KR20220053108A - Substrate processing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing device and, more particularly, to a substrate processing device for performing substrate processing such as deposition, etc. on a substrate and a substrate processing method using the same. The present invention discloses a substrate processing device comprising: a process chamber (100) forming a processing space (S) for substrate processing; an evaporation source (200) disposed below the process chamber (100) and evaporating a deposition material toward an upper side of the process chamber (100); a substrate support part (300) supporting the substrate (10) so that the substrate processing surface of the substrate (10) faces the evaporation source (200) at the upper side of the process chamber (100); a mask support part (400) supporting an edge of a mask (20) facing the substrate processing surface of the substrate (10); and an alignment part (500) for aligning a relative horizontal position between the substrate (10) and the mask (20). Accordingly, a separate driving part for driving the movement of a shutter part can be omitted, so the configuration of the device can be simplified and the operation can be simplified.

Description

Substrate processing apparatus

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing substrate processing such as deposition on a substrate, and a substrate processing method using the same.

In general, a flat panel display device such as a liquid crystal display (LCD) or an organic light emitting display (OLED) includes an electro-optical active layer between a plurality of pairs of electric field generating electrodes. In the liquid crystal display device, the liquid crystal layer is formed as the electro-optically active layer, and in the organic light emitting display device, the organic light emitting layer is formed as the electro-optically active layer.

Such a flat panel display uses a mask to form the electric field generating electrode and the electro-optical active layer, and slots having the same pattern as the pattern to be deposited are formed in the mask.

On the other hand, when manufacturing a flat panel display device using a mask, it is essential to align the substrate and the mask using the substrate alignment device. mark) is formed, and a hole is formed in the mask at a location corresponding to the alignment mark.

The alignment mark formed on the substrate and the hole formed in the mask are photographed by the CCD camera for alignment inspection, and the alignment mark of the substrate and the hole formed in the mask, photographed by the CCD camera, are located on the same line to align the substrate and the mask. state is detected.

When the substrate and the mask are aligned, the CCD camera is removed between the mask and the evaporation source, and a deposition process of depositing a thin film on the substrate by spraying a deposition material from the evaporation source is performed.

In this deposition process, since the deposition material sprayed from the evaporation source is deposited on the alignment mark through the hole, the alignment mark formed on the substrate is deformed as the deposition time and deposition amount increase, so that the CCD camera cannot recognize the alignment mark on the substrate. A problem in which alignment is impossible occurs.

In order to solve this problem, in the related art, many and various alignment marks are formed on the substrate, and the alignment operation is performed using a mask in which holes are formed in different places depending on the deposition material deposited on the substrate.

However, in the conventional substrate alignment process of this method, since the holes formed in the mask are located at different positions for each deposition material, the difficulty of the alignment setting operation increases, and the number of alignment marks 12a that can be formed on the substrate is limited. Therefore, there is a problem in that various types of deposition materials cannot be deposited.

An object of the present invention is to open a mask hole formed in a mask for alignment during alignment between a substrate and a mask with a simple configuration and simple operation in order to solve the above problems, and when processing a substrate using a deposition material An object of the present invention is to provide a substrate processing apparatus capable of closing a mask hole in order to prevent deposition of a deposition material on an alignment mark of a substrate through the mask hole.

The present invention was created to achieve the object of the present invention as described above, and the process chamber 100 for forming a processing space (S) for substrate processing; an evaporation source 200 disposed below the process chamber 100 and evaporating a deposition material toward an upper side of the process chamber 100; a substrate support unit 300 for supporting the substrate 10 from an upper side of the process chamber 100 so that the substrate processing surface of the substrate 10 faces the evaporation source 200; a mask support unit 400 supporting an edge of the mask 20 facing the substrate processing surface of the substrate 10; Disclosed is a substrate processing apparatus including an alignment unit (500) for aligning a relative horizontal position between the substrate (10) and the mask (20).

The alignment unit 500 includes an imaging unit 520 for imaging the alignment mark 12 provided on the substrate 10 through a mask hole 22 formed through the mask 20, and the The mask support part 400 opens the mask hole 22 when the alignment mark 12 is imaged through the imaging part 520 and closes the mask hole 22 when the substrate 10 is processed. ) may include a shutter unit 530 that is movably installed in the .

