KR100842183B1 - 증발원 스캐닝 장치 - Google Patents
증발원 스캐닝 장치 Download PDFInfo
- Publication number
- KR100842183B1 KR100842183B1 KR1020060138032A KR20060138032A KR100842183B1 KR 100842183 B1 KR100842183 B1 KR 100842183B1 KR 1020060138032 A KR1020060138032 A KR 1020060138032A KR 20060138032 A KR20060138032 A KR 20060138032A KR 100842183 B1 KR100842183 B1 KR 100842183B1
- Authority
- KR
- South Korea
- Prior art keywords
- evaporation source
- arm
- source
- vapor deposition
- evaporation
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (8)
- 증발원을 스캐닝하는 장치에 있어서,적어도 1개 이상의 관절을 가지며, 상기 증발원이 선단부에 결합되는 암(arm)부; 및상기 암부에 결합된 증발원을 선형이동시키는 구동부;를 포함하며,상기 관절의 외주면에는 실링부가 구비되는 것을 특징으로 하는 증발원 스캐닝장치.
- 제 1 항에 있어서,상기 암부는 적어도 2세트 이상 구비되는 것을 특징으로 하는 증발원 스캐닝장치.
- 제 1 항에 있어서,상기 암부 및 구동부는 상기 증발원을 사이에 두고 서로 마주보도록 각각 한 쌍이 구비되며, 상기 증발원은 상기 한 쌍의 암부의 선단에 각각 결합되는 것을 특징으로 하는 증발원 스캐닝장치.
- 제 1 항에 있어서,상기 증발원은 선형 증발원(linear source) 또는 점증발원(point source)인 것을 특징으로 하는 증발원 스캐닝장치.
- 제 4 항에 있어서,상기 암부의 선단에는 상기 증발원이 적어도 1개 이상 장착되는 것을 특징으로 하는 증발원 스캐닝장치.
- 제 1 항에 있어서,상기 구동부는 상기 증발원을 선형 왕복운동하도록 구동하는 것을 특징으로 하는 증발원 스캐닝장치.
- 삭제
- 제 1 항에 있어서,상기 스캐닝장치의 배관 및 배선은 상기 암부 내부에 배설되도록 구성되는 것을 특징으로 하는 증발원 스캐닝장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060138032A KR100842183B1 (ko) | 2006-12-29 | 2006-12-29 | 증발원 스캐닝 장치 |
PCT/KR2007/003133 WO2008082050A1 (en) | 2006-12-29 | 2007-06-28 | Evaporation source scanning device and evaporation apparatus having the same |
TW096123446A TWI396065B (zh) | 2006-12-29 | 2007-06-28 | 蒸發源掃描裝置及具有該裝置之蒸發設備 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060138032A KR100842183B1 (ko) | 2006-12-29 | 2006-12-29 | 증발원 스캐닝 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100842183B1 true KR100842183B1 (ko) | 2008-06-30 |
Family
ID=39588700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060138032A KR100842183B1 (ko) | 2006-12-29 | 2006-12-29 | 증발원 스캐닝 장치 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100842183B1 (ko) |
TW (1) | TWI396065B (ko) |
WO (1) | WO2008082050A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104911548B (zh) * | 2015-06-30 | 2017-05-03 | 合肥鑫晟光电科技有限公司 | 一种真空蒸镀装置及蒸镀方法 |
KR101821926B1 (ko) * | 2017-06-02 | 2018-01-24 | 캐논 톡키 가부시키가이샤 | 진공 증착 장치 및 이를 사용한 디바이스 제조방법 |
CN108486532A (zh) * | 2018-03-12 | 2018-09-04 | 昆山国显光电有限公司 | 一种蒸发源的搬送装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040031442A1 (en) * | 2002-05-17 | 2004-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation method, evaporation device and method of fabricating light emitting device |
US6722834B1 (en) * | 1997-10-08 | 2004-04-20 | Applied Materials, Inc. | Robot blade with dual offset wafer supports |
US20050022743A1 (en) * | 2003-07-31 | 2005-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation container and vapor deposition apparatus |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW490714B (en) * | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
JP4785269B2 (ja) * | 2000-05-02 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法及び成膜装置のクリーニング方法 |
JP4493926B2 (ja) * | 2003-04-25 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 製造装置 |
-
2006
- 2006-12-29 KR KR1020060138032A patent/KR100842183B1/ko active IP Right Grant
-
2007
- 2007-06-28 WO PCT/KR2007/003133 patent/WO2008082050A1/en active Application Filing
- 2007-06-28 TW TW096123446A patent/TWI396065B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6722834B1 (en) * | 1997-10-08 | 2004-04-20 | Applied Materials, Inc. | Robot blade with dual offset wafer supports |
US20040031442A1 (en) * | 2002-05-17 | 2004-02-19 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation method, evaporation device and method of fabricating light emitting device |
US20050022743A1 (en) * | 2003-07-31 | 2005-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation container and vapor deposition apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2008082050A1 (en) | 2008-07-10 |
TWI396065B (zh) | 2013-05-11 |
TW200827980A (en) | 2008-07-01 |
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