KR101061388B1 - 성막 장치 및 발광 장치 - Google Patents
성막 장치 및 발광 장치 Download PDFInfo
- Publication number
- KR101061388B1 KR101061388B1 KR1020040028181A KR20040028181A KR101061388B1 KR 101061388 B1 KR101061388 B1 KR 101061388B1 KR 1020040028181 A KR1020040028181 A KR 1020040028181A KR 20040028181 A KR20040028181 A KR 20040028181A KR 101061388 B1 KR101061388 B1 KR 101061388B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- deposition
- film
- light emitting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
- A63C17/00—Roller skates; Skate-boards
- A63C17/22—Wheels for roller skates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63C—SKATES; SKIS; ROLLER SKATES; DESIGN OR LAYOUT OF COURTS, RINKS OR THE LIKE
- A63C17/00—Roller skates; Skate-boards
- A63C17/04—Roller skates; Skate-boards with wheels arranged otherwise than in two pairs
- A63C17/06—Roller skates; Skate-boards with wheels arranged otherwise than in two pairs single-track type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2003-00121313 | 2003-04-25 | ||
| JP2003121313A JP4493926B2 (ja) | 2003-04-25 | 2003-04-25 | 製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040093011A KR20040093011A (ko) | 2004-11-04 |
| KR101061388B1 true KR101061388B1 (ko) | 2011-09-02 |
Family
ID=33499922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040028181A Expired - Fee Related KR101061388B1 (ko) | 2003-04-25 | 2004-04-23 | 성막 장치 및 발광 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US8034182B2 (enExample) |
| JP (1) | JP4493926B2 (enExample) |
| KR (1) | KR101061388B1 (enExample) |
| CN (2) | CN1550568B (enExample) |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3877613B2 (ja) * | 2002-03-05 | 2007-02-07 | 三洋電機株式会社 | 有機エレクトロルミネッセンス表示装置の製造方法 |
| US6858464B2 (en) * | 2002-06-19 | 2005-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing light emitting device |
| US7211454B2 (en) * | 2003-07-25 | 2007-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate |
| US6962648B2 (en) * | 2003-09-15 | 2005-11-08 | Global Silicon Net Corp. | Back-biased face target sputtering |
| KR100552975B1 (ko) * | 2003-11-22 | 2006-02-15 | 삼성에스디아이 주식회사 | 능동 매트릭스 유기전계발광표시장치 및 그의 제조방법 |
| US8884845B2 (en) * | 2003-10-28 | 2014-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device and telecommunication system |
| JP2005283922A (ja) * | 2004-03-29 | 2005-10-13 | Tdk Corp | 画像表示装置 |
| US20050279285A1 (en) * | 2004-06-10 | 2005-12-22 | Fuji Photo Film Co., Ltd. | Phosphor sheet manufacturing apparatus |
| US20050282308A1 (en) * | 2004-06-22 | 2005-12-22 | Albrecht Uhlig | Organic electroluminescent display device and method of producing the same |
| JP4545504B2 (ja) * | 2004-07-15 | 2010-09-15 | 株式会社半導体エネルギー研究所 | 膜形成方法、発光装置の作製方法 |
| JP2006164737A (ja) * | 2004-12-07 | 2006-06-22 | Sharp Corp | 表示素子、若しくはそれを備えた表示パネル及び表示装置 |
| JP4384109B2 (ja) * | 2005-01-05 | 2009-12-16 | 三星モバイルディスプレイ株式會社 | 蒸着システム用蒸着源の駆動軸及びこれを具備した蒸着システム |
| JP4442558B2 (ja) | 2005-01-06 | 2010-03-31 | 三星モバイルディスプレイ株式會社 | 蒸発源の加熱制御方法,蒸発源の冷却制御方法および蒸発源の制御方法 |
