KR100880109B1 - 내장된 강유전성 소자의 제조공정을 위한 오염 제어법 - Google Patents

내장된 강유전성 소자의 제조공정을 위한 오염 제어법 Download PDF

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Publication number
KR100880109B1
KR100880109B1 KR1020020046627A KR20020046627A KR100880109B1 KR 100880109 B1 KR100880109 B1 KR 100880109B1 KR 1020020046627 A KR1020020046627 A KR 1020020046627A KR 20020046627 A KR20020046627 A KR 20020046627A KR 100880109 B1 KR100880109 B1 KR 100880109B1
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South Korea
Prior art keywords
substrate
ferroelectric
forming
ferroelectric element
etchant
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Expired - Fee Related
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KR1020020046627A
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English (en)
Korean (ko)
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KR20030014627A (ko
Inventor
길버트스티븐알
허드트레이스큐
미카리미라우라더블유
서머펠트스코트
콜롬보루이지
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애질런트 테크놀로지스, 인크.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
    • H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
    • H10P50/267—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H10P50/285—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means of materials not containing Si, e.g. PZT or Al2O3

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  • Semiconductor Memories (AREA)
  • Weting (AREA)
KR1020020046627A 2001-08-08 2002-08-07 내장된 강유전성 소자의 제조공정을 위한 오염 제어법 Expired - Fee Related KR100880109B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/925,201 US6709875B2 (en) 2001-08-08 2001-08-08 Contamination control for embedded ferroelectric device fabrication processes
US09/925,201 2001-08-08

Publications (2)

Publication Number Publication Date
KR20030014627A KR20030014627A (ko) 2003-02-19
KR100880109B1 true KR100880109B1 (ko) 2009-01-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020046627A Expired - Fee Related KR100880109B1 (ko) 2001-08-08 2002-08-07 내장된 강유전성 소자의 제조공정을 위한 오염 제어법

Country Status (4)

Country Link
US (1) US6709875B2 (https=)
JP (1) JP4285954B2 (https=)
KR (1) KR100880109B1 (https=)
DE (1) DE10231192A1 (https=)

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* Cited by examiner, † Cited by third party
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JP5132859B2 (ja) * 2001-08-24 2013-01-30 ステラケミファ株式会社 多成分を有するガラス基板用の微細加工表面処理液
US6767750B2 (en) * 2001-12-31 2004-07-27 Texas Instruments Incorporated Detection of AIOx ears for process control in FeRAM processing
JP2004087691A (ja) * 2002-08-26 2004-03-18 Fujitsu Ltd ゲート絶縁膜を除去する方法
US6876021B2 (en) * 2002-11-25 2005-04-05 Texas Instruments Incorporated Use of amorphous aluminum oxide on a capacitor sidewall for use as a hydrogen barrier
KR100504693B1 (ko) * 2003-02-10 2005-08-03 삼성전자주식회사 강유전체 메모리 소자 및 그 제조방법
US20050037521A1 (en) * 2003-08-15 2005-02-17 Uwe Wellhausen Methods and apparatus for processing semiconductor devices by gas annealing
CN100505265C (zh) * 2003-12-26 2009-06-24 富士通微电子株式会社 半导体装置、半导体装置的制造方法
US7180141B2 (en) * 2004-12-03 2007-02-20 Texas Instruments Incorporated Ferroelectric capacitor with parallel resistance for ferroelectric memory
CN100578821C (zh) * 2005-09-22 2010-01-06 安捷尔射频公司 铁电薄膜装置及其制造方法
KR100722128B1 (ko) * 2005-12-28 2007-05-25 동부일렉트로닉스 주식회사 반도체 소자 제조방법
US7572698B2 (en) * 2006-05-30 2009-08-11 Texas Instruments Incorporated Mitigation of edge degradation in ferroelectric memory devices through plasma etch clean
JP5109395B2 (ja) * 2007-02-14 2012-12-26 富士通セミコンダクター株式会社 半導体装置及びその製造方法
US8269204B2 (en) * 2009-07-02 2012-09-18 Actel Corporation Back to back resistive random access memory cells
US20110297088A1 (en) * 2010-06-04 2011-12-08 Texas Instruments Incorporated Thin edge carrier ring
CN103087718B (zh) * 2013-01-16 2014-12-31 四川大学 湿法刻蚀镍酸镧薄膜和铁电薄膜/镍酸镧复合薄膜的腐蚀液及其制备方法
US9041919B2 (en) 2013-02-18 2015-05-26 Globalfoundries Inc. Infrared-based metrology for detection of stress and defects around through silicon vias
JP2016184677A (ja) * 2015-03-26 2016-10-20 株式会社ユーテック 強誘電体膜の製造方法
JP2017098367A (ja) * 2015-11-20 2017-06-01 東京エレクトロン株式会社 基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
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JPH10340893A (ja) * 1997-06-09 1998-12-22 Sony Corp 電子薄膜材料のエッチング方法
JP2000269178A (ja) * 1999-03-15 2000-09-29 Nec Corp エッチング除去方法および装置と洗浄方法および装置
KR20010005096A (ko) * 1999-06-30 2001-01-15 김영환 강유전체 캐패시터 형성 방법
JP2001068463A (ja) * 1999-08-31 2001-03-16 Hitachi Ltd 半導体集積回路装置の量産方法
US6225156B1 (en) * 1998-04-17 2001-05-01 Symetrix Corporation Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating same
US20010009814A1 (en) * 1996-10-15 2001-07-26 Rolfson J. Brett Method for removing contaminants from a semiconductor wafer

