KR101043307B1 - 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크 - Google Patents

전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크 Download PDF

Info

Publication number
KR101043307B1
KR101043307B1 KR1020047020280A KR20047020280A KR101043307B1 KR 101043307 B1 KR101043307 B1 KR 101043307B1 KR 1020047020280 A KR1020047020280 A KR 1020047020280A KR 20047020280 A KR20047020280 A KR 20047020280A KR 101043307 B1 KR101043307 B1 KR 101043307B1
Authority
KR
South Korea
Prior art keywords
nano
composition
particles
delete delete
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020047020280A
Other languages
English (en)
Korean (ko)
Other versions
KR20060012542A (ko
Inventor
가르바르아르카디
데라베가페르난도
마츠너에이나트
Original Assignee
시마 나노 테크 이스라엘 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시마 나노 테크 이스라엘 리미티드 filed Critical 시마 나노 테크 이스라엘 리미티드
Publication of KR20060012542A publication Critical patent/KR20060012542A/ko
Application granted granted Critical
Publication of KR101043307B1 publication Critical patent/KR101043307B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/38Paints containing free metal not provided for above in groups C09D5/00 - C09D5/36
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/08Coating starting from inorganic powder by application of heat or pressure and heat
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/12Braided wires or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020047020280A 2002-06-13 2003-06-12 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크 Expired - Fee Related KR101043307B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38791902P 2002-06-13 2002-06-13
US60/387,919 2002-06-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020117009313A Division KR101321255B1 (ko) 2002-06-13 2003-06-12 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크

Publications (2)

Publication Number Publication Date
KR20060012542A KR20060012542A (ko) 2006-02-08
KR101043307B1 true KR101043307B1 (ko) 2011-06-22

Family

ID=29736385

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020047020280A Expired - Fee Related KR101043307B1 (ko) 2002-06-13 2003-06-12 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크
KR1020117009313A Expired - Fee Related KR101321255B1 (ko) 2002-06-13 2003-06-12 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020117009313A Expired - Fee Related KR101321255B1 (ko) 2002-06-13 2003-06-12 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크

Country Status (9)

Country Link
EP (2) EP2154212A1 (https=)
JP (1) JP4636496B2 (https=)
KR (2) KR101043307B1 (https=)
CN (1) CN1322075C (https=)
AT (1) ATE450581T1 (https=)
AU (1) AU2003241128A1 (https=)
DE (1) DE60330344D1 (https=)
ES (1) ES2336779T3 (https=)
WO (1) WO2003106573A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101270803B1 (ko) 2013-03-18 2013-06-05 단국대학교 산학협력단 금속 전극의 제조방법
KR20150080370A (ko) * 2013-12-31 2015-07-09 삼성정밀화학 주식회사 투명전극용 금속 잉크 및 그 제조방법
KR102231494B1 (ko) * 2020-10-13 2021-03-23 유시욱 투명 잉크 조성물 및 이를 포함하는 인쇄 기판

