KR100693238B1 - 반도체 제조 장치 및 시약 교환 방법 - Google Patents
반도체 제조 장치 및 시약 교환 방법 Download PDFInfo
- Publication number
- KR100693238B1 KR100693238B1 KR1020050077129A KR20050077129A KR100693238B1 KR 100693238 B1 KR100693238 B1 KR 100693238B1 KR 1020050077129 A KR1020050077129 A KR 1020050077129A KR 20050077129 A KR20050077129 A KR 20050077129A KR 100693238 B1 KR100693238 B1 KR 100693238B1
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- KR
- South Korea
- Prior art keywords
- reagent
- temperature
- reagents
- new
- waste
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 111
- 239000000126 substance Substances 0.000 title 1
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 443
- 239000002699 waste material Substances 0.000 claims abstract description 87
- 239000012530 fluid Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000004140 cleaning Methods 0.000 claims abstract description 34
- 238000007599 discharging Methods 0.000 claims abstract description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
- 238000002156 mixing Methods 0.000 claims description 18
- 238000010790 dilution Methods 0.000 claims description 11
- 239000012895 dilution Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 238000006386 neutralization reaction Methods 0.000 claims description 5
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004248970A JP2006066727A (ja) | 2004-08-27 | 2004-08-27 | 半導体製造装置及び薬液交換方法 |
JPJP-P-2004-00248970 | 2004-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060050557A KR20060050557A (ko) | 2006-05-19 |
KR100693238B1 true KR100693238B1 (ko) | 2007-03-12 |
Family
ID=35941389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050077129A KR100693238B1 (ko) | 2004-08-27 | 2005-08-23 | 반도체 제조 장치 및 시약 교환 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060042756A1 (ja) |
JP (1) | JP2006066727A (ja) |
KR (1) | KR100693238B1 (ja) |
CN (1) | CN100390932C (ja) |
TW (1) | TWI279833B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007146892A2 (en) | 2006-06-13 | 2007-12-21 | Advanced Technology Materials, Inc. | Liquid dispensing systems encompassing gas removal |
JP2008016620A (ja) * | 2006-07-05 | 2008-01-24 | Toshiba Corp | 半導体製造装置及び半導体製造方法 |
KR100794585B1 (ko) * | 2006-08-01 | 2008-01-17 | 세메스 주식회사 | 습식 세정 장치 및 방법 |
KR100812545B1 (ko) * | 2006-10-23 | 2008-03-13 | 주식회사 케이씨텍 | 반도체 웨이퍼 세정장치 및 그 세정장치의 세정 약액공급방법 |
JP4878986B2 (ja) * | 2006-11-07 | 2012-02-15 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、プログラムおよび記録媒体 |
KR101388110B1 (ko) * | 2007-10-22 | 2014-04-22 | 주식회사 케이씨텍 | 습식세정장치 및 그 운용방법 |
JP2009189905A (ja) * | 2008-02-12 | 2009-08-27 | Kurita Water Ind Ltd | 熱回収型洗浄装置 |
JP5313647B2 (ja) * | 2008-03-25 | 2013-10-09 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
TWI358327B (en) * | 2008-11-19 | 2012-02-21 | Inotera Memories Inc | Chemical treatment apparatus |
CN102122608B (zh) * | 2010-12-31 | 2012-08-15 | 北京七星华创电子股份有限公司 | 化学制剂处理系统 |
JP5766453B2 (ja) * | 2011-01-31 | 2015-08-19 | 三菱重工業株式会社 | 温水洗浄システムおよび温水洗浄方法 |
JP2013141613A (ja) * | 2012-01-06 | 2013-07-22 | Toshiba Carrier Corp | 産業用加熱装置 |
CN103377972B (zh) * | 2012-04-30 | 2016-12-28 | 细美事有限公司 | 基板处理装置和供给处理溶液的方法 |
JP6118719B2 (ja) * | 2013-12-16 | 2017-04-19 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
US9498799B2 (en) | 2014-03-11 | 2016-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for removing non-bonding compound from polycrystalline materials on solar panel |
CN104391433A (zh) * | 2014-12-05 | 2015-03-04 | 合肥鑫晟光电科技有限公司 | 一种喷淋系统及其使用方法 |
JP6858036B2 (ja) * | 2017-02-28 | 2021-04-14 | 株式会社Screenホールディングス | 基板処理装置 |
JP6786429B2 (ja) * | 2017-03-22 | 2020-11-18 | 株式会社Screenホールディングス | 基板処理装置、基板処理システム、および基板処理方法 |
US11227780B2 (en) | 2018-09-20 | 2022-01-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for operating the same |
JP2022178121A (ja) * | 2021-05-19 | 2022-12-02 | 株式会社Screenホールディングス | 基板処理システム |
JP2023131679A (ja) | 2022-03-09 | 2023-09-22 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3508371A1 (de) * | 1985-03-08 | 1986-09-11 | Wacker Chemie Gmbh | Verfahren zur nachreinigung von chlorwasserstoff aus einer 1,2-dichlorethan-pyrolyse |
US5273589A (en) * | 1992-07-10 | 1993-12-28 | Griswold Bradley L | Method for low pressure rinsing and drying in a process chamber |
US5820689A (en) * | 1996-12-04 | 1998-10-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wet chemical treatment system and method for cleaning such system |
KR100252221B1 (ko) * | 1997-06-25 | 2000-04-15 | 윤종용 | 반도체장치 제조용 습식 식각장치 및 습식 식각장치내의 식각액 순환방법 |
US6039055A (en) * | 1998-01-08 | 2000-03-21 | International Business Machines Corporation | Wafer cleaning with dissolved gas concentration control |
JP2000266496A (ja) * | 1999-03-15 | 2000-09-29 | Komatsu Electronics Kk | 流体加熱装置 |
US6399517B2 (en) * | 1999-03-30 | 2002-06-04 | Tokyo Electron Limited | Etching method and etching apparatus |
US6295998B1 (en) * | 1999-05-25 | 2001-10-02 | Infineon Technologies North America Corp. | Temperature controlled gassification of deionized water for megasonic cleaning of semiconductor wafers |
JP4602540B2 (ja) * | 2000-12-12 | 2010-12-22 | オメガセミコン電子株式会社 | 基板処理装置 |
-
2004
- 2004-08-27 JP JP2004248970A patent/JP2006066727A/ja active Pending
-
2005
- 2005-08-16 TW TW094127946A patent/TWI279833B/zh not_active IP Right Cessation
- 2005-08-23 KR KR1020050077129A patent/KR100693238B1/ko active IP Right Grant
- 2005-08-25 CN CNB2005100930887A patent/CN100390932C/zh not_active Expired - Fee Related
- 2005-08-26 US US11/211,748 patent/US20060042756A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI279833B (en) | 2007-04-21 |
US20060042756A1 (en) | 2006-03-02 |
CN100390932C (zh) | 2008-05-28 |
TW200625390A (en) | 2006-07-16 |
JP2006066727A (ja) | 2006-03-09 |
CN1741249A (zh) | 2006-03-01 |
KR20060050557A (ko) | 2006-05-19 |
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