KR100684155B1 - 원자외선 노광용 포지티브 포토레지스트 조성물 - Google Patents
원자외선 노광용 포지티브 포토레지스트 조성물 Download PDFInfo
- Publication number
- KR100684155B1 KR100684155B1 KR1020000028523A KR20000028523A KR100684155B1 KR 100684155 B1 KR100684155 B1 KR 100684155B1 KR 1020000028523 A KR1020000028523 A KR 1020000028523A KR 20000028523 A KR20000028523 A KR 20000028523A KR 100684155 B1 KR100684155 B1 KR 100684155B1
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- KR
- South Korea
- Prior art keywords
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- hydrogen atom
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
Applications Claiming Priority (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99-146774 | 1999-05-26 | ||
JP99-146775 | 1999-05-26 | ||
JP14677599A JP3547047B2 (ja) | 1999-05-26 | 1999-05-26 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP11146774A JP2000338673A (ja) | 1999-05-26 | 1999-05-26 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP15021599A JP3890380B2 (ja) | 1999-05-28 | 1999-05-28 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP99-150215 | 1999-05-28 | ||
JP11152862A JP2000338681A (ja) | 1999-05-31 | 1999-05-31 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP99-152860 | 1999-05-31 | ||
JP15286199A JP4046258B2 (ja) | 1999-05-31 | 1999-05-31 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP11152860A JP2000338679A (ja) | 1999-05-31 | 1999-05-31 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP99-152861 | 1999-05-31 | ||
JP99-152862 | 1999-05-31 | ||
JP15869599A JP3992882B2 (ja) | 1999-06-04 | 1999-06-04 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP99-158693 | 1999-06-04 | ||
JP99-158695 | 1999-06-04 | ||
JP15869399A JP3989132B2 (ja) | 1999-06-04 | 1999-06-04 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000077438A KR20000077438A (ko) | 2000-12-26 |
KR100684155B1 true KR100684155B1 (ko) | 2007-02-28 |
Family
ID=27573200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000028523A KR100684155B1 (ko) | 1999-05-26 | 2000-05-26 | 원자외선 노광용 포지티브 포토레지스트 조성물 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6479211B1 (US06479211-20021112-C00034.png) |
KR (1) | KR100684155B1 (US06479211-20021112-C00034.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101378765B1 (ko) | 2007-05-30 | 2014-03-28 | 주식회사 동진쎄미켐 | 포토에시드 제너레이터를 포함하는 포토레지스트 모노머,폴리머 및 그를 포함하는 포토레지스트 조성물 |
Families Citing this family (57)
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JP2001215704A (ja) * | 2000-01-31 | 2001-08-10 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
JP3945741B2 (ja) * | 2000-12-04 | 2007-07-18 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
TW538316B (en) * | 2001-01-19 | 2003-06-21 | Sumitomo Chemical Co | Chemical amplifying type positive resist composition |
US6858370B2 (en) * | 2001-02-23 | 2005-02-22 | Fuji Photo Film Co., Ltd. | Positive photosensitive composition |
JP4225699B2 (ja) | 2001-03-12 | 2009-02-18 | 富士フイルム株式会社 | ポジ型感光性組成物 |
TWI226973B (en) * | 2001-03-19 | 2005-01-21 | Fuji Photo Film Co Ltd | Positive resist composition |
JP4117112B2 (ja) * | 2001-03-30 | 2008-07-16 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
KR100907268B1 (ko) * | 2001-04-05 | 2009-07-13 | 후지필름 가부시키가이샤 | 포지티브 레지스트 조성물 및 이를 사용한 패턴 형성 방법 |
US6852468B2 (en) * | 2001-06-12 | 2005-02-08 | Fuji Photo Film Co., Ltd. | Positive resist composition |
