TW493285B - A new grid electrode technique for LEDs fabrication - Google Patents
A new grid electrode technique for LEDs fabrication Download PDFInfo
- Publication number
- TW493285B TW493285B TW89122388A TW89122388A TW493285B TW 493285 B TW493285 B TW 493285B TW 89122388 A TW89122388 A TW 89122388A TW 89122388 A TW89122388 A TW 89122388A TW 493285 B TW493285 B TW 493285B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- light
- metal
- mesh
- type
- Prior art date
Links
Landscapes
- Led Devices (AREA)
Abstract
Description
產業上之利用領域 1色發光-極體是國内戶外顯示器工業及新絲未來發 展之主流,本發明可以有效侧於戶外顯示器元件上,以提 高產品的發光亮度。 背 景 在藍色發光n體巾,是採贱化鎵魏化錮鎵蟲晶薄 料為發光㈣,在習知技術上,__技術在晶片正面 疋義出N 5L及P型氮化鎵材料區域’平台上是屬於p型氮化 叙材料區域,電子束級法蒸鍍_點狀鎳和金雙層厚 金屬(厚度大於⑽奈幻作為P魏極;如圖1所示結構在 餘刻面上是屬於N型氮化鎵材籠域,利 錢—麵-_雜。在平台上P魏化録材 7 I片區域利用電子束錢法蒸鑛鎳和金雙層薄金屬(厚度 健20奈米)作為整片p型電極薄膜,注入電流能整片進入 發光區,使平台上是屬於p型氮化錁材料區域整片發光,提 昇發光亮度。由於傳統藍色發光二極體在發光祕用薄金屬Industrial application fields: One-color light-emitting body is the mainstream of the domestic outdoor display industry and the future development of new silk. The present invention can effectively focus on outdoor display elements to improve the luminous brightness of products. The background is a blue luminous n-body towel, which is made of low-gallium gallium and ferrocium gallium worm crystal thin material as a light-emitting gallium. In the conventional technology, __ technology defines N 5L and P-type gallium nitride materials on the front of the wafer. The area 'platform is a p-type nitrided material area. Electron beam-level vapor deposition _ dot-shaped nickel and gold double-thick metal (thickness greater than Sinai as P Wei pole; the structure shown in Figure 1 in the remaining moment The surface belongs to the N-type GaN material cage domain, which is a good money-face-_miscellaneous. On the platform, the 7 area of the P Weihua recording material uses the electron beam method to steam the nickel and gold double-layer thin metals (thickness and health). 20nm) As a whole p-type electrode film, the current can be injected into the light-emitting area by injecting a current, so that the whole area of the p-type hafnium nitride material on the platform emits light and the luminous brightness is improved. Because the traditional blue light-emitting diode is Luminous thin metal
電極使發光區整面發光’⑼此層薄金屬電極的透光率约 80% ’使元件發光效率降低,且當藍色發光二極體在可靠 度量測時薄金屬電極容錢毁,#屬電極燒毀時會使操 作電壓提昇造成不良^,使藍色發光二極體在聽時良率下 發明目標 本發明之主要目的,係揭示利用本方法製得之網狀電極 取代發絲之薄金屬電極,將原本厚Ρ魏極及薄金屬電極 兩道製程簡化成正方形的厚ρ型電極延伸形成·電極之— 道製程,提供此有效又省時的製程技術。 本發明揭示五種新型的網狀電極,其係運用光阻剝離 (lift-off)技術和金屬姓刻技術(wet—扣咖呢),讓厚ρ型電 極延伸形成網狀電極。 凡是熟悉該技藝的人士在閱讀下列經由不同圖解所展示 49328^ 發明說明(3) 之較佳實施觸細說_,驗簡非常清楚本發明所揭 之目的和優點 發明之詳細說明 本發明採用—種新型_狀電極,將原本正方形的p型 電極延伸形成峨電極,纟於此網狀電鱗㈣麵A,將 原本祕p型雜及薄金屬透域極兩道製程,並簡化製程 成-道p型電極延伸形成網狀電極,避免在驗麵厚薄 金屬透光電極之高失敗率,此係—種實雜技術以提高發光 二極體製程之成功率。 i 一種發光二極體之網狀電極之製法可使用光阻剝離 (1 i ft off)技術及#刻金屬技術(呢卜的冰丨ng)技術皆可達 到網狀電極之製程,製程技術詳列如下。 一種發光二極體之網狀電極之製法,其係在使用光阻The electrode makes the entire area of the light-emitting area emit light. 'The light transmittance of this thin metal electrode is about 80%.' It reduces the luminous efficiency of the element, and when the blue light-emitting diode is reliably measured, the thin metal electrode can be destroyed. # When the metal electrode is burned out, the operating voltage will increase and cause bad ^, so that the blue light-emitting diode will have a good yield when listening. The main object of the present invention is to reveal that the mesh electrode prepared by this method replaces the thin hair. The metal electrode simplifies the two processes of the original thick PW