JP5991554B2 - 透明基板の製造方法 - Google Patents
透明基板の製造方法 Download PDFInfo
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- JP5991554B2 JP5991554B2 JP2014523880A JP2014523880A JP5991554B2 JP 5991554 B2 JP5991554 B2 JP 5991554B2 JP 2014523880 A JP2014523880 A JP 2014523880A JP 2014523880 A JP2014523880 A JP 2014523880A JP 5991554 B2 JP5991554 B2 JP 5991554B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1866—Transmission gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electric Cables (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
特に、最近開発されたプラズマディスプレイパネルは高解像度を実現するために画素パターンをより細かくしており、このため、モアレの発生可能性がより大きくなった。よって、既存のパターンの線幅、ピッチ、角度の調節だけではモアレの改善に限界がある。
前記伝導性パターンは電気的に断絶させる断線部を含み、
前記断線部を連結した時に形成される断線パターンは不規則的なパターン形状を含むものである透明伝導性基板を提供する。
[数学式1]
(頂点間の距離の標準偏差/頂点間の距離の平均)×100
前記数学式1の値は伝導性パターンの単位面積内で計算されることができる。前記単位面積は伝導性パターンが形成される面積であってもよく、例えば、3.5cm×3.5cmなどであってもよいが、これのみに限定されるものではない。
本発明による透明伝導性基板において、前記伝導性パターンは伝導性金属線を含み、前記断線部によって断線した伝導性金属線の間隔は50μm以下であってもよい。前記断線部によって断線した伝導性金属線の間隔は0.5〜15μmであることがより好ましいが、これのみに限定されるものではない。
この時、蒸着をする方式は、熱または電子ビームによる熱蒸着法およびスパッタ(sputter)のようなPVD(physical vapor deposition)方式を利用することもでき、有機金属(organometal)材料を用いたCVD(chemical vapor deposition)方式を利用することもできる。
線の断線によるモアレ(moire)の回避のために、300μmピッチ4μmのメッシュ(mesh)領域を電気的に絶縁するために1,000μm設計ピッチのボロノイパターン(Voronoi pattern)を用いて断線を行い、この時の断線幅は10μmに定義した。
前記結果のように、本発明による伝導性パターンを含む透明伝導性基板は、規則的または不規則的な伝導性パターンを不規則的なパターンを用いて断線させることによってモアレ(moire)現象および外部光による回折現象を最小化することができる。
Claims (11)
- 基板上に伝導材パターンを形成する透明基板の製造方法であって、
前記伝導材パターンの形状を決定するステップと、
前記基板上に前記伝導材パターンを形成するステップと、
を含み、
前記伝導材パターンを形成するステップは、不規則的なパターン用いて、前記伝導材パターンを電気的に断線させるステップを有し、これにより、前記伝導材パターンは、電気的に絶縁された断線部を含み、前記断線部を連結した時に形成される断線パターンは、不規則的なパターン形状を含み、
前記不規則的なパターン形状は、連続して連結された閉鎖図形の輪郭構造を含み、前記断線パターンは任意の単位面積(1cm×1cm)内で同一形態の閉鎖図形は存在せず、
前記閉鎖図形の頂点数は、前記閉鎖図形と同一個数の四角形の頂点数と相異なるか、または、前記閉鎖図形は、下記数学式1の値が50以上である透明基板の製造方法:
[数学式1]
(頂点間の距離の標準偏差/頂点間の距離の平均)×100 - 前記伝導材パターンは、伝導性金属線からなるパターンを含む、請求項1に記載の製造方法。
- 前記断線部は伝導性金属線を電気的に断絶させ、電気的に断絶された伝導性金属線の間隔は50μm以下である、請求項2に記載の製造方法。
- 前記電気的に断絶された伝導性金属線の間隔は、0.5〜15μmである、請求項3に記載の製造方法。
- 前記伝導性金属線からなるパターンは、直線、曲線、または直線や曲線からなる閉曲線を含む、請求項2に記載の製造方法。
- 前記伝導材パターンは、規則的または不規則的なパターンである、請求項1から5のいずれか1項に記載の製造方法。
- 前記伝導材パターンは、メッシュパターンを含む、請求項1から6のいずれか1項に記載の製造方法。
- 前記メッシュパターンは、三角形、四角形、五角形、六角形および八角形のうち1つ以上の形態を含む規則的な多角形パターンを含む、請求項7に記載の製造方法。
- 前記伝導材パターンは連続して連結された閉鎖図形の輪郭構造を含み、前記伝導材パターンは任意の単位面積(1cm×1cm)内で同一形態の閉鎖図形は存在せず、
