KR101132282B1 - 미립 은분의 제조 방법 - Google Patents

미립 은분의 제조 방법 Download PDF

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Publication number
KR101132282B1
KR101132282B1 KR1020067001513A KR20067001513A KR101132282B1 KR 101132282 B1 KR101132282 B1 KR 101132282B1 KR 1020067001513 A KR1020067001513 A KR 1020067001513A KR 20067001513 A KR20067001513 A KR 20067001513A KR 101132282 B1 KR101132282 B1 KR 101132282B1
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KR
South Korea
Prior art keywords
silver
silver powder
powder
reducing agent
fine
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Application number
KR1020067001513A
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English (en)
Korean (ko)
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KR20060035781A (ko
Inventor
타쿠야 사사키
마시시 카토
카츠히코 요시마루
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
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Publication of KR20060035781A publication Critical patent/KR20060035781A/ko
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Publication of KR101132282B1 publication Critical patent/KR101132282B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
KR1020067001513A 2003-07-29 2004-07-15 미립 은분의 제조 방법 KR101132282B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003281659A JP4489388B2 (ja) 2003-07-29 2003-07-29 微粒銀粉の製造方法
JPJP-P-2003-00281659 2003-07-29
PCT/JP2004/010099 WO2005009651A1 (ja) 2003-07-29 2004-07-15 微粒銀粉及びその微粒銀粉の製造方法

Publications (2)

Publication Number Publication Date
KR20060035781A KR20060035781A (ko) 2006-04-26
KR101132282B1 true KR101132282B1 (ko) 2012-04-02

Family

ID=34100959

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067001513A KR101132282B1 (ko) 2003-07-29 2004-07-15 미립 은분의 제조 방법

Country Status (9)

Country Link
US (1) US20080138238A1 (de)
JP (1) JP4489388B2 (de)
KR (1) KR101132282B1 (de)
CN (1) CN100455382C (de)
CA (1) CA2534107A1 (de)
DE (1) DE112004001399T5 (de)
HK (1) HK1092101A1 (de)
TW (1) TW200504166A (de)
WO (1) WO2005009651A1 (de)

