KR100684627B1 - 기판 처리장치 및 기판 처리방법 - Google Patents

기판 처리장치 및 기판 처리방법 Download PDF

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Publication number
KR100684627B1
KR100684627B1 KR1020050116310A KR20050116310A KR100684627B1 KR 100684627 B1 KR100684627 B1 KR 100684627B1 KR 1020050116310 A KR1020050116310 A KR 1020050116310A KR 20050116310 A KR20050116310 A KR 20050116310A KR 100684627 B1 KR100684627 B1 KR 100684627B1
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KR
South Korea
Prior art keywords
substrate
unit
processing
processing unit
board
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Expired - Lifetime
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KR1020050116310A
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English (en)
Korean (ko)
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KR20060063683A (ko
Inventor
토루 아사노
유키오 도리야마
타카시 다구치
츠요시 미츠하시
코지 가네야마
츠요시 오쿠무라
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
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Publication of KR20060063683A publication Critical patent/KR20060063683A/ko
Application granted granted Critical
Publication of KR100684627B1 publication Critical patent/KR100684627B1/ko
Assigned to 가부시키가이샤 스크린 세미컨덕터 솔루션즈 reassignment 가부시키가이샤 스크린 세미컨덕터 솔루션즈 권리의 전부이전등록 Assignors: 다이닛뽕스크린 세이조오 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020050116310A 2004-12-06 2005-12-01 기판 처리장치 및 기판 처리방법 Expired - Lifetime KR100684627B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00353117 2004-12-06
JP2004353117 2004-12-06
JPJP-P-2005-00095780 2005-03-29
JP2005095780A JP5008268B2 (ja) 2004-12-06 2005-03-29 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20060063683A KR20060063683A (ko) 2006-06-12
KR100684627B1 true KR100684627B1 (ko) 2007-02-20

Family

ID=36640545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050116310A Expired - Lifetime KR100684627B1 (ko) 2004-12-06 2005-12-01 기판 처리장치 및 기판 처리방법

Country Status (4)

Country Link
US (1) US20060147201A1 (https=)
JP (1) JP5008268B2 (https=)
KR (1) KR100684627B1 (https=)
TW (1) TWI278058B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220056663A (ko) * 2020-10-28 2022-05-06 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5008280B2 (ja) 2004-11-10 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154007B2 (ja) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4926433B2 (ja) * 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4794232B2 (ja) * 2004-12-06 2011-10-19 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4514657B2 (ja) * 2005-06-24 2010-07-28 株式会社Sokudo 基板処理装置
JP4761907B2 (ja) * 2005-09-28 2011-08-31 株式会社Sokudo 基板処理装置
JP5132108B2 (ja) 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4832201B2 (ja) * 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 基板処理装置
JP2008060302A (ja) * 2006-08-31 2008-03-13 Sokudo:Kk 基板処理装置
JP2008091508A (ja) * 2006-09-29 2008-04-17 Canon Inc 処理装置
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP2011205004A (ja) 2010-03-26 2011-10-13 Sokudo Co Ltd 基板処理装置および基板処理方法
JP5713081B2 (ja) * 2010-07-09 2015-05-07 東京エレクトロン株式会社 塗布、現像装置
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
JP7195841B2 (ja) * 2018-09-21 2022-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324139A (ja) 2002-05-01 2003-11-14 Dainippon Screen Mfg Co Ltd 基板処理装置
KR20060052515A (ko) * 2004-11-10 2006-05-19 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리 장치 및 기판처리 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260686A (ja) * 1998-03-11 1999-09-24 Toshiba Corp 露光方法
JP3914690B2 (ja) * 1999-06-30 2007-05-16 東京エレクトロン株式会社 基板受け渡し装置及び塗布現像処理システム
JP4018965B2 (ja) * 2002-10-28 2007-12-05 東京エレクトロン株式会社 基板処理装置
JP4170864B2 (ja) * 2003-02-03 2008-10-22 大日本スクリーン製造株式会社 基板処理装置および基板処理装置における基板搬送方法および基板処理方法
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
JP4397646B2 (ja) * 2003-07-30 2010-01-13 東京エレクトロン株式会社 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324139A (ja) 2002-05-01 2003-11-14 Dainippon Screen Mfg Co Ltd 基板処理装置
KR20060052515A (ko) * 2004-11-10 2006-05-19 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리 장치 및 기판처리 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220056663A (ko) * 2020-10-28 2022-05-06 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102583261B1 (ko) * 2020-10-28 2023-09-27 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US12334386B2 (en) 2020-10-28 2025-06-17 Semes Co., Ltd. Apparatus and method for treating substrate

Also Published As

Publication number Publication date
KR20060063683A (ko) 2006-06-12
US20060147201A1 (en) 2006-07-06
JP2006190921A (ja) 2006-07-20
TWI278058B (en) 2007-04-01
TW200627575A (en) 2006-08-01
JP5008268B2 (ja) 2012-08-22

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