前記閉鎖図形の頂点数は、前記閉鎖図形と同一の個数の四角形の頂点数と相異なる、請求項1から8のいずれか1項に記載の製造方法。 - 前記伝導材パターンは連続して連結された閉鎖図形の輪郭構造を含み、前記伝導材パターンは任意の単位面積(1cm×1cm)内で同一形態の閉鎖図形は存在しない、請求項1から8のいずれか1項に記載の製造方法。
- 前記伝導材パターンは連続して連結された閉鎖図形の輪郭構造を含み、前記伝導材パターンは任意の単位面積(1cm×1cm)内で同一形態の閉鎖図形は存在せず、
前記閉鎖図形は、下記数学式1の値が50以上である、請求項1から8のいずれか1項に記載の製造方法:
[数学式1]
(頂点間の距離の標準偏差/頂点間の距離の平均)×100
Applications Claiming Priority (3)
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KR20110097754 | 2011-09-27 | ||
KR10-2011-0097754 | 2011-09-27 | ||
PCT/KR2012/007801 WO2013048135A2 (ko) | 2011-09-27 | 2012-09-27 | 투명 전도성 기판 및 이의 제조방법 |
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JP2014529841A JP2014529841A (ja) | 2014-11-13 |
JP5991554B2 true JP5991554B2 (ja) | 2016-09-14 |
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US (2) | US9686859B2 (ja) |
EP (1) | EP2763519B1 (ja) |
JP (1) | JP5991554B2 (ja) |
KR (1) | KR101379963B1 (ja) |
CN (1) | CN103828502B (ja) |
TW (1) | TWI527062B (ja) |
WO (1) | WO2013048135A2 (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013215060A1 (de) * | 2013-07-31 | 2015-02-05 | Irlbacher Blickpunkt Glas Gmbh | Kapazitive Sensorvorrichtung mit elektrisch leitfähig beschichteter Sensorplatte aus Dünnglas |
JP6338138B2 (ja) * | 2013-12-03 | 2018-06-06 | 大日本印刷株式会社 | タッチパネル用電極基材、タッチパネル装置およびタッチパネル用電極基材の製造方法 |
KR101682773B1 (ko) | 2013-12-13 | 2016-12-05 | 주식회사 엘지화학 | 터치 센서 및 이의 제조방법 |
US9552090B2 (en) * | 2014-02-05 | 2017-01-24 | Lg Innotek Co., Ltd. | Touch panel and display with the same |
US10198113B2 (en) | 2014-02-17 | 2019-02-05 | Lg Innotek Co., Ltd. | Touch window |
KR102237797B1 (ko) * | 2014-02-17 | 2021-04-09 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
JP2015197985A (ja) * | 2014-03-31 | 2015-11-09 | 株式会社カネカ | 透明電極付きフィルム基板の製造方法 |
KR102286730B1 (ko) * | 2014-06-13 | 2021-08-09 | 미래나노텍(주) | 비정형 센서 패턴을 구비한 터치 센서 및 이를 이용한 터치스크린 패널 |
JP6159688B2 (ja) * | 2014-06-25 | 2017-07-05 | 三菱製紙株式会社 | 光透過性導電材料 |
JP6165693B2 (ja) * | 2014-09-16 | 2017-07-19 | 三菱製紙株式会社 | 光透過性導電材料 |
US9639221B2 (en) | 2014-09-25 | 2017-05-02 | Eastman Kodak Company | Method of designing a conductive pattern with reduced channel break visibility |
WO2016048320A1 (en) * | 2014-09-25 | 2016-03-31 | Uni-Pixel Displays, Inc. | Method of designing a conductive pattern with reduced channel break visibility |
