HK1092101A1 - Fine-grain silver powder and process for producing the same - Google Patents
Fine-grain silver powder and process for producing the sameInfo
- Publication number
- HK1092101A1 HK1092101A1 HK06112769.8A HK06112769A HK1092101A1 HK 1092101 A1 HK1092101 A1 HK 1092101A1 HK 06112769 A HK06112769 A HK 06112769A HK 1092101 A1 HK1092101 A1 HK 1092101A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- fine
- producing
- same
- silver powder
- grain silver
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003281659A JP4489388B2 (ja) | 2003-07-29 | 2003-07-29 | 微粒銀粉の製造方法 |
PCT/JP2004/010099 WO2005009651A1 (ja) | 2003-07-29 | 2004-07-15 | 微粒銀粉及びその微粒銀粉の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1092101A1 true HK1092101A1 (en) | 2007-02-02 |
Family
ID=34100959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06112769.8A HK1092101A1 (en) | 2003-07-29 | 2006-11-21 | Fine-grain silver powder and process for producing the same |
Country Status (9)
Country | Link |
---|---|
US (1) | US20080138238A1 (de) |
JP (1) | JP4489388B2 (de) |
KR (1) | KR101132282B1 (de) |
CN (1) | CN100455382C (de) |
CA (1) | CA2534107A1 (de) |
DE (1) | DE112004001399T5 (de) |
HK (1) | HK1092101A1 (de) |
TW (1) | TW200504166A (de) |
WO (1) | WO2005009651A1 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006126614A1 (ja) * | 2005-05-25 | 2006-11-30 | Nihon Handa Co., Ltd. | ペースト状銀組成物、その製造方法、固形状銀の製造方法、固形状銀、接着方法および回路板の製造方法 |
KR101136766B1 (ko) | 2006-07-28 | 2012-04-20 | 미쓰비시 마테리알 가부시키가이샤 | 은 미립자와 그 제조 방법 및 제조 장치 |
TWI468240B (zh) * | 2007-03-30 | 2015-01-11 | Mitsubishi Materials Corp | 銀微粒子、銀微粒子之製造方法、及銀微粒子之製造裝置 |
US8968608B2 (en) | 2008-01-17 | 2015-03-03 | Nichia Corporation | Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device |
JP5355007B2 (ja) * | 2008-09-17 | 2013-11-27 | Dowaエレクトロニクス株式会社 | 球状銀粉の製造方法 |
US8836130B2 (en) | 2009-01-23 | 2014-09-16 | Nichia Corporation | Light emitting semiconductor element bonded to a base by a silver coating |
JP5370372B2 (ja) | 2009-01-23 | 2013-12-18 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
CN102292835B (zh) | 2009-01-23 | 2015-03-25 | 日亚化学工业株式会社 | 半导体装置及其制造方法 |
US8231704B2 (en) * | 2009-05-01 | 2012-07-31 | E I Du Pont De Nemours And Company | Silver particles and processes for making them |
US8372178B2 (en) * | 2009-05-01 | 2013-02-12 | E I Du Pont De Nemours And Company | Silver particles and processes for making them |
EP2407980B1 (de) | 2009-07-21 | 2019-01-23 | Nichia Corporation | Verfahren zur herstellung eines leitfähigen materials, in diesem verfahren gewonnenes leitfähiges material, elektronikgerät mit dem leitfähigen material und lichtemittierende vorrichtung damit |
TW201108249A (en) * | 2009-08-25 | 2011-03-01 | Du Pont | Silver thick film paste compositions and their use in conductors for photovoltaic cells |
JP2011080094A (ja) * | 2009-10-02 | 2011-04-21 | Toda Kogyo Corp | 銀微粒子及びその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス |
JP5659495B2 (ja) * | 2010-01-26 | 2015-01-28 | 三菱マテリアル株式会社 | 電極又は配線パターンの形成方法 |
US8366799B2 (en) | 2010-08-30 | 2013-02-05 | E I Du Pont De Nemours And Company | Silver particles and a process for making them |
US9186727B2 (en) * | 2010-11-08 | 2015-11-17 | Namics Corporation | Metal particle |
US8574338B2 (en) | 2010-11-17 | 2013-11-05 | E I Du Pont De Nemours And Company | Reactor and continuous process for producing silver powders |