electrode and the thin metal electrode into a square thick p-type electrode to extend the formation of the electrode. This process provides an effective and time-saving process technology. The present invention discloses five new types of mesh electrodes, which use a lift-off technology and a metal-engraving technology (wet-coffee) to extend a thick p-type electrode to form a mesh electrode. Anyone who is familiar with the art will read the following detailed explanation of the preferred implementation of the 49328 ^ invention description (3) illustrated by different diagrams, and it will be very clear from the summary that the objects and advantages disclosed by the invention are described in detail. This kind of new-type electrode extends the original square p-type electrode to form an e-electrode, and lays on this mesh-shaped electric scale surface A. The two processes of the original p-type impurity and the thin metal transparent electrode are simplified, and the process is simplified into- The p-type electrode is extended to form a mesh electrode to avoid the high failure rate of thick and thin metal light-transmitting electrodes in the inspection surface. This is a hybrid technology to improve the success rate of the light-emitting diode system. i A method of manufacturing a mesh electrode of a light-emitting diode can use the photoresistance stripping (1 i ft off) technology and #etched metal technology (the ice of the 丨 ng) technology to achieve the process of the mesh electrode, the process technology details The columns are as follows. Method for producing mesh electrode of light emitting diode, using photoresist
493285493285
a·)在晶片表面塗布上正光阻; b·)在光罩對準儀上曝光; C·)在顯驗巾除去曝絲阻裸露_狀電極區域; d·)鍍上P型金屬電極;以及 e.)利用丙石同將其餘光阻除去並掀離視窗區氮化錄表 面。 其中步驟(e)得利用金屬侧液除去視窗區上金 屬,以裸露氮化鎵表面。 基於藍色發光二極體是國 内戶外顯示器工業及新光源未 來發展之錢,朝本發騎麻使収賴離⑽t_〇ff) 技術達到網狀電極n採物b鎵錢化銦縣晶薄膜 作為發光材料,可以製作藍色發光二極體。嘯藍色發光 二極體之難電極及二極體,健方式如下·· (1).減正方形及_兩種的p型電極延伸形成網狀電 極以取代發光區之薄金屬電極。 (2)·藍色發光二極體之操作電流:1〇毫安培(mA)〜6〇 培、提供充放電周期(duty cycle) : 1〇奈秒(ns)〜1〇毫和、 (ms)、供電周期百分比(duty cycle %) : 〇」〜Μ⑽。 其中網狀電極之紋㈣(如圖9)所示,採収阻剝離 (-off)技術將錢内之金離形成發光二極體發光可 穿過之發光㈣,改變大小可提升整體發光效率及輸出發光 縣數,崎電極之發光㈣大何由長度與寬度加以界 定:其長度範圍為1微米㈣到3微米;寬度範圍為i微米 (μπι)到300微米。 乂驟()中4 Ρ型金屬電極線寬由〇 〇5微米(叩)〜綱 微米及金屬層之厚度為5奈米〜1咖奈米(1微米·〇奈 米)〇 圖 所不網狀結構上『產品名稱網狀電極』:係利用條 狀電極將公司、,品名稱及人名標示在發光二極體 之發光 —-- 、發明說明(6) 區’以突顯其產品特色。條狀電極處理方式為採用厚p型電 . ^51(0tTO^„^ 父通大學,,縮寫)、人名(圖中”C· F. Lin”為,,作者林佳鋒之英 予、备目寫)’使用光阻剝離(lift 〇ff)技術及钱刻金屬技 術(wet-etching)技術達到條狀電極之製程。 。圖4所不『指形網狀電極』,係在p型金屬電極(方形及 圓形兩種)左右延伸出條狀金屬線並由條狀金屬線伸張出手 指狀條狀金屬線,使發光區呈條狀均勻發光。圖5所示『弧 形網狀電極』,係峡ρ型金屬電極到Ν型金屬電極距離所 形成之弧形電極,其半徑距離範圍由10微米㈣〜3、。 圖6所示『跑道形網狀電極』,係固定Ρ型金屬電極到Ν型 金屬電極距離所形成等距弧形電極,ρ型金屬電極線寬由1〇 微米i15微米及厚度為5奈米〜酬〇奈米α微米溯0奈 米)『’使電流·狀分布並_均勻且高電流密度。圖7所 丁方才網狀包極』,網狀電極之發光室窗大小改變可提 麟及輪&發細絲,概電極金>1綾窗唐由 ΙΙιϋΜΠΜΚΜΒΕ'Μ^ίΛυΜ·^ 气 4m 油 mu»·· — —— --- 第10頁 493285 發明說明(7) 〇· 05微米(μιη)〜300微米、發光室窗大小可由長度與寬度加 以界定:Μ度範圍為1微米(网)到3〇〇微米;寬度範圍為 1微米(μιη)到綱微米;發光室窗大小,可提升方格形網狀 電極之發光亮度。 在藍色發光二極體中’採用氮化鎵與氮化銦鎵蟲晶薄膜 作為發光材料,由於傳統藍色發光二極體在發光區採用薄全 屬電極使發光區整面發光,然而此層薄金屬電極透光率約 60㈣%,使树發光效率降低,且當藍色發光二極體在可靠 度量測時薄金屬電極容易燒毁。 為了提高發光亮度及延長發光二極_壽命,本發明採 如2新型的網狀電極,將原本正方形的Ρ型電極延伸形成 古=所示之網狀馳,由於此__厚賴細A,在 :二=間可靠度量測時此網狀電極不易燒毀,其發光 傳统薄金屬電極來的長,採__狀電 光亮度並 第Π頁 493285 發明說明(8) 進而延長發光二極體的壽命。在製作正方形的P型電極延伸 形成網狀電極之製程步驟中採用光阻剝離(他讀)技術和 金屬細技術(wet-etehing)皆可達到網狀電極之製程。 一種發光二極體之網狀電極之製法,在使_侧技 術㈣- etching)技術達到網狀電極之製程其包括下列步驟·· a·在晶片表面鍍上p型金屬電極; b·在晶片及金屬層上塗布上正光阻; α在光罩對準儀上曝光,· d.在顯影液中除去曝光光阻裸露出視窗區氮化錄表面 區域; e. 利用金屬侧液除去視龍上金屬並裸露氮 面。 化錄表 f. 利用丙娜其餘光崎去裸露出網狀 電極。 