KR101924056B1 (ko) | 2014-09-29 | 2018-11-30 | 주식회사 엘지화학 | 오프셋 인쇄용 클리쉐 및 이의 제조방법 |
KR101754454B1 (ko) * | 2014-11-17 | 2017-07-05 | 주식회사 엘지화학 | 전도성 구조체 및 이의 제조방법 |
JP6441046B2 (ja) * | 2014-11-26 | 2018-12-19 | 三菱製紙株式会社 | 光透過性導電材料 |
US10816815B2 (en) | 2014-12-10 | 2020-10-27 | President And Fellows Of Harvard College | Achromatic metasurface optical components by dispersive phase compensation |
JP6422762B2 (ja) * | 2014-12-16 | 2018-11-14 | 三菱製紙株式会社 | 光透過性導電材料 |
KR102376977B1 (ko) | 2015-01-12 | 2022-03-21 | 삼성디스플레이 주식회사 | 터치 패널 |
WO2016114754A1 (en) * | 2015-01-12 | 2016-07-21 | Uni-Pixel Displays, Inc. | Method of fabricating electrically isolated conductors using flexographic voiding |
JP6404153B2 (ja) * | 2015-03-19 | 2018-10-10 | 三菱製紙株式会社 | 光透過性導電材料 |
WO2016153531A1 (en) * | 2015-03-24 | 2016-09-29 | Uni-Pixel Displays, Inc. | Metal mesh touch sensor with randomized channel displacement |
CN104765491A (zh) * | 2015-03-26 | 2015-07-08 | 业成光电(深圳)有限公司 | 触控面板的导电层的制作方法与触控面板 |
KR101991213B1 (ko) * | 2015-11-17 | 2019-08-08 | 미쓰비시 세이시 가부시키가이샤 | 광투과성 도전 재료 |
TWI582660B (zh) * | 2015-12-02 | 2017-05-11 | Wei-Long Huang | A touch panel that eliminates the Murray effect |
WO2017111540A1 (ko) * | 2015-12-23 | 2017-06-29 | 주식회사 엘지화학 | 터치스크린 센서 |
US20190204957A1 (en) * | 2016-05-24 | 2019-07-04 | Vts-Touchsensor Co., Ltd. | Conductive film, touch panel, and display device |
JP2017211775A (ja) * | 2016-05-24 | 2017-11-30 | 凸版印刷株式会社 | 導電性フィルム、タッチパネル、および、表示装置 |
JP2017211774A (ja) * | 2016-05-24 | 2017-11-30 | 凸版印刷株式会社 | 導電性フィルム、タッチパネル、および、表示装置 |
JP7461294B2 (ja) | 2017-08-31 | 2024-04-03 | メタレンズ,インコーポレイテッド | 透過型メタサーフェスレンズ統合 |
JP6886909B2 (ja) * | 2017-11-06 | 2021-06-16 | 日本航空電子工業株式会社 | タッチパネルの生産方法 |
CN108170307A (zh) * | 2017-11-30 | 2018-06-15 | 云谷(固安)科技有限公司 | 一种触控面板及触控显示装置 |
CN113168022B (zh) * | 2018-07-02 | 2024-07-30 | 梅特兰兹股份有限公司 | 用于激光散斑减少的超表面 |
EP3972832A4 (en) * | 2019-05-23 | 2023-06-28 | Saint-Gobain Performance Plastics Corporation | Solar control film |
EP3972831A4 (en) * | 2019-05-23 | 2023-06-28 | Saint-Gobain Performance Plastics Corporation | Solar control composite film |
JP2022542172A (ja) | 2019-07-26 | 2022-09-29 | メタレンズ,インコーポレイテッド | アパーチャメタ表面およびハイブリッド屈折メタ表面イメージングシステム |
CN111625141B (zh) * | 2020-05-25 | 2022-05-10 | 业成科技(成都)有限公司 | 触控面板及电子设备 |