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7625420B1 (en) 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0300529D0 (en) * 2003-01-10 2003-02-12 Qinetiq Nanomaterials Ltd Improvements in and relating to ink jet deposition
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
WO2006030286A1 (en) * 2004-09-14 2006-03-23 Cima Nano Tech Israel Ltd Ink jet printable compositions
WO2006040989A1 (ja) * 2004-10-08 2006-04-20 Toray Industries, Inc. 導電性フィルム
DE102004051019A1 (de) * 2004-10-20 2006-04-27 Mhm Holding Gmbh Trocknungsverfahren und -vorrichtung und dazu gehörige thermisch trocknende oder vernetzende Druckfarbe oder Lack
US20060130700A1 (en) * 2004-12-16 2006-06-22 Reinartz Nicole M Silver-containing inkjet ink
JP5007020B2 (ja) * 2004-12-20 2012-08-22 株式会社アルバック 金属薄膜の形成方法及び金属薄膜
JP4799881B2 (ja) * 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
TW200640596A (en) * 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
WO2006076603A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electrical conductors
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US7533361B2 (en) 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
EP1696006B1 (en) * 2005-02-28 2009-06-17 Samsung SDI Germany GmbH metal ink and substrate for a display and method for manufacturing the same
JP5009907B2 (ja) * 2005-06-10 2012-08-29 シーマ ナノ テック イスラエル リミティド 向上透明導電性被膜及びそれらを作製する方法
WO2007011331A2 (en) * 2005-07-14 2007-01-25 3M Innovative Properties Company Water-soluble polymeric substrate having metallic nanoparticle coating
ATE532217T1 (de) 2005-08-12 2011-11-15 Cambrios Technologies Corp Verfahren zur herstellung von transparente leiter auf nanodrahtbasis
EP1947702B1 (en) 2005-08-12 2011-11-02 Cambrios Technologies Corporation Method of fabricating nanowire based transparent conductors
JP2007146117A (ja) * 2005-11-04 2007-06-14 Mitsui Mining & Smelting Co Ltd ニッケルインク及びそのニッケルインクで形成した導体膜
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
JP4918790B2 (ja) * 2006-02-28 2012-04-18 旭硝子株式会社 透明導電膜の製造方法、透明導電膜および塗布液
JP5065613B2 (ja) * 2006-04-10 2012-11-07 三井金属鉱業株式会社 ニッケルインク
KR100860446B1 (ko) * 2006-04-12 2008-09-25 주식회사 엘지화학 금속 나노 입자의 분산 보조제 및 이를 포함하는 금속 나노잉크
JP4967437B2 (ja) * 2006-04-27 2012-07-04 旭硝子株式会社 透明導電膜の製造方法および透明導電膜
CN101448904A (zh) * 2006-05-24 2009-06-03 纳幕尔杜邦公司 导电喷墨油墨制剂
RU2297471C1 (ru) * 2006-05-30 2007-04-20 Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт стали и сплавов" (технологический университет) Способ получения проводящих нанокомпозитных покрытий, содержащих металл в кремний-углеродной матрице
JP2008041445A (ja) * 2006-08-07 2008-02-21 Asahi Glass Co Ltd 透明導電膜の製造方法および透明導電膜
WO2008024342A2 (en) * 2006-08-24 2008-02-28 Ngimat, Co Optical coating
KR100833869B1 (ko) * 2006-10-10 2008-06-02 삼성전기주식회사 내마이그레이션 잉크 조성물 및 이를 이용하여 제조된전도성 배선
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
TWI426531B (zh) 2006-10-12 2014-02-11 坎畢歐科技公司 以奈米線為主之透明導體及其應用
US7568251B2 (en) 2006-12-28 2009-08-04 Kimberly-Clark Worldwide, Inc. Process for dyeing a textile web
KR101375047B1 (ko) * 2006-12-29 2014-03-26 엘지디스플레이 주식회사 표시장치 제조방법
WO2008115681A2 (en) * 2007-03-01 2008-09-25 Pchem Associates, Inc. Shielding based on metallic nanoparticle compositions and devices and methods thereof
CN103777417B (zh) 2007-04-20 2017-01-18 凯姆控股有限公司 复合透明导体及其形成方法
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
WO2009086161A1 (en) * 2007-12-20 2009-07-09 Cima Nanotech Israel Ltd. Transparent conductive coating with filler material
WO2009082705A1 (en) * 2007-12-20 2009-07-02 Cima Nanotech Israel Ltd. Microstructured material and process for its manufacture
