area of the pixel mentioned above, local pixel color unevenness may occur due to the line width of the mesh pattern or the intersection of the mesh patterns. Since there exists an area
- the present inventors have introduced the pitch that the metal mesh pattern of the touch panel should have in the display.
- Conductive substrate according to the present invention a conductive substrate comprising a conductive substrate comprising a transparent substrate and a conductive line provided on the transparent substrate,
- the conductive pattern includes a cell closed by the conductive line, and characterized in that the characteristic length Lc of the cells defined as the square of 0.5 of the area of the cell satisfies Equation 3 below.
- ⁇ is the number of sub-pixels arranged in one direction in each pixel of the display to which the conductive substrate is applied
- ⁇ and Y 2 are each represented by the following formula:
- Q is the diagonal length (inch) of the effective surface portion of the display to which the conductive substrate is applied.
- a conductive substrate comprising a conductive substrate including a transparent substrate and a conductive line provided on the transparent substrate,
- the conductive pattern includes a cell closed by the conductive line, and characterized in that the characteristic length Lc of the cell, which is defined as 0.5 square value of the area of the cell, satisfies Equation 4 below.
- n is the number of subpixels arranged in one direction in each pixel of the display to which the conductive substrate is applied
- Lp is the characteristic length Lp of the pixel, which is defined as the 0.5 squared value of the area of each pixel of the display to which the conductive substrate is applied.
- the characteristic length Lc of the cells may satisfy the following Equation 5.
- n is the number of subpixels arranged in one direction in each pixel of the display to which the conductive substrate is applied
- Ppixel 1 is the pitch of the short width of each pixel of the display to which the conductive substrate is applied
- 1 1 ⁇ 1 2 is the pitch of the long width of each pixel of the display to which the conductive substrate is applied.
- An important part of the pitch with the introduction of "previously defined metal mesh pattern may be referred to as part of the width of the mesh pattern.
- the pixels on the display are W
- the opening area can be recalculated as follows when the display is covered according to the line width of the metal mesh pattern.
- the difference in aperture ratio should be about 3%. Therefore, based on this, the pitch of the pixel of the display and the metal mesh pattern of the touch panel should be determined. The correlation of line width was derived.
- Conductive substrate according to the present invention a conductive substrate comprising a conductive substrate comprising a transparent substrate and a conductive line provided on the transparent substrate,
- the line width (W) of the conductive line provides a conductive substrate characterized by satisfying the following relation:
- W is the line width of the conductive line
- Y 3 is a real number in the range ⁇ ⁇ 3 ⁇ ⁇ 2 , where and ⁇ 2 are each represented by the following formula:
- Q is the diagonal length (inch) of the effective surface portion of the display to which the conductive substrate is applied.
- the conductive substrate according to the present invention is a conductive substrate comprising a conductive pattern including a transparent substrate and a conductive line provided on the transparent substrate,
- the line width (W) of the conductive line provides a conductive substrate, characterized by satisfying the following relation:
- W is the line width of the conductive line
- Lp is equal to 0.5 of the area of each pixel of the display to which the conductive substrate is applied.
- the line width (W) of the conductive line may satisfy the following Equation 8. ⁇ Relationship 8>
- W is the line width of the conductive line
- the conductive substrate according to the present invention is a conductive substrate comprising a conductive substrate including a transparent substrate and a conductive line provided on the transparent substrate,
- the line width (W) of the conductive line provides a conductive substrate characterized by satisfying the following relation:
- W is the line width of the conductive line
- ⁇ 3 is a real number (um) in the range ⁇ ⁇ 3 ⁇ ⁇ 2 , where and Y 2 are each represented by the following formula:
- Q is the diagonal length (inch) of the effective surface portion of the display to which the conductive substrate is applied.
- the conductive substrate according to the present invention is a conductive substrate comprising a conductive pattern including a transparent substrate and a conductive line provided on the transparent substrate,
- the line width (W) of the conductive line provides a conductive substrate, characterized by satisfying the following relation:
- W is the line width of the conductive line
- Lp is the characteristic length (um) of the pixel defined by the square of 0.5 of the area of each pixel of the display to which the conductive substrate is applied.
- the line width (W) of the conductive line may satisfy the following Equation 11. ⁇ Relationship 11>
- w is the line width of the conductive line
- Ppixel is the pitch of each pixel of the display to which the conductive substrate is applied.
- the display is streaked through three colors of R, G, and B to express an image by making white and black.
