CN1671805B - 烧结温度低的导电纳米油墨及其制备方法 - Google Patents
烧结温度低的导电纳米油墨及其制备方法 Download PDFInfo
- Publication number
- CN1671805B CN1671805B CN03815904XA CN03815904A CN1671805B CN 1671805 B CN1671805 B CN 1671805B CN 03815904X A CN03815904X A CN 03815904XA CN 03815904 A CN03815904 A CN 03815904A CN 1671805 B CN1671805 B CN 1671805B
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- described method
- powder
- homogenizing mixture
- metal powder
- organic solvent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
体系 | 制剂 | 电阻,Ω/平方 | 电阻率,Ωcm | 烧结温度,℃ |
1 | P0010 | 0.7 | 2.84E-4 | 120 |
l | P0010 | 0.05 | 2.03E-5 | 300 |
3 | Cl16 | 2.8 | 6.72E-5 | 120 |
3 | Cl16 | 1.17 | 2.93E-5 | 300 |
2 | Cl21 | 0.255 | 3.09E-4 | 100 |
银块* | 0.004 | 1.95E-5 | 120 | |
银块* | 0.0045 | 2.14E-5 | 220 |
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39312302P | 2002-07-03 | 2002-07-03 | |
US60/393,123 | 2002-07-03 | ||
PCT/IL2003/000554 WO2004005413A1 (en) | 2002-07-03 | 2003-07-03 | Low sintering temperatures conductive nano-inks and a method for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1671805A CN1671805A (zh) | 2005-09-21 |
CN1671805B true CN1671805B (zh) | 2010-05-26 |
Family
ID=30115548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03815904XA Expired - Fee Related CN1671805B (zh) | 2002-07-03 | 2003-07-03 | 烧结温度低的导电纳米油墨及其制备方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2005531679A (zh) |
KR (1) | KR20060012545A (zh) |
CN (1) | CN1671805B (zh) |
AU (1) | AU2003237578A1 (zh) |
WO (1) | WO2004005413A1 (zh) |
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US7585349B2 (en) | 2002-12-09 | 2009-09-08 | The University Of Washington | Methods of nanostructure formation and shape selection |
GB0300529D0 (en) * | 2003-01-10 | 2003-02-12 | Qinetiq Nanomaterials Ltd | Improvements in and relating to ink jet deposition |
US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
US8257795B2 (en) | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
EP1716578A4 (en) * | 2004-02-18 | 2009-11-11 | Virginia Tech Intell Prop | NANOMASS BAR METAL PASTE FOR CONNECTION AND USE METHOD |
JP4721677B2 (ja) * | 2004-09-06 | 2011-07-13 | 株式会社秀峰 | 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体 |
EP1835512B1 (en) * | 2004-10-08 | 2010-05-12 | Mitsui Mining & Smelting Co., Ltd. | Conductive ink |
US20060093732A1 (en) * | 2004-10-29 | 2006-05-04 | David Schut | Ink-jet printing of coupling agents for trace or circuit deposition templating |
JP4756628B2 (ja) * | 2004-12-01 | 2011-08-24 | 三井金属鉱業株式会社 | 水系itoインク |
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WO2006076603A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
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CN113831864A (zh) * | 2021-11-11 | 2021-12-24 | 苏州诺菲纳米科技有限公司 | 单层纳米银线可剥导电胶及其制备方法 |
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EP0977212A2 (en) * | 1998-07-31 | 2000-02-02 | International Business Machines Corporation | Method for producing nanoparticles of transition metals |
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-
2003
- 2003-07-03 WO PCT/IL2003/000554 patent/WO2004005413A1/en active Application Filing
- 2003-07-03 CN CN03815904XA patent/CN1671805B/zh not_active Expired - Fee Related
- 2003-07-03 AU AU2003237578A patent/AU2003237578A1/en not_active Abandoned
- 2003-07-03 KR KR1020047021518A patent/KR20060012545A/ko not_active Application Discontinuation
- 2003-07-03 JP JP2004519139A patent/JP2005531679A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0977212A2 (en) * | 1998-07-31 | 2000-02-02 | International Business Machines Corporation | Method for producing nanoparticles of transition metals |
Non-Patent Citations (1)
Title |
---|
US 6,379,745 B1,2002.04.30,全文. |
Also Published As
Publication number | Publication date |
---|---|
CN1671805A (zh) | 2005-09-21 |
JP2005531679A (ja) | 2005-10-20 |
AU2003237578A1 (en) | 2004-01-23 |
WO2004005413A1 (en) | 2004-01-15 |
KR20060012545A (ko) | 2006-02-08 |
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