WO2013048135A3 - 투명 전도성 기판 및 이의 제조방법 - Google Patents
투명 전도성 기판 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2013048135A3 WO2013048135A3 PCT/KR2012/007801 KR2012007801W WO2013048135A3 WO 2013048135 A3 WO2013048135 A3 WO 2013048135A3 KR 2012007801 W KR2012007801 W KR 2012007801W WO 2013048135 A3 WO2013048135 A3 WO 2013048135A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- transparent conductive
- conductive substrate
- manufacturing same
- short circuit
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1866—Transmission gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014523880A JP5991554B2 (ja) | 2011-09-27 | 2012-09-27 | 透明基板の製造方法 |
EP12836760.4A EP2763519B1 (en) | 2011-09-27 | 2012-09-27 | Transparent conductive substrate and method for manufacturing same |
US14/235,999 US9686859B2 (en) | 2011-09-27 | 2012-09-27 | Patterned conductive substrate and method for manufacturing same |
CN201280047385.6A CN103828502B (zh) | 2011-09-27 | 2012-09-27 | 透明导电基板及其制造方法 |
US13/973,609 US9035198B2 (en) | 2011-09-27 | 2013-08-22 | Transparent conductive substrate and method for manufacturing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0097754 | 2011-09-27 | ||
KR20110097754 | 2011-09-27 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/973,609 Continuation US9035198B2 (en) | 2011-09-27 | 2013-08-22 | Transparent conductive substrate and method for manufacturing same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013048135A2 WO2013048135A2 (ko) | 2013-04-04 |
WO2013048135A3 true WO2013048135A3 (ko) | 2013-05-23 |
Family
ID=47996623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/007801 WO2013048135A2 (ko) | 2011-09-27 | 2012-09-27 | 투명 전도성 기판 및 이의 제조방법 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9686859B2 (ko) |
EP (1) | EP2763519B1 (ko) |
JP (1) | JP5991554B2 (ko) |
KR (1) | KR101379963B1 (ko) |
CN (1) | CN103828502B (ko) |
TW (1) | TWI527062B (ko) |
WO (1) | WO2013048135A2 (ko) |
Families Citing this family (38)
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DE102013215060A1 (de) * | 2013-07-31 | 2015-02-05 | Irlbacher Blickpunkt Glas Gmbh | Kapazitive Sensorvorrichtung mit elektrisch leitfähig beschichteter Sensorplatte aus Dünnglas |
JP6338138B2 (ja) * | 2013-12-03 | 2018-06-06 | 大日本印刷株式会社 | タッチパネル用電極基材、タッチパネル装置およびタッチパネル用電極基材の製造方法 |
TWI559186B (zh) | 2013-12-13 | 2016-11-21 | Lg化學股份有限公司 | 觸控感測器及顯示裝置 |
US9552090B2 (en) * | 2014-02-05 | 2017-01-24 | Lg Innotek Co., Ltd. | Touch panel and display with the same |
KR102237797B1 (ko) * | 2014-02-17 | 2021-04-09 | 엘지이노텍 주식회사 | 터치 윈도우 및 이를 포함하는 디스플레이 장치 |
WO2015122678A1 (en) * | 2014-02-17 | 2015-08-20 | Lg Innotek Co., Ltd. | Touch window |
JP2015197985A (ja) * | 2014-03-31 | 2015-11-09 | 株式会社カネカ | 透明電極付きフィルム基板の製造方法 |
KR102286730B1 (ko) * | 2014-06-13 | 2021-08-09 | 미래나노텍(주) | 비정형 센서 패턴을 구비한 터치 센서 및 이를 이용한 터치스크린 패널 |
JP6159688B2 (ja) * | 2014-06-25 | 2017-07-05 | 三菱製紙株式会社 | 光透過性導電材料 |
JP6165693B2 (ja) * | 2014-09-16 | 2017-07-19 | 三菱製紙株式会社 | 光透過性導電材料 |
