CN100455382C - 微粒银粉及其微粒银粉的制造方法 - Google Patents

微粒银粉及其微粒银粉的制造方法 Download PDF

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Publication number
CN100455382C
CN100455382C CNB2004800209878A CN200480020987A CN100455382C CN 100455382 C CN100455382 C CN 100455382C CN B2004800209878 A CNB2004800209878 A CN B2004800209878A CN 200480020987 A CN200480020987 A CN 200480020987A CN 100455382 C CN100455382 C CN 100455382C
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China
Prior art keywords
silver
silver powder
powder
particulate
aqueous solution
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Expired - Fee Related
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CNB2004800209878A
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Chinese (zh)
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CN1826197A (zh
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佐佐木卓也
加藤政志
吉丸克彦
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
CNB2004800209878A 2003-07-29 2004-07-15 微粒银粉及其微粒银粉的制造方法 Expired - Fee Related CN100455382C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP281659/2003 2003-07-29
JP2003281659A JP4489388B2 (ja) 2003-07-29 2003-07-29 微粒銀粉の製造方法

Publications (2)

Publication Number Publication Date
CN1826197A CN1826197A (zh) 2006-08-30
CN100455382C true CN100455382C (zh) 2009-01-28

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CNB2004800209878A Expired - Fee Related CN100455382C (zh) 2003-07-29 2004-07-15 微粒银粉及其微粒银粉的制造方法

Country Status (9)

Country Link
US (1) US20080138238A1 (de)
JP (1) JP4489388B2 (de)
KR (1) KR101132282B1 (de)
CN (1) CN100455382C (de)
CA (1) CA2534107A1 (de)
DE (1) DE112004001399T5 (de)
HK (1) HK1092101A1 (de)
TW (1) TW200504166A (de)
WO (1) WO2005009651A1 (de)

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US20100009191A1 (en) * 2006-07-28 2010-01-14 Mitsubishi Materials Corporation Fine silver particles, production method thereof, and production apparatus therefor
KR20090128380A (ko) * 2007-03-30 2009-12-15 미쓰비시 마테리알 가부시키가이샤 은 미립자, 은 미립자의 제조 방법 및 은 미립자의 제조 장치
JP5212364B2 (ja) 2008-01-17 2013-06-19 日亜化学工業株式会社 導電性材料の製造方法、その方法により得られた導電性材料、その導電性材料を含む電子機器、発光装置、発光装置製造方法
JP5355007B2 (ja) * 2008-09-17 2013-11-27 Ｄｏｗａエレクトロニクス株式会社 球状銀粉の製造方法
US8836130B2 (en) 2009-01-23 2014-09-16 Nichia Corporation Light emitting semiconductor element bonded to a base by a silver coating
CN102292835B (zh) 2009-01-23 2015-03-25 日亚化学工业株式会社 半导体装置及其制造方法
JP5370372B2 (ja) 2009-01-23 2013-12-18 日亜化学工業株式会社 半導体装置及びその製造方法
TW201100185A (en) * 2009-05-01 2011-01-01 Du Pont Silver particles and a process for making them
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
EP2407980B1 (de) 2009-07-21 2019-01-23 Nichia Corporation Verfahren zur herstellung eines leitfähigen materials, in diesem verfahren gewonnenes leitfähiges material, elektronikgerät mit dem leitfähigen material und lichtemittierende vorrichtung damit
TW201108249A (en) * 2009-08-25 2011-03-01 Du Pont Silver thick film paste compositions and their use in conductors for photovoltaic cells
JP2011080094A (ja) * 2009-10-02 2011-04-21 Toda Kogyo Corp 銀微粒子及びその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP5659495B2 (ja) * 2010-01-26 2015-01-28 三菱マテリアル株式会社 電極又は配線パターンの形成方法
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
CN103260795B (zh) * 2010-11-08 2015-10-07 纳美仕有限公司 金属粒子及其制造方法
US8574338B2 (en) 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
CN102133635B (zh) * 2011-05-02 2012-09-19 杨荣春 银粉及其制造方法
CN103702786B (zh) * 2011-07-29 2015-07-29 户田工业株式会社 银微颗粒以及含有该银微颗粒的导电性膏、导电性膜和电子器件
JP5354041B2 (ja) * 2012-02-24 2013-11-27 住友金属鉱山株式会社 銀粉の製造方法
CN104160490B (zh) * 2012-03-05 2018-07-03 纳美仕股份有限公司 银微粒烧结体
JP5510531B1 (ja) * 2012-11-29 2014-06-04 住友金属鉱山株式会社 銀粉及び銀ペースト
TWI508799B (zh) * 2012-12-06 2015-11-21 China Steel Corp A Method for Synthesis of Silver Powder with Adjustable Particle Size
JP6115405B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
JP6086145B2 (ja) * 2015-12-22 2017-03-01 住友金属鉱山株式会社 銀粉の製造方法
KR102033545B1 (ko) * 2017-06-05 2019-10-17 대주전자재료 주식회사 은 입자 및 이의 제조방법
CN107520460A (zh) * 2017-07-26 2017-12-29 华南理工大学 一种超细纳米金/纳米纤维素复合溶液及其制备方法
WO2021106171A1 (ja) 2019-11-28 2021-06-03 エム・テクニック株式会社 銀微粒子の製造方法
CN114682792B (zh) * 2022-04-14 2024-02-13 宁夏中色新材料有限公司 一种高比表面球形银粉及其制备方法
JP2023164097A (ja) * 2022-04-28 2023-11-10 Ｄｏｗａエレクトロニクス株式会社 球状銀粉、球状銀粉の製造方法、球状銀粉製造装置、及び導電性ペースト

