JP4446048B2 - Evaporation source moving mechanism of vacuum evaporation system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an evaporation source mechanism of a film forming apparatus using vacuum evaporation, and more particularly to an evaporation source mechanism of an optical thin film manufacturing apparatus.
[0002]
[Prior art]
FIG. 1 shows a schematic configuration diagram of a conventional optical thin film manufacturing apparatus.
In the figure, 1 is a vacuum chamber provided with a vacuum exhaust port 11 and a gas introduction port 2, 3 is a substrate dome for holding a film-forming substrate 6, 7 is an evaporation source for loading an evaporating substance, and 4 is via a matching box 5. Reference numeral 8 denotes a high-frequency power source for supplying high-frequency power to the substrate dome 3, and a shutter for shielding the evaporated substance. The substrate dome 3 is rotatably installed by a rotation mechanism 10, and a high frequency power feeding mechanism 9 that supplies high frequency power to the rotating substrate dome 3 is provided.
The apparatus shown in the figure self-induces a negative DC electric field on the surface of the film-forming substrate by applying high-frequency power directly to the substrate dome, and forms a thin film with high energy and high packing density. Is disclosed in Japanese Patent Laid-Open No. 2001-73136.
Film formation is performed while observing and controlling the optical thin film deposited on the monitor substrate with an optical film thickness meter (not shown), and when the desired film thickness is reached, the shutter 8 is closed and finished.
The evaporation source 7 was fixedly disposed at a position facing the substrate dome 3.
[0003]
[Problems to be solved by the invention]
An optical thin film manufacturing apparatus is required to form a film with high accuracy in order to satisfy the optical specifications. There are various factors that affect film formation, but the influence of the position of the evaporation source is large, and simulations and the like for obtaining an optimal evaporation source position have been performed conventionally. The simulation is for finding the evaporation source position where the evaporation coefficient is calculated from the material of the evaporation substance and the like, and the evaporation substance density is uniform in the film formation substrate surface. In the conventional apparatus, an optimum evaporation source position is determined in consideration of past data and the like in addition to the simulation result, and film formation is performed with the evaporation source fixedly arranged at that position.
[0004]
However, in the actual film formation process, the evaporation coefficient changes depending on the beam width and position of the electron beam evaporation source, the shape and height of the evaporating substance dissolution surface, etc. There has been a problem that the yield has been reduced.
Further, since the position of the evaporation source is fixed according to the specification in the conventional apparatus, there is a problem that the apparatus must be manufactured again in order to change the specification. Therefore, there are devices designed to change the fixed position of the evaporation source, but even if such a device is used, the position of the evaporation source cannot be changed after evacuation once. In order to change the position of the evaporation source, there is a disadvantage that the vacuum chamber must be opened and evacuation must be performed again.
Further, since the evaporation source position must be changed every time the film forming conditions such as the material of the evaporation substance are changed, there is a trouble of unfixing and rearranging each time.
[0005]
The present invention solves the problems of the conventional apparatus as described above, and aims to finely adjust the evaporation source position by an external operation during the film forming process.
[0006]
[Means for solving the problems]
In order to solve the problem, the present invention connects the evaporation source to the rotation drive source and the elevation drive source, and performs the rotation drive and elevation drive while keeping the inside of the vacuum chamber airtight, thereby maintaining the position of the evaporation source while maintaining the vacuum atmosphere. It is intended to provide an evaporation source mechanism that can be set variably.
Specifically, it has a cylinder installed in the lower part of the vacuum chamber, a piston that moves the cylinder in an airtight manner, and a rotating drum that is fitted to the piston and driven to move up and down integrally with the piston. It is connected to a drive source and driven in an airtight manner independently of the piston, and an evaporation source is arranged on the upper part of the rotating drum. It is characterized by being driven to rotate.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
(1) Description of Configuration of Embodiment An embodiment of the present invention will be described with reference to FIGS.
FIG. 2 is a schematic view of the evaporation source mechanism of the present invention, and FIG. 3 is a schematic view for explaining a vacuum seal portion of the present invention.
The evaporation source 28 for loading the evaporation substance is attached to the upper part of the rotary drum 12 installed so as to be swivelable and movable up and down. The rotary drum 12 is located inside a cylinder 25 provided at the lower part of the vacuum chamber, and a piston 13 is disposed between the cylinder 25 and the rotary drum 12.
