US20080017110A1 - Rotation evaporator for thin film deposition and thin film deposition apparatus using the same - Google Patents
Rotation evaporator for thin film deposition and thin film deposition apparatus using the same Download PDFInfo
- Publication number
- US20080017110A1 US20080017110A1 US11/825,684 US82568407A US2008017110A1 US 20080017110 A1 US20080017110 A1 US 20080017110A1 US 82568407 A US82568407 A US 82568407A US 2008017110 A1 US2008017110 A1 US 2008017110A1
- Authority
- US
- United States
- Prior art keywords
- evaporator
- substrate
- thin film
- rotation
- film deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A rotation evaporator for thin film deposition and a thin film deposition apparatus using the same are provided. The rotation evaporator includes a melting pot that has an opened top surface and in which a deposition material is filled, a heating unit that heats the melting pot, and a rotation unit that rotates the evaporator using predetermined electric power to be supplied from the outside. The thin film deposition apparatus that uses a rotation evaporator includes a substrate that is to be subject to deposition, a mask that is coupled to the substrate so as to cover a portion to be not deposited of the substrate and to deposit a necessary portion of the substrate, a substrate chucking system that supports the substrate and the mask, and an evaporator that rotates using a rotation unit. The rotation unit includes a melting pot that has an opened top surface and in which a deposition material is filled, and a heating unit that heats the melting pot.
Description
- This application claims priority from Korean Patent Application No. 10-2006-0066962 filed on Jul. 18, 2006 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to an apparatus for rotating an evaporator that deposits an organic material, and more particularly, to an apparatus for thin film deposition that can efficiently perform uniform deposition on a substrate by rotating an evaporator instead of a substrate, compared with a case of rotating a substrate.
- 2. Description of the Related Art
- As the Internet is becoming widespread, technologies related to data processing, applications, data transfer, and the like are being rapidly developed. Accordingly, as digital data transfer rates are being rapidly increased, there is a demand for the development of a display device that can display moving images and the like at a corresponding response speed. Recently, an organic EL having a high response speed has been attracting attention. The organic EL has many advantages, such as a high response speed, lower power consumption than the existing liquid crystal displays, and excellent luminance, and is light-weight and thin, and thus it is becoming the next generation display.
- The organic EL has an ITO anode film, an organic thin film, and a metal cathode film that are coated on a glass substrate. Then, a voltage is applied between the anode and the cathode such that an appropriate difference in energy is formed in the organic thin film between the anode and the cathode, and then the organic EL emits light. That is, light is generated by energy emitted when injected electrons and holes are recombined. At this time, the wavelength of emitted light can be adjusted according to the amount of a dopant of an organic material, thereby implementing natural colors (RGB). As for the structure, an ITO (Indium Tin Oxide) film having low resistance and good transmittance, an organic thin film that has a multilayer of HIL, HTL, EML, ETL, and EIL to increase light-emission efficiency, and a metal film (LiF—Al) are laminated. The organic material to be used includes Alq3, TPD, PBD, m-MTDATA, TCTA, or the like, and the dopant includes cumarine 6, BczVBi, or the like.
- The characteristics of the organic EL are primarily defined by an organic thin film layer, and a multilayer organic thin film is formed by a vacuum deposition method that uses deposition under a high vacuum atmosphere to form pixel patterns of the organic material through a shadow mask. In a vacuum chamber where the multilayer organic thin film is deposited, a deposition material of the organic material, an evaporator, an alignment device of the glass substrate and the mask, a vision system notifying whether or not the mask and the substrate are accurately aligned with each other, a thickness monitor, and the like are provided.
-
FIG. 1 is a conceptual view of a known deposition apparatus for uniform deposition. - According to the related art, for uniform deposition, deposition is performed by rotating a
mask 10, asubstrate 20, asubstrate chucking system 40, and the like. - However, the larger the
substrate 20, thesubstrate chucking system 40 that holds the substrate and the mask at an upper end of the chamber needs to be larger. As a result, there is a difficulty in rotating the substrate. Further, since the mask alignment device or the vision system is provided at the upper end of the chamber, it may also obstruct the rotation of thesubstrate 20 and the like. In addition, there are various limitations, for example, themask 10 and thesubstrate 20 that face each other must rotate with a very limited space. - The invention has been finalized in order to solve the above-described problems, and an object of the invention is to easily design a deposition apparatus for uniform deposition by rotating an evaporator instead of a substrate and the like, and to reduce operation cost of the deposition apparatus.
- Objects of the present invention are not limited to those mentioned above, and other objects of the present invention will be apparently understood by those skilled in the art through the following description.