- the most important part in this regard is the part about the visibility of the metal mesh pattern in the black state.
- the reason why the recognition of the metal mesh pattern in the black state is important is that the black state is defined as the most basic state in the LCD, and the expression of black color on the screen is the most important factor in the image quality of the display. This is because it has a very important effect on. From this point of view, the recognition of the metal wires in the metal mesh pattern in the contact state is a very important factor.
- the factors affecting the recognition of the metal wires are not only the physical line width of the metal but also the material of the metals. Reflectivity is also very relevant.
- the concept of a new visible line width including the reflectivity of the material forming the metal line as well as the existing physical line width in this respect is defined as follows.
- the visible line width W v of the conductive line satisfies the following relational expression (12).
- w is the line width of the conductive line
- R m is the reflectivity of the conductive line material constituting the conductive pattern.
- the display panel's pitch in pixels is pixcel
- the line width of the mesh pattern is w
- the reflectivity of the mesh pattern material is R m
- the display panel is clear in the display off mode where the mesh pattern is applied. If the reflectivity is a, the total reflectivity of the display including the metal mesh pattern may be represented by the following equation.
- W x R m can be replaced with the visible line width (W v ) summarized in the above relation 12, and since the value of the visible line width is 0 or more, the following equation 13 can be finally derived. ⁇ Relationship 13>
- a may be 0.11 or less, but is not limited thereto.
- b may be 0.03 or less, and may be 0.115 or less, but is not limited thereto.
- the visible line width (W v ) according to the relation 13 may be greater than ⁇ 3.6, or less, and may be greater than 0 2.4 GHz or less, but is not limited thereto.
- the clear reflection reflectance is measured by observing only the reflectivity of the surface to be measured after making the reflectance zero by using a black paste or a tape on the opposite side of the surface to which the reflectance is to be measured.
- the incoming light source selected a diffuse light source that most closely resembled the ambient light conditions.
- the measurement position which measures a reflectance at this time was based on the position inclined about 7 degree
- the aspect ratio of the screen is 16: 9
- the height of the screen is h
- the diagonal length is d
- the viewing angle of the user for viewing the display Is a
- the width of the screen is w
- the viewing distance between the eye and the screen is D '
- D 1.62641 (Inches should be substituted in cm. Unit cm)
- the ability to distinguish human objects is expressed in angular resolution. This indicates how many pairs of black and white lines can be distinguished within the range of 1 degree.
- the black / white pair is called 1 cycle and is expressed as Cycle per degree (CPD) (FIG. 12). This is how many cycles there are in the w width corresponding to the 1 degree audio visual range at a distance D as shown below. 50 CPD, or 50 cycles, is known as the limit of the human retina (FIG. 13).
- (number of pixels in the distance x 2) 7 ⁇ is the CPD value, and the upper and lower limits of the retina are distinguishable are 0.5 and 50, respectively.
- the pitch of the pixel according to the produced display inch represented by the solid black line is converted into CPD.
- the CPD value is about 9.8, which is about 20 pixels in the range of about 1 degree from the viewer's viewing distance. It can be interpreted to mean that the arrangement rules are followed, which may correspond to an area near 8, which is an area where the luminous function according to the CPD becomes Max in FIG. 13.
- the conductive line may be made of straight lines, but various modifications such as curved lines, wavy lines, and zigzag lines are possible. In addition, at least two of the above-mentioned lines may be common.
- the conductive pattern is a cell closed by the conductive line may include a polygonal pattern of three or more, for example, triangular, four, five, six or seven or more.
- the conductive pattern may include a regular pattern.
- the rule pattern means that the form of the pattern has regularity.
- the former The conductive pattern may include a mesh in the form of a rectangle or a square, or a pattern in the form of a hexagon.
- the conductive pattern In order to manufacture the above-described conductive pattern, first, determine the desired pattern shape, and then use a printing method, a photolithography method, a photography method, a method using a mask, a sputtering method, an inkjet method, or the like on a transparent substrate.
- the line width is thin and precise conductive patterns can be formed.
- the printing method may be performed by transferring a paste including a conductive pattern material onto a transparent substrate in a desired pattern shape and then baking the paste.
- the transfer method is not particularly limited, and the pattern may be formed on a pattern transfer medium such as an intaglio or a screen, and a desired pattern may be transferred onto the transparent substrate using the pattern shape.
- the method of forming the pattern shape on the pattern transfer medium may use a method known in the art.