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US5046043A (en) 1987-10-08 1991-09-03 National Semiconductor Corporation Ferroelectric capacitor and memory cell including barrier and isolation layers
US5258093A (en) * 1992-12-21 1993-11-02 Motorola, Inc. Procss for fabricating a ferroelectric capacitor in a semiconductor device
US6051858A (en) 1996-07-26 2000-04-18 Symetrix Corporation Ferroelectric/high dielectric constant integrated circuit and method of fabricating same
US5807774A (en) 1996-12-06 1998-09-15 Sharp Kabushiki Kaisha Simple method of fabricating ferroelectric capacitors
US5773314A (en) 1997-04-25 1998-06-30 Motorola, Inc. Plug protection process for use in the manufacture of embedded dynamic random access memory (DRAM) cells
US6143476A (en) 1997-12-12 2000-11-07 Applied Materials Inc Method for high temperature etching of patterned layers using an organic mask stack
US6174735B1 (en) 1998-10-23 2001-01-16 Ramtron International Corporation Method of manufacturing ferroelectric memory device useful for preventing hydrogen line degradation
US6140672A (en) * 1999-03-05 2000-10-31 Symetrix Corporation Ferroelectric field effect transistor having a gate electrode being electrically connected to the bottom electrode of a ferroelectric capacitor
JP2000315670A (ja) * 1999-04-30 2000-11-14 Nec Corp 半導体基板の洗浄方法
US6261892B1 (en) * 1999-12-31 2001-07-17 Texas Instruments Incorporated Intra-chip AC isolation of RF passive components
JP2002231676A (ja) * 2001-01-30 2002-08-16 Toshiba Corp ウェハ洗浄方法及びウェハ洗浄装置
JP2002353182A (ja) * 2001-05-25 2002-12-06 Mitsubishi Electric Corp 半導体装置の洗浄方法および洗浄装置、ならびに半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010009814A1 (en) * 1996-10-15 2001-07-26 Rolfson J. Brett Method for removing contaminants from a semiconductor wafer
JPH10340893A (ja) * 1997-06-09 1998-12-22 Sony Corp 電子薄膜材料のエッチング方法
US6225156B1 (en) * 1998-04-17 2001-05-01 Symetrix Corporation Ferroelectric integrated circuit having low sensitivity to hydrogen exposure and method for fabricating same
JP2000269178A (ja) * 1999-03-15 2000-09-29 Nec Corp エッチング除去方法および装置と洗浄方法および装置
KR20010005096A (ko) * 1999-06-30 2001-01-15 김영환 강유전체 캐패시터 형성 방법
JP2001068463A (ja) * 1999-08-31 2001-03-16 Hitachi Ltd 半導体集積回路装置の量産方法

Also Published As

Publication number Publication date
KR20030014627A (ko) 2003-02-19
JP2003158115A (ja) 2003-05-30
DE10231192A1 (de) 2003-03-06
JP4285954B2 (ja) 2009-06-24
US6709875B2 (en) 2004-03-23
US20030036209A1 (en) 2003-02-20

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