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JP4347381B2 (ja) * 2005-05-25 2009-10-21 ニホンハンダ株式会社 金属系被着体接着用ペースト状銀組成物、その製造方法および金属系被着体の接着方法
CN101495257B (zh) 2006-07-28 2011-12-14 三菱麻铁里亚尔株式会社 银微粒的制备方法以及制备装置
TWI468240B (zh) * 2007-03-30 2015-01-11 Mitsubishi Materials Corp 銀微粒子、銀微粒子之製造方法、及銀微粒子之製造裝置
WO2009090915A1 (ja) 2008-01-17 2009-07-23 Nichia Corporation 導電性材料の製造方法、その方法により得られた導電性材料、その導電性材料を含む電子機器、発光装置、発光装置製造方法
JP5355007B2 (ja) * 2008-09-17 2013-11-27 Ｄｏｗａエレクトロニクス株式会社 球状銀粉の製造方法
US8836130B2 (en) 2009-01-23 2014-09-16 Nichia Corporation Light emitting semiconductor element bonded to a base by a silver coating
JP5370372B2 (ja) 2009-01-23 2013-12-18 日亜化学工業株式会社 半導体装置及びその製造方法
JP5492096B2 (ja) 2009-01-23 2014-05-14 日亜化学工業株式会社 半導体装置及びその製造方法
US8231704B2 (en) * 2009-05-01 2012-07-31 E I Du Pont De Nemours And Company Silver particles and processes for making them
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
JP5673536B2 (ja) 2009-07-21 2015-02-18 日亜化学工業株式会社 導電性材料の製造方法、その方法により得られた導電性材料、その導電性材料を含む電子機器、および発光装置
TW201108249A (en) * 2009-08-25 2011-03-01 Du Pont Silver thick film paste compositions and their use in conductors for photovoltaic cells
JP2011080094A (ja) * 2009-10-02 2011-04-21 Toda Kogyo Corp 銀微粒子及びその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP5659495B2 (ja) * 2010-01-26 2015-01-28 三菱マテリアル株式会社 電極又は配線パターンの形成方法
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
KR20130099998A (ko) 2010-11-08 2013-09-06 나믹스 가부시끼가이샤 금속 입자 및 그 제조 방법
US8574338B2 (en) 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
CN102133635B (zh) * 2011-05-02 2012-09-19 杨荣春 银粉及其制造方法
KR20140047663A (ko) * 2011-07-29 2014-04-22 도다 고교 가부시끼가이샤 은미립자 및 이 은미립자를 함유하는 도전성 페이스트, 도전성 막 및 전자 디바이스
JP5354041B2 (ja) * 2012-02-24 2013-11-27 住友金属鉱山株式会社 銀粉の製造方法
JP6216709B2 (ja) * 2012-03-05 2017-10-18 ナミックス株式会社 銀微粒子焼結体
JP5510531B1 (ja) * 2012-11-29 2014-06-04 住友金属鉱山株式会社 銀粉及び銀ペースト
TWI508799B (zh) * 2012-12-06 2015-11-21 China Steel Corp A Method for Synthesis of Silver Powder with Adjustable Particle Size
JP6115405B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
JP6086145B2 (ja) * 2015-12-22 2017-03-01 住友金属鉱山株式会社 銀粉の製造方法
KR102033545B1 (ko) * 2017-06-05 2019-10-17 대주전자재료 주식회사 은 입자 및 이의 제조방법
CN107520460A (zh) * 2017-07-26 2017-12-29 华南理工大学 一种超细纳米金/纳米纤维素复合溶液及其制备方法
KR20220106128A (ko) 2019-11-28 2022-07-28 엠. 테크닉 가부시키가이샤 은 미립자의 제조 방법
CN114682792B (zh) * 2022-04-14 2024-02-13 宁夏中色新材料有限公司 一种高比表面球形银粉及其制备方法
JP2023164097A (ja) * 2022-04-28 2023-11-10 Ｄｏｗａエレクトロニクス株式会社 球状銀粉、球状銀粉の製造方法、球状銀粉製造装置、及び導電性ペースト

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979985A (en) * 1990-02-06 1990-12-25 E. I. Du Pont De Nemours And Company Process for making finely divided particles of silver metal
JP2001107101A (ja) 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP2003034802A (ja) 2001-07-25 2003-02-07 Mitsui Mining & Smelting Co Ltd 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板
JP2003129106A (ja) * 2001-10-25 2003-05-08 Murata Mfg Co Ltd ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287210A (ja) * 1988-05-12 1989-11-17 Tanaka Kikinzoku Kogyo Kk 銀微粒子の製造方法
JPH04333504A (ja) * 1991-05-10 1992-11-20 Sumitomo Metal Mining Co Ltd 単分散銀微粉の連続製造方法
CN1174827C (zh) * 2001-08-17 2004-11-10 中国科学院过程工程研究所 化学还原法制备六方片状银粉
JP4109520B2 (ja) * 2002-09-12 2008-07-02 三井金属鉱業株式会社 低凝集性銀粉並びにその低凝集性銀粉の製造方法及びその低凝集性銀粉を用いた導電性ペースト

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979985A (en) * 1990-02-06 1990-12-25 E. I. Du Pont De Nemours And Company Process for making finely divided particles of silver metal
JP2001107101A (ja) 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP2003034802A (ja) 2001-07-25 2003-02-07 Mitsui Mining & Smelting Co Ltd 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板
JP2003129106A (ja) * 2001-10-25 2003-05-08 Murata Mfg Co Ltd ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品

Also Published As

Publication number Publication date
HK1092101A1 (en) 2007-02-02
KR20060035781A (ko) 2006-04-26
CN100455382C (zh) 2009-01-28
TW200504166A (en) 2005-02-01
CN1826197A (zh) 2006-08-30
JP4489388B2 (ja) 2010-06-23
JP2005048236A (ja) 2005-02-24
US20080138238A1 (en) 2008-06-12
DE112004001399T5 (de) 2006-06-22
TWI304832B (de) 2009-01-01
CA2534107A1 (en) 2005-02-03
WO2005009651A1 (ja) 2005-02-03

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