KR100776469B1 - 상호 접속 조립체, 및 가요성 기판과 반도체 장치 사이를 전기적으로 연결하는 방법 - Google Patents

상호 접속 조립체, 및 가요성 기판과 반도체 장치 사이를 전기적으로 연결하는 방법 Download PDF

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Publication number
KR100776469B1
KR100776469B1 KR1020027002038A KR20027002038A KR100776469B1 KR 100776469 B1 KR100776469 B1 KR 100776469B1 KR 1020027002038 A KR1020027002038 A KR 1020027002038A KR 20027002038 A KR20027002038 A KR 20027002038A KR 100776469 B1 KR100776469 B1 KR 100776469B1
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South Korea
Prior art keywords
fluid
interconnect assembly
semiconductor device
flexible substrate
wiring layer
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Expired - Fee Related
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KR1020027002038A
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English (en)
Korean (ko)
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KR20020027552A (ko
Inventor
엘드리지벤자민
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폼팩터, 인크.
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Publication of KR20020027552A publication Critical patent/KR20020027552A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/316—Testing of analog circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020027002038A 1999-08-17 2000-08-10 상호 접속 조립체, 및 가요성 기판과 반도체 장치 사이를 전기적으로 연결하는 방법 Expired - Fee Related KR100776469B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/376,759 1999-08-17
US09/376,759 US6468098B1 (en) 1999-08-17 1999-08-17 Electrical contactor especially wafer level contactor using fluid pressure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020067026616A Division KR100915927B1 (ko) 1999-08-17 2000-08-10 탐침 조립체 및 가요성 기판과 전자장치 사이의 전기 접속방법

Publications (2)

Publication Number Publication Date
KR20020027552A KR20020027552A (ko) 2002-04-13
KR100776469B1 true KR100776469B1 (ko) 2007-11-16

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020027002038A Expired - Fee Related KR100776469B1 (ko) 1999-08-17 2000-08-10 상호 접속 조립체, 및 가요성 기판과 반도체 장치 사이를 전기적으로 연결하는 방법
KR1020067026616A Expired - Fee Related KR100915927B1 (ko) 1999-08-17 2000-08-10 탐침 조립체 및 가요성 기판과 전자장치 사이의 전기 접속방법
KR1020077018764A Ceased KR20070087695A (ko) 1999-08-17 2000-08-10 상호 접속 조립체

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020067026616A Expired - Fee Related KR100915927B1 (ko) 1999-08-17 2000-08-10 탐침 조립체 및 가요성 기판과 전자장치 사이의 전기 접속방법
KR1020077018764A Ceased KR20070087695A (ko) 1999-08-17 2000-08-10 상호 접속 조립체

Country Status (8)

Country Link
US (5) US6468098B1 (enExample)
EP (2) EP1418436A3 (enExample)
JP (2) JP2003507882A (enExample)
KR (3) KR100776469B1 (enExample)
AU (1) AU6903300A (enExample)
DE (1) DE60007999T2 (enExample)
TW (1) TW460918B (enExample)
WO (1) WO2001013130A1 (enExample)

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US7455540B2 (en) 2008-11-25
US20100297863A1 (en) 2010-11-25
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US20070287304A1 (en) 2007-12-13
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US7722371B2 (en) 2010-05-25
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