[0008]
Two bearings 14 are fixed to the piston 13 on the contact surface with the rotary drum 12 in the vertical direction. Further, O-rings 26 and 27 are disposed on the inner periphery and the outer periphery of the piston 13, respectively. The number of bearings and the number of O-rings may be set arbitrarily. The O-ring 26 on the inner periphery of the piston vacuum seals the contact surface with the rotating drum 12, and the O-ring 27 on the outer periphery vacuum seals the contact surface with the cylinder 25. The lower bearing 14 is supported by a piston presser 15 fixed to the rotary drum 12 so that the piston 13 cannot be removed. The rotary drum 12 is provided with another piston retainer 16 above the piston retainer 15, and the piston 13 is fitted between the two piston retainers 15 and 16. Thereby, even if the piston 13 moves up and down, the piston 14 and the rotary drum 12 move integrally through the piston pressers 15 and 16 arranged up and down. The piston retainers 15 and 16 may have any shape as long as the piston 13 is sandwiched from above and below, and a protrusion may be provided on the rotating drum 12 or an independent retaining member may be fixed to the rotating drum 12 with a screw or the like. Alternatively, a groove for fitting the piston 13 may be provided in the rotating drum 12.
[0009]
A spur gear 17 is attached to the lower piston presser 15 fixed to the rotary drum 12, and the spur gear 17 is connected to an AC servomotor 24. When the spur gear 17 is rotated by the AC servo motor 24, the piston retainer 15 and the rotary drum 12 fixed to the spur gear 17 are rotated, and the evaporation source 28 above the rotary drum 12 is turned. When the piston presser 15 is integrated with the rotary drum 12, the spur gear 17 may be directly fixed to the rotary drum 12.
When the rotary drum 12 is turned, the vacuum chamber is sealed by an O-ring 26 disposed on the inner periphery of the piston 13.
[0010]
FIG. 4 shows a schematic plan view of the evaporation source 28.
The evaporation source 28 shown in the figure is one in which an evaporating substance 29 is loaded on the circumference and the evaporating substance 29 is evaporated by an electron beam (not shown). When the evaporation source 28 is rotated by the rotary drum 12, the position of the evaporation material 29 is moved on an arc. As shown in FIG. 5, the evaporation source 28 may be provided with an evaporation material 29 on a linear guide 30 to convert the rotary motion into a linear motion and move the evaporation material 29 on a straight line.
[0011]
Next, the structure of raising and lowering the rotating drum 12 will be described.
A moving plate 19 is fixed below the piston 13 via a support 18. The moving plate 19 is attached to four ball screws 20, and a driving pulley 21 and a PX belt 22 are connected to the ball screws 20. When one point of the ball screw 20 is rotated by the AC servo motor 23, the four ball screws 20 are rotated via the PX belt 22, and the moving plate 19 is driven in the vertical direction. The piston 13 and the rotating drum 12 are moved up and down integrally with the movement plate 19 ascending and descending, and the evaporation source 28 above the rotating drum 12 is driven in the vertical direction.
When the rotary drum 12 is moved up and down, the vacuum chamber is sealed by an O-ring 27 disposed on the outer periphery of the piston.
[0012]
In the evaporation source mechanism of the present invention, the rotary drum 12 is driven integrally with the piston 13 during the up-and-down drive, and only the rotary drum 12 is driven independently of the piston 13 during the rotary drive. A single movement in the turning direction is possible. Further, by sealing the vacuum chamber according to the present invention, the position of the evaporation source 28 can be changed without pressure fluctuation.
[0013]
In the above embodiment, the AC servomotors 23 and 24 are used as the rotational drive source, but other drive sources may be used. Further, the raising / lowering drive of the moving plate 19 is not limited to the configuration using the ball screw 20. Since the drive source and the drive mechanism of the present invention are installed outside the vacuum chamber, any mechanism can be freely selected as long as it is a lift drive and a rotation drive mechanism.
[0014]
(2) Description of Operation and Operation of Embodiment FIG. 6 shows an embodiment of an optical thin film manufacturing apparatus equipped with the evaporation source mechanism of the present invention. Components similar to those of the conventional apparatus are denoted by the same reference numerals and description thereof is omitted.
The position of turning and raising / lowering of the evaporation source according to the present invention is set by the operation panel 31. It is the same as before that the evaporation source 28 is arranged at the optimum evaporation source position obtained by simulation or the like before the start of film formation. After the start of film formation, the operation source 31 is used to finely adjust the evaporation source 28 by turning it up and down to a good position.
