CN1671805A - 烧结温度低的导电纳米油墨及其制备方法 - Google Patents
烧结温度低的导电纳米油墨及其制备方法 Download PDFInfo
- Publication number
- CN1671805A CN1671805A CNA03815904XA CN03815904A CN1671805A CN 1671805 A CN1671805 A CN 1671805A CN A03815904X A CNA03815904X A CN A03815904XA CN 03815904 A CN03815904 A CN 03815904A CN 1671805 A CN1671805 A CN 1671805A
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- Prior art keywords
- described method
- powder
- nano
- metal powder
- ink
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
样品号 | 粒度分布 | |
D50微米 | D90微米 | |
1 | 0.054 | 0.067 |
2 | 0.054 | 0.066 |
3 | 0.052 | 0.063 |
4 | 0.246 | 2.851 |
5 | 3.2 | 8 |
样品1(涂有表面活性剂) | 样品2(洗去表面活性剂) | ||||
电阻 | 电阻率 | 温度 | 电阻 | 电阻率 | 温度 |
R,Ω | ρ,Ω×cm | ℃ | R,Ω | ρ,Ω×cm | ℃ |
1300 | 7.60 | 236 | 0.1065 | 1.24E-3 | 62 |
131 | 0.76 | 270 | 0.0166 | 1.94E-4 | 127 |
样品号 | T=120℃ | T=220℃ | ||
电阻 | 电阻率 | 电阻 | 电阻率 | |
R,Ω | ρ,Ω×cm | R,Ω | ρ,Ω×cm | |
2 | 0.0203 | 2.40E-4 | 0.0034 | 3.98E-5 |
4 | 0.1600 | 1.20E-3 | 0.0860 | 6.61E-4 |
5 | 0.4620 | 3.24E-3 | 0.4200 | 2.95E-3 |
银块* | 0.0040 | 1.95E-5 | 0.0045 | 2.14E-5 |
样品号 | 粒度分布 | 表面积 | |
D50微米 | 平均,微米 | m2/g | |
AS0873 | 0.073 | 0.181 | 7.2 |
ASX0871 | 0.35 | 0.317 | 6.0 |
ASX13-1 | 3.4 | 3.4 | 1.3 |
体系 | 制剂 | 电阻,Ω/平方 | 电阻率,Ωcm | 烧结温度,℃ |
1 | P0010 | 0.7 | 2.84E-4 | 120 |
1 | P0010 | 0.05 | 2.03E-5 | 300 |
3 | C116 | 2.8 | 6.72E-5 | 120 |
3 | C116 | 1.17 | 2.93E-5 | 300 |
2 | C121 | 0.255 | 3.09E-4 | 100 |
银块* | 0.004 | 1.95E-5 | 120 | |
银块* | 0.0045 | 2.14E-5 | 220 |
Claims (29)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39312302P | 2002-07-03 | 2002-07-03 | |
US60/393,123 | 2002-07-03 | ||
PCT/IL2003/000554 WO2004005413A1 (en) | 2002-07-03 | 2003-07-03 | Low sintering temperatures conductive nano-inks and a method for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1671805A true CN1671805A (zh) | 2005-09-21 |
CN1671805B CN1671805B (zh) | 2010-05-26 |
Family
ID=30115548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03815904XA Expired - Fee Related CN1671805B (zh) | 2002-07-03 | 2003-07-03 | 烧结温度低的导电纳米油墨及其制备方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2005531679A (zh) |
KR (1) | KR20060012545A (zh) |
CN (1) | CN1671805B (zh) |
AU (1) | AU2003237578A1 (zh) |
WO (1) | WO2004005413A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101805538A (zh) * | 2010-04-08 | 2010-08-18 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
CN102522342A (zh) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | 半导体结构及其制造方法 |
CN104024351A (zh) * | 2011-09-06 | 2014-09-03 | 汉高知识产权控股有限责任公司 | 导电金属和方法 |
CN104662109A (zh) * | 2012-09-28 | 2015-05-27 | 凸版资讯股份有限公司 | 银油墨组合物、导电体以及通信设备 |
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US7585349B2 (en) | 2002-12-09 | 2009-09-08 | The University Of Washington | Methods of nanostructure formation and shape selection |
GB0300529D0 (en) * | 2003-01-10 | 2003-02-12 | Qinetiq Nanomaterials Ltd | Improvements in and relating to ink jet deposition |
US20050173680A1 (en) * | 2004-02-10 | 2005-08-11 | Haixin Yang | Ink jet printable thick film ink compositions and processes |
US8257795B2 (en) | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
EP1716578A4 (en) * | 2004-02-18 | 2009-11-11 | Virginia Tech Intell Prop | NANOMASS BAR METAL PASTE FOR CONNECTION AND USE METHOD |
JP4721677B2 (ja) * | 2004-09-06 | 2011-07-13 | 株式会社秀峰 | 印刷または塗布画像作成方法、およびそれによる、印刷または塗布画像体 |
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US20060093732A1 (en) * | 2004-10-29 | 2006-05-04 | David Schut | Ink-jet printing of coupling agents for trace or circuit deposition templating |
JP4756628B2 (ja) * | 2004-12-01 | 2011-08-24 | 三井金属鉱業株式会社 | 水系itoインク |
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2003
- 2003-07-03 WO PCT/IL2003/000554 patent/WO2004005413A1/en active Application Filing
- 2003-07-03 CN CN03815904XA patent/CN1671805B/zh not_active Expired - Fee Related
- 2003-07-03 AU AU2003237578A patent/AU2003237578A1/en not_active Abandoned
- 2003-07-03 KR KR1020047021518A patent/KR20060012545A/ko not_active Application Discontinuation
- 2003-07-03 JP JP2004519139A patent/JP2005531679A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101805538A (zh) * | 2010-04-08 | 2010-08-18 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
CN101805538B (zh) * | 2010-04-08 | 2014-05-07 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
CN104024351A (zh) * | 2011-09-06 | 2014-09-03 | 汉高知识产权控股有限责任公司 | 导电金属和方法 |
CN102522342A (zh) * | 2011-12-27 | 2012-06-27 | 日月光半导体制造股份有限公司 | 半导体结构及其制造方法 |
CN104662109A (zh) * | 2012-09-28 | 2015-05-27 | 凸版资讯股份有限公司 | 银油墨组合物、导电体以及通信设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2005531679A (ja) | 2005-10-20 |
AU2003237578A1 (en) | 2004-01-23 |
WO2004005413A1 (en) | 2004-01-15 |
KR20060012545A (ko) | 2006-02-08 |
CN1671805B (zh) | 2010-05-26 |
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