- the printing method is not particularly limited, and the printing method of offset printing, screen printing, gravure printing, flexo printing, inkjet printing, etc. may be used, among which
- the printing method may use a roll to roll method, a roll to plate, a plate to roll, or a plate to late method.
- Gravure offset printing may be performed by filling a paste on a patterned intaglio and then performing primary transfer with a blanket, followed by secondary transfer by bringing the blanket and the transparent substrate into close contact with each other.
- gravure printing may be performed by winding a blanket with a pattern engraved thereon, filling a paste into a pattern, and then deforming the transfer method to a transparent substrate.
- the above schemes as well as the above schemes may be used in combination. It is also possible to use a printing method known to those skilled in the art, such as a screen printing method.
- the photolithography process is not limited to the above-described printing method. May be available.
- the photolithography process is the after forming the conductive pattern material layer on the entire surface of the transparent substrate, forming a photoresist, the host layer thereon and selectively exposed and developed pattern of the photoresist layer by a ball purification, patterned
- the photoresist layer may be used as an etching resist to pattern the conductive pattern and to remove the photoresist layer.
- the present invention may also utilize a photography method.
- the photosensitive material may be patterned by selective exposure and development processes. More detailed examples are as follows.
- a negative photosensitive material is coated on a substrate on which a pattern is to be formed.
- a polymer film such as PET or acetyl salloid may be used as the substrate.
- the polymer film material coated with the photosensitive material will be referred to herein as a film.
- the negative photosensitive material may be composed of silver halide (Silver Halide) in which a little Agl is mixed with AgBr, which is generally very sensitive to light and regularly reacts with light. Since the image processed by photographing a general negative photosensitive material is negative in contrast with a subject, contrast may be photographed by using a mask having a pattern shape, preferably an irregular pattern shape.
- Plating may be further performed to increase the conductivity of the conductive pattern formed using photolithography and a photolithography process.
- the plating is electroless
- a plating method may be used, and copper or nickel may be used as the plating material, and nickel plating may be performed thereon after copper plating, but the scope of the present invention is not limited only to these examples.
- the present invention may also use a method using a hard mask.
- a mask having the shape of the desired conductive pattern may be placed close to the substrate and then patterned using a method of depositing a conductive quite turn material onto the substrate.
- the deposition method may be thermal vapor deposition by heat or electron beam and PVE physical vapor deposition such as sputter, or chemical vapor deposition (CVD) using an organometallic material.
- CVD chemical vapor deposition
- the present invention can also be prepared via an imprinting process. After coating a resin capable of imprinting on a substrate on which conductive metals are deposited, it is printed using a mold pattern prepared in advance, followed by dry etching and etching processes. After patterning the metal wire, the resin may be removed, or the black imprinting resin may be patterned through a mold, and then partially filled with a conductive material between the patterns to use itself or may be transferred to another substrate. have.
- the conductive pattern is a conductive line width of 20 micrometers or less And may include conductive lines having a line width of 15 micrometers or less, 10 micrometers or less, 7 micrometers or less, 4 micrometers or less, or 3 micrometers or less.
- the line width of the conductive line can be adjusted within the range of 0.5 to 10 micrometers.
- the aperture ratio of the conductive pattern that is, the area ratio of the transparent substrate not covered by the pattern is preferably 70% or more, 90% or more, 93% or more, 95% or more, 96% or more, 97% or more. , 98% or more, 99% or more.
- the conductor may include a region in which the conductive pattern is not formed.
- the conductive pattern may be blackened. This can further reduce the visibility even when the conductive pattern is made of a metallic material.
- the paste black or black ink for forming the conductive pattern is added, or the printing is performed after printing and firing the paste or ink. As a result, the conductive pattern can be degraded.
- Blackening materials that may be added to the ink or paste include metal oxides, carbon blocks, carbon nanotubes, pigmented pigments, and colored glass frits.
- the post-firing cross-linking treatment is an oxidation solution such as Fe or Cu ions when the ink or paste is Ag-based. It can be treated by immersion in the solution, immersion in a halogen ion-containing solution such as chlorine ions, immersion in hydrogen peroxide, nitric acid, or the like with halogen gas.
- blackening is a deposition layer on the face of a person and a layer for imparting conductivity thereon.
- the method of deposition and patterning in one step in the subsequent etching process can be used.
