KR101136423B1 - 용량성 결합이 감소된 회로기판 어셈블리 - Google Patents

용량성 결합이 감소된 회로기판 어셈블리 Download PDF

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Publication number
KR101136423B1
KR101136423B1 KR1020077007805A KR20077007805A KR101136423B1 KR 101136423 B1 KR101136423 B1 KR 101136423B1 KR 1020077007805 A KR1020077007805 A KR 1020077007805A KR 20077007805 A KR20077007805 A KR 20077007805A KR 101136423 B1 KR101136423 B1 KR 101136423B1
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South Korea
Prior art keywords
conductor
spacer
substrate
assembly
circuit board
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Expired - Lifetime
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KR1020077007805A
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English (en)
Korean (ko)
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KR20070114692A (ko
Inventor
영주 윤
페르난도 아귀레
니콜라스 제이. 테네켓지스
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테라다인 인코퍼레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020077007805A 2004-09-17 2005-07-27 용량성 결합이 감소된 회로기판 어셈블리 Expired - Lifetime KR101136423B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/817,785 2004-09-17
US10/817,785 US7388158B2 (en) 2004-09-17 2004-09-17 Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
PCT/US2005/026688 WO2006036282A1 (en) 2004-09-17 2005-07-27 Circuit board assembly with reduced capacitive coupling

Publications (2)

Publication Number Publication Date
KR20070114692A KR20070114692A (ko) 2007-12-04
KR101136423B1 true KR101136423B1 (ko) 2012-04-19

Family

ID=35482356

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077007805A Expired - Lifetime KR101136423B1 (ko) 2004-09-17 2005-07-27 용량성 결합이 감소된 회로기판 어셈블리

Country Status (6)

Country Link
US (1) US7388158B2 (https=)
EP (1) EP1795057A1 (https=)
JP (1) JP5172341B2 (https=)
KR (1) KR101136423B1 (https=)
CN (2) CN102638931B (https=)
WO (1) WO2006036282A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108650777A (zh) * 2018-05-16 2018-10-12 新华三技术有限公司 印制电路板及通信设备
WO2019078408A1 (ko) * 2017-10-18 2019-04-25 삼성전자 주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치

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US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
US20110139484A1 (en) * 2009-12-15 2011-06-16 Advanced Bionics, Llc Hermetic Electrical Feedthrough
US8487195B2 (en) * 2010-03-04 2013-07-16 Broadcom Corporation Via structure for multi-gigahertz signaling
US10572416B1 (en) 2016-03-28 2020-02-25 Aquantia Corporation Efficient signaling scheme for high-speed ultra short reach interfaces
US11855056B1 (en) 2019-03-15 2023-12-26 Eliyan Corporation Low cost solution for 2.5D and 3D packaging using USR chiplets
US11855043B1 (en) 2021-05-06 2023-12-26 Eliyan Corporation Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12438095B1 (en) 2021-05-06 2025-10-07 Eliyan Corp. Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12204794B1 (en) 2021-05-18 2025-01-21 Eliyan Corporation Architecture for DRAM control optimization using simultaneous bidirectional memory interfaces
US11842986B1 (en) 2021-11-25 2023-12-12 Eliyan Corporation Multi-chip module (MCM) with interface adapter circuitry
US12190038B1 (en) 2021-11-25 2025-01-07 Eliyan Corporation Multi-chip module (MCM) with multi-port unified memory
US12579093B1 (en) 2021-12-31 2026-03-17 Eliyan Corp. Chiplet gearbox for low-cost multi-chip module applications
US11841815B1 (en) 2021-12-31 2023-12-12 Eliyan Corporation Chiplet gearbox for low-cost multi-chip module applications
US12248419B1 (en) 2022-05-26 2025-03-11 Eliyan Corporation Interface conversion circuitry for universal chiplet interconnect express (UCIe)
US12058874B1 (en) 2022-12-27 2024-08-06 Eliyan Corporation Universal network-attached memory architecture
US12182040B1 (en) 2023-06-05 2024-12-31 Eliyan Corporation Multi-chip module (MCM) with scalable high bandwidth memory
US12525540B1 (en) 2023-06-05 2026-01-13 Eliyan Corp. Multi-chip module (MCM) with scalable high bandwidth memory
US12204482B1 (en) 2023-10-09 2025-01-21 Eliyan Corporation Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules
US12248413B1 (en) 2023-10-11 2025-03-11 Eliyan Corporation Universal memory interface utilizing die-to-die (D2D) interfaces between chiplets

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US20010054939A1 (en) * 2000-04-27 2001-12-27 Yu Zhu High-frequency multilayer circuit substrate

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019078408A1 (ko) * 2017-10-18 2019-04-25 삼성전자 주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
KR20190043328A (ko) * 2017-10-18 2019-04-26 삼성전자주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
KR102362243B1 (ko) 2017-10-18 2022-02-11 삼성전자주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
US11357099B2 (en) 2017-10-18 2022-06-07 Samsung Electronics Co., Ltd. RF package module and electronic device comprising RF package module
CN108650777A (zh) * 2018-05-16 2018-10-12 新华三技术有限公司 印制电路板及通信设备

Also Published As

Publication number Publication date
CN102638931A (zh) 2012-08-15
US20060060376A1 (en) 2006-03-23
KR20070114692A (ko) 2007-12-04
WO2006036282A1 (en) 2006-04-06
CN101044801A (zh) 2007-09-26
JP5172341B2 (ja) 2013-03-27
EP1795057A1 (en) 2007-06-13
JP2008513998A (ja) 2008-05-01
US7388158B2 (en) 2008-06-17
CN102638931B (zh) 2014-09-24

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