US7736546B2 (en) 2008-01-30 2010-06-15 Basf Se Glass frits
US8383011B2 (en) 2008-01-30 2013-02-26 Basf Se Conductive inks with metallo-organic modifiers
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
TWI401205B (zh) * 2008-01-31 2013-07-11 Ind Tech Res Inst 利用光熱效應製作應用基板的方法
SG188159A1 (en) * 2008-02-26 2013-03-28 Cambrios Technologies Corp Methods and compositions for ink jet deposition of conductive features
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
JP2009277466A (ja) * 2008-05-14 2009-11-26 Konica Minolta Holdings Inc 透明導電性フィルム及びその製造方法
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
EP2302645A1 (en) 2008-07-04 2011-03-30 Toda Kogyo Corporation Transparent electrically conductive transfer plate and production method therefor, transparent electrically conductive base, method for producing transparent electrically conductive base using transparent electrically conductive transfer plate, and molded article using transparent electrically conductive base
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材
JP2010159350A (ja) * 2009-01-08 2010-07-22 Sumitomo Rubber Ind Ltd インキ組成物およびそれを用いた凹版オフセット印刷法
JP5545796B2 (ja) * 2009-02-09 2014-07-09 戸田工業株式会社 透明導電性基板、色素増感型太陽電池用透明導電性基板及び透明導電性基板の製造方法
CN102365713B (zh) 2009-03-27 2015-11-25 应用纳米技术控股股份有限公司 增强光和/或激光烧结的缓冲层
JP5606687B2 (ja) * 2009-04-14 2014-10-15 戸田工業株式会社 透明樹脂箔の製造方法、並びに該透明樹脂箔を用いた電磁波シールド材の製造方法
JP2010251475A (ja) * 2009-04-14 2010-11-04 Toda Kogyo Corp 透明樹脂箔及びその製造方法、並びに該透明樹脂箔を用いた電磁波シールド材
WO2010119838A1 (ja) * 2009-04-14 2010-10-21 戸田工業株式会社 透明樹脂箔及びその製造方法、並びに該透明樹脂箔を用いた電磁波シールド材
KR20120037464A (ko) * 2009-06-12 2012-04-19 로오드 코포레이션 전자파 장애로부터 기판을 차폐하는 방법
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
JP2013513220A (ja) * 2009-12-07 2013-04-18 デューク ユニバーシティ 銅ナノワイヤを成長させるための組成および方法
JP5727766B2 (ja) * 2009-12-10 2015-06-03 理想科学工業株式会社 導電性エマルジョンインク及びそれを用いた導電性薄膜の形成方法
CN102782770A (zh) * 2010-01-14 2012-11-14 加利福尼亚大学董事会 用于生长导电性纳米结构薄膜的通用方法
WO2011097470A2 (en) 2010-02-05 2011-08-11 Cambrios Technologies Corporation Photosensitive ink compositions and transparent conductors and method of using the same
WO2011109114A2 (en) 2010-03-05 2011-09-09 Carestream Health, Inc. Transparent conductive films, articles, and methods
KR101487342B1 (ko) * 2010-07-30 2015-01-30 주식회사 잉크테크 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막
US20120097059A1 (en) * 2010-10-22 2012-04-26 Cambrios Technologies Corporation Nanowire ink compositions and printing of same
KR101260956B1 (ko) * 2011-02-25 2013-05-06 한화케미칼 주식회사 오프셋 또는 리버스­오프셋 인쇄용 전도성 잉크 조성물
WO2012118582A1 (en) * 2011-02-28 2012-09-07 Nthdegree Technologies Worldwide Inc. Metallic nanofiber ink, substantially transparent conductor, and fabrication method
CN102917530B (zh) * 2011-08-01 2016-01-06 富士康(昆山)电脑接插件有限公司 具有导电线路的玻璃板及其制造方法
TW201325335A (zh) * 2011-10-29 2013-06-16 西瑪奈米技術以色列有限公司 經圖案化基材上之導電網路
TWI584485B (zh) * 2011-10-29 2017-05-21 西瑪奈米技術以色列有限公司 於基材上對齊的網路
US9603242B2 (en) * 2011-12-21 2017-03-21 3M Innovative Properties Company Laser patterning of silver nanowire-based transparent electrically conducting coatings
US9469773B2 (en) 2011-12-23 2016-10-18 The Board Of Trustees Of The University Of Illinois Ink composition for making a conductive silver structure
CN103073943B (zh) * 2012-01-19 2014-09-17 中国科学院上海硅酸盐研究所 一种二氧化钒智能温控涂层
TWI648751B (zh) * 2012-02-28 2019-01-21 以色列商客利福薄膜技術有限公司 在彈性基材上之透明導電塗層
CN102723126B (zh) * 2012-05-09 2015-10-21 南昌欧菲光科技有限公司 一种基于随机网格的图形化透明导电薄膜
JP5934576B2 (ja) * 2012-05-18 2016-06-15 三菱製紙株式会社 導電性部材の製造方法
GB2516570A (en) * 2012-05-18 2015-01-28 Unipixel Displays Inc Forming conductive patterns using ink comprising metal nanoparticles and nanowires