- A rotation evaporator for thin film deposition and a thin film deposition apparatus using the same are provided.
- According to an aspect of the invention, there is provided a rotation evaporator including a melting pot that has an opened top surface and in which a deposition material is filled, a heating unit that heats the melting pot, and a rotation unit that rotates the evaporator using predetermined electric power to be supplied from the outside.
- According to another aspect of the invention, there is provided a thin film deposition apparatus that uses a rotation evaporator, the apparatus including a substrate to be subjected to deposition, a mask coupled to the substrate so as to cover a portion to be not deposited of the substrate and to deposit a necessary portion of the substrate, a substrate chucking system supporting the substrate and the mask, and an evaporator that rotates using a rotation unit. The rotation unit includes a melting pot that has an opened top surface and in which a deposition material is filled, and a heating unit that heats the melting pot.
- The above and other features and advantages of the present invention will become more apparent by describing in detail preferred embodiments thereof with reference to the attached drawings, in which:
-
FIG. 1 is a conceptual view of a known deposition apparatus for uniform deposition; -
FIG. 2 is a diagram showing a thin film deposition apparatus that uses a rotation evaporator according to an embodiment of the invention; -
FIG. 3 is a diagram showing a thin film deposition apparatus that uses a rotation evaporator rotating an evaporator using a motor according to an embodiment of the invention; -
FIG. 4 is a diagram showing a thin film deposition apparatus that uses a rotation evaporator rotating an evaporator using a belt according to an embodiment of the invention; and -
FIG. 5 is a diagram showing a thin film deposition apparatus that uses a rotation evaporator rotating an evaporator using a gear according to an embodiment of the invention. - Advantages and features of the present invention and methods of accomplishing the same may be understood more readily by reference to the following detailed description of preferred embodiments and the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, and the present invention will only be defined by the appended claims. Like reference numerals refer to like elements throughout the specification.
- Hereinafter, the invention will be described by way of embodiments of the invention with reference to the drawings that illustrates a linear evaporator for thin film deposition.
-
FIG. 2 is a diagram showing a thin film deposition apparatus that uses a rotation evaporator according to an embodiment of the invention. - A thin film deposition apparatus that uses a rotation evaporator according to an embodiment of the invention includes an
evaporator 10, asubstrate 20, amask 30, asubstrate chucking system 40, and ashaft 500 that is coupled to theevaporator 10. - The
evaporator 10 includes a melting pot that has an opened top surface and in which a deposition material is filled, and a heating unit that heats the melting pot. On thesubstrate 20, a deposition material evaporated by the evaporator is deposited, and a glass substrate or the like is used. Themask 30 performs patterning by covering a portion to be not deposited of the substrate, to thereby a pixel at a desired portion of the substrate. During a deposition process, thesubstrate 20 and themask 30 are coupled to each other. Thesubstrate chucking system 40 supports thesubstrate 20 and themask 30 that are coupled to each other, and thus they are located at an upper portion of the vacuum chamber. Theshaft 500 is coupled to theevaporator 10 so as to rotate theevaporator 10, and energy for rotating the evaporator is transferred through theshaft 500. - For uniform deposition, in the related art, the
substrate 20, themask 30, and thesubstrate chucking system 40 that supports thesubstrate 20 and themask 30 rotate. Alternatively, according to an embodiment of the invention, theevaporator 10 that is located below thesubstrate 20 rotates. Theshaft 500 is provided at a lower surface of theevaporator 10 in order to rotate theevaporator 10. -
FIG. 3 is a diagram showing a thin film deposition apparatus that uses a rotation evaporator rotating theevaporator 10 using a motor according to an embodiment of the invention. - In order to rotate the
evaporator 10, amotor 600 may be coupled to theshaft 500 of the thin film deposition apparatus that uses the rotation evaporator and that includes theevaporator 10, thesubstrate 20, themask 30, thesubstrate chucking system 40, and theshaft 500 coupled to theevaporator 10, according to the embodiment of the invention. - The
motor 600 may be provided inside the vacuum chamber or outside the vacuum chamber. -
