KR101045515B1 - 진공 증착 장치 및 증착 필름 제조 방법 - Google Patents

진공 증착 장치 및 증착 필름 제조 방법 Download PDF

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Publication number
KR101045515B1
KR101045515B1 KR1020057012013A KR20057012013A KR101045515B1 KR 101045515 B1 KR101045515 B1 KR 101045515B1 KR 1020057012013 A KR1020057012013 A KR 1020057012013A KR 20057012013 A KR20057012013 A KR 20057012013A KR 101045515 B1 KR101045515 B1 KR 101045515B1
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South Korea
Prior art keywords
roll
film
vapor deposition
coating
deposition
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KR1020057012013A
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English (en)
Korean (ko)
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KR20050092724A (ko
Inventor
노보루 사사키
히로시 스즈키
후미타케 고이즈미
노부히코 이마이
구니마사 아라이
히로유키 고나가이
Original Assignee
어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게
도판 인사츠 가부시키가이샤
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Publication of KR20050092724A publication Critical patent/KR20050092724A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
KR1020057012013A 2002-12-26 2003-12-26 진공 증착 장치 및 증착 필름 제조 방법 Expired - Lifetime KR101045515B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002376933 2002-12-26
JPJP-P-2002-00376933 2002-12-26

Publications (2)

Publication Number Publication Date
KR20050092724A KR20050092724A (ko) 2005-09-22
KR101045515B1 true KR101045515B1 (ko) 2011-06-30

Family

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KR1020057012013A Expired - Lifetime KR101045515B1 (ko) 2002-12-26 2003-12-26 진공 증착 장치 및 증착 필름 제조 방법

Country Status (9)

Country Link
US (1) US7754015B2 (enExample)
EP (1) EP1593754B1 (enExample)
JP (1) JP4529688B2 (enExample)
KR (1) KR101045515B1 (enExample)
CN (1) CN100582295C (enExample)
AU (1) AU2003292634A1 (enExample)
IN (1) IN266855B (enExample)
RU (1) RU2332523C2 (enExample)
WO (1) WO2004059032A1 (enExample)

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CN1942744A (zh) * 2004-03-01 2007-04-04 应用材料股份有限两合公司 具有法布里－珀罗滤波器的基底和将滤波器涂覆在基底上的方法
ATE507320T1 (de) 2006-03-26 2011-05-15 Lotus Applied Technology Llc Atomlagenabscheidungssystem und verfahren zur beschichtung von flexiblen substraten
JP5291875B2 (ja) * 2006-11-01 2013-09-18 富士フイルム株式会社 プラズマ装置
US7968353B2 (en) 2008-04-15 2011-06-28 Global Solar Energy, Inc. Apparatus and methods for manufacturing thin-film solar cells
US9249502B2 (en) * 2008-06-20 2016-02-02 Sakti3, Inc. Method for high volume manufacture of electrochemical cells using physical vapor deposition
US7945344B2 (en) 2008-06-20 2011-05-17 SAKT13, Inc. Computational method for design and manufacture of electrochemical systems
US20100196591A1 (en) * 2009-02-05 2010-08-05 Applied Materials, Inc. Modular pvd system for flex pv
US20110177622A1 (en) * 2009-12-28 2011-07-21 Global Solar Energy, Inc. Apparatus and methods of mixing and depositing thin film photovoltaic compositions
US8357464B2 (en) 2011-04-01 2013-01-22 Sakti3, Inc. Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells
DE102009060413A1 (de) * 2009-09-07 2011-03-24 Von Ardenne Anlagentechnik Gmbh Vorrichtung zum Transport bandförmigen Materials
EP2292339A1 (en) * 2009-09-07 2011-03-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Coating method and coating apparatus
US8637117B2 (en) 2009-10-14 2014-01-28 Lotus Applied Technology, Llc Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system
KR101791033B1 (ko) 2010-07-23 2017-10-27 로터스 어플라이드 테크놀로지, 엘엘씨 롤-투-롤 박막 증착을 위한 유연한 웹 기재의 한쪽 측면과 접촉하는 기재 이동 메커니즘
CN102021529A (zh) * 2010-12-01 2011-04-20 常州常松金属复合材料有限公司 一种真空镀翻转辊道装置
US9065080B2 (en) 2011-04-01 2015-06-23 Sakti3, Inc. Electric vehicle propulsion system and method utilizing solid-state rechargeable electrochemical cells
JP2012219322A (ja) * 2011-04-07 2012-11-12 Ulvac Japan Ltd 巻取式成膜装置及び巻取式成膜方法
JP5930791B2 (ja) 2011-04-28 2016-06-08 日東電工株式会社 真空成膜方法、及び該方法によって得られる積層体
US9127344B2 (en) 2011-11-08 2015-09-08 Sakti3, Inc. Thermal evaporation process for manufacture of solid state battery devices
US20140311409A1 (en) * 2011-12-28 2014-10-23 Dai Nippon Printing Co., Ltd. Vapor deposition apparatus having pretreatment device that uses plasma
JP5794151B2 (ja) * 2012-01-19 2015-10-14 住友金属鉱山株式会社 長尺帯状体の搬送制御方法と長尺帯状体の表面処理方法
EP2626144A1 (en) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone
US9627717B1 (en) 2012-10-16 2017-04-18 Sakti3, Inc. Embedded solid-state battery
US9435028B2 (en) 2013-05-06 2016-09-06 Lotus Applied Technology, Llc Plasma generation for thin film deposition on flexible substrates
KR101697609B1 (ko) * 2013-10-24 2017-01-19 주식회사 석원 무장력 상태에서의 진공 코팅 필름 건조 장치
US9627709B2 (en) 2014-10-15 2017-04-18 Sakti3, Inc. Amorphous cathode material for battery device
US9508976B2 (en) 2015-01-09 2016-11-29 Applied Materials, Inc. Battery separator with dielectric coating
CN105986235B (zh) * 2016-06-27 2018-09-07 广东腾胜真空技术工程有限公司 多功能卷绕镀膜设备及方法
JP6772663B2 (ja) * 2016-08-23 2020-10-21 住友金属鉱山株式会社 ロールツーロール方式による長尺基材の処理装置及びこれを用いた成膜装置
WO2018149510A1 (en) * 2017-02-20 2018-08-23 Applied Materials, Inc. Deposition apparatus for coating a flexible substrate and method of coating a flexible substrate
CN116207335A (zh) 2017-08-17 2023-06-02 应用材料公司 无烯烃隔板的锂离子电池
EP3841631A4 (en) 2018-08-21 2022-03-30 Applied Materials, Inc. ULTRA-THIN CERAMIC COATING ON A BATTERY SEPARATOR
SG11202100867RA (en) * 2019-03-12 2021-03-30 Ulvac Inc Vacuum deposition apparatus
JP6681524B1 (ja) * 2019-03-12 2020-04-15 株式会社アルバック 真空蒸着装置
DE102019135296A1 (de) * 2019-07-18 2021-01-21 Tdk Electronics Ag Metallisierte Folie, Vorrichtung für die Herstellung einer metallisierten Folie, Verfahren zur Herstellung einer metallisierten Folie und Folienkondensator, der die metallisierte Folie enthält
KR102422431B1 (ko) * 2021-07-07 2022-07-19 주식회사 서일 마찰대전수단을 구비한 진공증착장치
CN113684464B (zh) * 2021-08-27 2023-06-02 辽宁分子流科技有限公司 一种用于石墨烯复合薄膜制备的卷绕式设备

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JPH09176855A (ja) * 1995-12-22 1997-07-08 Fuji Electric Corp Res & Dev Ltd 薄膜形成装置
JPH09195041A (ja) * 1996-01-12 1997-07-29 Sony Corp スパッタリング装置
JPH1197446A (ja) 1997-09-18 1999-04-09 Tokyo Electron Ltd 縦型熱処理装置
JP2001073133A (ja) * 1999-09-02 2001-03-21 Nitto Denko Corp 真空薄膜形成装置および真空薄膜形成方法

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JPH1197446A (ja) 1997-09-18 1999-04-09 Tokyo Electron Ltd 縦型熱処理装置
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Also Published As

Publication number Publication date
EP1593754B1 (en) 2018-05-23
RU2332523C2 (ru) 2008-08-27
EP1593754A4 (en) 2011-03-23
JPWO2004059032A1 (ja) 2006-04-27
US20050249875A1 (en) 2005-11-10
CN1732284A (zh) 2006-02-08
EP1593754A1 (en) 2005-11-09
US7754015B2 (en) 2010-07-13
CN100582295C (zh) 2010-01-20
JP4529688B2 (ja) 2010-08-25
KR20050092724A (ko) 2005-09-22
IN266855B (enExample) 2015-06-09
RU2005120006A (ru) 2006-02-10
AU2003292634A1 (en) 2004-07-22
WO2004059032A1 (ja) 2004-07-15

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