WO2016048320A1 (en) * | 2014-09-25 | 2016-03-31 | Uni-Pixel Displays, Inc. | Method of designing a conductive pattern with reduced channel break visibility |
US9639221B2 (en) | 2014-09-25 | 2017-05-02 | Eastman Kodak Company | Method of designing a conductive pattern with reduced channel break visibility |
KR101924056B1 (ko) | 2014-09-29 | 2018-11-30 | 주식회사 엘지화학 | 오프셋 인쇄용 클리쉐 및 이의 제조방법 |
KR101754454B1 (ko) * | 2014-11-17 | 2017-07-05 | 주식회사 엘지화학 | 전도성 구조체 및 이의 제조방법 |
JP6441046B2 (ja) * | 2014-11-26 | 2018-12-19 | 三菱製紙株式会社 | 光透過性導電材料 |
WO2016140720A2 (en) | 2014-12-10 | 2016-09-09 | President And Fellows Of Harvard College | Achromatic metasurface optical components by dispersive phase compensation |
JP6422762B2 (ja) | 2014-12-16 | 2018-11-14 | 三菱製紙株式会社 | 光透過性導電材料 |
WO2016114754A1 (en) * | 2015-01-12 | 2016-07-21 | Uni-Pixel Displays, Inc. | Method of fabricating electrically isolated conductors using flexographic voiding |
KR102376977B1 (ko) | 2015-01-12 | 2022-03-21 | 삼성디스플레이 주식회사 | 터치 패널 |
JP6404153B2 (ja) * | 2015-03-19 | 2018-10-10 | 三菱製紙株式会社 | 光透過性導電材料 |
US20160282973A1 (en) * | 2015-03-24 | 2016-09-29 | Uni-Pixel Display, Inc. | Metal mesh touch sensor with randomized channel displacement |
CN104765491A (zh) * | 2015-03-26 | 2015-07-08 | 业成光电(深圳)有限公司 | 触控面板的导电层的制作方法与触控面板 |
US10359895B2 (en) * | 2015-11-17 | 2019-07-23 | Mitsubishi Paper Mills Limited | Optically transparent electroconductive material |
TWI582660B (zh) * | 2015-12-02 | 2017-05-11 | Wei-Long Huang | A touch panel that eliminates the Murray effect |
JP6662533B2 (ja) * | 2015-12-23 | 2020-03-11 | エルジー・ケム・リミテッド | タッチスクリーンセンサ |
JP2017211774A (ja) * | 2016-05-24 | 2017-11-30 | 凸版印刷株式会社 | 導電性フィルム、タッチパネル、および、表示装置 |
WO2017204256A1 (ja) * | 2016-05-24 | 2017-11-30 | 凸版印刷株式会社 | 導電性フィルム、タッチパネル、および、表示装置 |
JP2017211775A (ja) * | 2016-05-24 | 2017-11-30 | 凸版印刷株式会社 | 導電性フィルム、タッチパネル、および、表示装置 |
EP3676973A4 (en) | 2017-08-31 | 2021-05-05 | Metalenz, Inc. | INTEGRATION OF LENS WITH PERMEABLE METAL SURFACE |
JP6886909B2 (ja) * | 2017-11-06 | 2021-06-16 | 日本航空電子工業株式会社 | タッチパネルの生産方法 |
CN108170307A (zh) * | 2017-11-30 | 2018-06-15 | 云谷(固安)科技有限公司 | 一种触控面板及触控显示装置 |
SG11202013228XA (en) * | 2018-07-02 | 2021-01-28 | Metalenz Inc | Metasurfaces for laser speckle reduction |
EP3972832A4 (en) * | 2019-05-23 | 2023-06-28 | Saint-Gobain Performance Plastics Corporation | Solar control film |
WO2020236542A1 (en) * | 2019-05-23 | 2020-11-26 | Saint-Gobain Performance Plastics Corporation | Solar control composite film |
US11978752B2 (en) | 2019-07-26 | 2024-05-07 | Metalenz, Inc. | Aperture-metasurface and hybrid refractive-metasurface imaging systems |
CN111625141B (zh) * | 2020-05-25 | 2022-05-10 | 业成科技(成都)有限公司 | 触控面板及电子设备 |
WO2021237722A1 (zh) * | 2020-05-29 | 2021-12-02 | 京东方科技集团股份有限公司 | 显示面板、触控结构和显示装置 |
US11927769B2 (en) | 2022-03-31 | 2024-03-12 | Metalenz, Inc. | Polarization sorting metasurface microlens array device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11218766A (ja) * | 1998-01-30 | 1999-08-10 | Denso Corp | 液晶セル |