JP4262422B2 (ja) * | 2001-06-28 | 2009-05-13 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物及びそれを用いたパターン形成方法 |
JP4025074B2 (ja) * | 2001-09-19 | 2007-12-19 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
JP4149154B2 (ja) * | 2001-09-28 | 2008-09-10 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
JP3803286B2 (ja) * | 2001-12-03 | 2006-08-02 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターンの形成方法 |
JP3895224B2 (ja) * | 2001-12-03 | 2007-03-22 | 東京応化工業株式会社 | ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法 |
JP3836359B2 (ja) * | 2001-12-03 | 2006-10-25 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
EP1324134B1 (en) * | 2001-12-27 | 2010-10-20 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process |
US7015291B2 (en) * | 2002-04-01 | 2006-03-21 | Daicel Chemical Industries, Ltd. | Process for the production of high-molecular compounds for photoresist |
TWI299816B (en) * | 2002-04-03 | 2008-08-11 | Sumitomo Chemical Co | Positive resist composition |
JP4048535B2 (ja) * | 2002-11-05 | 2008-02-20 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
WO2004061525A1 (ja) * | 2002-12-28 | 2004-07-22 | Jsr Corporation | 感放射線性樹脂組成物 |
JP4434762B2 (ja) * | 2003-01-31 | 2010-03-17 | 東京応化工業株式会社 | レジスト組成物 |
JP2005099646A (ja) * | 2003-03-28 | 2005-04-14 | Tokyo Ohka Kogyo Co Ltd | 液浸露光プロセス用レジスト組成物および該レジスト組成物を用いたレジストパターン形成方法 |
JP4083053B2 (ja) * | 2003-03-31 | 2008-04-30 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
JP4439270B2 (ja) * | 2003-06-18 | 2010-03-24 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
JP2005031233A (ja) * | 2003-07-09 | 2005-02-03 | Tokyo Ohka Kogyo Co Ltd | レジスト組成物、積層体、及びレジストパターン形成方法 |
US7601479B2 (en) * | 2003-09-12 | 2009-10-13 | Shin-Etsu Chemical Co., Ltd. | Polymer, resist composition and patterning process |
TWI316645B (en) * | 2003-09-18 | 2009-11-01 | Tokyo Ohka Kogyo Co Ltd | Positive resist composition and resist pattern formation method |
US7488565B2 (en) * | 2003-10-01 | 2009-02-10 | Chevron U.S.A. Inc. | Photoresist compositions comprising diamondoid derivatives |
JP2005164633A (ja) * | 2003-11-28 | 2005-06-23 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びレジストパターン形成方法 |
JP4240223B2 (ja) * | 2004-03-22 | 2009-03-18 | 信越化学工業株式会社 | 高分子化合物、レジスト材料及びパターン形成方法 |
JP2005300998A (ja) * | 2004-04-13 | 2005-10-27 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びレジストパターン形成方法 |
JP4622579B2 (ja) * | 2004-04-23 | 2011-02-02 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物及び(メタ)アクリル酸誘導体とその製法 |
KR100599081B1 (ko) * | 2004-05-27 | 2006-07-13 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 사용한 패턴 형성방법 |
JP4474256B2 (ja) * | 2004-09-30 | 2010-06-02 | 富士フイルム株式会社 | レジスト組成物及びそれを用いたパターン形成方法 |
JP4213107B2 (ja) * | 2004-10-07 | 2009-01-21 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
JP4448767B2 (ja) * | 2004-10-08 | 2010-04-14 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
US20060172223A1 (en) * | 2004-11-24 | 2006-08-03 | Rohm And Haas Electronic Materials Llc | Photoresist compositions |
US7326518B2 (en) * | 2004-11-24 | 2008-02-05 | Rohm And Haas Electronic Materials Llc | Photoresist compositions |
KR100906598B1 (ko) * | 2004-12-03 | 2009-07-09 | 도오꾜오까고오교 가부시끼가이샤 | 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법 |