| US7948171B2 (en) * | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| KR100623730B1 (ko) * | 2005-03-07 | 2006-09-14 | 삼성에스디아이 주식회사 | 증발원 어셈블리 및 이를 구비한 증착 장치 |
| JP4694429B2 (ja) * | 2005-07-11 | 2011-06-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4789551B2 (ja) * | 2005-09-06 | 2011-10-12 | 株式会社半導体エネルギー研究所 | 有機el成膜装置 |
| JP4974504B2 (ja) * | 2005-10-13 | 2012-07-11 | 株式会社半導体エネルギー研究所 | 成膜装置、発光装置の作製方法 |
| US20070145895A1 (en) * | 2005-10-14 | 2007-06-28 | Matsushita Electric Industrial Co., Ltd. | Light emitting apparatus, exposure apparatus, and method for manufacturing light emitting apparatus |
| US20070084717A1 (en) * | 2005-10-16 | 2007-04-19 | Makoto Nagashima | Back-biased face target sputtering based high density non-volatile caching data storage |
| JP4736757B2 (ja) * | 2005-12-01 | 2011-07-27 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| US20070205096A1 (en) * | 2006-03-06 | 2007-09-06 | Makoto Nagashima | Magnetron based wafer processing |
| US8454810B2 (en) | 2006-07-14 | 2013-06-04 | 4D-S Pty Ltd. | Dual hexagonal shaped plasma source |
| TWI324491B (en) * | 2006-08-16 | 2010-05-01 | Au Optronics Corp | Low-reflection self-illumination unit display pixel structure |
| JP4337852B2 (ja) | 2006-08-30 | 2009-09-30 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置とその製造方法及び電子機器 |
| WO2008069259A1 (en) * | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device |
| KR100842183B1 (ko) * | 2006-12-29 | 2008-06-30 | 두산메카텍 주식회사 | 증발원 스캐닝 장치 |
| JPWO2008102694A1 (ja) * | 2007-02-21 | 2010-05-27 | 株式会社アルバック | 表示装置、表示装置用の製造装置、及び表示装置の製造方法 |
| US7973473B2 (en) * | 2007-03-02 | 2011-07-05 | Global Oled Technology Llc | Flat panel OLED device having deformable substrate |
| KR101457653B1 (ko) * | 2007-03-22 | 2014-11-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 성막장치, 제조장치, 성막방법, 및 발광장치의 제조방법 |
| KR101563237B1 (ko) * | 2007-06-01 | 2015-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 제조장치 및 발광장치 제작방법 |
| KR20090041316A (ko) * | 2007-10-23 | 2009-04-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 성막 방법 및 발광 장치의 제작 방법 |
| US8153201B2 (en) | 2007-10-23 | 2012-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing light-emitting device, and evaporation donor substrate |
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| US8425974B2 (en) * | 2007-11-29 | 2013-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation donor substrate and method for manufacturing light-emitting device |
| KR101689519B1 (ko) * | 2007-12-26 | 2016-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 증착용 기판, 증착용 기판의 제조방법, 및 발광장치의 제조방법 |
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| JP5159689B2 (ja) * | 2008-04-25 | 2013-03-06 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
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| JP5469950B2 (ja) * | 2008-08-08 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
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| JP2010163637A (ja) * | 2009-01-13 | 2010-07-29 | Tokyo Electron Ltd | 成膜装置及び成膜方法 |
| CN102414863B (zh) * | 2009-05-01 | 2015-06-03 | 卡帝瓦公司 | 用于有机蒸汽印刷的方法和设备 |
| JP4831841B2 (ja) | 2009-07-10 | 2011-12-07 | 三菱重工業株式会社 | 真空蒸着装置及び方法 |
