HK1092101A1 - Fine-grain silver powder and process for producing the same - Google Patents
Fine-grain silver powder and process for producing the sameInfo
- Publication number
- HK1092101A1 HK1092101A1 HK06112769.8A HK06112769A HK1092101A1 HK 1092101 A1 HK1092101 A1 HK 1092101A1 HK 06112769 A HK06112769 A HK 06112769A HK 1092101 A1 HK1092101 A1 HK 1092101A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- fine
- producing
- same
- silver powder
- grain silver
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003281659A JP4489388B2 (en) | 2003-07-29 | 2003-07-29 | Method for producing fine silver powder |
PCT/JP2004/010099 WO2005009651A1 (en) | 2003-07-29 | 2004-07-15 | Fine-grain silver powder and process for producing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1092101A1 true HK1092101A1 (en) | 2007-02-02 |
Family
ID=34100959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06112769.8A HK1092101A1 (en) | 2003-07-29 | 2006-11-21 | Fine-grain silver powder and process for producing the same |
Country Status (9)
Country | Link |
---|---|
US (1) | US20080138238A1 (en) |
JP (1) | JP4489388B2 (en) |
KR (1) | KR101132282B1 (en) |
CN (1) | CN100455382C (en) |
CA (1) | CA2534107A1 (en) |
DE (1) | DE112004001399T5 (en) |
HK (1) | HK1092101A1 (en) |
TW (1) | TW200504166A (en) |
WO (1) | WO2005009651A1 (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4347381B2 (en) * | 2005-05-25 | 2009-10-21 | ニホンハンダ株式会社 | Paste silver composition for adhesion of metal-based adherend, method for producing the same, and method for bonding metal-based adherend |
WO2008013274A1 (en) | 2006-07-28 | 2008-01-31 | Mitsubishi Materials Corporation | Silver fine particles and processes and equipment for the production thereof |
TWI468240B (en) * | 2007-03-30 | 2015-01-11 | Mitsubishi Materials Corp | Silver fine particles, method for manufacturing silver fine particles, and apparatus for manufacturing silver fine particles |
CN101911219B (en) | 2008-01-17 | 2015-12-16 | 日亚化学工业株式会社 | Conductive material and manufacture method, electronic equipment, light-emitting device and manufacture method thereof |
JP5355007B2 (en) * | 2008-09-17 | 2013-11-27 | Dowaエレクトロニクス株式会社 | Method for producing spherical silver powder |
CN102292835B (en) | 2009-01-23 | 2015-03-25 | 日亚化学工业株式会社 | Semiconductor device and method for manufacturing same |
EP2390903B1 (en) | 2009-01-23 | 2016-11-02 | Nichia Corporation | Method of producing a semiconductor device by bonding silver oxide or silver on a surface of a semiconductor element with silver oxide or silver on a surface of a lead frame or of a wiring substrate, at least one of said surfaces being provided with silver oxide |
US8836130B2 (en) | 2009-01-23 | 2014-09-16 | Nichia Corporation | Light emitting semiconductor element bonded to a base by a silver coating |
US8372178B2 (en) * | 2009-05-01 | 2013-02-12 | E I Du Pont De Nemours And Company | Silver particles and processes for making them |
TW201100185A (en) * | 2009-05-01 | 2011-01-01 | Du Pont | Silver particles and a process for making them |
EP2407980B1 (en) | 2009-07-21 | 2019-01-23 | Nichia Corporation | Method for producing conductive material, conductive material obtained by the same method, electronic device containing the conductive material, and light-emitting device |
US20110048527A1 (en) * | 2009-08-25 | 2011-03-03 | E.I. Du Pont De Nemours And Company | Silver thick film paste compositions and their use in conductors for photovoltaic cells |
JP2011080094A (en) * | 2009-10-02 | 2011-04-21 | Toda Kogyo Corp | Fine silver particle, method for producing same, conductive paste containing the fine silver particles, conductive film, and electronic device |
JP5659495B2 (en) * | 2010-01-26 | 2015-01-28 | 三菱マテリアル株式会社 | Method for forming electrode or wiring pattern |
US8366799B2 (en) | 2010-08-30 | 2013-02-05 | E I Du Pont De Nemours And Company | Silver particles and a process for making them |
EP2638990B1 (en) * | 2010-11-08 | 2019-05-08 | Namics Corporation | Manufacturing method for metal particles |
US8574338B2 (en) | 2010-11-17 | 2013-11-05 | E I Du Pont De Nemours And Company | Reactor and continuous process for producing silver powders |
