KR100989279B1 - 기판처리장치 - Google Patents

기판처리장치 Download PDF

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Publication number
KR100989279B1
KR100989279B1 KR1020080018770A KR20080018770A KR100989279B1 KR 100989279 B1 KR100989279 B1 KR 100989279B1 KR 1020080018770 A KR1020080018770 A KR 1020080018770A KR 20080018770 A KR20080018770 A KR 20080018770A KR 100989279 B1 KR100989279 B1 KR 100989279B1
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KR
South Korea
Prior art keywords
substrate
substrates
moving
collectively
support
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KR1020080018770A
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English (en)
Korean (ko)
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KR20080082905A (ko
Inventor
아키오 시오미
요시히로 니시나
토루 사토
료 무라모토
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다이닛뽕스크린 세이조오 가부시키가이샤 filed Critical 다이닛뽕스크린 세이조오 가부시키가이샤
Publication of KR20080082905A publication Critical patent/KR20080082905A/ko
Application granted granted Critical
Publication of KR100989279B1 publication Critical patent/KR100989279B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020080018770A 2007-03-09 2008-02-29 기판처리장치 KR100989279B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007060780 2007-03-09
JPJP-P-2007-00060780 2007-03-09
JP2007060779 2007-03-09
JPJP-P-2007-00060779 2007-03-09
JP2007321142A JP4824664B2 (ja) 2007-03-09 2007-12-12 基板処理装置
JPJP-P-2007-00321142 2007-12-12

Publications (2)

Publication Number Publication Date
KR20080082905A KR20080082905A (ko) 2008-09-12
KR100989279B1 true KR100989279B1 (ko) 2010-10-20

Family

ID=39981808

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080018770A KR100989279B1 (ko) 2007-03-09 2008-02-29 기판처리장치

Country Status (4)

Country Link
JP (2) JP4824664B2 (ja)
KR (1) KR100989279B1 (ja)
CN (1) CN101261935B (ja)
TW (1) TWI378894B (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101181560B1 (ko) 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 그것에 사용되는 기판반송장치
JP5290890B2 (ja) * 2008-09-12 2013-09-18 大日本スクリーン製造株式会社 基板処理装置
JP5218000B2 (ja) * 2008-12-12 2013-06-19 株式会社Ｉｈｉ 基板保管供給システム
JP5330031B2 (ja) * 2009-03-05 2013-10-30 大日本スクリーン製造株式会社 基板処理装置
JP6049970B2 (ja) * 2011-08-10 2016-12-21 川崎重工業株式会社 エンドエフェクタ装置及び該エンドエフェクタ装置を備える基板搬送用ロボット
JP5875901B2 (ja) * 2012-03-09 2016-03-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN105336651B (zh) * 2014-06-10 2018-03-23 北大方正集团有限公司 晶片转置系统
ITUA20163368A1 (it) * 2016-05-12 2017-11-12 Marchesini Group Spa Dispositivo di stabilizzazione per stabilizzare articoli durante il loro sollevamento e raggruppamento
TW201839890A (zh) * 2017-02-13 2018-11-01 日商東京威力科創股份有限公司 搬送裝置﹑搬送方法及記憶媒體
JP6917846B2 (ja) * 2017-09-25 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置、基板処理装置および基板挟持装置
CN109226010A (zh) * 2018-09-28 2019-01-18 昆山市和博电子科技有限公司 一种基板清洗机及基板清洗系统
CN109127587B (zh) * 2018-10-22 2021-03-19 安徽深泽电子股份有限公司 一种pcb板的清洗工装
WO2020129714A1 (ja) * 2018-12-19 2020-06-25 東京エレクトロン株式会社 基板処理装置、および基板処理方法
KR20200102612A (ko) 2019-02-21 2020-09-01 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN110176390B (zh) * 2019-05-31 2022-02-18 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 无片盒清洗设备中批量晶圆固定、驱动装置及使用方法
US12037193B2 (en) * 2019-09-02 2024-07-16 Murata Machinery, Ltd. Wafer delivery device, wafer storage container, and wafer storage system
CN111769064B (zh) * 2020-06-18 2023-07-14 无锡先导智能装备股份有限公司 上下料装置
CN112757079B (zh) * 2020-12-31 2022-05-17 泉州市海恩德机电科技发展有限公司 一种智能化石材打磨设备
CN115312444A (zh) * 2022-09-03 2022-11-08 福建久策气体股份有限公司 一种led晶圆清洗夹具及清洗设备
JP2024046369A (ja) * 2022-09-22 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN115893002B (zh) * 2022-11-15 2023-07-28 浙江矽盛电子有限公司 一种光伏单晶硅片生产成型后的检验装置
CN117819154A (zh) * 2024-03-04 2024-04-05 成都环龙智能机器人有限公司 一种机器人自动搬运装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11165863A (ja) 1997-12-02 1999-06-22 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH11354604A (ja) 1998-06-05 1999-12-24 Dainippon Screen Mfg Co Ltd 基板移載装置およびそれを用いた基板処理装置
KR20030080355A (ko) * 2002-04-08 2003-10-17 한국디엔에스 주식회사 기판 정렬 시스템 및 그 정렬 방법
KR20040008331A (ko) * 2002-07-18 2004-01-31 한국디엔에스 주식회사 이송 로봇 및 이를 이용한 기판 정렬 시스템

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2824951B2 (ja) * 1992-09-25 1998-11-18 大日本スクリーン製造株式会社 基板処理装置における基板受け渡し装置
JP3521330B2 (ja) * 1997-01-21 2004-04-19 東京エレクトロン株式会社 基板搬送処理装置
JP3577204B2 (ja) * 1997-12-02 2004-10-13 大日本スクリーン製造株式会社 基板姿勢変換装置
JP3413567B2 (ja) * 1998-02-18 2003-06-03 東京エレクトロン株式会社 基板搬送処理装置及び基板搬送処理方法
JP3905658B2 (ja) * 1999-02-08 2007-04-18 大日本スクリーン製造株式会社 基板搬送装置
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
JP2002076094A (ja) * 2000-08-31 2002-03-15 Daikin Ind Ltd 基板搬送装置
JP3979804B2 (ja) * 2001-08-17 2007-09-19 大日本スクリーン製造株式会社 基板処理装置
JP4401285B2 (ja) * 2004-12-24 2010-01-20 大日本スクリーン製造株式会社 基板処理装置
JP4688637B2 (ja) * 2005-10-28 2011-05-25 東京エレクトロン株式会社 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11165863A (ja) 1997-12-02 1999-06-22 Dainippon Screen Mfg Co Ltd 基板搬送装置
JPH11354604A (ja) 1998-06-05 1999-12-24 Dainippon Screen Mfg Co Ltd 基板移載装置およびそれを用いた基板処理装置
KR20030080355A (ko) * 2002-04-08 2003-10-17 한국디엔에스 주식회사 기판 정렬 시스템 및 그 정렬 방법
KR20040008331A (ko) * 2002-07-18 2004-01-31 한국디엔에스 주식회사 이송 로봇 및 이를 이용한 기판 정렬 시스템

Also Published As

Publication number Publication date
JP2011238945A (ja) 2011-11-24
JP4824664B2 (ja) 2011-11-30
JP5054218B2 (ja) 2012-10-24
TWI378894B (en) 2012-12-11
JP2008258570A (ja) 2008-10-23
TW200902415A (en) 2009-01-16
CN101261935B (zh) 2010-12-01
CN101261935A (zh) 2008-09-10
KR20080082905A (ko) 2008-09-12

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