| KR101015357B1 (ko) | 2009-08-20 | 2011-02-16 | 삼성모바일디스플레이주식회사 | 정전파괴 방지구조를 갖는 마스터 글래스 |
| JP5473576B2 (ja) * | 2009-12-10 | 2014-04-16 | 住友化学株式会社 | シリコン膜およびリチウム二次電池 |
| TW201200948A (en) * | 2010-06-22 | 2012-01-01 | Au Optronics Corp | Pixel structure and method for manufacturing the same |
| JP5412389B2 (ja) * | 2010-09-03 | 2014-02-12 | 株式会社ジャパンディスプレイ | 液晶表示装置の製造方法 |
| DE102010055285A1 (de) * | 2010-12-21 | 2012-06-21 | Solarion Ag Photovoltaik | Verdampferquelle, Verdampferkammer und Beschichtungsverfahren |
| JP5312697B2 (ja) * | 2011-01-18 | 2013-10-09 | シャープ株式会社 | 蒸着装置及び蒸着方法 |
| KR101233629B1 (ko) * | 2011-04-13 | 2013-02-15 | 에스엔유 프리시젼 주식회사 | 대용량 박막형성용 증착장치 |
| US9055654B2 (en) | 2011-12-22 | 2015-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus and film formation method |
| KR101810046B1 (ko) * | 2012-01-19 | 2017-12-19 | 삼성디스플레이 주식회사 | 기상 증착 장치 및 기상 증착 방법 |
| US9991463B2 (en) * | 2012-06-14 | 2018-06-05 | Universal Display Corporation | Electronic devices with improved shelf lives |
| JP6160614B2 (ja) * | 2012-07-04 | 2017-07-12 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6181358B2 (ja) * | 2012-07-25 | 2017-08-16 | 東京エレクトロン株式会社 | ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 |
| KR102064391B1 (ko) | 2012-08-31 | 2020-01-10 | 삼성디스플레이 주식회사 | 기판 처리 장치 |
| CN104756178B (zh) | 2012-11-05 | 2018-05-25 | 索尼半导体解决方案公司 | 光学单元、制造光学单元的方法以及电子装置 |
| KR20140077625A (ko) * | 2012-12-14 | 2014-06-24 | 삼성디스플레이 주식회사 | 유기물 증착 장치 |
| KR102108361B1 (ko) * | 2013-06-24 | 2020-05-11 | 삼성디스플레이 주식회사 | 증착률 모니터링 장치, 이를 구비하는 유기층 증착 장치, 증착률 모니터링 방법, 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| JP2015060780A (ja) * | 2013-09-20 | 2015-03-30 | 株式会社東芝 | 表示装置の製造方法及び製造システム |
| CN104637972A (zh) * | 2013-11-08 | 2015-05-20 | 昆山工研院新型平板显示技术中心有限公司 | 一种高分辨率的有机发光显示器及其制造方法 |
| CN104851901B (zh) * | 2014-02-18 | 2018-03-30 | 昆山工研院新型平板显示技术中心有限公司 | 一种高分辨率的oled显示装置及其制造方法 |
| WO2015125046A1 (en) | 2014-02-19 | 2015-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and peeling method |
| CN103938161A (zh) * | 2014-04-29 | 2014-07-23 | 京东方科技集团股份有限公司 | 基板蒸镀装置和蒸镀方法 |
| US10056574B2 (en) * | 2015-02-19 | 2018-08-21 | Sharp Kabushiki Kaisha | Organic EL display device |
| JP6685675B2 (ja) * | 2015-09-07 | 2020-04-22 | 株式会社Joled | 有機el素子、それを用いた有機el表示パネル、及び有機el表示パネルの製造方法 |
| CN105506548B (zh) * | 2016-03-01 | 2018-05-25 | 京东方科技集团股份有限公司 | 一种掩膜板修复装置、修复方法及蒸镀系统 |
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- 2004-04-26 CN CN2004100384332A patent/CN1550568B/zh not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2004327272A (ja) | 2004-11-18 |
| US20050005848A1 (en) | 2005-01-13 |
| CN102676998B (zh) | 2015-12-16 |
| CN102676998A (zh) | 2012-09-19 |
| CN1550568A (zh) | 2004-12-01 |
| US20120021548A1 (en) | 2012-01-26 |
| US8778809B2 (en) | 2014-07-15 |
| CN1550568B (zh) | 2012-01-11 |
| JP4493926B2 (ja) | 2010-06-30 |
| KR20040093011A (ko) | 2004-11-04 |
| US8399362B2 (en) | 2013-03-19 |
| US20130196054A1 (en) | 2013-08-01 |
| US8034182B2 (en) | 2011-10-11 |
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