CN102133635B (en) * | 2011-05-02 | 2012-09-19 | 杨荣春 | Silver powder and manufacturing method thereof |
WO2013018645A1 (en) * | 2011-07-29 | 2013-02-07 | 戸田工業株式会社 | Fine silver particles, conductive paste containing fine silver particles, conductive film and electronic device |
JP5354041B2 (en) * | 2012-02-24 | 2013-11-27 | 住友金属鉱山株式会社 | Silver powder manufacturing method |
JP6216709B2 (en) * | 2012-03-05 | 2017-10-18 | ナミックス株式会社 | Silver fine particle sintered body |
JP5510531B1 (en) * | 2012-11-29 | 2014-06-04 | 住友金属鉱山株式会社 | Silver powder and silver paste |
TWI508799B (en) * | 2012-12-06 | 2015-11-21 | China Steel Corp | A Method for Synthesis of Silver Powder with Adjustable Particle Size |
JP6115405B2 (en) * | 2013-08-28 | 2017-04-19 | 住友金属鉱山株式会社 | Silver powder manufacturing method |
JP6086145B2 (en) * | 2015-12-22 | 2017-03-01 | 住友金属鉱山株式会社 | Silver powder manufacturing method |
KR102033545B1 (en) * | 2017-06-05 | 2019-10-17 | 대주전자재료 주식회사 | Silver particle and method of manufacture thereof |
CN107520460A (en) * | 2017-07-26 | 2017-12-29 | 华南理工大学 | A kind of superfine nano gold/nano-cellulose composite solution and preparation method thereof |
CN114728339B (en) | 2019-11-28 | 2024-09-10 | M技术株式会社 | Method for producing silver microparticles |
CN114682792B (en) * | 2022-04-14 | 2024-02-13 | 宁夏中色新材料有限公司 | Spherical silver powder with high specific surface area and preparation method thereof |
JP2023164097A (en) * | 2022-04-28 | 2023-11-10 | Dowaエレクトロニクス株式会社 | Spherical silver powder, method for producing spherical silver powder, apparatus for producing spherical silver powder, and conductive paste |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287210A (en) * | 1988-05-12 | 1989-11-17 | Tanaka Kikinzoku Kogyo Kk | Manufacture of silver fine particle |
US4979985A (en) * | 1990-02-06 | 1990-12-25 | E. I. Du Pont De Nemours And Company | Process for making finely divided particles of silver metal |
JPH04333504A (en) * | 1991-05-10 | 1992-11-20 | Sumitomo Metal Mining Co Ltd | Continuous production of monodisperse fine silver powder |
JP2001107101A (en) * | 1999-10-12 | 2001-04-17 | Mitsui Mining & Smelting Co Ltd | High dispersibility spherical silver powder and its producing method |
JP4185267B2 (en) * | 2001-07-25 | 2008-11-26 | 三井金属鉱業株式会社 | Copper powder, method for producing the copper powder, copper paste using the copper powder, and printed wiring board using the copper paste |
CN1174827C (en) * | 2001-08-17 | 2004-11-10 | 中国科学院过程工程研究所 | Preparation of hexagonal plate silver powder by chemical reduction process |
JP2003129106A (en) * | 2001-10-25 | 2003-05-08 | Murata Mfg Co Ltd | Method for manufacturing nickel powder, nickel powder, nickel paste, and laminated ceramic electronic component |
JP4109520B2 (en) * | 2002-09-12 | 2008-07-02 | 三井金属鉱業株式会社 | Low cohesive silver powder, method for producing the low cohesive silver powder, and conductive paste using the low cohesive silver powder |
-
2003
- 2003-07-29 JP JP2003281659A patent/JP4489388B2/en not_active Expired - Lifetime
-
2004
- 2004-06-28 TW TW093118759A patent/TW200504166A/en not_active IP Right Cessation
- 2004-07-15 WO PCT/JP2004/010099 patent/WO2005009651A1/en active Application Filing
- 2004-07-15 CA CA002534107A patent/CA2534107A1/en not_active Abandoned
- 2004-07-15 DE DE112004001399T patent/DE112004001399T5/en not_active Withdrawn
- 2004-07-15 CN CNB2004800209878A patent/CN100455382C/en not_active Expired - Fee Related
- 2004-07-15 US US10/566,365 patent/US20080138238A1/en not_active Abandoned
- 2004-07-15 KR KR1020067001513A patent/KR101132282B1/en not_active IP Right Cessation
-
2006
- 2006-11-21 HK HK06112769.8A patent/HK1092101A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200504166A (en) | 2005-02-01 |
JP2005048236A (en) | 2005-02-24 |
US20080138238A1 (en) | 2008-06-12 |
CA2534107A1 (en) | 2005-02-03 |
KR101132282B1 (en) | 2012-04-02 |
CN100455382C (en) | 2009-01-28 |
TWI304832B (en) | 2009-01-01 |
CN1826197A (en) | 2006-08-30 |
JP4489388B2 (en) | 2010-06-23 |
WO2005009651A1 (en) | 2005-02-03 |
DE112004001399T5 (en) | 2006-06-22 |
KR20060035781A (en) | 2006-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20160715 |