According to the present invention, since the position of the evaporation source can be operated from the outside of the vacuum chamber, the position of the evaporation source 28 can be adjusted without breaking the vacuum atmosphere during the film forming process. The fine adjustment of the evaporation source position may be performed during film formation, or may be stopped once and after the operation of the evaporation source position, the film formation is started again as the correction film formation.
[0015]
The operation of the evaporation source position may be changed according to the amount of the evaporation substance 29, for example. As time elapses from the start of film formation, the amount of the evaporation substance 29 decreases and transpiration changes, but by operating the evaporation source position during film formation, it is possible to maintain a constant film formation condition.
[0016]
(3) Description of other examples, description of examples of diversion to other applications In the above examples, an optical thin film manufacturing apparatus was used, but a vacuum vapor deposition apparatus other than the optical thin film may be used.
[0017]
【The invention's effect】
The present invention makes it possible to variably set the evaporation source position while maintaining the vacuum state, so that it is possible to finely adjust the evaporation source to a good position during the film formation process, and to form a film with high accuracy. It became possible to do. Furthermore, since the position of the evaporation source can be easily changed in accordance with the evaporation material or the like, an apparatus that can cope with any film forming condition can be provided.
[Brief description of the drawings]
FIG. 1 is a schematic diagram of a conventional optical thin film manufacturing apparatus. FIG. 2 is a schematic diagram of an evaporation source mechanism of the present invention. FIG. 3 is an explanatory diagram of a vacuum seal of the present invention. [FIG. 6] Optical thin film manufacturing apparatus of the present invention [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Gas inlet 3 Substrate dome 4 High frequency power supply 5 Matching box 6 Film forming substrate 7 Evaporation source 8 Shutter 9 High frequency power feeding mechanism 10 Substrate dome rotation mechanism 11 Vacuum exhaust port 12 Rotating drum 13 Piston 14 Bearing 15 Piston presser 16 Piston retainer 17 Spur gear 18 Support 19 Moving plate 20 Ball screw 21 Drive pulley 22 PX belt 23 AC servo motor 24 AC servo motor 25 Cylinder 26 Inner peripheral O-ring 27 Outer peripheral O-ring 28 Evaporating source 29 Evaporating substance 30 Linear guide 31 Operation panel

Claims (7)

A film forming method in a vacuum evaporation apparatus,
The vacuum deposition apparatus is evacuated,
In any order,
Rotate the substrate dome on which the target substrate is mounted,
Evaporate the evaporating substance placed on the circumference of the evaporation source rotation shaft,
Adjusting the rotation angle of the evaporation source to determine the evaporation position of the evaporation material with respect to the substrate dome rotation axis;
Adjusting the height of the evaporation source to determine the height of the evaporation position relative to the substrate dome
Film forming method. A vacuum deposition apparatus,
Vacuum chamber,
A substrate dome on which a substrate to be processed is mounted and rotated,
An evaporating source, wherein the evaporating substance is disposed on a circumference of the evaporating source rotating shaft and is capable of moving up and down; and
A mechanism for determining the positional relationship between the evaporation position of the evaporation material and the substrate dome by adjusting the rotation angle and height of the evaporation source while maintaining the vacuum chamber in a vacuum.
A vacuum deposition apparatus equipped with In the vacuum evaporation system according to claim 2,
The evaporation source is disposed on a rotating drum;
The mechanism is
A cylinder through which a part of the rotating drum is inserted, and
A piston that is arranged in close contact with the inner surface of the cylinder and a part of the outer surface of the rotating drum to maintain the airtightness of the vacuum chamber
With
When the rotary drum moves up and down, the piston is integrated with the rotary drum and slid with respect to the cylinder,
A vacuum deposition apparatus configured to rotate the rotating drum relative to the piston when the rotating drum rotates. 4. The vacuum vapor deposition apparatus according to claim 3, wherein the rotary drum includes first and second piston pressers that sandwich the piston from above and below . The vacuum evaporation apparatus according to claim 3, wherein
A vacuum deposition apparatus comprising an O-ring (26) for airtightness that is mounted between the outer peripheral surface of the drum and the inner peripheral surface of the piston . The vacuum evaporation apparatus according to claim 3, wherein
A vacuum deposition apparatus comprising an airtight holding O-ring (27) mounted between the outer peripheral surface of the piston and the inner peripheral surface of the cylinder . The vacuum evaporation apparatus according to claim 3, further comprising:
A support for supporting the piston;
A moving plate to which the support is fixed, and
Ball screw for moving the moving plate up and down
A vacuum deposition apparatus equipped with

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