- a blackening layer is deposited through MoOxNy
- an A1 layer is deposited thereon, and a resist ink is printed and etched on such a substrate
- MoOxNy and A1 are an etchant such as a mixture of phosphoric acid, nitric acid, acetic acid, and water.
- the transparent substrate is not particularly limited, but the light transmittance is preferably 50% or more, preferably 75% or more, and more preferably 88% or more.
- glass may be used as the transparent substrate, or a plastic substrate or a plastic film may be used.
- the plastic substrate or film may be a material known in the art, for example selected from polyacrylic, polyurethane, polyester, polyepoxy, polyolefin, polycarbonate and cellulose. What formed with 1 or more types of resin can be used.
- PET polyethylene terephthalate
- PVB polyvinylbutyral
- PEN polyethylene naphthalate
- PES polyethersulfon
- PC polycarbonate
- acet Films having a visible light transmittance of 80% or more such as tilcells are preferable. It is preferable that the thickness of the said plastic film is 12.5-500 micrometers, It is more preferable that it is 50-450 micrometers, It is more preferable that it is 50-250 micrometers.
- the plastic substrate may be a substrate having various functional layers such as a moisture barrier, a gas barrier layer for blocking gas, a strength reinforcement and transmittance improvement, and a hard coat layer for reducing haze value on one or both surfaces of the plastic film.
- various functional layers such as a moisture barrier, a gas barrier layer for blocking gas, a strength reinforcement and transmittance improvement, and a hard coat layer for reducing haze value on one or both surfaces of the plastic film.
- the functional layer that may be included in the plastic substrate is not limited to those described above, and various functional layers may be provided.
- the conductive pattern may be directly formed on a component included in a device or device to which the conductive substrate of the present invention is applied, such as a display, a touch panel, or an organic light emitting diode lighting, for example.
- the resistivity value of the conductive pattern material is preferably 1 microOhm cm or more and 100 micrometers or less, and more preferably 1 micron has a value of ⁇ cm or more and 5 microOhm cm or less.
- Specific examples of conductive pattern materials include aluminum, copper, silver, gold, iron, molybdenum, nickel, carbon nanotubes (CNT), titanium and alloys thereof (Alloy) Black oxide, nitride or oxynitride Etc. can be used. However, aluminum is the best in terms of price and conductivity desirable.
- the conductive pattern material may be converted into a particle form, and in this case, the particle form may be a particle having a single composition black or a mixed composition of the metals listed above.
- the ink black paste when using the ink or paste containing the conductive pattern material, may further include an organic binder in addition to the conductive pattern material described above to facilitate the printing process. It is preferable that the organic binder has a property of volatilization in the firing process.
- the organic binder include polyacrylic resins, polyurethane resins, polyester resins, polyolefin resins, polycarbonate resins, cellulose resins, polyimide resin polyethylene naphthalate resins, and modified epoxy resins. It is not limited only to.
- the conductive substrate according to the present invention may be connected to a power source, wherein the resistance value per unit area in consideration of the opening ratio is O.Olohm / square to 100Ohm / square at room temperature, preferably 5ohm / square to 150ohm / square.
- the conductive substrate according to the present invention can be used for the purpose of conducting a current or applying a voltage by external factors other than the configuration of the conductive substrate itself.
- the conductive substrate according to the present invention can be used in various applications for which conductivity is required. For example, it can be used for electromagnetic shielding film, touch panel, light emitting device auxiliary electrode, solar cell auxiliary electrode and the like.
- the auxiliary electrode for the light emitting device is specifically an organic light emitting device DLED) It may be a bright auxiliary electrode. .
- an electronic device that includes a conductive substrate of the present invention described above.
- the electronic device may further include a display pixel substrate provided on at least one side of the conductive organ, and each pixel of the display pixel substrate may include two or more subpixels. In this case, each pixel of the display pixel substrate may include three or four sub pixels.
- the electronic device may be a touch panel, an organic light emitting device lighting, or an organic solar cell.
- a display device including the conductive substrate of the present invention described above.
- Touch panel according to the present invention is a lower base; Upper substrate; And an electrode layer provided on any one surface or both surfaces of the lower substrate and the surface in contact with the upper substrate.
- the electrode layer may perform X-axis position detection and Y-axis position detection, respectively.
- the electrode provided on the surface in contact with the lower substrate and the upper substrate of the lower substrate; And one or both of the electrode worm provided on the upper substrate and the surface in contact with the lower substrate of the upper substrate may be a conductive substrate according to the present invention described above.