The imaging unit 520 may include a camera 522 for capturing an image, and a camera position adjusting unit 524 on which the camera 522 is installed and for adjusting the position of the camera 522 .

The shutter unit 530 may open and close the mask hole 22 by at least one of horizontal movement and rotational movement with respect to the mask hole 22 .

The substrate processing apparatus may further include a shutter position adjusting unit 600 for adjusting the position of the shutter unit 530 .

The camera position adjusting unit 524 is coupled to the rotating shaft 524a and is formed to extend in the vertical direction and is rotatably installed with respect to a central axis parallel to the longitudinal direction, and extends in the horizontal direction. It may include a camera support part 524b formed and supported by the camera 522 , and a rotation driving part driving rotation of the rotation shaft part 524a to adjust the position of the camera 522 .

The shutter unit 530 includes a blocking plate 532 for closing the mask hole 22 when processing the substrate 10 , and a first magnetic member installed at one end of the blocking plate 532 . (534).

The shutter unit position adjusting unit 600 includes a support member 610 coupled to the rotating shaft unit 524a and rotated together with the rotating shaft unit 524a by rotation of the rotating shaft unit 524a; A second magnetic member 620 coupled to one end of the support member 610 and magnetically interacting with the first magnetic member 534 may be included.

The first magnetic member 534 and the second magnetic member 620 may form a repulsive force that repels each other as the distance increases.

An open hole 532a penetrating through the blocking plate 532 may be formed in the blocking plate 532 at a position overlapping the mask hole 22 when imaging the alignment mark 12 .

The blocking plate 532 may be moved to a position where the opening hole 532a does not vertically overlap the mask hole 22 by a repulsive force formed as the second magnetic member 620 approaches.

The blocking plate 532 may be moved to a position where the blocking plate 532 does not vertically overlap the mask hole 22 by a repulsive force formed as the second magnetic member 620 approaches.

The substrate processing apparatus according to the present invention, with a simple configuration and simple operation, opens a mask hole formed in a mask for alignment during alignment between a substrate and a mask, and passes through the mask hole during substrate processing using a deposition material. There is an advantage in that the mask hole can be closed to prevent deposition of a deposition material on the alignment mark of the .

More specifically, the present invention adjusts the position of the shutter unit for opening and closing the mask hole to the camera position adjusting unit that adjusts the position of the camera that captures the alignment mark through the mask hole in order to determine the alignment between the substrate and the mask. By installing a shutter position adjusting unit for There is an advantage.

1A to 1B are cross-sectional views illustrating a substrate processing apparatus according to the present invention, and are views showing a state change according to a positional movement of a camera.
FIG. 2 is a view showing an alignment mark of a substrate and a mask hole of a mask obtained through the camera of FIG. 1 .
3A to 3B are plan views illustrating a state change according to a positional movement of the camera in FIGS. 1A to 1B .
4A to 4B are plan views illustrating modified examples of FIGS. 3A to 3B .

Hereinafter, a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings.

A substrate processing apparatus according to the present invention, as shown in FIGS. 1A to 1B , includes: a process chamber 100 forming a processing space S for substrate processing; an evaporation source 200 disposed below the process chamber 100 and evaporating a deposition material toward an upper side of the process chamber 100; a substrate support unit 300 for supporting the substrate 10 from an upper side of the process chamber 100 so that the substrate processing surface of the substrate 10 faces the evaporation source 200; a mask support unit 400 supporting an edge of the mask 20 facing the substrate processing surface of the substrate 10; and an alignment unit 500 for aligning a relative horizontal position between the substrate 10 and the mask 20 .

Here, the substrate 10 to be processed is a substrate that performs substrate processing such as deposition and etching using the mask 160. If a substrate has a rectangular shape, such as a substrate for LCD manufacturing, a substrate for OLED manufacturing, a substrate for solar cell manufacturing, etc. Any substrate is possible.

As shown in FIG. 2 , an alignment mark 12 for horizontal position alignment with the mask 20 may be formed on the substrate 10 at a specific position.