KR101209049B1 (ko) * | 2004-12-24 | 2012-12-07 | 스미또모 가가꾸 가부시끼가이샤 | 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을 포함하는 박막 표시판 및 그 제조 방법 |
DE112005003399B4 (de) * | 2005-02-10 | 2017-04-13 | Tokyo Ohka Kogyo Co., Ltd. | Positivresist-Zusammensetzung und Verfahren zur Erzeugung eines Resistmusters |
JP4505357B2 (ja) * | 2005-03-16 | 2010-07-21 | 富士フイルム株式会社 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
EP1720072B1 (en) * | 2005-05-01 | 2019-06-05 | Rohm and Haas Electronic Materials, L.L.C. | Compositons and processes for immersion lithography |
JP4679990B2 (ja) * | 2005-07-22 | 2011-05-11 | 東京応化工業株式会社 | ポジ型レジスト組成物の製造方法、ポジ型レジスト組成物およびレジストパターン形成方法 |
EP1993849B1 (en) | 2006-01-19 | 2010-09-01 | Ikonics Corporation | Digital mold texturizing methods |
US7476492B2 (en) * | 2006-05-26 | 2009-01-13 | International Business Machines Corporation | Low activation energy photoresist composition and process for its use |
JP2008037857A (ja) * | 2006-07-14 | 2008-02-21 | Tokyo Ohka Kogyo Co Ltd | 化合物、酸発生剤、レジスト組成物及びレジストパターン形成方法 |
CN102253596B (zh) * | 2006-10-30 | 2014-05-14 | 罗门哈斯电子材料有限公司 | 浸渍平版印刷用组合物和浸渍平版印刷方法 |
JP2009048182A (ja) * | 2007-07-20 | 2009-03-05 | Fujifilm Corp | ポジ型レジスト組成物及びパターン形成方法 |
JP2009199058A (ja) | 2007-11-05 | 2009-09-03 | Rohm & Haas Electronic Materials Llc | 液浸リソグラフィーのための組成物および方法 |
KR100933984B1 (ko) * | 2007-11-26 | 2009-12-28 | 제일모직주식회사 | 신규 공중합체 및 이를 포함하는 레지스트 조성물 |
KR100933983B1 (ko) * | 2007-11-26 | 2009-12-28 | 제일모직주식회사 | 우수한 식각 내성 특성을 갖는 레지스트 조성물 |
KR100922841B1 (ko) * | 2007-12-18 | 2009-10-20 | 제일모직주식회사 | 감광성 고분자 및 이를 포함하는 레지스트 조성물 |
CN101735390A (zh) * | 2008-11-14 | 2010-06-16 | 住友化学株式会社 | 聚合物及包含该聚合物的抗蚀剂组合物 |
JP6287466B2 (ja) * | 2013-04-08 | 2018-03-07 | Jsr株式会社 | レジスト組成物及びレジストパターン形成方法 |
WO2017154345A1 (ja) * | 2016-03-07 | 2017-09-14 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法 |
US11345772B2 (en) | 2019-09-06 | 2022-05-31 | Canon Kabushiki Kaisha | Curable composition |
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JPH0712927A (ja) * | 1991-08-30 | 1995-01-17 | Kobe Steel Ltd | 超音波物体検知装置 |
JPH0973173A (ja) * | 1995-06-28 | 1997-03-18 | Fujitsu Ltd | レジスト材料及びレジストパターンの形成方法 |
JPH10239847A (ja) * | 1997-02-28 | 1998-09-11 | Fuji Photo Film Co Ltd | ポジ型感光性組成物 |
JPH10319595A (ja) * | 1997-05-20 | 1998-12-04 | Fujitsu Ltd | レジスト組成物及びレジストパターン形成方法 |
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US6093517A (en) * | 1998-07-31 | 2000-07-25 | International Business Machines Corporation | Calixarenes for use as dissolution inhibitors in lithographic photoresist compositions |
CN1190706C (zh) * | 1998-08-26 | 2005-02-23 | 住友化学工业株式会社 | 一种化学增强型正光刻胶组合物 |
-
2000
- 2000-05-25 US US09/577,884 patent/US6479211B1/en not_active Expired - Lifetime
- 2000-05-26 KR KR1020000028523A patent/KR100684155B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0712927A (ja) * | 1991-08-30 | 1995-01-17 | Kobe Steel Ltd | 超音波物体検知装置 |
JPH0973173A (ja) * | 1995-06-28 | 1997-03-18 | Fujitsu Ltd | レジスト材料及びレジストパターンの形成方法 |
JPH10239847A (ja) * | 1997-02-28 | 1998-09-11 | Fuji Photo Film Co Ltd | ポジ型感光性組成物 |
JPH10319595A (ja) * | 1997-05-20 | 1998-12-04 | Fujitsu Ltd | レジスト組成物及びレジストパターン形成方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101378765B1 (ko) | 2007-05-30 | 2014-03-28 | 주식회사 동진쎄미켐 | 포토에시드 제너레이터를 포함하는 포토레지스트 모노머,폴리머 및 그를 포함하는 포토레지스트 조성물 |
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