CN102133635B (zh) * | 2011-05-02 | 2012-09-19 | 杨荣春 | 银粉及其制造方法 |
KR20140047663A (ko) * | 2011-07-29 | 2014-04-22 | 도다 고교 가부시끼가이샤 | 은미립자 및 이 은미립자를 함유하는 도전성 페이스트, 도전성 막 및 전자 디바이스 |
JP5354041B2 (ja) * | 2012-02-24 | 2013-11-27 | 住友金属鉱山株式会社 | 銀粉の製造方法 |
WO2013133085A1 (ja) * | 2012-03-05 | 2013-09-12 | ナミックス株式会社 | 銀微粒子焼結体 |
JP5510531B1 (ja) * | 2012-11-29 | 2014-06-04 | 住友金属鉱山株式会社 | 銀粉及び銀ペースト |
TWI508799B (zh) * | 2012-12-06 | 2015-11-21 | China Steel Corp | A Method for Synthesis of Silver Powder with Adjustable Particle Size |
JP6115405B2 (ja) * | 2013-08-28 | 2017-04-19 | 住友金属鉱山株式会社 | 銀粉の製造方法 |
JP6086145B2 (ja) * | 2015-12-22 | 2017-03-01 | 住友金属鉱山株式会社 | 銀粉の製造方法 |
KR102033545B1 (ko) * | 2017-06-05 | 2019-10-17 | 대주전자재료 주식회사 | 은 입자 및 이의 제조방법 |
CN107520460A (zh) * | 2017-07-26 | 2017-12-29 | 华南理工大学 | 一种超细纳米金/纳米纤维素复合溶液及其制备方法 |
EP4066968A4 (de) | 2019-11-28 | 2023-08-02 | M. Technique Co., Ltd. | Verfahren zur herstellung von feinen silberpartikeln |
CN114682792B (zh) * | 2022-04-14 | 2024-02-13 | 宁夏中色新材料有限公司 | 一种高比表面球形银粉及其制备方法 |
JP2023164097A (ja) * | 2022-04-28 | 2023-11-10 | Dowaエレクトロニクス株式会社 | 球状銀粉、球状銀粉の製造方法、球状銀粉製造装置、及び導電性ペースト |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287210A (ja) * | 1988-05-12 | 1989-11-17 | Tanaka Kikinzoku Kogyo Kk | 銀微粒子の製造方法 |
US4979985A (en) * | 1990-02-06 | 1990-12-25 | E. I. Du Pont De Nemours And Company | Process for making finely divided particles of silver metal |
JPH04333504A (ja) * | 1991-05-10 | 1992-11-20 | Sumitomo Metal Mining Co Ltd | 単分散銀微粉の連続製造方法 |
JP2001107101A (ja) * | 1999-10-12 | 2001-04-17 | Mitsui Mining & Smelting Co Ltd | 高分散性球状銀粉末及びその製造方法 |
JP4185267B2 (ja) * | 2001-07-25 | 2008-11-26 | 三井金属鉱業株式会社 | 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板 |
CN1174827C (zh) * | 2001-08-17 | 2004-11-10 | 中国科学院过程工程研究所 | 化学还原法制备六方片状银粉 |
JP2003129106A (ja) * | 2001-10-25 | 2003-05-08 | Murata Mfg Co Ltd | ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品 |
JP4109520B2 (ja) * | 2002-09-12 | 2008-07-02 | 三井金属鉱業株式会社 | 低凝集性銀粉並びにその低凝集性銀粉の製造方法及びその低凝集性銀粉を用いた導電性ペースト |
-
2003
- 2003-07-29 JP JP2003281659A patent/JP4489388B2/ja not_active Expired - Lifetime
-
2004
- 2004-06-28 TW TW093118759A patent/TW200504166A/zh not_active IP Right Cessation
- 2004-07-15 CN CNB2004800209878A patent/CN100455382C/zh not_active Expired - Fee Related
- 2004-07-15 US US10/566,365 patent/US20080138238A1/en not_active Abandoned
- 2004-07-15 DE DE112004001399T patent/DE112004001399T5/de not_active Withdrawn
- 2004-07-15 WO PCT/JP2004/010099 patent/WO2005009651A1/ja active Application Filing
- 2004-07-15 CA CA002534107A patent/CA2534107A1/en not_active Abandoned
- 2004-07-15 KR KR1020067001513A patent/KR101132282B1/ko not_active IP Right Cessation
-
2006
- 2006-11-21 HK HK06112769.8A patent/HK1092101A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101132282B1 (ko) | 2012-04-02 |
CN100455382C (zh) | 2009-01-28 |
JP2005048236A (ja) | 2005-02-24 |
CA2534107A1 (en) | 2005-02-03 |
TW200504166A (en) | 2005-02-01 |
KR20060035781A (ko) | 2006-04-26 |
WO2005009651A1 (ja) | 2005-02-03 |
DE112004001399T5 (de) | 2006-06-22 |
US20080138238A1 (en) | 2008-06-12 |
CN1826197A (zh) | 2006-08-30 |
JP4489388B2 (ja) | 2010-06-23 |
TWI304832B (de) | 2009-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20160715 |