FIG. 4 is a diagram showing a thin film deposition apparatus that uses the rotation evaporator rotating theevaporator 10 using a belt according to an embodiment of the invention. - In order to rotate the
evaporator 10, a belt may be coupled to the shaft of the thin film deposition apparatus that uses the rotation evaporator and that includes theevaporator 10, thesubstrate 20, themask 30, thesubstrate chucking system 40, and theshaft 500 coupled to theevaporator 10 according to an embodiment of the invention. - At this time, when energy is supplied to the
belt 700 through an energy supply apparatus, theevaporator 10 rotates using thebelt 700. Thebelt 700 and the apparatus for supplying energy to thebelt 700 may be provided inside or outside the vacuum chamber according to individual situations. -
FIG. 5 is a diagram showing a thin film deposition apparatus that uses the rotation evaporator rotating theevaporator 10 using a gear according to an embodiment of the invention. - In order to rotate the
evaporator 10, agear 800 may be coupled to theshaft 500 of the thin film deposition apparatus that uses the rotation evaporator and that includes theevaporator 10, thesubstrate 20, themask 30, thesubstrate chucking system 40, and theshaft 500 coupled to theevaporator 10, according to an embodiment of the invention. - At this time, when energy is supplied to the
gear 800 through an energy supply apparatus, theevaporator 10 rotates using thegear 800. Thegear 800 and an apparatus for supplying energy to thegear 800 may be provided inside or outside the vacuum chamber according to individual situations. - Although the present invention has been described in connection with the exemplary embodiments of the present invention, it will be apparent to those skilled in the art that various modifications and changes may be made thereto without departing from the scope and spirit of the invention. Therefore, it should be understood that the above embodiments are not limitative, but illustrative in all aspects. The scope of the present invention is defined by the appended claims rather than by the description preceding them, and all changes and modifications that fall within meets and bounds of the claims, or equivalents of such meets and bounds are therefore intended to be embraced by the claims.
- As described above, according to the invention, a misalignment between the substrate and the mask that may occur when the substrate and the mask rotate together with the substrate chucking system can be prevented, and design and cost loads for rotating the substrate chucking system can be reduced.
Claims (5)
1. A rotation evaporator for thin film deposition, the evaporator comprising:
a melting pot that has an opened top surface, into which a deposition material is filled;
a heating unit that heats the melting pot; and
a rotation unit that rotates the evaporator using predetermined electric power to be supplied from the outside.
2. The rotation evaporator of claim 1 , wherein the rotation unit has a shaft that is provided at a lower end of the evaporator and a motor that is coupled to the shaft.
3. The rotation evaporator of claim 1 , wherein the rotation unit rotates the evaporator by connecting a shaft provided at a lower end of the evaporator and a belt.
4. The rotation evaporator of claim 1 , wherein the rotation unit rotates the evaporator using a shaft provided at a lower end of the evaporator and a saw-toothed screw.
5. A thin film deposition apparatus that uses a rotation evaporator, the apparatus comprising:
a substrate that is to be subject to deposition;
a mask that is coupled to the substrate so as to cover a portion to be not deposited of the substrate and to deposit a necessary portion of the substrate;
a substrate chucking system that supports the substrate and the mask; and
an evaporator that rotates using a rotation unit,
wherein the evaporator comprises a melting pot that has an opened top surface and in which a deposition material is filled, and a heating unit that heats the melting pot.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060066962A KR20080007820A (en) | 2006-07-18 | 2006-07-18 | The rotation evaporator for vapor deposition of thin film and apparatus for vapor deposition of thin film using rotation evaporators |
KR10-2006-0066962 | 2006-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080017110A1 true US20080017110A1 (en) | 2008-01-24 |
Family
ID=38970241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/825,684 Abandoned US20080017110A1 (en) | 2006-07-18 | 2007-07-09 | Rotation evaporator for thin film deposition and thin film deposition apparatus using the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080017110A1 (en) |
JP (1) | JP2008025022A (en) |
KR (1) | KR20080007820A (en) |
CN (1) | CN101109067A (en) |