WO2021237722A1 (zh) * | 2020-05-29 | 2021-12-02 | 京东方科技集团股份有限公司 | 显示面板、触控结构和显示装置 |
US11927769B2 (en) | 2022-03-31 | 2024-03-12 | Metalenz, Inc. | Polarization sorting metasurface microlens array device |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6449302A (en) * | 1987-08-19 | 1989-02-23 | Dainippon Printing Co Ltd | Film antenna |
JPH11218766A (ja) * | 1998-01-30 | 1999-08-10 | Denso Corp | 液晶セル |
US20020050783A1 (en) | 2000-06-01 | 2002-05-02 | Tadahiko Kubota | Electromagnetic-wave-shielding film, production method thereof and image display device using the same |
JP2002014772A (ja) * | 2000-06-30 | 2002-01-18 | Minolta Co Ltd | タッチパネル、表示パネル及び表示装置 |
JP4280843B2 (ja) | 2003-11-17 | 2009-06-17 | 住友金属鉱山株式会社 | 電磁シールド膜およびそのメッシュ構造パターンの設計方法 |
CN101180764B (zh) * | 2005-04-01 | 2012-02-15 | 日本写真印刷株式会社 | 车辆用透明天线以及带天线的车辆用玻璃 |
KR100864152B1 (ko) * | 2007-04-02 | 2008-10-16 | 주식회사 엘지화학 | 전도성 패턴이 흑화처리된 전자파 차폐 유리 및 그제조방법 |
JP5515010B2 (ja) * | 2008-07-02 | 2014-06-11 | 国立大学法人東北大学 | 導電性膜の製造方法、及び、導電性膜 |
KR101081320B1 (ko) * | 2008-08-28 | 2011-11-08 | 에스에스씨피 주식회사 | 도전성 페이스트 조성물 |
JP5474097B2 (ja) * | 2009-02-06 | 2014-04-16 | エルジー・ケム・リミテッド | タッチスクリーンおよびその製造方法 |
WO2010099132A2 (en) * | 2009-02-26 | 2010-09-02 | 3M Innovative Properties Company | Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility |
JP5174745B2 (ja) * | 2009-06-09 | 2013-04-03 | グンゼ株式会社 | タッチスイッチ |
CN102598891B (zh) * | 2009-07-16 | 2015-11-25 | Lg化学株式会社 | 电导体及其制造方法 |
WO2011008055A2 (ko) * | 2009-07-16 | 2011-01-20 | 주식회사 엘지화학 | 전도체 및 이의 제조방법 |
JP2011059771A (ja) * | 2009-09-07 | 2011-03-24 | Hitachi Chem Co Ltd | 網目状導電性パターン、導体層パターン付き基材及びタッチパネル部材 |
JP5667938B2 (ja) * | 2010-09-30 | 2015-02-12 | 富士フイルム株式会社 | 静電容量方式タッチパネル |
KR20140030120A (ko) | 2010-12-16 | 2014-03-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 투명한 미세 패턴화된 rfid 안테나 및 이를 포함하는 물품 |
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CN103828502A (zh) | 2014-05-28 |
WO2013048135A3 (ko) | 2013-05-23 |
WO2013048135A2 (ko) | 2013-04-04 |
KR101379963B1 (ko) | 2014-04-01 |
KR20130033992A (ko) | 2013-04-04 |
US9035198B2 (en) | 2015-05-19 |
CN103828502B (zh) | 2016-10-26 |
US9686859B2 (en) | 2017-06-20 |
TW201327585A (zh) | 2013-07-01 |
EP2763519A4 (en) | 2015-05-06 |
US20140198269A1 (en) | 2014-07-17 |
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