五種P型電極延伸形成網狀電極製程步驟中,採用光阻 f)—和Μ飿刻技術(wet-etching)皆可達到 第12頁 493285 五 發明說明(9)a ·) coating a positive photoresist on the surface of the wafer; b ·) exposing on a photomask aligner; C ·) removing exposed wire-shaped exposed electrode-shaped electrode areas on a test towel; d ·) plating a P-type metal electrode; And e.) Removing the rest of the photoresist using propane and lifting it off the surface of the nitride recording surface in the window area. In step (e), the metal on the window region is removed by using a metal side liquid to expose the gallium nitride surface. Based on the blue light-emitting diode is the future development of the domestic outdoor display industry and new light sources, Asahi ’s horse riding technology has been adopted to achieve the net electrode n material b gallium alloy indium crystal As a light-emitting material, a thin film can be used to produce a blue light-emitting diode. The hard blue light-emitting diode and the difficult electrode are as follows: (1). The p-type electrode minus the square and _ is extended to form a mesh electrode to replace the thin metal electrode in the light-emitting area. (2) Operating current of blue light-emitting diode: 10 milliamperes (mA) to 60 amperes, providing charge cycle (duty cycle): 10 nanoseconds (ns) to 10 milliamperes, (ms ). Duty cycle%: 〇 ″ ~ Μ⑽. Among them, the pattern of the grid electrode (as shown in Figure 9), the harvesting resistance stripping (-off) technology separates the gold in the money to form a light-emitting diode through which the light-emitting diode can pass. Changing the size can improve the overall light-emitting efficiency. And the number of light emitting counties, the light emission of the Saki electrode is defined by the length and width: its length ranges from 1 micron to 3 microns; the width ranges from i microns (μm) to 300 microns. In step (4), the line width of the 4 P-type metal electrode is from 0.05 micron (叩) to 1 micron and the thickness of the metal layer is 5 nanometers to 1 nanometer (1 micrometer. 0 nanometers). "Product name mesh electrode" on the shape structure: The company name, product name and person name are marked on the light-emitting diode by using strip-shaped electrodes ---, invention description (6) area 'to highlight its product characteristics. The processing method of the strip electrode is to use thick p-type electricity. ^ 51 (0tTO ^ „^ Father Tong University, abbreviation), person name (" C · F. Lin "in the picture), the author Lin Jiafeng's Yingyu, prepared for writing ) 'Using photoresist lift-off technology and wet-etching technology to achieve the process of strip electrodes.. The "finger mesh electrode" shown in Figure 4 is based on the p-type metal electrode ( (Square and round)) Strip-shaped metal wires are extended left and right, and finger-shaped strip-shaped metal wires are stretched out from the strip-shaped metal wires, so that the light-emitting area is uniformly illuminated in stripes. "Arc-shaped mesh electrode" shown in Figure 5, The radius of the arc-shaped electrode formed by the distance between the ρ-type metal electrode and the N-type metal electrode ranges from 10 microns to 3. The "track-shaped mesh electrode" shown in Figure 6 is a fixed P-type metal electrode to N-type metal electrode is formed by equidistant arc-shaped electrode, ρ-type metal electrode line width is from 10 microns to 15 microns and thickness is 5 nanometers to 5 nanometers to 0 nanometers and 0 nanometers) "'makes current distribution _ Uniform and high current density. Fig. 7 shows the grid-like encapsulation electrode ", the luminous chamber window