KR100949560B1 - 연마 패드 - Google Patents
연마 패드 Download PDFInfo
- Publication number
- KR100949560B1 KR100949560B1 KR1020077026853A KR20077026853A KR100949560B1 KR 100949560 B1 KR100949560 B1 KR 100949560B1 KR 1020077026853 A KR1020077026853 A KR 1020077026853A KR 20077026853 A KR20077026853 A KR 20077026853A KR 100949560 B1 KR100949560 B1 KR 100949560B1
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- delete delete
- weight
- polyurethane resin
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
- C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/30—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0025—Foam properties rigid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0041—Foam properties having specified density
- C08G2110/0066—≥ 150kg/m3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/08—Polyurethanes from polyethers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005144318A JP2006320982A (ja) | 2005-05-17 | 2005-05-17 | 研磨パッド |
| JPJP-P-2005-00144318 | 2005-05-17 | ||
| JP2005144292A JP4897238B2 (ja) | 2005-05-17 | 2005-05-17 | 研磨パッド |
| JPJP-P-2005-00144292 | 2005-05-17 | ||
| JP2005144304A JP4979200B2 (ja) | 2005-05-17 | 2005-05-17 | 研磨パッド |
| JPJP-P-2005-00144304 | 2005-05-17 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097013450A Division KR101134058B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
| KR1020097013449A Division KR101134432B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080002981A KR20080002981A (ko) | 2008-01-04 |
| KR100949560B1 true KR100949560B1 (ko) | 2010-03-25 |
Family
ID=37431136
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077026853A Expired - Fee Related KR100949560B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
| KR1020097013450A Expired - Fee Related KR101134058B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
| KR1020097013449A Expired - Fee Related KR101134432B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097013450A Expired - Fee Related KR101134058B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
| KR1020097013449A Expired - Fee Related KR101134432B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US8304467B2 (https=) |
| KR (3) | KR100949560B1 (https=) |
| MY (1) | MY146929A (https=) |
| TW (1) | TW200709891A (https=) |
| WO (1) | WO2006123559A1 (https=) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG160368A1 (en) * | 2005-03-08 | 2010-04-29 | Toyo Tire & Rubber Co | Polishing pad and process for producing the same |
| WO2006123559A1 (ja) * | 2005-05-17 | 2006-11-23 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド |
| JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5031236B2 (ja) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| CN102152233B (zh) * | 2006-08-28 | 2013-10-30 | 东洋橡胶工业株式会社 | 抛光垫 |
| JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
| US20090062414A1 (en) * | 2007-08-28 | 2009-03-05 | David Picheng Huang | System and method for producing damping polyurethane CMP pads |
| US8052507B2 (en) * | 2007-11-20 | 2011-11-08 | Praxair Technology, Inc. | Damping polyurethane CMP pads with microfillers |
| JP2012528487A (ja) * | 2009-05-27 | 2012-11-12 | ロジャーズ コーポレーション | 研磨パッド、それを用いた組成物および、その製造と使用方法 |