And the substrate processing performed by the substrate processing apparatus according to the present invention is a substrate processing process that performs substrate processing such as deposition and etching using the mask 20 in the closed processing space S, and the deposition material is evaporated. It may be an evaporation deposition process for depositing on the substrate 10 .

On the other hand, the mask 20 is a configuration that is installed in close contact with the substrate 10 or spaced apart to perform substrate processing in a preset pattern, and various configurations are possible, such as openings in a preset pattern are formed.

A mask hole 22 for imaging the alignment mark 12 from the mask 20 side may be formed in the mask 20 at a position corresponding to the alignment mark 12 of the substrate 10 .

The mask hole 22 and the alignment mark 12 are formed in a number corresponding to each other, and may be provided in at least two or more.

The process chamber 100 is configured to form a closed processing space (S) for substrate processing, and various configurations are possible.

For example, the process chamber 100 may include a chamber body 110 having an upper side opened, and an upper lid 120 detachably coupled to the opening of the chamber body 110 .

The chamber body 110 is a configuration in which the substrate support part 200, the mask support part 400, etc. are installed, and various configurations are possible, and an inner wall for introducing and discharging the substrate 10 into the processing space S. One or more gates 111 may be formed on the .

The evaporation source 200 is disposed below the process chamber 100 , and various configurations are possible as an evaporation source source for evaporating the deposition material toward the upper side of the process chamber 100 .

The evaporation source 200 is a configuration for evaporating the deposition material to be deposited on the substrate 10 and is installed on the lower inner side of the chamber body 110, and may be disposed in a point shape or a linear shape. there is.

The evaporation source 200 may include a crucible (not shown) containing a deposition material such as an organic material and a heater (not shown) for heating the crucible (not shown).

The substrate support unit 300 may have various configurations such that the substrate 10 is supported so that the substrate processing surface of the substrate 10 faces the evaporation source 200 from the upper side of the process chamber 100 . Do.

The substrate support unit 300 may support the substrate 10 so that the substrate processing surface faces downward.

The mask support unit 400 may have various configurations such as supporting the edge of the mask 20 opposite to the substrate processing surface of the substrate 10 .

The mask support unit 400 is installed to be movable relative to the substrate 10 in a horizontal direction in order to align a horizontal position between the mask 20 and the substrate 10 in a state in which the mask 20 is supported. can be

The alignment unit 500 is configured to align the relative horizontal position between the substrate 10 and the mask 20 by adjusting the relative positions of the mask hole 22 and the alignment mark 12 . Various configurations are possible.

Specifically, the alignment unit 500 includes an imaging unit 520 for imaging the alignment mark 12 provided on the substrate 10 through a mask hole 22 formed through the mask 20 . and the mask to open the mask hole 22 when imaging the alignment mark 12 through the imaging unit 520 and close the mask hole 22 when processing the substrate 10 It may include a shutter unit 530 movably installed on the support unit 400 .

At this time, the alignment unit 500 is at least one of the substrate supporting unit 200 and the mask supporting unit 400 for horizontal position alignment between the substrate 10 and the mask 20 after image capturing through the imaging unit 520 . One can be moved horizontally.

After adjusting the horizontal positions of the substrate 10 and the mask 20 , alignment may be checked through the imaging unit 520 .

However, since the imaging unit 520 images the alignment mark 12 of the substrate 10 positioned above the mask 20 from the lower side of the mask hole 22, the mask 20 and the It needs to be moved to a position that does not overlap up and down.

To this end, the imaging unit 520, a camera 522 for capturing an image, the camera 522 is installed, and a camera position adjustment unit 524 for adjusting the position of the camera 522. can

The camera 522 is configured to image the alignment mark 12 through the mask hole 22 from the lower side of the mask 20, and may be a CCD camera.

By analyzing the image captured by the camera 522 , it is possible to check whether the horizontal position is aligned between the substrate 10 and the mask 20 .

The number of cameras 522 may be installed corresponding to the number of mask holes 22 .

The camera position adjusting unit 524, the camera 522 is installed, a configuration for adjusting the position of the camera 522, various configurations are possible.