of the grid electrode Small changes can be made to Lin & Wheel & Hair Filament, Probable Electrode Gold > 1 window window by ΙΙιϋΜΠΜΚΜΒΕ'Μ ^ ίΛυΜ · ^ gas 4m oil mu »·· —————— Page 10 493285 Description of the invention ( 7) 0.05 micron (μιη) ~ 300 microns, the size of the light-emitting room window can be defined by length and width: the range of M degrees is 1 micron (mesh) to 300 micrometers; the width range is 1 micron (μιη) to 1 micron The size of the light-emitting room window can increase the luminous brightness of the grid-shaped grid electrode. In the blue light-emitting diode, 'gallium nitride and indium gallium nitride worm-crystal film is used as the light-emitting material. The thin light-emitting electrode in the light-emitting area makes the whole area of the light-emitting area emit light. However, the light transmittance of this thin metal electrode is about 60㈣%, which reduces the light-emitting efficiency of the tree, and it is thin when the blue light-emitting diode is reliably measured. The metal electrode is easy to burn. In order to improve the luminous brightness and prolong the life of the light-emitting diode, the present invention adopts 2 new-type mesh electrodes to extend the original square P-type electrode to form a net-shaped electrode as shown in the figure. _Thin depends on A, in: two = reliable measurement When tested, this mesh electrode is not easy to burn. It emits light as compared to traditional thin metal electrodes, adopting __like electro-optical brightness and p. 493285. Description of the invention (8) to extend the life of the light-emitting diode. In the process of electrode extension to form a mesh electrode, both the photoresistance stripping technique and the metal-etehing technique can be used to achieve the mesh electrode process. A method for manufacturing a mesh electrode of a light emitting diode is The process of using _ side technology (etching) technology to achieve a mesh electrode includes the following steps: a. P-type metal electrode is plated on the wafer surface; b. Positive photoresist is coated on the wafer and metal layer; α is in a photomask Exposure on the collimator, d. Remove the exposed photoresist in the developer to expose the nitrided surface area of the window area; e. Use the metal side solution to remove the metal on the dragon and expose the nitrogen surface. Catalogue table f. Use the rest of Bina's Misaki to expose the mesh electrodes. In the process of extending the five P-type electrodes to form a mesh electrode, photoresist f)-and M-etching can be used. Page 12 493285 V. Description of the invention (9)
網狀電極之製程 功 能 y為了提高發光亮度及延長發光二極體的Process function of mesh electrode In order to improve the luminous brightness and extend the luminous diode
_型的網狀電極,將原本正方形的p型電極 網狀電極’在高電流及長時間可靠度量測時此網狀 祕易燒H料:觸#侧_蝴極來的 長’㈣新型的網狀電極可在發光室窗處得到職的透光 -、P型電極金屬為Ni/Au,Ni金屬鑛膜厚度5奈米〜麵 奈米及AU金屬鑛膜厚度5奈米〜5〇〇奈米雙層金屬皆可在p 型氮化鎵蠢晶層上得到歐姆接點。(1微米觸奈米)。_-Type mesh electrode, the original square p-type electrode mesh electrode 'reliable measurement of this mesh is easy to burn at high current and long-term reliable measurement: contact # 侧 _ 蝶 极 来 长' new type The mesh electrode can be used for light transmission in the light-emitting room window. The P-type electrode metal is Ni / Au. The thickness of the Ni metal ore film is 5 nanometers to the surface nanometer and the thickness of the AU metal ore film is 5 nanometers to 5 nanometers. 〇Nano-layer metal can get ohmic contact on p-type gallium nitride layer. (1 micron touch nanometer).