JP2002014772A (ja) * | 2000-06-30 | 2002-01-18 | Minolta Co Ltd | タッチパネル、表示パネル及び表示装置 |
JP2012094115A (ja) * | 2010-09-30 | 2012-05-17 | Fujifilm Corp | 静電容量方式タッチパネル |
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JPS6449302A (en) * | 1987-08-19 | 1989-02-23 | Dainippon Printing Co Ltd | Film antenna |
US20020050783A1 (en) * | 2000-06-01 | 2002-05-02 | Tadahiko Kubota | Electromagnetic-wave-shielding film, production method thereof and image display device using the same |
JP4280843B2 (ja) | 2003-11-17 | 2009-06-17 | 住友金属鉱山株式会社 | 電磁シールド膜およびそのメッシュ構造パターンの設計方法 |
CN101180764B (zh) * | 2005-04-01 | 2012-02-15 | 日本写真印刷株式会社 | 车辆用透明天线以及带天线的车辆用玻璃 |
KR100864152B1 (ko) * | 2007-04-02 | 2008-10-16 | 주식회사 엘지화학 | 전도성 패턴이 흑화처리된 전자파 차폐 유리 및 그제조방법 |
JP5515010B2 (ja) | 2008-07-02 | 2014-06-11 | 国立大学法人東北大学 | 導電性膜の製造方法、及び、導電性膜 |
KR101081320B1 (ko) * | 2008-08-28 | 2011-11-08 | 에스에스씨피 주식회사 | 도전성 페이스트 조성물 |
CN102308366B (zh) * | 2009-02-06 | 2015-08-12 | Lg化学株式会社 | 触摸屏及其制备方法 |
JP5643774B2 (ja) * | 2009-02-26 | 2014-12-17 | スリーエム イノベイティブ プロパティズ カンパニー | 低視認性の重ね合わせられた微小パターンを有する、タッチスクリーンセンサ及びパターン基材 |
JP5174745B2 (ja) * | 2009-06-09 | 2013-04-03 | グンゼ株式会社 | タッチスイッチ |
KR101144537B1 (ko) * | 2009-07-16 | 2012-05-11 | 주식회사 엘지화학 | 전도체 및 이의 제조방법 |
WO2011008055A2 (ko) | 2009-07-16 | 2011-01-20 | 주식회사 엘지화학 | 전도체 및 이의 제조방법 |
JP2011059771A (ja) | 2009-09-07 | 2011-03-24 | Hitachi Chem Co Ltd | 網目状導電性パターン、導体層パターン付き基材及びタッチパネル部材 |
WO2012082300A1 (en) * | 2010-12-16 | 2012-06-21 | 3M Innovative Properties Company | Transparent micropatterned rfid antenna and articles incorporating same |
-
2012
- 2012-09-27 TW TW101135643A patent/TWI527062B/zh active
- 2012-09-27 JP JP2014523880A patent/JP5991554B2/ja active Active
- 2012-09-27 CN CN201280047385.6A patent/CN103828502B/zh active Active
- 2012-09-27 KR KR1020120107601A patent/KR101379963B1/ko active IP Right Grant
- 2012-09-27 US US14/235,999 patent/US9686859B2/en active Active
- 2012-09-27 WO PCT/KR2012/007801 patent/WO2013048135A2/ko active Application Filing
- 2012-09-27 EP EP12836760.4A patent/EP2763519B1/en active Active
-
2013
- 2013-08-22 US US13/973,609 patent/US9035198B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11218766A (ja) * | 1998-01-30 | 1999-08-10 | Denso Corp | 液晶セル |
JP2002014772A (ja) * | 2000-06-30 | 2002-01-18 | Minolta Co Ltd | タッチパネル、表示パネル及び表示装置 |
JP2012094115A (ja) * | 2010-09-30 | 2012-05-17 | Fujifilm Corp | 静電容量方式タッチパネル |
Also Published As
Publication number | Publication date |
---|---|
CN103828502B (zh) | 2016-10-26 |
CN103828502A (zh) | 2014-05-28 |
TWI527062B (zh) | 2016-03-21 |
EP2763519B1 (en) | 2018-07-25 |
US9686859B2 (en) | 2017-06-20 |
US20130341079A1 (en) | 2013-12-26 |
JP2014529841A (ja) | 2014-11-13 |
JP5991554B2 (ja) | 2016-09-14 |
WO2013048135A2 (ko) | 2013-04-04 |
US9035198B2 (en) | 2015-05-19 |
KR101379963B1 (ko) | 2014-04-01 |
KR20130033992A (ko) | 2013-04-04 |
EP2763519A2 (en) | 2014-08-06 |
TW201327585A (zh) | 2013-07-01 |
US20140198269A1 (en) | 2014-07-17 |
EP2763519A4 (en) | 2015-05-06 |
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