The camera position adjustment unit 524, when acquiring an image through the camera 522, position the camera 522 below the mask hole 22, and when the alignment is completed (or substrate processing), the camera 522 In order to move the mask 20 to a position that does not overlap vertically, the position of the camera 522 may be adjusted through at least one of a linear movement and a rotational movement.

For example, the camera position adjusting unit 524 may adjust the position of the camera 522 by rotating the camera 522 as shown in FIGS. 1A to 1B .

Specifically, the camera position adjusting unit 524 includes a rotating shaft unit 524a that extends in the vertical direction and is rotatably installed with respect to a central axis parallel to the longitudinal direction, and is coupled to the rotating shaft 524a to be horizontal. It may include a camera support part 524b extending in the direction and supporting the camera 522 , and a rotation driving part driving rotation of the rotation shaft part 524a to adjust the position of the camera 522 .

The rotary shaft portion 524a is formed to extend in the vertical direction and is a rotary shaft that is rotatably installed with respect to a central axis R parallel to the longitudinal direction, and various configurations are possible.

The rotating shaft part 524a may be installed in a pair on one side of the mask support part 400 around the mask 20 to correspond to the mask hole 22 .

The camera support part 524b is coupled to the rotation shaft 524a to extend in the horizontal direction, and various configurations are possible such that the camera 522 is supported.

The rotating shaft part 524a and the camera support part 524b may be formed in an L-shape when viewed from the side.

The rotation driving unit is a driving source for driving the rotation of the rotation shaft unit 524a to adjust the position of the camera 522, and various configurations such as a motor and a cylinder are possible.

When the rotation shaft unit 524a rotates about the central axis R by the rotation driving unit, the camera 522 that is seated and supported on one end of the camera support unit 524b is centered on the central axis R and is flat. It may be rotated along a virtual circle whose radius is the distance from the upper rotation shaft part 524a to the camera 522 .

1A is a view showing a state in which the camera 522 is positioned at a position deviated from the lower side of the mask 20 for substrate processing, and FIG. ) is a view showing a state located below the mask 20 , more specifically, below the mask hole 22 .

Since the camera 522 is positioned below the mask hole 22 , the alignment mark 12 of the substrate 10 may be imaged through the mask hole 22 .

That is, the camera position adjusting unit 524 may adjust the position of the camera 522 through rotational driving with respect to the rotating shaft unit 524a.

Meanwhile, referring to FIGS. 1A to 1B , the substrate processing apparatus according to the present invention may further include a camera shutter unit 700 for preventing deposition of a deposition material on the camera 522 lens during an evaporation process. can

The camera shutter unit 700 is configured to block the lens of the camera 522 when the camera 522 is not in use, and is separated from the camera 522 when capturing an image through the camera 522 and evaporates during substrate processing. In order to prevent the deposition material evaporated from the deposition source 200 from being deposited on the camera 522 lens, the camera shutter 720 closely adheres to the camera 522 lens, and the camera 522 lens of the camera shutter 720 opens and closes. It may include a camera shutter position adjusting unit 710 for adjusting the position of the camera shutter 720 for operation.

The shutter unit 530 opens the mask hole 22 when the alignment mark 12 is imaged through the imaging unit 520 , and the mask hole 22 when processing the substrate 10 . Various configurations are possible with a configuration that is movably installed on the mask support part 400 to close the .

The shutter unit 530 may open and close the mask hole 22 by at least one of horizontal movement and rotational movement with respect to the mask hole 22 .

In one embodiment, the shutter unit 530 is installed at one end of the blocking plate 532 for closing the mask hole 22 when processing the substrate 10 , and the blocking plate 532 . It may include a first magnetic member 534 that is.

The blocking plate 532 may be a blocking plate for covering the mask hole 22 to prevent the substrate 10 from being exposed to a deposition material through the mask hole 22 during substrate processing.

For example, the blocking plate 532 may be installed to be linearly movable, as shown in FIGS. 3A to 3B .

In this case, an open hole 532a penetrating through the blocking plate 532 may be formed in the blocking plate 532 at a position overlapping the mask hole 22 when imaging the alignment mark 12 . .