TW (1) | TW200807785A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012111977A (en) * | 2010-11-19 | 2012-06-14 | Semiconductor Energy Lab Co Ltd | Film deposition apparatus and film deposition method, and method for manufacturing illumination device |
CN102534475A (en) * | 2012-03-01 | 2012-07-04 | 苏州鼎旺科技有限公司 | Coating process for ultra-thin optical filter and coating fixture |
US8236108B1 (en) | 2008-04-25 | 2012-08-07 | University Of South Florida | Inertial masking assembly |
US9302291B2 (en) | 2011-08-05 | 2016-04-05 | 3M Innovative Properties Company | Systems and methods for processing vapor |
WO2017003791A1 (en) | 2015-06-30 | 2017-01-05 | 3M Innovative Properties Company | Discontinuous coatings and methods of forming the same |
WO2017172531A1 (en) | 2016-04-01 | 2017-10-05 | 3M Innovative Properties Company | Roll-to-roll atomic layer deposition apparatus and method |
US10919200B2 (en) | 2017-10-17 | 2021-02-16 | Mold-Masters (2007) Limited | Injection molding apparatus |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984135B (en) * | 2010-11-19 | 2013-07-10 | 光驰科技(上海)有限公司 | Film-forming substrate clamp and film-forming device thereof |
CN102277563A (en) * | 2011-08-03 | 2011-12-14 | 深圳大学 | Device and method for preparing coating or thin film by rotating induction thermal deposition |
KR20130045432A (en) * | 2011-10-26 | 2013-05-06 | 주식회사 탑 엔지니어링 | Rotary deposition apparatus |
KR102208242B1 (en) * | 2014-06-27 | 2021-01-28 | (주)선익시스템 | Deposition Apparatus for Variable Vaporizing Position and Deposition Method Thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6309508B1 (en) * | 1998-01-15 | 2001-10-30 | 3M Innovative Properties Company | Spinning disk evaporator |
US6902625B2 (en) * | 2000-06-01 | 2005-06-07 | The Boc Group, Inc. | Multiple pocket electron beam source |
US20060099820A1 (en) * | 2004-11-05 | 2006-05-11 | Samsung Sdi Co., Ltd. | Deposition method and apparatus |
US7125581B2 (en) * | 2002-10-25 | 2006-10-24 | Ritdisplay Corporation | Evaporation method and apparatus thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3316554C1 (en) * | 1983-05-06 | 1984-07-12 | Dr. Johannes Heidenhain Gmbh, 8225 Traunreut | Evaporator device with jet heating for vapor deposition of several materials |
JPS61195968A (en) * | 1985-02-26 | 1986-08-30 | Hitachi Cable Ltd | Production of alloy film deposited by evaporation |
JP2825918B2 (en) * | 1990-03-13 | 1998-11-18 | キヤノン株式会社 | Vacuum deposition equipment |
JP4473496B2 (en) * | 2002-09-06 | 2010-06-02 | 株式会社シンクロン | Thin film forming apparatus having a monitor holder |
JP4446048B2 (en) * | 2003-07-11 | 2010-04-07 | 株式会社昭和真空 | Evaporation source moving mechanism of vacuum evaporation system |
-
2006
- 2006-07-18 KR KR1020060066962A patent/KR20080007820A/en not_active Application Discontinuation
-
2007
- 2007-04-04 JP JP2007098887A patent/JP2008025022A/en active Pending
- 2007-05-23 CN CNA2007101037592A patent/CN101109067A/en active Pending
- 2007-06-23 TW TW096122722A patent/TW200807785A/en unknown
- 2007-07-09 US US11/825,684 patent/US20080017110A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6309508B1 (en) * | 1998-01-15 | 2001-10-30 | 3M Innovative Properties Company | Spinning disk evaporator |
US6902625B2 (en) * | 2000-06-01 | 2005-06-07 | The Boc Group, Inc. | Multiple pocket electron beam source |
US7125581B2 (en) * | 2002-10-25 | 2006-10-24 | Ritdisplay Corporation | Evaporation method and apparatus thereof |
US20060099820A1 (en) * | 2004-11-05 | 2006-05-11 | Samsung Sdi Co., Ltd. | Deposition method and apparatus |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8236108B1 (en) | 2008-04-25 | 2012-08-07 | University Of South Florida | Inertial masking assembly |
JP2012111977A (en) * | 2010-11-19 | 2012-06-14 | Semiconductor Energy Lab Co Ltd | Film deposition apparatus and film deposition method, and method for manufacturing illumination device |
US9302291B2 (en) | 2011-08-05 | 2016-04-05 | 3M Innovative Properties Company | Systems and methods for processing vapor |
CN102534475A (en) * | 2012-03-01 | 2012-07-04 | 苏州鼎旺科技有限公司 | Coating process for ultra-thin optical filter and coating fixture |
WO2017003791A1 (en) | 2015-06-30 | 2017-01-05 | 3M Innovative Properties Company | Discontinuous coatings and methods of forming the same |
WO2017172531A1 (en) | 2016-04-01 | 2017-10-05 | 3M Innovative Properties Company | Roll-to-roll atomic layer deposition apparatus and method |
US10919200B2 (en) | 2017-10-17 | 2021-02-16 | Mold-Masters (2007) Limited | Injection molding apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW200807785A (en) | 2008-02-01 |
CN101109067A (en) | 2008-01-23 |
KR20080007820A (en) | 2008-01-23 |
JP2008025022A (en) | 2008-02-07 |
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AS | Assignment |
Owner name: SEMES CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIM, KYONG-HO;REEL/FRAME:019591/0490 Effective date: 20070614 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |