KR20100065695A - Magnet shutter and substrate processing apparatus using the same - Google Patents

Abstract

PURPOSE: A magnet shutter and a method for processing a substrate using the same are provided to prevent the contamination due to particles by omitting sealing units which is capable of generating friction. CONSTITUTION: A first rotation unit(30) is pivotally installed. First magnets(41, 42) are eccentrically arranged with respect to the rotation point of the first rotation unit. A second rotation unit(60) is pivotally installed on the upper side of the first rotation unit. Second magnets(71, 72) are eccentrically arranged with respect to the rotation point of the second rotation unit. A shutter unit is combined to the second rotation unit.

Description

Magnet shutter and Substrate processing apparatus using the same}

The present invention relates to a substrate processing apparatus for performing a certain process on a substrate in a chamber formed inside a vacuum atmosphere, and a shutter used in the substrate processing apparatus to open and close a shielded object such as a deposition material or a sputtering target. will be.

In a substrate processing apparatus such as an organic thin film deposition apparatus or a sputtering apparatus for manufacturing an organic light emitting device, a configuration for opening or closing a specific object, that is, a shutter is often adopted. First, the organic thin film deposition apparatus and the shutter included in the apparatus will be described.

OLEDs, which are spotlighted as next generation display devices, are formed by sequentially stacking an anode, an organic thin film, and a cathode on a substrate. The organic thin film is composed of a multilayer of a hole injection layer, a hole transport layer, an emitting layer, an electron transport layer, an electron injection layer, and an encapsulation film in order to increase luminous efficiency.

The organic thin film is deposited by a thermal evaporation method, which is a kind of physical vapor deposition method, and FIG. 1 illustrates an organic thin film deposition apparatus for realizing a thermal evaporation method.

Referring to FIG. 1, the conventional organic thin film deposition apparatus 9 includes a chamber 1 in which a vacuum is formed inside by a pump or the like. The side of the chamber 1 is provided with a gate valve (2) for carrying in and out the substrate s to be deposited, the substrate holder (3) for supporting the substrate (s) on the upper part of the chamber (1) ) Is placed. The shadow mask M is closely arranged on the substrate S. As shown in FIG. The organic material evaporation source 4 serving as a source of the organic thin film is disposed below the chamber 1. When the organic substance is evaporated by applying heat to the organic substance evaporation source 4, the organic substance vapor is diffused and deposited on the substrate s mounted on the substrate holder 3.

However, since the evaporation of the organic matter does not form a steady state for a certain time from the time when the organic evaporation source 4 starts to be heated, the organic evaporation source 4 should be closed so that the evaporated organic matter does not face the substrate s during this time. The organic material evaporation source 4 should be opened after a certain time after heating.

Thus, the shutter 5 for opening and closing the organic material evaporation source 4 is provided. The shutter 5 is rotatable shutter portion 6 between the position of opening and closing the upper portion of the organic material evaporation source 4, and the rotating shaft coupled to the lower portion of the shutter portion 6 protrudes out of the chamber 1 It consists of a part (7). The rotating shaft portion 7 is connected to a driving means such as a motor (not shown) to impart rotational force to the shutter portion 6. The driving means such as a motor may be disposed outside of the chamber 1 because particles may be generated during operation and frequent maintenance is required.

Since the inside of the chamber 1 must maintain a vacuum state, a sealing is required between the rotating shaft portion 7 and the chamber 1. In order to seal while allowing the rotation of the rotating shaft portion 7, a ferrosil using magnetic fluid may be used as the sealing member, but the ferrosil is an expensive member and is not preferable in terms of economics.

In the conventional organic thin film deposition apparatus 9, although the structure of sealing the inside of the chamber 1 through the O-ring 8 between the chamber 1 and the rotating shaft portion 7 is adopted, the rotating shaft portion 7 and If the O-ring 8 is continuously rubbed, a gap is generated between the O-rings 8 and the sealing property of the chamber 1 is lowered. In order to replace the O-ring 8, there is a problem in that the vacuum of the chamber 1 must be released. In addition, there is a problem that the quality of the thin film due to the particles generated by the friction between the rotary shaft portion 7 and the O-ring (8).

On the other hand, when a high frequency power is applied in the sputtering apparatus (not shown), the gas inside the chamber is formed in the plasma state, and the target is sputtered by the gas in the plasma state and deposited on the substrate. However, since the plasma is not maintained in a steady state for a predetermined time from the time when the high frequency power is applied to the chamber and the plasma is formed, it is often not suitable for sputtering. After the high frequency power is applied, the target is closed so as not to come into contact with the target and the gas in the plasma state for a predetermined time, and the target is opened and sputtered when the plasma is maintained in the chamber in the normal state. That is, the sputtering apparatus has a shutter for opening and closing the target toward the substrate, and the shutter opens and closes the target while rotating in the forward and reverse directions. The rotating shaft for rotating the shutter protrudes out of the chamber and is coupled to a motor or the like. Since the sputtering apparatus must be maintained in a vacuum during the process, the rotary shaft and the chamber must be sealed, and the same problem as in the aforementioned organic thin film deposition apparatus occurs.

As described above, the inside of the organic thin film deposition equipment, sputtering apparatus, etc. must be maintained in a vacuum, and in the substrate processing apparatus having a shutter for opening or closing an object by a rotation operation, the airtightness inside the chamber according to the driving of the shutter. And particle generation are on the rise.

The present invention is to solve the above problems, while being able to open and close the opened and closed through a simple configuration, the magnet shutter is improved in the structure so that the airtightness inside the chamber is stably ensured and contamination by particles can be prevented, It is an object of the present invention to provide a substrate processing apparatus using the magnet shutter.

The magnet shutter according to the present invention for achieving the above object is a first magnet rotatably installed, a first magnet disposed eccentrically from the rotary point of the first rotary member, coupled to the first rotary member, the first The second rotating member rotatably installed on the upper side of the first rotating member, coupled to the second rotating member so as to be eccentric from the rotating point of the second rotating member, in a direction in which repulsive force is applied between the first magnet and the first rotating member. It is characterized in that it comprises a shutter member is rotatably installed between the position of the second magnet and the second rotating member arranged to open and close the closed object.

According to the present invention, two first magnets are spaced apart from each other along the circumferential direction of the first rotating member, and the second magnets are also arranged on a straight line crossing each other with a straight line connecting the two first magnets. Two are spaced apart from each other, the first rotating member is preferably rotatable in the forward and reverse direction.

In addition, the substrate processing apparatus according to the present invention includes a chamber in which a vacuum atmosphere is formed and a through hole is formed, and the magnet shutter is inserted into and coupled to the through hole of the chamber. A shielding plate is installed between the two magnets to seal the space in which the first magnet is installed from the space in which the second magnet is installed.

In the magnet shutter according to the present invention and the substrate processing apparatus employing the same, the vacuum space in which the first magnet is installed is opened while the opening and closing of the shielded object is transmitted by transmitting the driving force of the driving source outside the chamber to the shutter member by the magnetic force of the magnets. Since the magnet is sealed from the space of the atmospheric pressure state is installed, it is possible to ensure the airtightness stably, there is no effect that the particles do not occur because the sealing member that can generate friction, such as O-ring is not interposed.

Hereinafter, with reference to the accompanying drawings, a substrate processing apparatus and a magnet shutter according to a preferred embodiment of the present invention will be described in more detail. In the present embodiment, the substrate processing apparatus is described using an organic thin film deposition apparatus as an example, but the substrate processing apparatus according to the present invention is not limited to the organic thin film deposition apparatus, and may be various devices including a chamber and a shutter such as a sputtering apparatus. Can be.

FIG. 2A is a schematic exploded perspective view of a magnet shutter according to a preferred embodiment of the present invention. FIG. 2B is a schematic longitudinal cross-sectional view of the magnet shutter illustrated in FIG. 2A in a coupled state, and FIG. 3 is a magnet shutter illustrated in FIG. 2. Is a schematic configuration diagram of a substrate processing apparatus combined with FIG. 4, and FIG. 4 is a schematic cross-sectional view taken along the line IV-IV of FIG. 3.

2A to 4, a substrate processing apparatus 100 according to a preferred embodiment of the present invention includes a chamber 10 and a magnet shutter 90.

The chamber 10 has a space 11 formed therein such that a predetermined process for the substrate s such as thin film deposition is performed. A slit 12 through which the substrate s can be carried in and out of the substrate 10 is formed on one side wall of the chamber 10, and a slit valve 13 for opening and closing the slit 12 is provided. A holder 14 for mounting and fixing the substrate s is provided at the upper portion of the chamber 10, and the shadow mask M is covered with the substrate s.

The organic material evaporation source 15 in which the organic material, which is a raw material of the organic thin film deposited on the substrate s, is accommodated is disposed below the chamber 10. The organic material evaporation source 15 is provided with a heating means such as a coil (not shown) to heat and evaporate the organic material. In the present embodiment, the organic material evaporation source 15 is a closed object opened and closed by a magnet shutter 90 to be described later. That is, in the initial stage of heating and evaporating the organic material, the organic material evaporation source 15 is closed by the magnet shutter 90 so that the evaporated organic material is not directed to the substrate s. When the evaporation of the organic matter is maintained in the normal state, the magnet shutter 90 is operated to open the organic evaporation source 15 so that the evaporated organic matter may be directed to the substrate s.

 In addition, a through hole 16 is formed in the lower portion of the chamber 10 to engage and engage the magnet shutter 90 to be described later. When the magnet shutter 90, which will be described later, is fitted into the through hole 16 and coupled thereto, the space 11 of the chamber 10 is sealed from the outside, and the gas in the space 11 is forced by a pump (not shown). By exhausting, the inside of the chamber 10 is formed with a vacuum atmosphere.

The magnet shutter 90 according to the invention has a housing 20. The housing 20 is disposed below the through hole 16 and coupled to the chamber 10. The housing 20 is formed in a hollow shape, the diameter of the upper portion 21 of the hollow portion is formed smaller than the diameter of the lower portion 22 so that the inside of the housing 20 is stepped. A shielding plate 23 made of a substantially circular plate is coupled to the lower end of the housing 20 to seal the space of the lower portion 22 of the hollow part from the outside. The shielding plate 23 is formed so thin that magnetic force can act between the first magnets 41 and 42 and the second magnets 71 and 72 which will be described later.

The first rotating member 30 having a circular plate shape is rotatably installed in the space of the lower portion 22 of the hollow part. Two first magnets 41 and 42 are coupled to the lower portion of the first rotating member 30 along the circumferential direction of the first rotating member 30. As shown in FIG. 4, the first magnets 41 and 42 are eccentrically spaced apart from the rotation point C1 of the first rotation member 30 and are centered on the rotation point C1. They are arranged symmetrically with each other at 180 ° intervals. A portion of the first magnets 41 and 42 that contacts the first rotating member 30 is, for example, an N pole, and a portion of the first magnets 41 and 42 that faces the shield plate 23 is an S pole. The polarities are arranged the same.

The shutter member 50 is installed above the first rotating member 30. The shutter member 50 performs a shutter function of opening and closing the to-be-closed object disposed in the chamber, and in this embodiment, the organic material evaporation source 15. The shutter member 50 performing this function is composed of a rotating shaft 51 and the opening and closing plate 52.

The rotating shaft 51 extends from the upper surface of the first rotating member 30 to the inside of the chamber 10 through the through hole 16 of the housing 20 and the chamber 10, the upper end of which is an organic vapor source. It is arrange | positioned at the position higher than the upper surface of (15). In addition, the rotation shaft 51 is located at the side of the organic matter evaporation source 15. Meanwhile, a bearing 25 is interposed in the upper portion 21 of the hollow part of the housing 20 to rotatably support the rotation shaft 51. The inner ring of the bearing 25 is fitted to the rotating shaft 51, the outer ring is fitted to the inner peripheral surface of the upper portion 21 of the hollow portion of the housing 10 to be supported.

Opening and closing plate 52 is eccentrically coupled to the upper end of the rotating shaft 51. The opening and closing plate 52 is defined in shape and area so as to completely cover the upper surface of the organic material evaporation source 15, and opens and closes the organic material blister source 15 by the forward and reverse rotation of the rotary shaft (51). The member denoted by reference numeral 53 is a hollow bushing for coupling the opening and closing plate 52 to the rotary shaft 51.

Meanwhile, the second rotating member 60 is rotatably installed at the lower portion of the shield plate 23. The second rotating member 60 is formed in a circular plate shape and is disposed to face the first rotating member 30 with the shielding plate 23 interposed therebetween. In addition, the first rotating member 30 and the second rotating member 60 are installed coaxially, the rotation point (C2) of the second rotating member 60 is the rotation point (C2) of the first rotating member (30). It is disposed at the same position as).

Two second magnets 71 and 72 are coupled to the upper portion of the second rotating member 60 along the circumferential direction of the second rotating member 60. As shown by the dotted line in FIG. 4, the second magnets 71 and 72 are eccentrically spaced apart from the rotation point C2 of the second rotation member 60, and the rotation point C2 is disposed. They are arranged symmetrically with each other at intervals of 180 degrees. The polarity of the portion of the second magnets 71 and 72 that faces the shield plate 23, that is, the portion of the second magnets 71 and 72 that faces the first magnets 41 and 42 is S-pole, and is coupled to the second rotating member 60. The polarity of the portion is the N pole. Importantly, the polarities of the first magnets 41 and 42 and the second magnets 71 and 72 are applied so that the repulsive force acts between the first magnets 41 and 42 and the second magnets 71 and 72. It must be deployed. That is, in the present embodiment, all the portions in which the first magnets 41 and 42 and the second magnets 71 and 72 face each other are S poles, but in other embodiments, all of them may be N poles.

Thus, since the repulsive force acts between the first magnets 41 and 42 and the second magnets 71 and 72, a straight line connecting two first magnets 41 and 42 and two second magnets 71 and 72 are applied. ) And the straight lines intersecting with each other, the two straight lines will be orthogonal to each other if the conditions such as the strength of the magnetic force, the frictional force or the weight of the rotating members (30, 60) are the same.

In addition, a driving source for rotating the second rotating member 60 is provided. In this embodiment, as a driving source for rotating the second rotating member 60, a pneumatic rotary cylinder 80 capable of forward and reverse rotation in a predetermined angle range is employed. The piston 81 of the pneumatic rotary cylinder 80 is fixed to the lower portion of the second rotary member 60 to rotate the second rotary member 60 in the forward and reverse directions in accordance with the operation of the pneumatic rotary cylinder (80). In the present embodiment, although the pneumatic rotary cylinder 80 is used as the driving source of the second rotary member 60, it is apparent that other rotary means such as a motor (not shown) may be employed. Reference numeral 83 which is not described is a coupling member for coupling the pneumatic rotation cylinder 80 to the shielding plate 23 while maintaining a constant distance.

Hereinafter, operations of the magnet shutter 90 and the substrate processing apparatus 100 having the above-described configuration will be described.

As shown in FIG. 3, when the space 11 of the chamber 10 is maintained in a vacuum, the substrate s is loaded through the gate valve 13 and mounted on the holder 14. (15) is heated to evaporate the organic substance that is the source of the organic thin film. At this time, the opening and closing plate 52 of the magnet shutter 90 is disposed above the organic material evaporation source 15 to close the organic material evaporation source 15 to prevent the organic material evaporated from the organic material evaporation source 15 toward the substrate s. have.

If the evaporation of the organic matter from the organic evaporation source 15 is maintained in a steady state after a certain time, that is, if the amount of evaporation of the organic matter, etc. is maintained in a constant state with the passage of time, the organic matter evaporation source 15 is opened to the organic material substrate (s). To head).

When the compressed air is applied to any one of two airports (not shown) provided in the pneumatic rotation cylinder 80 to open the organic material evaporation source 15, the cylinder 81 rotates in one direction, As shown in FIG. 4, the second rotating member 60 also rotates in one direction a1. The second magnets 71 and 72 are also rotated by the rotation of the second rotating member 60. Since the repulsive force acts between the second magnets 71 and 72 and the first magnets 41 and 42, As the two magnets 71 and 72 are rotated, the first magnets 41 and 42 are also rotated so that the first rotating member 30 is also rotated as shown by the arrow a2.

As the first rotation member 30 also rotates with the rotation shaft 51 of the shutter member 50 by rotation, the opening and closing plate 52 is opened from the upper surface of the organic material evaporation source 15 to open the organic material evaporation source 15. .

When the process is completed, when the pneumatic rotary cylinder 80 is driven in the reverse direction to rotate the second rotary member 60 in the other direction b1, the first rotary member 30 is also rotated in the direction of the image table b2 and again. The opening and closing plate 52 of the shutter member 50 closes the organic material evaporation source 15, and the substrate s is carried out through the gate valve 13.

In the above process, the airtightness of the chamber 10 is reduced or particles are not generated by the rotation of the magnet shutter 90. That is, in the related art, since the rotation axis of the shutter is extended to the outside of the chamber formed by the vacuum, the airtight is released or particles are generated at the portion where the O-ring is interposed between the chamber and the rotation axis. 51 is located in the space formed by the vacuum, that is, only in the hollow portion (21, 22) of the interior of the chamber 10 and the interior of the housing 20 and does not extend to the outside of the atmospheric pressure state, there is a configuration that is likely to decrease the airtightness It does not contain.

That is, while the rotational force of the pneumatic rotary cylinder 80 is transmitted to the shutter member 50 by the magnetic force of the magnets, the vacuum space in which the first magnets 41 and 42 are installed by the shielding plate 23 is the second magnet. Since airtightness is secured from the space of the atmospheric pressure state in which the 71 and 72 are installed, the airtightness can be stably ensured, and the sealing member that can generate friction such as an O-ring is not interposed so that the particles are not generated.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

1 is a schematic configuration diagram of a conventional organic thin film deposition apparatus for manufacturing an organic light emitting device.

2A is a schematic exploded perspective view of a magnet shutter according to a preferred embodiment of the present invention.

FIG. 2B is a schematic longitudinal cross-sectional view with the magnet shutter shown in FIG. 2A engaged; FIG.

3 is a schematic configuration diagram of a substrate processing apparatus incorporating the magnet shutter shown in FIG. 2.

4 is a schematic cross-sectional view taken along the line IV-IV of FIG. 3.

<Explanation of symbols for the main parts of the drawings>

100 ... Substrate Processing Unit 90 ... Magnet Shutter

10 ... chamber 20 ... housing

23 ... shield plate 30 ... first rotating member

41,42 ... First magnet 50 ... Shutter member

51 ... rotating shaft 52 ... opening and closing plate

60 ... second rotating member 71, 72 ... second magnet

80 ... pneumatic cylinder 81 ... piston

s ... Substrate M ... Shadow Mask

Claims (5)

A first rotating member rotatably installed; A first magnet disposed eccentrically from the rotation point of the first rotation member and coupled to the first rotation member; A second rotating member rotatably installed on the upper side of the first rotating member; A second magnet coupled to the second rotation member so as to be eccentric from the rotation point of the second rotation member, and disposed in a direction in which repulsive force is applied between the first rotation member and the first rotation member; And And a shutter member coupled to the second rotation member and rotatably installed between a position of opening and closing a closed object. The method of claim 1, The first magnet is installed two spaced apart from each other along the circumferential direction of the first rotating member, The second magnets are installed two spaced apart from each other on a straight line intersecting with the straight line connecting the two first magnets, And the first rotating member and the second rotating member are rotatable in a forward and reverse direction. The method of claim 1, And a shielding plate interposed between the first magnet and the second magnet to seal the space in which the first magnet is installed from the space in which the second magnet is installed. A chamber in which a space part is formed so that a predetermined process for the substrate is performed and a through hole is formed; And A first rotatable member rotatably installed, a first magnet disposed eccentrically from the rotation point of the first rotatable member and coupled to the first rotatable member, and rotatably disposed facing the first rotatable member A second magnet which is installed, and a second magnet which is coupled to the second rotation member so as to be eccentric from the rotation point of the second rotation member and is disposed in a direction in which repulsive force is applied between the first rotation member and the first magnet; A shutter member rotatably coupled to a second rotating member, the shutter member being rotatably installed between the opening and closing positions of the closed object disposed in the chamber, and installed between the first magnet and the second magnet; And a shielding plate for sealing the installed space from the space in which the second magnet is installed, and a magnet shutter inserted into the through hole of the chamber. The substrate processing apparatus as. The method of claim 4, wherein The first magnet is installed two spaced apart from each other along the circumferential direction of the first rotating member, The second magnets are installed two spaced apart from each other on a straight line intersecting with the straight line connecting the two first magnets, And the first rotating member is rotatable in a forward and backward direction.

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