Through this, the blocking plate 532 may be moved linearly and the mask hole 22 may be covered (closed) or the mask hole 22 may be opened through the opening hole 532a.

As another example, the blocking plate 532 may be rotatably installed about a vertical hinge shaft 538 as shown in FIGS. 4A to 4B .

Through this, the blocking plate 532 is rotated and moved to a position overlapping the mask hole 22 up and down so that the mask hole 22 is covered (closed) or to a position where the mask hole 22 does not overlap up and down. It can be moved to open the mask hole 22 .

The first magnetic member 534 is a magnetic member installed at one end of the blocking plate 532, and various configurations are possible.

The blocking plate 532 may be linearly moved or rotated by the first magnetic member 534 .

To this end, the substrate processing apparatus may further include a shutter position adjusting unit 600 for adjusting the position of the shutter unit 530 .

The shutter position adjusting unit 600 may be installed in the camera position adjusting unit 524 for adjusting the position of the camera 522 .

More specifically, the shutter position adjusting unit 600 is coupled to the rotating shaft unit 524a and a support member 610 that is rotated together with the rotating shaft unit 524a by rotation of the rotating shaft unit 524a. ) and a second magnetic member 620 coupled to one end of the support member 610 and magnetically interacting with the first magnetic member 534 .

The support member 610 is coupled to the rotary shaft part 524a and rotates together with the rotary shaft part 524a by the rotation of the rotary shaft part 524a. The outer peripheral surface of the rotary shaft part 524a may be formed extending in the horizontal direction.

Since the support member 610 is fixedly coupled to the rotating shaft portion 524a, it may be rotated about the rotational axis R together with the rotation of the rotating shaft portion 524a.

The second magnetic member 620 is a magnetic member coupled to one end of the support member 610 and magnetically interacting with the first magnetic member 534, and various configurations are possible.

Since the second magnetic member 620 is coupled to one end of the support member 610 , it may be rotated about the rotation axis R together with the rotation of the rotation shaft part 524a.

As a result, according to the rotation of the rotating shaft part 524a, the second magnetic member 620 may move away from or closer to the first magnetic member 534 .

In this case, the first magnetic member 534 and the second magnetic member 620 may be configured to form a repulsive force that repels each other as the distance increases.

That is, the first magnetic member 534 and the second magnetic member 620 are installed such that the first magnetic member 534 and the second magnetic member 620 have the same polarity on opposite sides of each other. can be

For example, the first magnetic member 534 and the second magnetic member 620 may be installed such that their N poles face each other or their S poles face each other.

For example, referring to FIGS. 3A to 3B , as the second magnetic member 620 approaches the first magnetic member 534 , the repulsive force between the first magnetic member 534 and the second magnetic member 620 . is increased, and the first magnetic member 534 may be linearly moved in a direction away from the second magnetic member 620 by this repulsive force.

At this time, the blocking plate 532 may be moved to a position where the opening hole 532a does not vertically overlap the mask hole 22 by a repulsive force formed as the second magnetic member 620 approaches. there is.

Conversely, when the second magnetic member 620 moves away from the first magnetic member 534 by the rotating shaft part 524a, the repulsive force between the first magnetic member 534 and the second magnetic member 620 is reduced and The first magnetic member 534 is returned to its original position (the blocking plate 532 covers the mask hole 22) by the elastic member 536 installed between the first magnetic member 534 and the mask support part 400 ( It can be moved to the closing position).

As another example, referring to FIGS. 4A to 4B , as the second magnetic member 620 approaches the first magnetic member 534 , the distance between the first magnetic member 534 and the second magnetic member 620 . The repulsive force is increased, and the first magnetic member 534 may be rotated about the hinge shaft 538 by the repulsive force.

At this time, the blocking plate 532 is rotated about the hinge shaft 538 by a repulsive force formed as the second magnetic member 620 approaches, so that the blocking plate 532 is connected to the mask hole 22 . It can be moved to a position that does not overlap with the top and bottom.

Conversely, when the second magnetic member 620 moves away from the first magnetic member 534 by the rotating shaft part 524a, the repulsive force between the first magnetic member 534 and the second magnetic member 620 is reduced and The first magnetic member 534 may be moved back to its original position (a position where the blocking plate 532 covers (closes) the mask hole 22) by a separate restoring force forming member (not shown).