| US20110028074A1 (en) * | 2009-08-03 | 2011-02-03 | Canon Kabushiki Kaisha | Polishing method for a workpiece and polishing tool used for the polishing method |
| US8551201B2 (en) * | 2009-08-07 | 2013-10-08 | Praxair S.T. Technology, Inc. | Polyurethane composition for CMP pads and method of manufacturing same |
| JP5634903B2 (ja) * | 2010-02-25 | 2014-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5350309B2 (ja) * | 2010-03-31 | 2013-11-27 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法 |
| US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
| WO2013089240A1 (ja) * | 2011-12-16 | 2013-06-20 | 東洋ゴム工業株式会社 | 研磨パッド |
| US9421666B2 (en) | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| US9993907B2 (en) | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| CN105171593B (zh) | 2015-08-11 | 2017-12-26 | 湖北鼎龙控股股份有限公司 | 耐候性化学机械抛光垫 |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10456886B2 (en) | 2016-01-19 | 2019-10-29 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| KR101853021B1 (ko) | 2017-01-12 | 2018-04-30 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| KR101835087B1 (ko) | 2017-05-29 | 2018-03-06 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
| KR101835090B1 (ko) | 2017-05-29 | 2018-03-06 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7045334B2 (ja) | 2017-09-11 | 2022-03-31 | エスケイシー・ソルミックス・カンパニー・リミテッド | 多孔質ポリウレタン研磨パッドおよびその製造方法 |
| KR102058877B1 (ko) | 2018-04-20 | 2019-12-24 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| CN112088069B (zh) | 2018-05-07 | 2024-03-19 | 应用材料公司 | 亲水性和z电位可调谐的化学机械抛光垫 |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| CN109596446B (zh) * | 2018-11-13 | 2021-06-18 | 江苏大学 | 一种检测产品耐磨性能的测量装置 |
| TWI735101B (zh) | 2018-12-26 | 2021-08-01 | 南韓商Skc索密思股份有限公司 | 用於研磨墊之組成物、研磨墊及用於製備其之方法 |
| KR102202076B1 (ko) * | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| KR102283399B1 (ko) * | 2018-12-26 | 2021-07-30 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
| US11071860B2 (en) | 2019-02-06 | 2021-07-27 | Oncosec Medical Incorporated | Systems and methods for detecting fault conditions in electroporation therapy |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| KR102237357B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| KR102237367B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| KR102237351B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| TWI743831B (zh) * | 2019-06-17 | 2021-10-21 | 南韓商Skc索密思股份有限公司 | 用於研磨墊之組成物、研磨墊及半導體裝置之製備方法 |
| KR102237362B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
| CN114450127B (zh) * | 2019-07-12 | 2024-05-28 | Cmc材料有限责任公司 | 采用多胺及环己烷二甲醇固化剂的抛光垫 |
| CN110528287B (zh) * | 2019-08-08 | 2022-03-08 | 安徽安利材料科技股份有限公司 | 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| CN113896856B (zh) * | 2020-06-19 | 2023-05-12 | 中国科学院微电子研究所 | 一种抛光垫材料及抛光垫 |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN113956421A (zh) * | 2021-11-16 | 2022-01-21 | 上海映智研磨材料有限公司 | 聚氨酯抛光垫材料及其制备方法和应用 |
| KR20230153739A (ko) | 2022-04-29 | 2023-11-07 | 케이피엑스케미칼 주식회사 | 개선된 연마속도를 제공하는 연마패드 및 이의 제조방법 |
| KR20240026409A (ko) | 2022-08-19 | 2024-02-28 | 케이피엑스케미칼 주식회사 | 연마패드, 이의 제조방법, 및 연마패드의 연마성능 추정방법 |
| US20250073842A1 (en) * | 2022-09-03 | 2025-03-06 | Rajeev Bajaj | Multilayer cmp pads |