三、不論採用光阻剝離Gift—off)技術或是金屬侧技 術(wet-etching),製程中以正方形的p型電極延伸形成網狀 電極,皆可獲得本發明預期之產品。 四、藍色發光二極體之操作發光電流範圍:1〇mA〜6〇mA、 直流電源供應器之供放電周期(duty cycle) : l〇ns〜10ms、3. Whether the photoresist-gift-off technology or metal-etching technology is used, a square p-type electrode is extended to form a mesh electrode in the process, and the product expected by the present invention can be obtained. 4. Operating luminous current range of blue light-emitting diode: 10mA ~ 60mA, Duty cycle of DC power supply: 10ns ~ 10ms,
第13頁 493285 五、發明說明(10) ----- 直流電源供應器供放電周期百分比(崎cycle %): 〇· 1 〜100%〇 练上所述,本發明具備原創性、新穎性及進步性。雖然 本發明以-些雛實施·露如上,然其並非㈣限定树 明’任何熟習此技術者,在不脫離本發明之精神和範圍内, 當可作為些許之更動與潤飾,因此本發明之保護範圍當視後 附之申請專利範圍所界定為準。Page 13 493285 V. Description of the invention (10) ----- Percentage of supply and discharge cycle of DC power supply (cycle cycle%): 〇 · 1 ~ 100% 〇 As mentioned above, the present invention has originality and novelty And progressive. Although the present invention is implemented with some chicks and exposed as above, it is not limited to Shuming. Anyone familiar with this technology can make changes and retouches without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.
第14頁 493285 圖式簡單說明 圖式說明: 圖1 引用Nakamura期刊圖片 圖2 實際發光二極體之照片及各部分結構 圖3 產品名稱網狀電極 圖4 指形網狀電極 圖5 弧形網狀電極 圖6 跑道形網狀電極 圖7 方格形網狀電極 圖8 傳統UED有薄金屬電極發光照片 圖9 LED有網狀電極發光照片 圖號說明: 1. N型電極 2. 薄金屬電極 3. P型電極 4. P型氮化鎵磊晶層 5. 發光蟲晶層Page 14 493285 Schematic description Schematic description: Figure 1 Cited from Nakamura journal picture Figure 2 Photograph of actual light-emitting diode and structure of each part 3 Product name Mesh electrode Figure 4 Finger-shaped mesh electrode Figure 5 Curved mesh Shaped electrode Figure 6 Track-shaped mesh electrode Figure 7 Grid-shaped mesh electrode Figure 8 Conventional UED with thin metal electrode glowing photo Figure 9 LED with mesh electrode glowing photo Figure number description: 1. N-type electrode 2. Thin metal electrode 3. P-type electrode 4. P-type gallium nitride epitaxial layer 5. Luminescent insect crystal layer
第15頁 493285 圖式簡單說明 6. N型氮化鎵磊晶層氮化鎵磊晶層氧化鋁基板P型電 極薄金屬電極 11. N型電極 12. 蝕刻氮化鎵磊晶平台 13. 採用厚P型電極製作產品名稱、公司(圖中”NCTU” 為”國立交通大學”縮寫)、人名(圖中”C· F· Lin” 為”作者林佳鋒之英文名字’’縮寫) 14. 由厚P型電極延伸出之指狀電極 15. 弧形網狀厚P型電極 16. 跑道形網狀厚P型電極 17. 方格形網狀厚P型電極Page 15 493285 Brief description of the diagram 6. N-type gallium nitride epitaxial layer GaN epitaxial layer alumina substrate P-type electrode thin metal electrode 11. N-type electrode 12. Etching gallium nitride epitaxial platform 13. Adopt Thick P-type electrode production product name, company ("NCTU" in the picture is the abbreviation of "National Jiaotong University"), person name ("C · F · Lin" in the picture is the abbreviation of the author's English name Lin Jiafeng) 14. By thick P-shaped electrode extended finger electrode 15. Arc-shaped mesh-shaped thick P-type electrode 16. Track-shaped mesh-shaped thick P-type electrode 17. Checkered mesh-shaped thick P-type electrode
第16頁Page 16
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89122388A TW493285B (en) | 2000-10-23 | 2000-10-23 | A new grid electrode technique for LEDs fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW89122388A TW493285B (en) | 2000-10-23 | 2000-10-23 | A new grid electrode technique for LEDs fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
TW493285B true TW493285B (en) | 2002-07-01 |
Family
ID=21661676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW89122388A TW493285B (en) | 2000-10-23 | 2000-10-23 | A new grid electrode technique for LEDs fabrication |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW493285B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102308365A (en) * | 2009-02-06 | 2012-01-04 | Lg化学株式会社 | Method for manufacturing an insulated conductive pattern |