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287210A (ja) * 1988-05-12 1989-11-17 Tanaka Kikinzoku Kogyo Kk 銀微粒子の製造方法
JPH04333504A (ja) * 1991-05-10 1992-11-20 Sumitomo Metal Mining Co Ltd 単分散銀微粉の連続製造方法
JP2001107101A (ja) * 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP2003034802A (ja) * 2001-07-25 2003-02-07 Mitsui Mining & Smelting Co Ltd 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板
CN1401452A (zh) * 2001-08-17 2003-03-12 中国科学院过程工程研究所 化学还原法制备六方片状银粉
JP2003129106A (ja) * 2001-10-25 2003-05-08 Murata Mfg Co Ltd ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品

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US4979985A (en) * 1990-02-06 1990-12-25 E. I. Du Pont De Nemours And Company Process for making finely divided particles of silver metal
JP4109520B2 (ja) * 2002-09-12 2008-07-02 三井金属鉱業株式会社 低凝集性銀粉並びにその低凝集性銀粉の製造方法及びその低凝集性銀粉を用いた導電性ペースト

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287210A (ja) * 1988-05-12 1989-11-17 Tanaka Kikinzoku Kogyo Kk 銀微粒子の製造方法
JPH04333504A (ja) * 1991-05-10 1992-11-20 Sumitomo Metal Mining Co Ltd 単分散銀微粉の連続製造方法
JP2001107101A (ja) * 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP2003034802A (ja) * 2001-07-25 2003-02-07 Mitsui Mining & Smelting Co Ltd 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板
CN1401452A (zh) * 2001-08-17 2003-03-12 中国科学院过程工程研究所 化学还原法制备六方片状银粉
JP2003129106A (ja) * 2001-10-25 2003-05-08 Murata Mfg Co Ltd ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
银纳米粒子的制备及其表面特性研究. 李亚栋，贺蕴普，钱逸泰.化学物理学报，第12卷第4期. 1999
银纳米粒子的制备及其表面特性研究. 李亚栋，贺蕴普，钱逸泰.化学物理学报，第12卷第4期. 1999 *

Also Published As

Publication number Publication date
KR101132282B1 (ko) 2012-04-02
US20080138238A1 (en) 2008-06-12
KR20060035781A (ko) 2006-04-26
TWI304832B (de) 2009-01-01
JP2005048236A (ja) 2005-02-24
CN1826197A (zh) 2006-08-30
JP4489388B2 (ja) 2010-06-23
DE112004001399T5 (de) 2006-06-22
WO2005009651A1 (ja) 2005-02-03
CA2534107A1 (en) 2005-02-03
TW200504166A (en) 2005-02-01
HK1092101A1 (en) 2007-02-02

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