| KR102731712B1 (ko) * | 2023-04-14 | 2024-11-19 | 에스케이엔펄스 주식회사 | 염소 함량이 조절된 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| CN116790190B (zh) * | 2023-06-26 | 2025-11-07 | 万桦(常州)新材料科技有限公司 | 一种用于碳化硅精抛的抛光材料及其制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002144220A (ja) * | 2000-09-19 | 2002-05-21 | Rodel Holdings Inc | ミクロ−テクスチャーを備えた研磨パッド |
| JP2003062748A (ja) * | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
| JP2004211076A (ja) * | 2002-12-17 | 2004-07-29 | Dainippon Ink & Chem Inc | 二液硬化型発泡砥石用ポリオール組成物、二液硬化型発泡砥石用組成物、発泡砥石、及び発泡砥石の製造法 |
| JP2005052907A (ja) * | 2003-08-07 | 2005-03-03 | Diatex Co Ltd | 研磨パッド用下地材 |
Family Cites Families (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL279602A (https=) | 1961-06-12 | |||
| US4410668A (en) * | 1982-01-29 | 1983-10-18 | Ppg Industries, Inc. | Elastomeric coating compositions |
| JPH0291279A (ja) | 1988-09-29 | 1990-03-30 | Achilles Corp | 合成皮革及びその製造方法 |
| JP3137260B2 (ja) | 1989-06-12 | 2001-02-19 | 凸版印刷株式会社 | ラジアルラインスロットアンテナ |
| JP2925736B2 (ja) * | 1991-08-07 | 1999-07-28 | ピーピージー インダストリーズ インコーポレーテッド | 独立して架橋しうるポリウレタンを有する含浸された繊維の束 |
| GB9216631D0 (en) * | 1992-08-05 | 1992-09-16 | Ici Plc | Reaction system for preparing microcellular elastomers |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| JPH06220151A (ja) | 1993-01-22 | 1994-08-09 | Sanyo Chem Ind Ltd | 研磨材用ポリウレタン樹脂 |
| JPH0871378A (ja) | 1994-09-09 | 1996-03-19 | Kanegafuchi Chem Ind Co Ltd | 中空糸膜ポッティング用ウレタン樹脂 |
| US5670599A (en) * | 1995-03-08 | 1997-09-23 | Air Products And Chemicals, Inc. | Ultra low voc polyurethane coatings |
| US5614575A (en) * | 1995-04-24 | 1997-03-25 | Rpg. Inc. | Sprayable polyurethane compositions |
| US5587502A (en) | 1995-06-02 | 1996-12-24 | Minnesota Mining & Manufacturing Company | Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom |
| WO1998045087A1 (en) | 1997-04-04 | 1998-10-15 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
| EP1011919B1 (en) | 1997-08-06 | 2004-10-20 | Rodel Holdings, Inc. | Method of manufacturing a polishing pad |
| JP2000017252A (ja) | 1998-06-29 | 2000-01-18 | Dainippon Ink & Chem Inc | 研磨材組成物及びその研磨材 |
| JP3516874B2 (ja) | 1998-12-15 | 2004-04-05 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
| US6354915B1 (en) | 1999-01-21 | 2002-03-12 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| JP2000248034A (ja) | 1999-03-02 | 2000-09-12 | Mitsubishi Chemicals Corp | 研磨材用ポリウレタン系樹脂組成物及びその発泡体 |
| JP3316756B2 (ja) | 1999-06-04 | 2002-08-19 | 富士紡績株式会社 | 研磨パッド用ウレタン成形物の製造方法及び研磨パッド用ウレタン成形物 |
| JP3880028B2 (ja) | 1999-08-06 | 2007-02-14 | Jsr株式会社 | 研磨パッド用重合体組成物及びそれを用いた研磨パッド |
| JP3558273B2 (ja) | 1999-09-22 | 2004-08-25 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
| JP4296655B2 (ja) | 1999-10-12 | 2009-07-15 | 東レ株式会社 | 半導体基板用研磨パッド |
| JP2001277101A (ja) | 2000-03-28 | 2001-10-09 | Rodel Nitta Co | 研磨布 |
| JP3490431B2 (ja) | 2000-06-13 | 2004-01-26 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法、ポリウレタン発泡体及び研磨シート |
| JP2003011066A (ja) | 2000-07-25 | 2003-01-15 | Ebara Corp | 研磨工具及びその製造方法 |
| US20020016139A1 (en) | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