TWI623597B (zh) * 2012-08-16 2018-05-11 西瑪奈米技術以色列有限公司 用於製造透明導電塗層之乳液
TWI652319B (zh) * 2012-12-28 2019-03-01 澳大利亞商印製能源技術有限公司 導電墨水及其製造方法與導電膜
CN103540927B (zh) * 2013-09-29 2015-07-15 山东科技大学 一种银功能涂层原位制备方法
CN103753939B (zh) * 2014-01-17 2015-11-11 苏州斯贝孚光电科技有限公司 淋涂纳米金属油墨制备薄膜的方法
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
CN103992041A (zh) * 2014-04-30 2014-08-20 天津宝兴威科技有限公司 一种纳米金属网格透明导电玻璃的制造方法
CN106661255A (zh) 2014-08-07 2017-05-10 沙特基础工业全球技术有限公司 用于热成型应用的导电多层片材
US9985344B2 (en) * 2014-12-23 2018-05-29 Te Connectivity Corporation Electronic article and process of producing an electronic article
WO2018004092A1 (ko) * 2016-06-29 2018-01-04 한양대학교에리카산학협력단 나노 구조체 네트워크 및 그 제조 방법
KR101879055B1 (ko) * 2016-06-29 2018-07-18 한양대학교 에리카산학협력단 나노 구조체 네트워크 및 그 제조 방법
WO2018045388A1 (en) * 2016-09-05 2018-03-08 NanoSD Inc. See-through plastic chamber insulators
RU2651837C1 (ru) * 2017-03-21 2018-04-24 Олег Андреевич Стрелецкий Способ нанесения антиадгезивного, биосовместимого и бактериостатичного покрытия на основе углерода на металлические, полимерные и текстильные изделия медицинского назначения
CN106954347B (zh) * 2017-04-21 2019-10-01 北京石油化工学院 光打印制备纳米银线电路板的方法
KR102008447B1 (ko) * 2017-06-09 2019-08-07 건국대학교 산학협력단 투명전도성 필름 제조장치 및 제조방법
JP2019065229A (ja) * 2017-10-04 2019-04-25 コニカミノルタ株式会社 混合液の製造方法、混合液を製造するシステム、インク組成物、画像形成方法および画像形成物
CN111164828B (zh) * 2017-10-05 2021-12-03 伊斯曼柯达公司 透明天线
CN109801736A (zh) * 2017-11-16 2019-05-24 吴宏伟 透明导电溶液及其制备方法
CN108001062A (zh) * 2017-12-05 2018-05-08 华南理工大学 一种修复大面积高均匀性喷墨打印薄膜表面起伏过大的方法
CN108384064B (zh) * 2018-02-05 2020-11-03 广西大学 一种蔗渣基纳米抗菌保鲜膜及其制备方法
CN109135427A (zh) * 2018-08-24 2019-01-04 天津大学 生物可吸收导电油墨及其制备方法、烧结方法
CN109887638B (zh) * 2019-01-14 2021-02-23 上海大学 纳米银颗粒与镀银碳化硅颗粒混合的多尺度纳米银浆及其制备方法
US20220244644A1 (en) 2019-07-16 2022-08-04 Agfa-Gevaert Nv A Method of Manufacturing a Transparent Conductive Film
JP7305272B2 (ja) * 2019-09-09 2023-07-10 石原ケミカル株式会社 導電膜形成方法
CN111225328B (zh) * 2020-01-22 2021-01-29 头领科技(昆山)有限公司 静电扬声器振膜及静电扬声器
CN112768113B (zh) * 2020-12-31 2023-06-27 合肥工业大学 一种响应性纳米复合聚合物导电薄膜的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1125759A (ja) * 1997-07-02 1999-01-29 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
KR100236154B1 (ko) * 1996-04-22 1999-12-15 아오야기 모리키 투명 도전막 형성용 도포액, 이것을 이용한 투명 도전막 및 그 형성 방법
JP2002088277A (ja) * 2000-09-13 2002-03-27 Fuji Photo Film Co Ltd 水分散系透明導電膜形成用塗料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL106958A (en) 1993-09-09 1996-06-18 Ultrafine Techn Ltd Method of producing high-purity ultra-fine metal powder
JP2955985B2 (ja) * 1994-08-31 1999-10-04 ナノパウダース インダストリーズ(イスラエル)リミテッド 高純度超微粒金属粉を製造する方法
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
JP3266066B2 (ja) * 1997-09-05 2002-03-18 三菱マテリアル株式会社 保存安定性に優れた金属微粒子含有導電膜形成用組成物
US6012658A (en) 1998-09-22 2000-01-11 Nanopowders Industries Ltd Method of producing metal flakes, particularly silver flakes of high purity
JP2001325831A (ja) * 2000-05-12 2001-11-22 Bando Chem Ind Ltd 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
AU2002363192A1 (en) * 2001-11-01 2003-05-12 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ink-jet inks containing metal nanoparticles
US6923923B2 (en) * 2001-12-29 2005-08-02 Samsung Electronics Co., Ltd. Metallic nanoparticle cluster ink and method for forming metal pattern using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100236154B1 (ko) * 1996-04-22 1999-12-15 아오야기 모리키 투명 도전막 형성용 도포액, 이것을 이용한 투명 도전막 및 그 형성 방법
JPH1125759A (ja) * 1997-07-02 1999-01-29 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
JP2002088277A (ja) * 2000-09-13 2002-03-27 Fuji Photo Film Co Ltd 水分散系透明導電膜形成用塗料

