WO2012169550A9 - 金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法 - Google Patents

金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法 Download PDF

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Publication number
WO2012169550A9
WO2012169550A9 PCT/JP2012/064594 JP2012064594W WO2012169550A9 WO 2012169550 A9 WO2012169550 A9 WO 2012169550A9 JP 2012064594 W JP2012064594 W JP 2012064594W WO 2012169550 A9 WO2012169550 A9 WO 2012169550A9
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
laminate
patterned
manufacturing
solar cell
Prior art date
Application number
PCT/JP2012/064594
Other languages
English (en)
French (fr)
Other versions
WO2012169550A1 (ja
Inventor
熊井　晃一
上田　龍二
孝夫 友野
塚本　健人
Original Assignee
凸版印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to JP2013519513A priority Critical patent/JP6161121B2/ja
Priority to KR1020137032525A priority patent/KR102067846B1/ko
Priority to ES12796975.6T priority patent/ES2660212T3/es
Priority to CN201280027999.8A priority patent/CN103597915B/zh
Priority to EP17197591.5A priority patent/EP3300125B1/en
Priority to EP12796975.6A priority patent/EP2720519B1/en
Publication of WO2012169550A1 publication Critical patent/WO2012169550A1/ja
Publication of WO2012169550A9 publication Critical patent/WO2012169550A9/ja
Priority to US14/098,020 priority patent/US10056517B2/en
Priority to US15/687,352 priority patent/US10672928B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10143—Solar cell
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/30—Foil or other thin sheet-metal making or treating
    • Y10T29/301—Method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　本発明の金属箔パターン積層体は、基材と、開口部と金属部とによって構成された金属箔パターンを含む金属箔と、前記開口部と前記金属部との境界において前記金属箔に設けられた突部とを備える。
PCT/JP2012/064594 2011-06-06 2012-06-06 金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法 WO2012169550A1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2013519513A JP6161121B2 (ja) 2011-06-06 2012-06-06 金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法
KR1020137032525A KR102067846B1 (ko) 2011-06-06 2012-06-06 금속박 패턴 적층체, 금속박 적층체, 금속박 적층 기판, 태양 전지 모듈 및 금속박 패턴 적층체의 제조 방법
ES12796975.6T ES2660212T3 (es) 2011-06-06 2012-06-06 Laminado con patrón de hoja metálica y un módulo solar
CN201280027999.8A CN103597915B (zh) 2011-06-06 2012-06-06 金属箔图案层叠体、金属箔层叠体、金属箔层叠基板、太阳能电池模块和金属箔图案层叠体的制造方法
EP17197591.5A EP3300125B1 (en) 2011-06-06 2012-06-06 Metal foil, patterned-laminate and a solar cell module
EP12796975.6A EP2720519B1 (en) 2011-06-06 2012-06-06 Metal foil patterned-laminate and a solar cell module
US14/098,020 US10056517B2 (en) 2011-06-06 2013-12-05 Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body
US15/687,352 US10672928B2 (en) 2011-06-06 2017-08-25 Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2011126518 2011-06-06
JP2011126517 2011-06-06
JP2011-126518 2011-06-06
JP2011126520 2011-06-06
JP2011-126516 2011-06-06
JP2011-126520 2011-06-06
JP2011-126517 2011-06-06
JP2011126516 2011-06-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/098,020 Continuation US10056517B2 (en) 2011-06-06 2013-12-05 Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

Publications (2)

Publication Number Publication Date
WO2012169550A1 WO2012169550A1 (ja) 2012-12-13
WO2012169550A9 true WO2012169550A9 (ja) 2013-02-21

Family

ID=47296109

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/064594 WO2012169550A1 (ja) 2011-06-06 2012-06-06 金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法

Country Status (8)

Country Link
US (2) US10056517B2 (ja)
EP (2) EP2720519B1 (ja)
JP (3) JP6161121B2 (ja)
KR (1) KR102067846B1 (ja)
CN (2) CN107256903B (ja)
ES (1) ES2660212T3 (ja)
TW (1) TWI548511B (ja)
WO (1) WO2012169550A1 (ja)

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US10056517B2 (en) 2018-08-21
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TW201307053A (zh) 2013-02-16
EP3300125A3 (en) 2018-12-26
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CN103597915B (zh) 2017-05-24
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EP3300125B1 (en) 2020-01-15
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