| JP2002059358A (ja) | 2000-08-24 | 2002-02-26 | Toray Ind Inc | 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法 |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US6679769B2 (en) | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| JP3826702B2 (ja) | 2000-10-24 | 2006-09-27 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| US6706383B1 (en) * | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
| WO2002046283A1 (en) | 2000-12-08 | 2002-06-13 | Kuraray. Co., Ltd. | Thermoplastic polyurethane foam, process for production thereof and polishing pads made of the foam |
| JP2005503447A (ja) * | 2001-01-24 | 2005-02-03 | ハンツマン・インターナショナル・エルエルシー | 短縮した金型滞留時間及び改良された品質で調製された成形発泡物品 |
| JP3455187B2 (ja) * | 2001-02-01 | 2003-10-14 | 東洋ゴム工業株式会社 | 研磨パッド用ポリウレタン発泡体の製造装置 |
| JP2002239905A (ja) | 2001-02-21 | 2002-08-28 | Allied Material Corp | Cmp用パッドコンディショナー及びその製造方法 |
| JP3956364B2 (ja) * | 2001-04-09 | 2007-08-08 | 東洋ゴム工業株式会社 | ポリウレタン組成物および研磨パッド |
| JP3359629B1 (ja) | 2001-04-09 | 2002-12-24 | 東洋紡績株式会社 | ポリウレタン組成物からなる研磨パッド |
| JP2003089051A (ja) | 2001-09-17 | 2003-03-25 | Tokyo Seimitsu Co Ltd | 研磨装置 |
| JP3851135B2 (ja) | 2001-10-17 | 2006-11-29 | ニッタ・ハース株式会社 | 研磨パッド |
| KR100877386B1 (ko) * | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| JP2003145414A (ja) | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
| JP3455208B2 (ja) | 2001-11-13 | 2003-10-14 | 東洋紡績株式会社 | 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック |
| JP3325562B1 (ja) | 2001-12-07 | 2002-09-17 | 東洋ゴム工業株式会社 | 発泡ポリウレタン研磨パッドの製造方法 |
| JP3494641B1 (ja) | 2001-12-12 | 2004-02-09 | 東洋紡績株式会社 | 半導体ウエハ研磨用研磨パッド |
| JP2003224094A (ja) | 2002-01-29 | 2003-08-08 | Ebara Corp | 研磨工具 |
| US6866565B2 (en) * | 2002-01-29 | 2005-03-15 | Ebara Corporation | Polishing tool and polishing apparatus |
| KR100467765B1 (ko) | 2002-02-04 | 2005-01-24 | 에스케이씨 주식회사 | 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물 |
| JP3571334B2 (ja) | 2002-05-20 | 2004-09-29 | 東洋紡績株式会社 | 研磨パッド |
| JP2004167680A (ja) | 2002-05-20 | 2004-06-17 | Toyobo Co Ltd | 研磨パッド |
| US6824854B2 (en) | 2002-07-29 | 2004-11-30 | E. I. Du Pont De Nemours And Company | Carpets treated for soil resistance |
| JP4101584B2 (ja) | 2002-08-09 | 2008-06-18 | 東洋ゴム工業株式会社 | 研磨シート用ポリウレタン発泡体及びその製造方法、研磨パッド用研磨シート、並びに研磨パッド |
| JP2005539398A (ja) | 2002-09-25 | 2005-12-22 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 平坦化するための研磨パッド |
| US7094811B2 (en) * | 2002-10-03 | 2006-08-22 | Bayer Corporation | Energy absorbing flexible foams produced in part with a double metal cyanide catalyzed polyol |
| US8845852B2 (en) * | 2002-11-27 | 2014-09-30 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and method of producing semiconductor device |
| JP4078643B2 (ja) | 2002-12-10 | 2008-04-23 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法、研磨パッド、及び半導体デバイスの製造方法 |
| JP4233319B2 (ja) | 2002-12-12 | 2009-03-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法及び研磨パッド |
| JP2004235446A (ja) | 2003-01-30 | 2004-08-19 | Toyobo Co Ltd | 研磨パッド |
| US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| JP4324785B2 (ja) | 2003-04-15 | 2009-09-02 | Jsr株式会社 | 研磨パッドの製造方法 |
| JP4189962B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| JP4189963B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4265366B2 (ja) | 2003-10-17 | 2009-05-20 | 日本ポリウレタン工業株式会社 | 軟質ポリウレタンフォームの製造方法 |