US8692445B2 (en) | 2009-07-16 | 2014-04-08 | Lg Chem, Ltd. | Electrical conductor and a production method therefor |
US8921726B2 (en) | 2009-02-06 | 2014-12-30 | Lg Chem, Ltd. | Touch screen and manufacturing method thereof |
US9060452B2 (en) | 2009-02-06 | 2015-06-16 | Lg Chem, Ltd. | Method for manufacturing insulated conductive pattern and laminate |
-
2000
- 2000-10-23 TW TW89122388A patent/TW493285B/en not_active IP Right Cessation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102308365A (en) * | 2009-02-06 | 2012-01-04 | Lg化学株式会社 | Method for manufacturing an insulated conductive pattern |
US8637776B2 (en) | 2009-02-06 | 2014-01-28 | Lg Chem, Ltd. | Conductive pattern and manufacturing method thereof |
US8921726B2 (en) | 2009-02-06 | 2014-12-30 | Lg Chem, Ltd. | Touch screen and manufacturing method thereof |
US9060452B2 (en) | 2009-02-06 | 2015-06-16 | Lg Chem, Ltd. | Method for manufacturing insulated conductive pattern and laminate |
US9524043B2 (en) | 2009-02-06 | 2016-12-20 | Lg Chem, Ltd. | Touch screen and manufacturing method thereof |
US9615450B2 (en) | 2009-02-06 | 2017-04-04 | Lg Chem, Ltd. | Conductive pattern and manufacturing method thereof |
US8692445B2 (en) | 2009-07-16 | 2014-04-08 | Lg Chem, Ltd. | Electrical conductor and a production method therefor |
US9049788B2 (en) | 2009-07-16 | 2015-06-02 | Lg Chem, Ltd. | Electrical conductor and a production method therefor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6162890B2 (en) | Micro light emitting diode | |
CN101752486A (en) | Light emitting device and manufacturing method thereof | |
TW200401462A (en) | Light-emitting diode device geometry | |
TW200828642A (en) | Electroluminescent device, and fabrication method thereof | |
KR101634338B1 (en) | Light emitting diode and method for manufacturing the same | |
KR20100042122A (en) | Semiconductor light emitting device and method for fabricating the same | |
TWI798695B (en) | Ultraviolet LED and method of making the same | |
CN104285307B (en) | Efficient LED and manufacture method thereof | |
JP2015092634A (en) | Light-emitting device and method for manufacturing the same | |
TW493285B (en) | A new grid electrode technique for LEDs fabrication | |
CN110808315A (en) | Method for increasing GaN Micro-LED color conversion efficiency | |
TWI446571B (en) | Light emitting diode chip and fabricating method thereof | |
TWI453968B (en) | Semiconductor light-emitting structure | |
CN108133989B (en) | GaN transverse LED preparation method based on multiple quantum wells | |
CN106340574B (en) | GaAs base LED chip and preparation method with roughening current extending | |
Chang et al. | Improvement of p-electrode structures for 280 nm AlGaN LED applications | |
JP6841708B2 (en) | Light emitting element and manufacturing method of light emitting element | |
CN113488569B (en) | Light-emitting diode chip with flip-chip structure and preparation method thereof | |
JP2009252826A (en) | Semiconductor light-emitting element and method of manufacturing the same | |
WO2016119732A1 (en) | Light-emitting diode and manufacturing method therefor | |
KR101280501B1 (en) | Light emitting diodes using a transparent electrode | |
KR100579320B1 (en) | Method of manufacturing light emitting device | |
TW201104921A (en) | Method of manufacturing a vertical type light-emitting diode | |
US20150162500A1 (en) | Transparent electrode and method for forming transparent electrode | |
US9768359B2 (en) | Semiconductor device, method for manufacturing same, light-emitting diode, and method for manufacturing same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |