TWI278058B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TWI278058B
TWI278058B TW094141869A TW94141869A TWI278058B TW I278058 B TWI278058 B TW I278058B TW 094141869 A TW094141869 A TW 094141869A TW 94141869 A TW94141869 A TW 94141869A TW I278058 B TWI278058 B TW I278058B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
processing
holding
exposure
Prior art date
Application number
TW094141869A
Other languages
English (en)
Chinese (zh)
Other versions
TW200627575A (en
Inventor
Toru Asano
Yukio Toriyama
Takashi Taguchi
Tsuyoshi Mitsuhashi
Koji Kaneyama
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200627575A publication Critical patent/TW200627575A/zh
Application granted granted Critical
Publication of TWI278058B publication Critical patent/TWI278058B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW094141869A 2004-12-06 2005-11-29 Substrate processing apparatus and substrate processing method TWI278058B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004353117 2004-12-06
JP2005095780A JP5008268B2 (ja) 2004-12-06 2005-03-29 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
TW200627575A TW200627575A (en) 2006-08-01
TWI278058B true TWI278058B (en) 2007-04-01

Family

ID=36640545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141869A TWI278058B (en) 2004-12-06 2005-11-29 Substrate processing apparatus and substrate processing method

Country Status (4)

Country Link
US (1) US20060147201A1 (https=)
JP (1) JP5008268B2 (https=)
KR (1) KR100684627B1 (https=)
TW (1) TWI278058B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5008280B2 (ja) 2004-11-10 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5154007B2 (ja) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4926433B2 (ja) * 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4794232B2 (ja) * 2004-12-06 2011-10-19 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4514657B2 (ja) * 2005-06-24 2010-07-28 株式会社Sokudo 基板処理装置
JP4761907B2 (ja) * 2005-09-28 2011-08-31 株式会社Sokudo 基板処理装置
JP5132108B2 (ja) 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4832201B2 (ja) * 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 基板処理装置
JP2008060302A (ja) * 2006-08-31 2008-03-13 Sokudo:Kk 基板処理装置
JP2008091508A (ja) * 2006-09-29 2008-04-17 Canon Inc 処理装置
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP5283842B2 (ja) * 2006-12-18 2013-09-04 キヤノン株式会社 処理装置
JP2011205004A (ja) 2010-03-26 2011-10-13 Sokudo Co Ltd 基板処理装置および基板処理方法
JP5713081B2 (ja) * 2010-07-09 2015-05-07 東京エレクトロン株式会社 塗布、現像装置
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
JP7195841B2 (ja) * 2018-09-21 2022-12-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102583261B1 (ko) * 2020-10-28 2023-09-27 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260686A (ja) * 1998-03-11 1999-09-24 Toshiba Corp 露光方法
JP3914690B2 (ja) * 1999-06-30 2007-05-16 東京エレクトロン株式会社 基板受け渡し装置及び塗布現像処理システム
JP4342147B2 (ja) 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 基板処理装置
JP4018965B2 (ja) * 2002-10-28 2007-12-05 東京エレクトロン株式会社 基板処理装置
JP4170864B2 (ja) * 2003-02-03 2008-10-22 大日本スクリーン製造株式会社 基板処理装置および基板処理装置における基板搬送方法および基板処理方法
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
JP4397646B2 (ja) * 2003-07-30 2010-01-13 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2006310724A (ja) * 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
KR20060063683A (ko) 2006-06-12
US20060147201A1 (en) 2006-07-06
JP2006190921A (ja) 2006-07-20
TW200627575A (en) 2006-08-01
JP5008268B2 (ja) 2012-08-22
KR100684627B1 (ko) 2007-02-20

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