As a result, in the substrate processing apparatus according to the present invention, the second magnetic member 620 is moved by the camera position adjusting unit 524 for camera position adjustment without a separate driving unit for the second magnetic member 620 . , the position of the shutter unit 530 can be adjusted, which greatly simplifies the configuration of the entire device, thereby enabling a compact device configuration.

In addition, it is possible to implement the movement of the position of the shutter unit 530 without contact between the first magnetic member 534 and the second magnetic member 620, there is an advantage that can eliminate the particle issue in the processing space.

Since the above has only been described with respect to some of the preferred embodiments that can be implemented by the present invention, as noted, the scope of the present invention should not be construed as being limited to the above embodiments, and It will be said that the technical idea and the technical idea accompanying the fundamental are all included in the scope of the present invention.

10: substrate 20: mask

Claims (9)

a process chamber 100 for forming a processing space S for substrate processing; an evaporation source 200 disposed below the process chamber 100 and evaporating a deposition material toward an upper side of the process chamber 100; a substrate support unit 300 for supporting the substrate 10 from an upper side of the process chamber 100 so that the substrate processing surface of the substrate 10 faces the evaporation source 200; a mask support unit 400 supporting an edge of the mask 20 facing the substrate processing surface of the substrate 10; and an aligning unit 500 for aligning a relative horizontal position between the substrate 10 and the mask 20,
The alignment unit 500 includes an imaging unit 520 for imaging the alignment mark 12 provided on the substrate 10 through a mask hole 22 formed through the mask 20, and the The mask support part 400 opens the mask hole 22 when the alignment mark 12 is imaged through the imaging part 520 and closes the mask hole 22 when the substrate 10 is processed. ) A substrate processing apparatus, characterized in that it comprises a shutter unit 530 that is movably installed in the. The method according to claim 1,
The imaging unit 520 includes a camera 522 for capturing an image, and a camera position adjusting unit 524 on which the camera 522 is installed and for adjusting the position of the camera 522. substrate processing equipment. 3. The method according to claim 2,
The shutter unit 530 opens and closes the mask hole 22 by at least one of horizontal movement and rotational movement with respect to the mask hole 22,
The substrate processing apparatus, the substrate processing apparatus characterized in that it further comprises a shutter position adjustment unit (600) for adjusting the position of the shutter unit (530). 4. The method according to claim 3,
The camera position adjusting unit 524 is coupled to the rotating shaft 524a, which is formed to extend in the vertical direction and is rotatably installed with respect to a central axis parallel to the longitudinal direction, and extends in the horizontal direction. A substrate processing comprising: a camera support part (524b) formed and supported by the camera (522); Device. 5. The method of claim 4,
The shutter unit 530 includes a blocking plate 532 for closing the mask hole 22 when processing the substrate 10 , and a first magnetic member installed at one end of the blocking plate 532 . (534);
The shutter unit position adjusting unit 600 includes a support member 610 coupled to the rotating shaft unit 524a and rotated together with the rotating shaft unit 524a by rotation of the rotating shaft unit 524a; and a second magnetic member (620) coupled to one end of the support member (610) and magnetically interacting with the first magnetic member (534). 6. The method of claim 5,
The first magnetic member 534 and the second magnetic member 620,
A substrate processing apparatus, characterized in that a repulsive force is formed to repel each other as the distance from each other increases. 6. The method of claim 5,
An open hole (532a) penetrating through the blocking plate (532) is formed in the blocking plate (532) at a position overlapping the mask hole (22) when imaging the alignment mark (12) Substrate processing equipment. 8. The method of claim 7,
The blocking plate 532 is characterized in that the opening hole 532a is moved to a position where it does not vertically overlap the mask hole 22 by a repulsive force formed as the second magnetic member 620 approaches. substrate processing equipment. 6. The method of claim 5,
The blocking plate 532 is characterized in that the blocking plate 532 is moved to a position where it does not vertically overlap the mask hole 22 by a repulsive force formed as the second magnetic member 620 approaches. substrate processing equipment.

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