- the other may have a pattern known in the art.
- an insulating layer or a spacer is provided between the lower substrate and the upper substrate so as to maintain a constant distance between the electrode layers and prevent connection. It may be provided. It is preferable that the said insulating layer is an adhesive or UV or thermosetting resin.
- the touch panel may further include a ground connected to the conductive pattern described above. For example, the ground portion may be formed at an edge portion of a surface on which the conductive pattern of the transparent substrate is formed.
- At least one surface of the conductive substrate may be provided with at least one of an antireflection film, a polarizing film, or a door film.
- an antireflection film may further include a functional film of another kind.
- Such a touch panel may be applied to display devices such as OLED display panels (OLEDs), liquid crystal displays (LC LcDs), cathode ray tubes (CRTs), and PDPs. .
- the touch panel according to the present invention is not limited to the structure as described above, the structure in which both the first electrode and the second electrode is formed on one substrate, or the electrode filling of the lower substrate is laminated on the surface where the electrode layer of the upper substrate is not provided It also includes a structure.
- an organic light emitting diode (OLED) auxiliary electrode including the conductive substrate of the present invention described above and an organic light emitting diode comprising the same
- the organic light emitting device illumination according to the present invention comprises a crab 1 electrode, an auxiliary electrode disposed on the first electrode, an insulating layer disposed on the auxiliary electrode, at least one organic layer and a second electrode
- the auxiliary electrode may be a conductive pattern according to the present invention.
- the auxiliary electrode may be directly formed on the first electrode, or a conductive substrate including a transparent substrate and a conductive pattern may be positioned on the first electrode.
- another embodiment according to the present invention provides an auxiliary electrode of an organic solar cell (solar cell) having the same or similar structure as the auxiliary electrode for an organic light emitting device (OLED) illumination and an organic solar cell comprising the same.
- OLED organic light emitting device
- a stripe pattern having a line width of 2.7 ⁇ was formed through a printing process, and a conductive pattern was formed through an etching and a peeling process.
- the conductive pattern according to Example 1 is shown in FIG. 8, and the conductive pattern according to Comparative Example 1 is shown in FIG. 9. As shown in the results of FIGS. 8 and 9, it can be seen that a conductive pattern having a line width of more than 3% with respect to the pixel pitch of the display has disadvantageous visibility characteristics.
- Examples 11 to 12 and Comparative Examples 11 to 12> As shown in Table 2, the clear reflection and visible line width of the conductive pattern were evaluated.
Abstract
Description
Claims
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JP2014522766A JP5683035B2 (ja) | 2011-12-23 | 2012-12-24 | 導電性基板、電子素子及びディスプレイ装置 |
CN201280037884.7A CN104094198B (zh) | 2011-12-23 | 2012-12-24 | 导电基板及包含其的电子装置 |
EP12859593.1A EP2720121B1 (en) | 2011-12-23 | 2012-12-24 | Conductive substrate and electronic device comprising same |
US14/367,539 US20150220107A1 (en) | 2011-12-23 | 2012-12-24 | Conductive substrate and electronic device comprising same |
US13/973,205 US8780567B2 (en) | 2011-12-23 | 2013-08-22 | Conductive substrate and electronic device comprising same |
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- 2012-12-24 EP EP12859593.1A patent/EP2720121B1/en active Active
- 2012-12-24 KR KR1020120152602A patent/KR101302284B1/ko active IP Right Grant
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Cited By (1)
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JP2014219973A (ja) * | 2013-04-30 | 2014-11-20 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | タッチパネルを含むディスプレイ装置及びそのタッチパネルの電極パターンの視認性評価方法 |
Also Published As
Publication number | Publication date |
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JP2014523599A (ja) | 2014-09-11 |
TW201342154A (zh) | 2013-10-16 |
EP2720121A1 (en) | 2014-04-16 |
KR20130073860A (ko) | 2013-07-03 |
CN104094198B (zh) | 2018-09-25 |
JP5683035B2 (ja) | 2015-03-11 |
KR101302284B1 (ko) | 2013-09-03 |
TWI479386B (zh) | 2015-04-01 |
US20130343010A1 (en) | 2013-12-26 |
US20150220107A1 (en) | 2015-08-06 |
CN104094198A (zh) | 2014-10-08 |
EP2720121A4 (en) | 2015-04-15 |
EP2720121B1 (en) | 2017-09-06 |
US8780567B2 (en) | 2014-07-15 |
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