| US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| WO2005088690A1 (ja) * | 2004-03-11 | 2005-09-22 | Toyo Tire & Rubber Co., Ltd. | 研磨パッドおよび半導体デバイスの製造方法 |
| JP4627149B2 (ja) | 2004-05-10 | 2011-02-09 | 東洋ゴム工業株式会社 | 研磨パッド及び半導体デバイスの製造方法 |
| US7018581B2 (en) | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
| EP1647588A3 (en) * | 2004-10-13 | 2006-11-02 | Rohm and Haas Company | Surface promoted Michael Cure Compositions |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US7871309B2 (en) * | 2004-12-10 | 2011-01-18 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP2006190826A (ja) | 2005-01-06 | 2006-07-20 | Toyo Tire & Rubber Co Ltd | 研磨パッド及び半導体デバイスの製造方法 |
| JP2006231429A (ja) | 2005-02-22 | 2006-09-07 | Inoac Corp | 研磨パッドおよびその製造方法 |
| SG160368A1 (en) | 2005-03-08 | 2010-04-29 | Toyo Tire & Rubber Co | Polishing pad and process for producing the same |
| WO2006123559A1 (ja) | 2005-05-17 | 2006-11-23 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド |
| JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| KR101290490B1 (ko) * | 2005-09-22 | 2013-07-26 | 가부시키가이샤 구라레 | 고분자 재료, 그것으로부터 얻어지는 발포체 및 이들을사용한 연마 패드 |
| JP5031236B2 (ja) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| CN102152233B (zh) * | 2006-08-28 | 2013-10-30 | 东洋橡胶工业株式会社 | 抛光垫 |
| JP5008927B2 (ja) * | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5078000B2 (ja) * | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
-
2006
- 2006-05-10 WO PCT/JP2006/309380 patent/WO2006123559A1/ja not_active Ceased
- 2006-05-10 US US11/914,547 patent/US8304467B2/en not_active Expired - Fee Related
- 2006-05-10 KR KR1020077026853A patent/KR100949560B1/ko not_active Expired - Fee Related
- 2006-05-10 KR KR1020097013450A patent/KR101134058B1/ko not_active Expired - Fee Related
- 2006-05-10 KR KR1020097013449A patent/KR101134432B1/ko not_active Expired - Fee Related
- 2006-05-12 TW TW095116870A patent/TW200709891A/zh not_active IP Right Cessation
- 2006-05-16 MY MYPI20062241A patent/MY146929A/en unknown
-
2011
- 2011-05-13 US US13/107,347 patent/US8530535B2/en not_active Expired - Fee Related
-
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- 2012-09-07 US US13/607,125 patent/US8779020B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002144220A (ja) * | 2000-09-19 | 2002-05-21 | Rodel Holdings Inc | ミクロ−テクスチャーを備えた研磨パッド |
| JP2003062748A (ja) * | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
| JP2004211076A (ja) * | 2002-12-17 | 2004-07-29 | Dainippon Ink & Chem Inc | 二液硬化型発泡砥石用ポリオール組成物、二液硬化型発泡砥石用組成物、発泡砥石、及び発泡砥石の製造法 |
| JP2005052907A (ja) * | 2003-08-07 | 2005-03-03 | Diatex Co Ltd | 研磨パッド用下地材 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200709891A (en) | 2007-03-16 |
| US20090093201A1 (en) | 2009-04-09 |
| US8304467B2 (en) | 2012-11-06 |
| MY146929A (en) | 2012-10-15 |
| US20130005228A1 (en) | 2013-01-03 |
| KR20090078845A (ko) | 2009-07-20 |
| KR20090078846A (ko) | 2009-07-20 |
| KR101134432B1 (ko) | 2012-04-10 |
| KR101134058B1 (ko) | 2012-04-16 |
| WO2006123559A1 (ja) | 2006-11-23 |
| US20110218263A1 (en) | 2011-09-08 |
| US8779020B2 (en) | 2014-07-15 |
| US8530535B2 (en) | 2013-09-10 |
| TWI295948B (https=) | 2008-04-21 |
| KR20080002981A (ko) | 2008-01-04 |
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