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101270803B1 (ko) 2013-03-18 2013-06-05 단국대학교 산학협력단 금속 전극의 제조방법
WO2014148726A1 (ko) * 2013-03-18 2014-09-25 단국대학교 산학협력단 금속 전극의 제조방법
KR20150080370A (ko) * 2013-12-31 2015-07-09 삼성정밀화학 주식회사 투명전극용 금속 잉크 및 그 제조방법
KR102237001B1 (ko) 2013-12-31 2021-04-07 삼성에스디아이 주식회사 투명전극용 금속 잉크 및 그 제조방법
KR102231494B1 (ko) * 2020-10-13 2021-03-23 유시욱 투명 잉크 조성물 및 이를 포함하는 인쇄 기판

Also Published As

Publication number Publication date
HK1083223A1 (en) 2006-06-30
KR20060012542A (ko) 2006-02-08
KR101321255B1 (ko) 2013-10-28
CN1322075C (zh) 2007-06-20
EP1521811A1 (en) 2005-04-13
KR20110049923A (ko) 2011-05-12
JP2005530005A (ja) 2005-10-06
DE60330344D1 (de) 2010-01-14
EP2154212A1 (en) 2010-02-17
AU2003241128A1 (en) 2003-12-31
ATE450581T1 (de) 2009-12-15
ES2336779T3 (es) 2010-04-16
JP4636496B2 (ja) 2011-02-23
WO2003106573A1 (en) 2003-12-24
EP1521811B1 (en) 2009-12-02
CN1668712A (zh) 2005-09-14

Similar Documents

Publication Publication Date Title
KR101043307B1 (ko) 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크
CN1671805B (zh) 烧结温度低的导电纳米油墨及其制备方法
US7566360B2 (en) Nano-powder-based coating and ink compositions
US7736693B2 (en) Nano-powder-based coating and ink compositions
US7601406B2 (en) Nano-powder-based coating and ink compositions
JP5009907B2 (ja) 向上透明導電性被膜及びそれらを作製する方法
DE102015206065B4 (de) Verfahren zur Herstellung eines Herstellungsgegenstands mit einem dehnbaren, leitfähigen Film auf Silber-Nanoteilchen-Basis
US8999204B2 (en) Conductive ink composition, method for manufacturing the same, and method for manufacturing conductive thin layer using the same
JP2005530005A5 (https=)
TWI573846B (zh) 形成具有燒結添加物之透明導電塗層的方法
DE102011076749A1 (de) Silbernanopartikelzusammensetzung, umfassend Lösungsmittel mit spezifischen Hansen-Löslichkeitsparametern
JP2005531679A5 (https=)
KR102035115B1 (ko) 도전성 피막 복합체 및 그 제조방법
JP2014505969A (ja) 導電性被膜の製造用のピッカリングエマルジョン及びピッカリングエマルジョンの製造方法
Yung et al. Synthesis of submicron sized silver powder for metal deposition via laser sintered inkjet printing
TWI620988B (zh) 製造圖案化塗層之方法
KR20250138781A (ko) 은 나노미립자 처리 및 층 형성용 잉크를 사용하여 주변 온도에 가까운 온도에서 전기 전도층 형성
HK1083223B (en) A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby
KR20100009877A (ko) 유기/나노-은 졸 용액과 이를 이용한 유-무기 하이브리드잉크 및 그 제조방법
HK1083516A (en) Low sintering temperatures conductive nano-inks and a method for producing the same

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T13-X000 Administrative time limit extension granted

St.27 status event code: U-3-3-T10-T13-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E14-X000 Pre-grant third party observation filed

St.27 status event code: A-2-3-E10-E14-opp-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

A107 Divisional application of patent
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20140528

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

FPAY Annual fee payment

Payment date: 20150527

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160602

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170609

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190616

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190616