JP4606012B2 - 銀ペースト - Google Patents
銀ペースト Download PDFInfo
- Publication number
- JP4606012B2 JP4606012B2 JP2003385882A JP2003385882A JP4606012B2 JP 4606012 B2 JP4606012 B2 JP 4606012B2 JP 2003385882 A JP2003385882 A JP 2003385882A JP 2003385882 A JP2003385882 A JP 2003385882A JP 4606012 B2 JP4606012 B2 JP 4606012B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- silver powder
- powder
- fine
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 249
- 229910052709 silver Inorganic materials 0.000 title claims description 105
- 239000004332 silver Substances 0.000 title claims description 105
- 239000002245 particle Substances 0.000 claims description 76
- 239000000843 powder Substances 0.000 claims description 26
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- 238000004220 aggregation Methods 0.000 claims description 19
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- 238000001000 micrograph Methods 0.000 claims description 9
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- 238000004519 manufacturing process Methods 0.000 description 35
- 239000003638 chemical reducing agent Substances 0.000 description 32
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 28
- 239000004020 conductor Substances 0.000 description 23
- 239000007864 aqueous solution Substances 0.000 description 21
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- 239000012535 impurity Substances 0.000 description 14
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- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
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Description
本件発明に係る銀ペーストは、フィラーとしての銀粉と樹脂成分と有機溶剤とからなる銀ペーストにおいて、前記銀粉の粉粒は略球形であり、凝集性の低い微粒の銀粉であって、a.走査型電子顕微鏡像の画像解析により得られる一次粒子の平均粒径D IA が0.6μm以下。b.前記一次粒子の平均粒径D IA と、レーザー回折散乱式粒度分布測定法による平均粒径D 50 とを用いてD 50 /D IA で表される凝集度が1.5以下。c.結晶子径が10nm以下。の粉体特性を備えたものを用い、銀粉の含有量が85wt%〜93wt%であることを特徴とする。
本件発明に係る銀ペーストは、銀粉に、走査型電子顕微鏡像の画像解析により得られる一次粒子の平均粒径DIAが0.6μm以下である微粒銀粉を用いることが前提である。しかも、上述の銀ペースト製造方法の説明から理解できるように、当初から微粒で且つ高分散の銀粉を使用することができれば、極めて有利なものとなる。従って、以下に述べる手法で得られる微粒銀粉を用いることが好ましいのである。
[比較例1]
S2 添加剤
a 第一流路
b 第二流路
m 合流点
Claims (2)
- フィラーとしての銀粉と樹脂成分と有機溶剤とからなる銀ペーストにおいて、
前記銀粉の粉粒は略球形であり、凝集性の低い微粒の銀粉であって、以下のa.〜c.の粉体特性を備えたものを用い、銀粉の含有量が85wt%〜93wt%であることを特徴とした銀ペースト。
a.走査型電子顕微鏡像の画像解析により得られる一次粒子の平均粒径D IA が0.6μm以下。
b.前記一次粒子の平均粒径D IA と、レーザー回折散乱式粒度分布測定法による平均粒径D 50 とを用いてD 50 /D IA で表される凝集度が1.5以下。
c.結晶子径が10nm以下。 - 前記銀粉は、レーザー回折散乱式粒度分布測定法による平均粒径D50がD50=0.25μm〜0.80μmの粉体特性を備えたものを用いた請求項1に記載の銀ペースト。
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CN105008070A (zh) * | 2012-12-05 | 2015-10-28 | 住友金属矿山株式会社 | 银粉 |
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JP5355007B2 (ja) * | 2008-09-17 | 2013-11-27 | Dowaエレクトロニクス株式会社 | 球状銀粉の製造方法 |
JP5458862B2 (ja) * | 2009-12-17 | 2014-04-02 | 住友金属鉱山株式会社 | 加熱硬化型銀ペーストおよびこれを用いて形成した導体膜 |
JP5370784B2 (ja) * | 2011-05-26 | 2013-12-18 | 住友電気工業株式会社 | 金属配線 |
WO2013018645A1 (ja) * | 2011-07-29 | 2013-02-07 | 戸田工業株式会社 | 銀微粒子並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス |
US9744593B2 (en) * | 2012-03-07 | 2017-08-29 | Sumitomo Metal Mining Co., Ltd. | Silver powder and method for producing same |
JP5890387B2 (ja) * | 2013-12-26 | 2016-03-22 | Dowaエレクトロニクス株式会社 | 導電性ペースト用銀粉および導電性ペースト |
JP5925350B2 (ja) * | 2015-03-05 | 2016-05-25 | Dowaエレクトロニクス株式会社 | 球状銀粉 |
CN105772705A (zh) * | 2016-03-22 | 2016-07-20 | 苏州捷德瑞精密机械有限公司 | 一种导电银粉及其制备方法 |
CN115746625A (zh) * | 2016-04-04 | 2023-03-07 | 株式会社大赛璐 | 网版印刷用油墨 |
CN110494805A (zh) * | 2017-03-13 | 2019-11-22 | 伊斯曼柯达公司 | 含有纤维素聚合物的含银组合物和用途 |
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JPH06302213A (ja) * | 1993-04-14 | 1994-10-28 | Sumitomo Metal Mining Co Ltd | 導電性樹脂ペースト |
JPH09176448A (ja) * | 1995-12-25 | 1997-07-08 | Matsushita Electric Ind Co Ltd | 導電ペースト |
JP2002299833A (ja) * | 2001-03-30 | 2002-10-11 | Harima Chem Inc | 多層配線板およびその形成方法 |
JP2003034802A (ja) * | 2001-07-25 | 2003-02-07 | Mitsui Mining & Smelting Co Ltd | 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板 |
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JPH06302213A (ja) * | 1993-04-14 | 1994-10-28 | Sumitomo Metal Mining Co Ltd | 導電性樹脂ペースト |
JPH09176448A (ja) * | 1995-12-25 | 1997-07-08 | Matsushita Electric Ind Co Ltd | 導電ペースト |
JP2002299833A (ja) * | 2001-03-30 | 2002-10-11 | Harima Chem Inc | 多層配線板およびその形成方法 |
JP2003034802A (ja) * | 2001-07-25 | 2003-02-07 | Mitsui Mining & Smelting Co Ltd | 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板 |
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CN105008070A (zh) * | 2012-12-05 | 2015-10-28 | 住友金属矿山株式会社 | 银粉 |
CN105008070B (zh) * | 2012-12-05 | 2017-05-24 | 住友金属矿山株式会社 | 银粉 |
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